Radiator and electronic equipment

Abstract

The utility model provides a radiator and electronic equipment, the radiator comprises a first heat dissipation assembly, the first heat dissipation assembly comprises at least one first heat exchange piece, and the first heat exchange piece is used for being in heat conduction contact with an electronic device to be subjected to heat dissipation; the first heat exchange piece comprises a first connecting section and at least two second connecting sections arranged in a folded mode, the first connecting section extends in the first direction, the second connecting sections extend in the second direction, the first connecting section is connected to one ends of the second connecting sections, and the first connecting section is used for being in heat conduction contact with an electronic device; at least two first flow channels are arranged in the first heat exchange piece and are arranged in the third direction, and the extending direction of the first flow channels is consistent with the extending direction of the first heat exchange piece. The radiator is high in radiating efficiency and simple in structure and process.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a radiator and an electronic device. Background Art

[0002] Currently, microchannel heat sinks are primarily composed of a base, a microchannel plate, and a top base. Both the top and base have cavities, and the microchannel plate has a flow channel, with both ends connected to the top and base cavities, respectively. The working fluid absorbs heat and vaporizes in the base cavity, rising through the flow channel of the microchannel plate. During this rise, the fluid transfers heat to the microchannel plate, condenses and liquefies, and flows back into the base cavity. The microchannel plate can exchange heat with the air through convection, allowing the air to carry away the heat. This reciprocating cycle transfers heat, thereby cooling the electronic devices.

[0003] However, the structure and process of the microchannel heat sink in the related art are relatively complicated. Utility Model Content

[0004] Based on this, the present application provides a heat sink and an electronic device to solve the problem of complex heat sink structure and process in related technologies.

[0005] In a first aspect, the present application provides a radiator, comprising a first heat dissipation component, the first heat dissipation component comprising at least one first heat exchange element;

[0006] The first heat exchange member includes a first connecting section and at least two second connecting sections folded in half, the first connecting section and the second connecting section being integrally formed, the first connecting section extending along a first direction, the second connecting section extending along a second direction, the first connecting section being connected to one end of the second connecting section, and the first connecting section being configured to be in thermal contact with the electronic device to be dissipated heat;

[0007] The first heat exchange element has at least two first flow channels therein, and the at least two first flow channels are arranged along the third direction. The extension direction of the first flow channels is consistent with the extension direction of the first heat exchange element.

[0008] In one possible implementation, the first heat exchange element further includes a third connecting section, the third connecting section connecting two adjacent second connecting sections, and the third connecting section is located at an end of the second connecting section facing away from the first connecting section, and the first flow channel extends sequentially along the first connecting section, the second connecting section, the third connecting section, and the second connecting section;

[0009] The first flow channel is filled with phase change medium, and both ends of the first flow channel are sealed.

[0010] In a possible implementation, the first heat dissipation assembly further includes a third heat exchange member, wherein a first gap is provided between two adjacent second connecting segments located at both ends of the first connecting segment, and a second gap is provided between two adjacent second connecting segments located at both ends of the third connecting segment;

[0011] The third heat exchange element is disposed in at least one of the first gap and the second gap.

[0012] In a possible implementation, the first gap is larger than the second gap; the third connecting segment is arc-shaped, and the first connecting segment and the second connecting segment are connected by an arc transition;

[0013] The first direction, the second direction and the third direction are perpendicular to each other.

[0014] In a possible implementation, there are at least two first heat exchange elements, and the at least two first heat exchange elements are arranged along the first direction.

[0015] In one possible implementation, the heat sink of the present application also includes a second heat dissipation component, the first connecting section has a first heat-conducting plane on the side facing away from the second connecting section, the second heat dissipation component has a second heat-conducting plane on the side facing the first heat exchanger, the first heat-conducting plane is in thermal contact with the second heat-conducting plane, and the second heat dissipation component is used to be in thermal contact with the electronic device.

[0016] In a possible implementation, the second heat dissipation assembly includes a second heat exchange element, the second heat exchange element has a first surface on a side facing the first heat exchange element, and the second heat conducting plane includes the first surface;

[0017] And / or, the second heat dissipation assembly includes a heat exchange base plate, the heat exchange base plate has a second surface on a side facing the first heat exchange element, and the second heat conduction plane includes the second surface.

[0018] In one possible implementation, the second heat dissipation assembly includes a second heat exchange element and a heat exchange base plate, the heat exchange base plate has a second surface on a side facing the first heat exchange element, and the second heat conducting plane includes the second surface;

[0019] The heat exchange bottom plate has a third surface on a side facing away from the first heat exchange element, and the third surface is used for heat-conducting contact with the electronic device;

[0020] The heat exchange bottom plate has a groove on a side facing away from the first heat exchange element. The second heat exchange element is arranged in the groove and is in thermal contact with the heat exchange bottom plate and / or the electronic device.

[0021] In one possible implementation, the second heat exchange member is flat and has a second flow channel therein. The second flow channel extends in a direction consistent with the length of a side of the second heat exchange member, and the second flow channel extends in a direction that forms an angle with the horizontal direction, where the angle is greater than or equal to 0° and less than or equal to 30°.

[0022] The second flow channel is filled with phase change medium, and both ends of the second flow channel are sealed.

[0023] In a second aspect, the present application further provides an electronic device, comprising an electronic device and the heat sink provided in the first aspect, wherein the heat sink is in thermal contact with the electronic device.

[0024] The radiator provided in the present application includes a first heat dissipation component, the first heat dissipation component includes a first heat exchanger, the first heat exchanger includes a first connecting section and a second connecting section, the first connecting section and the second connecting section are integrally arranged, and the first connecting section can be in thermal contact with the electronic device to be dissipated heat, so that the first connecting section absorbs the heat of the electronic device, and then the phase change medium circulates in the first flow channel within the first connecting section and the second connecting section. In this way, the phase change medium can circulate efficiently in the first heat exchanger, and the structure and process of the radiator can be simplified.

[0025] In addition to the technical problems solved by the embodiments of the present application described above, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions, other technical problems that can be solved by the radiator and electronic device provided by the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0027] Figure 1 It is a structural diagram of a microchannel radiator in the prior art;

[0028] Figure 2 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0029] Figure 3 for Figure 2 The main view;

[0030] Figure 4 A schematic structural diagram of a radiator provided in an embodiment of the present application;

[0031] Figure 5 for Figure 3 The main view;

[0032] Figure 6 Another structural schematic diagram of the radiator provided in an embodiment of the present application;

[0033] Figure 7 Schematic diagram of the structure of the first heat exchange element in the radiator provided in the embodiment of the present application Figure 1 ;

[0034] Figure 8 for Figure 7 The main view;

[0035] Figure 9 for Figure 8 AA section view;

[0036] Figure 10 for Figure 9 A partial enlarged view of point B in the middle;

[0037] Figure 11 Schematic diagram of the structure of the first heat exchange element in the radiator provided in the embodiment of the present application Figure 2 ;

[0038] Figure 12 Schematic diagram of the structure of the first heat exchange element in the radiator provided in the embodiment of the present application Figure 3 ;

[0039] Figure 13 Schematic diagram of the structure of the first heat exchange element in the radiator provided in the embodiment of the present application Figure 4 .

[0040] Description of reference numerals:

[0041] 1-base; 2-microchannel plate; 3-top seat;

[0042] 10- radiator; 100- first heat dissipation assembly; 110- first heat exchange element; 111- first connecting section; 112- second connecting section; 113- first flow channel; 114- third connecting section; 120- third heat exchange element; 200- second heat dissipation assembly; 210- second heat exchange element; 220- heat exchange bottom plate;

[0043] 20-Electronic devices. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below in conjunction with the drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals throughout represent the same or similar parts or parts with the same or similar functions. The described embodiments are part of the embodiments of the present application, not all of the embodiments. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. The embodiments of the present application are described in detail below in conjunction with the drawings.

[0045] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

[0046] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are orientations or positional relationships based on the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on this application.

[0047] The terms "first," "second," and "third" (if any) in the specification and claims of this application and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.

[0048] In the description of this application, the surface is not a virtual plane in a mathematical sense, but refers to the actual surface of a component after processing.

[0049] Reference Figure 1 As shown, currently, a microchannel heat sink mainly consists of a base 1, a microchannel plate 2, and a top base 3. Both the top base 3 and the base 1 have cavities. The microchannel plate 2 has a flow channel, and the two ends of the flow channel are connected to the cavity of the top base 3 and the cavity of the base 1 respectively. The working fluid absorbs heat and vaporizes in the cavity of the base 1, rising in the flow channel of the microchannel plate 2. During the rising process, the heat is transferred to the microchannel plate 2, condensed and liquefied, and then flows back to the cavity of the base 1. The microchannel plate 2 can conduct convection heat exchange with the air, and the air carries away the heat. This reciprocating cycle transfers heat, thereby cooling the electronic device.

[0050] However, the structure and process of the microchannel radiator in the related art are relatively complicated. This is because, firstly, both the base 1 and the top seat 3 need to form a cavity, and both the base 1 and the top seat 3 need to be welded by an upper cover and a lower cover. Secondly, in order to enhance the heat exchange capacity, the base 1 also needs to sinter aluminum powder. In order to improve the structural strength, connecting columns need to be added to the cavities of the base 1 and the top seat 3. The complex structure will inevitably increase the complexity of the process. Thirdly, the various components of the microchannel radiator need to be connected by welding or bonding. Large-area welding or bonding will also have void problems caused by bubbles, thereby reducing the yield of the product. Therefore, the complex structure, complex process, low yield and other factors caused by one or more of the above reasons will lead to a high cost of the microchannel radiator.

[0051] The specific implementation of the radiator and electronic device provided in the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0052] Reference Figure 2 and Figure 3 As shown, an embodiment of the present application provides an electronic device, which includes an electronic device and a heat sink 10. The heat sink 10 is in thermal contact with the electronic device 20 to be cooled, and is used to dissipate heat for the electronic device 20.

[0053] Thermal contact includes direct contact and indirect contact with the electronic device through other heat exchangers or heat sinks. The heat exchanger can be made of a highly thermally conductive material such as an aluminum substrate and have multiple bonding surfaces to fully bond with the electronic device 20 and the heat sink 10 to achieve heat transfer between them. The heat sink can be another microchannel heat exchanger or a PCM heat exchanger, etc. Among the multiple heat sinks and electronic devices 20, at least two are bonded to achieve heat transfer. In some embodiments, thermally conductive silicone is also used for bonding to enhance thermal conductivity.

[0054] The electronic device 20 may be various types of semiconductor devices, for example, a chip, an IGBT (Insulated Gate Bipolar Transistor) module, a diode, or other heating devices, which is not specifically limited in the embodiment of the present application.

[0055] In one embodiment, the heat sink 10 includes a first heat dissipation component 100. Figures 3 to 12 As shown, the first heat exchanger 110 includes a first connecting section 111 and at least two second connecting sections 112 folded in half. The first connecting section 111 extends along a first direction, and the second connecting section 112 extends along a second direction. The first connecting section 111 is connected to one end of the second connecting section 112 facing the second heat exchanger 210. The first connecting section 111 and the second connecting section 112 are integrally formed and may be formed by multiple bending operations.

[0056] Based on the above embodiments, Figures 4 to 13 As shown, an embodiment of the present application also provides a heat sink 10, which includes a first heat dissipation component 100 and a second heat dissipation component 200. The first heat dissipation component 100 includes at least one first heat exchange component 110, and the second heat dissipation component 200 is used to thermally contact the electronic device 20 to be dissipated, thereby achieving thermally conductive contact between the heat sink 10 and the electronic device 20.

[0057] The first heat exchange element 110 has at least two first flow channels 113 therein. The at least two first flow channels 113 are arranged along the third direction. The extending direction of the first flow channels 113 is consistent with the extending direction of the first heat exchange element 110 .

[0058] The first direction, the second direction, and the third direction are different directions. In a specific embodiment, the first direction, the second direction, and the third direction are perpendicular to each other. The first direction can refer to the X direction in the accompanying drawings, the second direction can refer to the Y direction in the accompanying drawings, and the third direction can refer to the Z direction in the accompanying drawings.

[0059] It should be noted that verticality is not absolute verticality in the mathematical sense, and processing errors and deviations within a small angle, such as within 10 degrees, are allowed.

[0060] It should be noted that the first heat exchanger 110 can be a structure formed by multiple bending of a heat pipe or a microchannel plate. The first heat exchanger 110 is a three-dimensional structure. For the convenience of description and understanding, the first heat exchanger 110 can be projected onto the XY plane, so that a two-dimensional plane structure can be obtained. At this time, the first connecting section 111 and the second connecting section 112 can be regarded as linear structures.

[0061] In some embodiments, the first connecting section 111 has a first heat-conducting surface on the side facing away from the second connecting section 112, and the second heat-dissipating assembly 200 has a second heat-conducting surface on the side facing the first heat exchanger. The first heat-conducting surface and the second heat-conducting surface are in thermal contact with each other, and the second heat-dissipating assembly 200 is configured to be in thermal contact with the electronic device. Thus, after the first heat-conducting surface and the second heat-conducting surface are in contact with each other, heat can be efficiently transferred between them, thereby allowing heat from the electronic device to be efficiently transferred to the first heat-dissipating assembly 100 through the second heat-dissipating assembly 200, thereby improving the heat dissipation effect of the heat sink 10.

[0062] Specifically, the second heat dissipation component 200 may include at least one of a second heat exchange element 210 and a heat exchange base plate 220, the second heat exchange element 210 has a first surface on the side facing the first heat exchange element 110, the heat exchange base plate 220 has a second surface on the side facing the first heat exchange element 110, and the second heat conduction plane includes the first surface and / or the second surface.

[0063] That is, the second heat dissipation assembly 200 may include a second heat exchange element 210, the second heat exchange element 210 is connected between the first heat exchange element 110 and the electronic device, and the first connecting section 111 may be in thermal contact with the first surface. Alternatively, the second heat dissipation assembly 200 may include a heat exchange base plate 220, the heat exchange base plate 220 is connected between the first heat exchange element 110 and the electronic device, and the first connecting section 111 may be in thermal contact with the second surface. Alternatively, the second heat dissipation assembly 200 may include both the second heat exchange element 210 and the heat exchange base plate 220, the first connecting section 111 may be in thermal contact with the second surface, and the first heat exchange element 110 may be in thermal contact with the electronic device through the heat exchange base plate 220 and the second heat exchange element 210.

[0064] In an embodiment of the present application, the second heat dissipation component 200 is used to make thermal contact with the electronic device 20 to be dissipated, thereby transferring the heat of the electronic device 20 to the second heat dissipation component 200. After that, the second heat dissipation component 200 can transfer part of the heat to the air, thereby allowing the second heat dissipation component 200 to dissipate heat for the electronic device 20. At the same time, the second heat dissipation component 200 can also transfer part of the heat to the first heat dissipation component 100, thereby allowing the first heat dissipation component 100 to dissipate heat for the electronic device 20. In this way, the first heat dissipation component 100 and the second heat dissipation component 200 can work together to cool the electronic device 20 to be dissipated.

[0065] The first heat dissipation component 100 may include a first heat exchange element 110, which has a first flow channel 113. A phase change medium can circulate in the first flow channel 113. The phase change medium absorbs heat and vaporizes when heated, and condenses and liquefies when cooled. In this way, the phase change medium circulates in the first flow channel 113 through its own morphology change, thereby absorbing heat from the electronic device 20 and transferring the heat to the air, so that the radiator 10 can achieve the heat dissipation function.

[0066] In order to reduce the structural and process complexity of the radiator 10, the first heat exchanger 110 can be processed by continuous bending. In this way, the top seat 3 and the base 1 in the related technology can be eliminated, and then the cavity and connecting column structures of the top seat 3 and the base 1 are eliminated, and the processes such as sintering aluminum powder of the base 1 are reduced, thereby reducing the structural complexity and process complexity of the radiator 10.

[0067] Specifically, refer to Figure 9 、 Figure 11 and Figure 13As shown, the first heat exchange element 110 may include at least one first connecting section 111 and at least two second connecting sections 112, the two adjacent second connecting sections 112 are folded in half, the first connecting section 111 is connected between the two adjacent second connecting sections 112, and the first connecting section 111 is connected to one end of the second connecting section 112 facing the electronic device 20, so that the first connecting section 111 is connected to the second heat exchange element 210.

[0068] Or, refer to Figure 12 As shown, in two adjacent second connecting sections 112, the first connecting section 111 connects at least one of the two adjacent second connecting sections 112, the first connecting section 111 is connected to the side of one second connecting section 112 away from the other second connecting section 112, and the first connecting section 111 is connected to one end of the second connecting section 112 facing the electronic device 20, so that the first connecting section 111 is connected to the second heat exchange member 210.

[0069] In this way, the first connecting section 111 absorbs the heat of the electronic device 20 through the second heat exchange element 210, and the phase change medium located in the first connecting section 111 vaporizes into gas after absorbing the heat and flows upward along the second connecting section 112. After the second connecting section 112 exchanges heat with the air, the heat of the phase change medium can be transferred to the air, and then the phase change medium located in the second connecting section 112 is condensed and liquefied, and flows back to the first connecting section 111 under the action of capillary force and gravity to continue absorbing the heat of the electronic device 20.

[0070] In this way, the radiator 10 eliminates the base 1 and the top 3 in the related art, thereby simplifying the structure and process of the radiator 10. The phase change medium can still circulate efficiently in the first heat exchange element 110, thereby effectively cooling the electronic device 20.

[0071] For example, the first heat dissipation assembly 100 may include only one first heat exchanger 110, which may include a plurality of first connecting sections 111 and a plurality of second connecting sections 112, with two adjacent second connecting sections 112 folded in half. The plurality of first connecting sections 111 and the plurality of second connecting sections 112 are integrally formed by bending.

[0072] For another example, the first heat dissipation component 100 may include several first heat exchange elements 110, and the several first heat exchange elements 110 are arranged along the first direction. Each first heat exchange element 110 may include a first connecting section 111 and two second connecting sections 112, and the two second connecting sections 112 are folded in half, and the first connecting section 111 is connected to the two second connecting sections 112.

[0073] The heat sink 10 provided in the embodiment of the present application includes a first heat sink assembly 100 and a second heat sink assembly 200. The first heat sink assembly 100 includes a first heat exchanger 110, the second heat exchanger 200 includes a second heat exchanger 210, and the first heat exchanger 110 includes a first connecting section 111 and a second connecting section 112. The second heat exchanger 210 is configured to contact the electronic device 20 to absorb heat from the electronic device 20. The second connecting section 112 is folded in half, and the first connecting section 111 is configured to connect to the second heat exchanger 210 so that the first connecting section 111 absorbs heat from the electronic device 20 through the second heat exchanger 210, thereby allowing the phase change medium to circulate within the first connecting section 111 and the second connecting section 112. In this way, the phase change medium can be efficiently circulated within the first heat exchanger 110, and the structure and process of the heat sink 10 can be simplified. The first heat exchanger 110 is integrally formed by a bending process. After the phase change medium is filled into the first heat exchanger 110, the whole can be completed by simply sealing it with the end cover. Similarly, after the second heat exchanger 210 is filled with the phase change medium, the whole can be completed by sealing it with the end cover. The first heat exchanger 110 and the second heat exchanger 210 are used together to achieve a 3D heat dissipation effect.

[0074] Reference Figure 7 、 Figure 8 、 Figure 12 and Figure 13 As shown, in a possible implementation, the first heat exchanger 110 further includes a third connecting section 114, which connects two adjacent second connecting sections 112, and is located at one end of the second connecting section 112 away from the second heat exchanger 210, and the first flow channel 113 extends along the first connecting section 111, the second connecting section 112, the third connecting section 114 and the second connecting section 112 in sequence. Furthermore, the first heat exchanger 110 can be composed of multiple groups such as Figure 12 or Figure 13 The structure shown is composed of an integral molding.

[0075] In this way, the phase change medium located in the first connecting section 111 absorbs heat and evaporates into gas, and flows upward along the second connecting section 112. The two adjacent second connecting sections 112 can be connected through the third connecting section 114, and the phase change medium can continue to flow to the third connecting section 114. After the second connecting section 112 and the third connecting section 114 exchange heat with the air, the heat of the phase change medium can be transferred to the air, and then the phase change medium located in the second connecting section 112 and the third connecting section 114 is condensed and liquefied, and flows back to the first connecting section 111 under the action of capillary force and gravity to continue absorbing heat from the electronic device 20.

[0076] Furthermore, during processing, the first connecting segment 111, the second connecting segment 112, the third connecting segment 114, and the second connecting segment 112 are bent sequentially in this order, so that the first heat exchange element 110 can be integrally formed using a single microchannel plate, thereby simplifying the process of the first heat exchange element 110. Multiple sets of the first connecting segment 111, the second connecting segment 112, and the third connecting segment 114 can also be integrally formed by sequentially bending.

[0077] It is understood that the first heat exchange element 110 is integrally formed by bending the first connecting section 111, the second connecting section 112, and the third connecting section 114. To fill the first flow channel 113 with the phase change medium, filling ports can be provided at both ends of the first flow channel 113. After filling, the filling ports can be sealed by welding, sintering, or other processing techniques, thereby sealing both ends of the first flow channel 113. Furthermore, the integrally formed filling ports can also be sealed by welding or sintering. Compared to existing technologies, the difficulty of welding and sintering is greatly reduced, thereby reducing the complexity of the structure and process.

[0078] Reference Figure 5 and Figure 6 As shown, in one possible implementation, the first heat dissipation assembly 100 further includes a third heat exchange member 120. A first gap is defined between two adjacent second connecting segments 112 located at both ends of the first connecting segment 111, and a second gap is defined between two adjacent second connecting segments 112 located at both ends of the third connecting segment 114. The third heat exchange member 120 is disposed in at least one of the first gap and the second gap.

[0079] For example, the third heat exchange element 120 can be a fin to increase the heat dissipation area and improve the heat dissipation capacity. The heat dissipation fin can be formed by various forms such as aluminum extrusion, skiving, cold forging, stamping, folding, and snap-fitting, which are not limited in this embodiment of the application.

[0080] That is, the third heat exchange element 120 is disposed in the first gap, or the third heat exchange element 120 is disposed in the second gap, or the third heat exchange element 120 is disposed in the first gap and the second gap.

[0081] It should be noted that no matter whether there is one or more first heat exchange elements 110, as long as there is a first gap and / or a second gap between two adjacent second connecting sections 112, a third heat exchange element 120 can be set in the first gap and / or the second gap. The surface area of the third heat exchange element 120 is larger, the third heat exchange element 120 can absorb the heat of the first heat exchange element 110, and the third heat exchange element 120 can exchange heat with the air. In this way, the heat of the electronic device 20 can be efficiently transferred to the air through the third heat exchange element 120, thereby improving the heat dissipation efficiency of the radiator 10.

[0082] In some embodiments, the first gap is larger than the second gap. That is, when the first heat exchange member 110 has a first connecting section 111 and a third connecting section 114, the extension length of the first connecting section 111 along the first direction is larger than the extension length of the third connecting section 114 along the first direction.

[0083] This is because the first connecting section 111 needs to be connected to the second heat exchanger 210 to absorb the heat of the electronic device 20. The larger the contact area between the first connecting section 111 and the second heat exchanger 210, the better the heat conduction effect between the two. Therefore, the extension length of the first connecting section 111 along the first direction can be set to be larger, and the extension length of the third connecting section 114 along the first direction can be set to be smaller, so that when the extension length of the electronic device 20 along the second direction is effective, the first heat exchanger 110 can have more second connecting sections 112, thereby increasing the surface area of the first heat exchanger 110, thereby improving the heat dissipation effect of the first heat exchanger 110.

[0084] In some embodiments, there are at least two first heat exchange elements 110 , and the at least two first heat exchange elements 110 are arranged along the first direction.

[0085] It is understandable that when there are multiple first heat exchange elements 110, each first heat exchange element 110 can be integrally formed using a microchannel plate, and then the multiple first heat exchange elements 110 are welded or bonded to the second heat exchange element 210 along the first direction to achieve heat transfer between the two.

[0086] The first heat exchange element 110 may be Figure 8 、 Figure 9 、 Figure 10 Any one or more structures in the can be selected according to the setting needs.

[0087] In a possible implementation, the third connecting segment 114 is arc-shaped, and the first connecting segment 111 and the second connecting segment 112 are connected in an arc transition.

[0088] In this way, the third connecting segment 114 is arc-shaped, which is beneficial to reducing the extension length of the third connecting segment 114 along the first direction, and is beneficial to folding in half to form the second connecting segments 112 at both ends of the third connecting segment 114. The arc transition connection between the first connecting segment 111 and the second connecting segment 112 is beneficial to bending processing.

[0089] In a possible implementation, the second heat exchange element 210 has a second flow channel therein, and the second flow channel extends along the first direction or the third direction.

[0090] In this way, the phase change medium can circulate in the second flow channel. When the temperature of the electronic device 20 is uneven, the two ends of the second flow channel are also heated unevenly, causing the phase change medium at one end of the second flow channel to absorb heat and vaporize and flow to the other end. After that, the phase change medium condenses and liquefies and flows back. In this way, the reciprocating cycle can enable the second heat exchange element 210 to cool the parts of the electronic device 20 with higher temperatures, thereby improving the temperature uniformity of the electronic device 20.

[0091] In some embodiments, the extension direction of the second flow channel is consistent with the extension direction of the second heat exchange element 210, and the extension direction of the second flow channel forms an angle with the horizontal direction, wherein the angle is greater than or equal to 0° and less than or equal to 30°.

[0092] In this way, when the second flow channel extends along the first direction or the third direction, one end of the second flow channel can be tilted relative to the other end, thereby increasing the gravitational potential energy of the phase change medium in the second flow channel, so that the phase change medium can quickly flow back under the action of the gravitational potential energy.

[0093] It should be noted that when the second heat exchange element 210 is tilted relative to the horizontal direction, the surface of the electronic device 20 in contact with the second heat exchange element 210 can also be tilted so that the second heat exchange element 210 is in close contact with the electronic device 20.

[0094] It should be understood that to allow the second flow channel to be filled with the phase-change medium, filling ports can be provided at both ends of the second flow channel. After filling, the filling ports can be sealed through processes such as welding and sintering, thereby sealing both ends of the second flow channel and allowing the phase-change medium to circulate within the second flow channel. Furthermore, the second heat exchanger 210 can also be integrally formed, and the integrally formed filling ports can also be sealed through welding or sintering. Compared to existing technologies, the difficulty of welding and sintering is greatly reduced, thereby reducing the complexity of the structure and process.

[0095] Reference Figure 4 and Figure 5 As shown, in one possible implementation, the first heat exchange element 110 is connected to the heat exchange base plate 220, the heat exchange base plate 220 has a groove on the side facing away from the first heat exchange element 110, the second heat exchange element 210 is arranged in the groove, and the second heat exchange element 210 is in thermal contact with the heat exchange base plate 220 and / or the electronic device 20.

[0096] That is, in this setting, the heat exchange base plate 220 is located on the side of the first heat exchange element 110 facing the electronic device 20, and the heat exchange base plate 220 is used to thermally contact the electronic device 20. The first heat exchange element 110 can transfer heat with the second heat exchange element 210 through the heat exchange base plate 220. In this way, by setting the heat exchange base plate 220 on the side of the radiator 10 facing the electronic device 20, and then installing the first heat exchange element 110 and the second heat exchange element 210 through the heat exchange base plate 220, and connecting the heat exchange base plate 220 to the electronic device 20, the installation convenience of the radiator 10 and the structural strength of the radiator 10 are improved.

[0097] In some embodiments, the heat exchange base plate 220 has a third surface on a side facing away from the first heat exchange element 110 , and the third surface is configured to be in thermal contact with the electronic device 20 .

[0098] The radiator 10 provided in the embodiment of the present application, the first heat exchange element 110, the second heat exchange element 210, the third heat exchange element 120 and the heat exchange base plate 220 can all be processed in an integrated molding manner, which can effectively simplify the structure and process of the radiator 10, thereby reducing the cost of the radiator 10. Moreover, since the connection area between the various parts is reduced, large-area bubbles generated by the connection can be reduced, thereby reducing the thermal resistance of the radiator 10 and improving the production yield of the radiator.

[0099] When the radiator 10 includes a first heat exchange element 110, a second heat exchange element 210, a third heat exchange element 120 and a heat exchange base plate 220, the microchannel plate can be first bent to form the first heat exchange element 110, and then the first heat exchange element 110 and the heat exchange base plate 220 are welded or bonded, and then the second heat exchange element 210 is embedded or bonded to the groove of the heat exchange base plate 220, and finally the third heat exchange element 120 is welded to the first gap and the second gap.

[0100] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A radiator, characterized in that: comprising a first heat dissipation assembly, wherein the first heat dissipation assembly comprises at least one first heat exchange element; The first heat exchange member includes a first connecting section and at least two second connecting sections folded in half, the first connecting section and the second connecting section being integrally formed, the first connecting section extending along a first direction, the second connecting section extending along a second direction, the first connecting section connected to one end of the second connecting section, and the first connecting section being configured to be in thermal contact with the electronic device to be dissipated heat; The first heat exchange element has at least two first flow channels therein, and the at least two first flow channels are arranged along the third direction. The extension direction of the first flow channels is consistent with the extension direction of the first heat exchange element.

2. The radiator according to claim 1, characterized in that The first heat exchange element further includes a third connecting section, the third connecting section connecting two adjacent second connecting sections, and the third connecting section is located at an end of the second connecting section away from the first connecting section, and the first flow channel extends along the first connecting section, the second connecting section, the third connecting section, and the second connecting section in sequence; The first flow channel is filled with phase change medium, and both ends of the first flow channel are sealed.

3. The radiator according to claim 2, characterized in that The first heat dissipation assembly further includes a third heat exchange member, wherein a first gap is formed between two adjacent second connecting segments located at both ends of the first connecting segment, and a second gap is formed between two adjacent second connecting segments located at both ends of the third connecting segment; The third heat exchange element is disposed in at least one of the first gap and the second gap.

4. The radiator according to claim 3, characterized in that The first gap is larger than the second gap; the third connecting segment is arc-shaped, and the first connecting segment and the second connecting segment are connected by an arc transition; the first direction, the second direction and the third direction are perpendicular to each other.

5. The radiator according to any one of claims 1 to 4, characterized in that: There are at least two first heat exchange members, and the at least two first heat exchange members are arranged along the first direction.

6. The radiator according to any one of claims 1 to 4, characterized in that: It also includes a second heat dissipation component, wherein the first connecting section has a first heat-conducting plane on a side facing away from the second connecting section, and the second heat dissipation component has a second heat-conducting plane on a side facing the first heat exchanger, the first heat-conducting plane is in thermal contact with the second heat-conducting plane, and the second heat dissipation component is used to be in thermal contact with the electronic device.

7. The radiator according to claim 6, characterized in that The second heat dissipation component includes a second heat exchange element, the second heat exchange element has a first surface on a side facing the first heat exchange element, and the second heat conducting plane includes the first surface; And / or, the second heat dissipation assembly includes a heat exchange base plate, the heat exchange base plate has a second surface on a side facing the first heat exchange element, and the second heat conducting plane includes the second surface.

8. The radiator according to claim 6, characterized in that The second heat dissipation assembly includes a second heat exchange element and a heat exchange base plate, the heat exchange base plate has a second surface on a side facing the first heat exchange element, and the second heat conducting plane includes the second surface; The heat exchange bottom plate has a third surface on a side facing away from the first heat exchange element, and the third surface is used for heat-conducting contact with the electronic device; The heat exchange bottom plate has a groove on a side facing away from the first heat exchange element. The second heat exchange element is arranged in the groove and is in thermal contact with the heat exchange bottom plate and / or the electronic device.

9. The radiator according to claim 8, characterized in that The second heat exchange member is in the shape of a flat plate and has a second flow channel therein. The extension direction of the second flow channel is consistent with the length direction of the side of the second heat exchange member, and the extension direction of the second flow channel forms an angle with the horizontal direction, and the angle is greater than or equal to 0° and less than or equal to 30°. The second flow channel is filled with a phase change medium, and both ends of the second flow channel are sealed.

10. An electronic device, characterized in that: The heat sink comprises an electronic device and the heat sink according to any one of claims 1 to 9, wherein the heat sink is in thermal contact with the electronic device.

Images