Heat exchange part, heat exchange module and electronic equipment

Abstract

The embodiment of the utility model discloses a heat exchange part, a heat exchange module and electronic equipment, the heat exchange part comprises a cover plate layer and a substrate layer, and the cover plate layer comprises a first layer; the base plate layer comprises a second layer, the melting point of the second layer is different from that of the first layer, and a first runner groove is formed in the side, close to the cover plate layer, of the base plate layer; one side, close to the second layer, of the first layer is provided with a first connecting area, one side, close to the first layer, of the second layer is provided with a second connecting area, and the second connecting area is welded to the first connecting area, so that the cover plate layer and the base plate layer are in sealed connection; and the cover plate layer and the substrate layer define a flow channel at the first flow channel groove. Therefore, the sealing performance and the connecting strength of the connecting area of the substrate layer and the cover plate layer can be enhanced by utilizing the melting point difference of materials of the connecting area of the substrate layer and the cover plate layer.

Description

Technical Field

[0001] The utility model relates to the technical field of heat transfer, and more specifically, to a heat exchange component, a heat exchange module and an electronic device. Background Art

[0002] As electronic devices become increasingly integrated, heat dissipation becomes a key factor restricting their performance. Liquid cooling plates, as highly efficient heat dissipation components, are widely used in various high-power density electronic devices.

[0003] Liquid cooling plates typically consist of a cover layer and a base layer. The base layer has flow channels, and the cover layer covers the base layer to form a sealed connection. However, due to the different materials of the two, the sealing effect is less than ideal. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a new type of heat exchange component, heat exchange module and electronic equipment.

[0005] According to one aspect of the present utility model, a heat exchange element is provided.

[0006] The heat exchange element comprises:

[0007] a cover layer, the cover layer comprising a first layer;

[0008] A substrate layer, the substrate layer including a second layer having a different melting point from the first layer, and a first flow channel groove is formed on a side of the substrate layer close to the cover layer;

[0009] The first layer has a first connection area on one side close to the second layer, and the second layer has a second connection area on one side close to the first layer. The second connection area is welded to the first connection area so that the cover layer and the substrate layer form a sealed connection, and the cover layer and the substrate layer form a flow channel at the first flow channel groove.

[0010] Optionally, along the thickness direction of the heat exchange element, the second connection area is located opposite to the first connection area.

[0011] Optionally, the first layer is a metal layer or a polymer material layer; and / or the second layer is a metal layer or a polymer material layer.

[0012] Optionally, a connection groove and / or a connection protrusion is provided on the first connection area, and the second connection area is sealedly connected to the first connection area.

[0013] Optionally, the melting point of the second layer is lower than the melting point of the first layer.

[0014] Optionally, a linear connection groove is provided on the first connection area, and the second connection area is embedded in the linear connection groove to form a circumferential seal.

[0015] Optionally, a plurality of grooves are provided on the first connection area, and the second connection area is embedded in the grooves to form a circumferential seal.

[0016] Optionally, an annular connecting groove is provided on the first connecting area, and the second connecting area is embedded in the annular connecting groove to form a seal.

[0017] Optionally, the ratio of the depth of any one of the linear connecting groove, the groove and the annular connecting groove to the thickness of the cover plate layer is in a range of 1:4 to 3:4.

[0018] Optionally, the ratio of the depth of any one of the linear connecting groove, the groove and the annular connecting groove to the thickness of the cover plate layer is 1:2.

[0019] Optionally, a through hole is opened on the cover plate layer, and on a transverse plane of the cover plate layer, the first connection area is arranged around the through hole, and a gap is provided between the first connection area and the through hole.

[0020] Optionally, the second connection area is connected to the first connection area by laser welding, ultrasonic welding, hot pressing welding, friction welding, brazing or diffusion welding.

[0021] According to another aspect of the present invention, a heat exchange module is provided, comprising a micro pump and the above-mentioned heat exchange element.

[0022] Optionally, the heat exchange element has a first working fluid inlet and a first working fluid outlet, and the micropump has a second working fluid inlet and a second working fluid outlet, the first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet.

[0023] According to another aspect of the present invention, an electronic device is provided, comprising the above-mentioned heat exchange element or the above-mentioned heat exchange module.

[0024] One technical effect of the embodiments of the present disclosure is:

[0025] The heat exchanger includes a cover layer and a substrate layer, the cover layer includes a first layer; the substrate layer includes a second layer, the second layer has a different melting point from the first layer, and a first flow channel is provided on a side of the substrate layer close to the cover layer; the first layer has a first connection area on a side close to the second layer, and the second layer has a second connection area on a side close to the first layer, the second connection area is welded to the first connection area to form a sealed connection between the cover layer and the substrate layer, and the cover layer and the substrate layer form a flow channel at the first flow channel.

[0026] This allows the difference in melting points between the materials in the connection area between the base and cover layers to be utilized to enhance the sealing and connection strength of the connection area, thereby improving both reliability and stability, and thus ensuring the stable operation of the heat exchanger. Furthermore, the provision of two connection areas, the first and second, can avoid issues such as liquid and air leakage that may exist with traditional connection methods, improving the sealing performance of the heat exchanger and thus ensuring the safe and stable operation of the electronic equipment using the heat exchanger.

[0027] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0029] Figure 1 is a schematic diagram of a heat exchange element according to an embodiment of the present disclosure;

[0030] Figure 2 is a schematic diagram of a first connection area according to an embodiment of the present disclosure;

[0031] Figure 3 is a schematic diagram of another first connection area according to an embodiment of the present disclosure;

[0032] Figure 4 is a schematic diagram of another first connection area according to an embodiment of the present disclosure;

[0033] Figure 5 This is a schematic diagram of another first connection area of an embodiment of the present disclosure.

[0034] Description of reference numerals:

[0035] 1. Cover plate layer; 111. First working fluid inlet; 112. First working fluid outlet; 2. Base plate layer; 21. First flow channel groove; 3. Linear connecting groove; 4. Groove; 5. Annular connecting groove. DETAILED DESCRIPTION

[0036] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention.

[0037] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present invention, its application, or uses.

[0038] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0039] In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0040] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0041] An embodiment of the present utility model provides a heat exchange component, which can be used in heat exchange of electronic devices such as tablet computers, laptop computers, VR (Virtual Reality) products, AR (Augmented Reality) products, and watches.

[0042] like Figure 1 As shown, the heat exchange element provided by the embodiment of the present utility model includes:

[0043] Cover layer 1, wherein the first layer is the first layer;

[0044] The substrate layer 2, wherein the second layer is the second layer, the second layer has a different melting point from the first layer, and a first flow channel 21 is provided on a side of the substrate layer 2 close to the cover layer 1;

[0045] The first layer has a first connection area on one side close to the second layer, and the second layer has a second connection area on one side close to the first layer. The second connection area is welded to the first connection area so that the cover layer 1 and the substrate layer 2 form a sealed connection, and the cover layer 1 and the substrate layer 2 form a flow channel at the first flow channel groove 21.

[0046] Specifically, depending on actual design requirements, the second layer can be a metal layer to meet the strength requirements of the substrate layer 2; the second layer can also be a polymer material layer to meet the lightweight requirements of the substrate layer 2; the second layer can also be a metal layer or a polymer material layer, and the substrate layer 2 also includes the other of the metal layer and the polymer material layer, which can improve the overall performance of the substrate layer 2. In addition, depending on the actual design, the substrate layer 2 can also include other material layers to form a multi-layer structure.

[0047] Similarly, depending on actual design requirements, the first layer can be a metal layer to meet the strength requirements of the cover layer 1; the first layer can also be a polymer material layer to meet the lightweight requirements of the cover layer 1; the first layer can also be a metal layer or a polymer material layer, and the cover layer 1 also includes the other of the metal layer and the polymer material layer to improve the overall performance of the cover layer 1. In addition, depending on the actual design, the cover layer 1 can also include other material layers to form a multi-layer structure.

[0048] In the present embodiment, the second layer and the first layer have different melting points, that is, the two opposing layers, substrate layer 2 and cover layer 1, have different melting points. For example, the second layer and the first layer can be made of different materials, such as any two of metal materials, inorganic non-metallic materials, and polymer materials, which can result in a difference in melting points between the second layer and the first layer. The second layer and the first layer can also be made of the same type but different materials, such as different metal materials, different inorganic non-metallic materials, or different polymer materials, which can also result in a difference in melting points between the second layer and the first layer, thereby allowing the connection area between the substrate layer 2 and the cover layer 1 to be made of different materials.

[0049] The following description is made by taking two different types of materials, a metal layer and a polymer material layer, respectively, as an example. Inorganic non-metallic materials or other materials can also be used.

[0050] In one embodiment, when the second layer is a metal layer and the first layer is a polymer material layer, a second connection area is formed on the metal layer of the substrate layer 2, and a first connection area is formed on the polymer material layer of the cover layer 1, so that the second layer and the first layer are different types of materials.

[0051] In another embodiment, when the second layer is a polymer material layer and the first layer is a metal layer, a first connection area is formed on the metal layer of the cover layer 1, and a second connection area is formed on the polymer material layer of the substrate layer 2, so that the second layer and the first layer are different types of materials.

[0052] In addition, the arrangement of different materials in the connection area between the substrate layer 2 and the cover layer 1 can also enhance the flexible deformation capability of the heat exchange component, thereby meeting the use requirements of bendable electronic devices.

[0053] In summary, the connection area between the substrate layer 2 and the cover layer 1 is made of materials with different melting points. That is, the first connection area and the second connection area have different melting points. In the process of welding the first connection area and the second connection area, the difference in melting points of the materials in the connection area between the substrate layer 2 and the cover layer 1 can be used to enhance the sealing and connection strength of the connection area, thereby improving the reliability and stability of the sealed connection between the substrate layer 2 and the cover layer 1, and thus ensuring the stable operation of the heat exchanger. Moreover, the provision of the two connection areas can also avoid problems such as liquid leakage and air leakage that may exist in traditional connection methods, thereby improving the sealing performance of the heat exchanger, and thus ensuring the safe and stable operation of electronic equipment using the heat exchanger.

[0054] The first connection region can be formed through processes such as etching, surface activation, and laser cutting. The second connection region is typically positioned opposite the first connection region, allowing the lower melting point to partially melt during welding and form a strong bond with the higher melting point. Control of welding parameters such as temperature and pressure is necessary to prevent deformation of the lower melting point during welding, which could lead to overall structural failure.

[0055] Specifically, the first connection area may include a connection groove, a connection protrusion, or both, and the second connection area is embedded within the first connection area to form a seal. The first connection area may also have a roughened structure formed by surface treatment, and the second connection area is welded to the first connection area so that the second connection area forms a tight bond with the roughened structure.

[0056] The welding methods for the first and second connection areas include, but are not limited to, laser welding, ultrasonic welding, hot press welding, and friction welding. Welding the second and first connection areas together strengthens the bond between the base plate layer 2 and the cover plate layer 1, making them less susceptible to falling off or breaking, and extending the lifespan and durability of the heat exchange module.

[0057] like Figure 1 As shown, in this embodiment, a first flow channel 21 is provided on one side of the substrate layer 2 near the cover layer 1. That is, the first flow channel 21 is a groove in the substrate layer 2, allowing the working medium to flow smoothly within the flow channel at the first flow channel 21, thereby achieving efficient heat conduction. Furthermore, because the first flow channel 21 is a groove in the substrate layer 2, the substrate layer 2 itself can also form a single-sided seal on the flow channel at the first flow channel 21, thereby reducing the difficulty of assembling the heat exchange component and improving assembly efficiency.

[0058] Depending on the actual design, the shape of the first flow channel 21 includes, but is not limited to, linear, serpentine, and spiral shapes to optimize the flow path and heat exchange efficiency of the working medium. Connectors or interfaces may also be provided at the inlet and outlet of the flow channel to facilitate connection to external heat exchange systems such as water pumps and radiators, thereby completing the heat exchange cycle.

[0059] Optionally, along the thickness direction of the heat exchange element, the second connection area is opposite to the first connection area, which can facilitate the sealed connection between the second connection area and the first connection area.

[0060] Optionally, the first layer is a metal layer or a polymer material layer; and / or the second layer is a metal layer or a polymer material layer.

[0061] Specifically, in one embodiment, the second layer can be set as a metal layer and the first layer can be set as a polymer material layer. The second connection area is formed on the metal layer of the substrate layer 2, and the first connection area is formed on the polymer material layer of the cover layer 1. The second connection area is welded to the first connection area. The polymer material layer in the first connection area can be locally melted and form a firm bond with the metal layer in the second connection area, thereby realizing a sealed connection between the substrate layer 2 and the cover layer 1.

[0062] Among them, setting the second layer as a metal layer can enhance the support force of the substrate layer 2 on the flow channel thereon, thereby ensuring the structural strength of the heat exchange component.

[0063] In another embodiment, the first layer may be a metal layer and the second layer may be a polymer layer. The polymer layer in the second connection area can be partially melted and form a strong bond with the metal layer in the first connection area, thereby achieving a sealed connection between the substrate layer 2 and the cover layer 1. In this case, the first flow channel 21 can be formed in the polymer layer of the substrate layer 2.

[0064] In another embodiment, the first layer and the second layer may be made of different metal materials, or the first layer and the second layer may be made of different polymer materials, and both layers can achieve reliable connection by utilizing the difference in melting points.

[0065] Optionally, there is a gap between the first flow channel groove 21 and the second connecting area.

[0066] In this embodiment, a gap is provided between the second connection area and the first flow channel 21, that is, a certain avoidance distance is maintained between the second connection area and the first flow channel 21. On the one hand, it can avoid the welding process of the second connection area from interfering with the first flow channel 21, and avoid the connection between the cover layer 1 and the substrate layer 2 from affecting the flow of the working medium in the flow channel, so as to ensure the heat exchange effect of the heat exchange component.

[0067] On the other hand, the setting of the gap between the second connection area and the first flow channel groove 21 can also prevent the working fluid from entering and exiting and causing erosion to the welding area between the first connection area and the second connection area, thereby ensuring the reliability of the sealed connection between the two and extending the service life and durability of the heat exchange component.

[0068] Optionally, a through hole is opened on the cover plate layer 1 , and on a transverse plane of the cover plate layer 1 , the first connection area is arranged around the through hole, and a gap is provided between the first connection area and the through hole.

[0069] In this embodiment, the cover layer 1 is provided with a through hole along the vertical direction, i.e., the longitudinal direction, and the through hole includes a first working fluid inlet 111 and a first working fluid outlet 112. The first working fluid inlet 111 and the first working fluid outlet 112 are respectively connected to the flow channel in the heat exchange element, so that the working fluid can enter the flow channel from the first working fluid inlet 111 and discharge the flow channel from the first working fluid outlet 112, thereby realizing the flow of the working fluid.

[0070] The first connection area can be arranged on the transverse plane of the cover layer 1, and is arranged around the through hole. That is, the first connection area surrounds the circumference of the through hole, which can achieve sealing between the substrate layer 2 and the cover layer 1 by using the first connection area while reducing the risk of liquid leakage, thereby improving the reliability of the heat exchange component.

[0071] In addition, a gap is provided between the first connection area and the through hole on the transverse plane of the cover layer 1, that is, a certain avoidance distance is maintained between the first connection area and the through hole. On the one hand, this can avoid interference of the welding process between the first connection area and the second connection area on the through hole, and avoid the connection between the substrate layer 2 and the cover layer 1 on the flow of the working medium in the heat exchanger, so as to ensure the normal and reliable operation of the heat exchanger.

[0072] On the other hand, the setting of the gap between the first connection area and the through hole can also prevent the working fluid from entering and exiting and causing erosion to the welding area of the first connection area and the second connection area, thereby ensuring the reliability of the sealed connection between the two and extending the service life and durability of the heat exchange component.

[0073] Optionally, the width of the gap is greater than or equal to 0.1 times the diameter of the through hole.

[0074] In this embodiment, the width of the gap is set to be no less than 0.1 times the diameter of the through hole, that is, the first connection area is located outside the area formed by 1.2 times the diameter of the through hole, so that a reliable avoidance distance can be formed between the first connection area and the through hole, which can avoid the welding process of the first connection area from interfering with the through hole, and avoid the connection between the substrate layer 2 and the cover layer 1 from affecting the flow of the working medium in the heat exchanger, so as to ensure the normal and stable operation of the heat exchanger, and also facilitate the welding process of the first connection area and the second connection area, thereby simplifying the processing difficulty of the heat exchanger.

[0075] Optionally, the width of the gap ranges from 0.1 times to 0.25 times the diameter of the through hole.

[0076] In this embodiment, the width of the gap is set between 0.1 and 0.25 times the diameter of the through-hole, that is, the first connection area is located outside the area formed by 1.2 times the diameter of the through-hole and within the area formed by 1.5 times the diameter of the through-hole. Setting the first connection area within the annular area defined by the area formed by 1.2 times the diameter of the through-hole and within the area formed by 1.5 times the diameter of the through-hole can avoid the through-hole while also enhancing the reliability of the sealed connection between the substrate layer 2 and the cover layer 1, reducing the risk of sealing failure.

[0077] Optionally, a connection groove and / or a connection protrusion is provided on the first connection area, and the second connection area is sealedly connected to the first connection area.

[0078] In this embodiment, the first connection area may include a groove, a protrusion, or both, and the second connection area is embedded within the first connection area to form a sealed connection. The number and distribution of the connection grooves and / or connection protrusions may be adjusted to enhance sealing performance based on actual sealing requirements.

[0079] Optionally, the melting point of the second layer is lower than that of the first layer, so that during welding, the second connection area of the second layer with a lower melting point can be partially melted and form a strong bond with the first connection area of the first layer with a higher melting point.

[0080] Optionally, a linear connection groove 3 is provided on the first connection area, and the second connection area is embedded in the linear connection groove 3 to form a circumferential seal.

[0081] In this embodiment, a linear connecting groove 3 can be formed in the first connecting region, for example, by etching, cutting, or other processes. Welding the first connecting region to the second connecting region can exploit the difference in melting points between the materials of the first and second connecting regions, allowing the second connecting region to partially melt and embed within the linear connecting groove 3, thereby forming a secure bond with the first connecting region. This achieves a sealed connection between the cover layer 1 and the substrate layer 2, thereby ensuring stable operation of the heat exchanger. The linear connecting groove 3 should be designed to avoid through-holes to prevent interference with the flow of the working medium within the flow channel.

[0082] According to design requirements, the shape of the linear connection groove 3 includes but is not limited to S-shape, arc shape, spiral shape, cross line shape and racetrack shape. Figure 2A cross-shaped linear connecting groove 3 is shown. The arrangement of the linear connecting groove 3 in this shape enables the first connecting area and the second connecting area to form a complete circle of sealing along the circumferential direction, thereby further enhancing the reliability of the sealing connection between the cover layer 1 and the substrate layer 2.

[0083] Optionally, a plurality of grooves 4 are formed on the first connection area, and the second connection area is embedded in the grooves 4 to form a circumferential seal.

[0084] In this embodiment, a groove 4, i.e., a depression or pit, can be formed in the first connection area, for example, by etching, cutting, or other processes. Welding the first connection area to the second connection area can utilize the difference in melting points between the materials of the first and second connection areas to partially melt the second connection area and embed it into the groove 4, thereby forming a strong bond with the first connection area. This can achieve a sealed connection between the cover plate layer 1 and the substrate layer 2, thereby ensuring stable operation of the heat exchange component.

[0085] According to design requirements, the cross-sectional shape of the groove 4 includes but is not limited to circular, elliptical, rectangular and irregular shapes. Figure 3 The figure shows a distribution condition of the grooves 4, in which some grooves 4 are arranged along the first circle of the outer periphery of the through hole, and other part of the grooves 4 are arranged along the second circle of the outer periphery of the through hole. The second circle is staggered with the first circle, so that the first connection area and the second connection area can be completely sealed along the circumferential direction by utilizing the multiple staggered grooves 4, thereby further enhancing the reliability of the sealed connection between the cover layer 1 and the substrate layer 2.

[0086] In another embodiment, the number of arranged circles of the grooves 4 may be increased to enhance the reliability of the circumferential sealing connection between the first connection area and the second connection area and reduce the risk of sealing failure.

[0087] Optionally, an annular connecting groove 5 is provided on the first connecting area, and the second connecting area is embedded in the annular connecting groove 5 to form a seal.

[0088] like Figure 4 As shown, in this embodiment, an annular connecting groove 5 is provided on the first connecting area to surround the circumference of the through hole. On the one hand, the gap between the annular connecting groove 5 and the through hole can be utilized to avoid the entry and exit of the working medium in the flow channel, so as to ensure the normal and stable operation of the heat exchanger; on the other hand, the provision of the annular connecting groove 5 surrounding the circumference of the through hole can enable the first connecting area and the second connecting area to form a complete circle of sealing along the circumferential direction, thereby further enhancing the reliability of the sealing connection between the cover layer 1 and the substrate layer 2.

[0089] Optionally, there are multiple annular connecting grooves 5 , and the multiple annular connecting grooves 5 are arranged at intervals.

[0090] like Figure 5 As shown, in this embodiment, a plurality of annular connecting grooves 5 can be provided with a common through hole along the circumferential direction, and the plurality of annular connecting grooves 5 can be used to further enhance the reliability of the circumferential sealing between the first connecting area and the second connecting area, thereby further enhancing the sealing connection between the cover layer 1 and the substrate layer 2, and avoiding the overall sealing failure of the heat exchange module caused by the failure of a single-layer seal, thereby extending the service life and durability of the heat exchange module.

[0091] Optionally, the ratio of the depth of any one of the linear connecting groove 3 , the groove 4 and the annular connecting groove 5 to the thickness of the cover plate layer 1 is in a range of 1:4 to 3:4.

[0092] In this embodiment, the connection grooves include but are not limited to linear connection grooves 3, grooves 4, and annular connection grooves 5. When the connection grooves are located on the cover plate layer 1, the ratio of the depth of the connection grooves to the thickness of the cover plate layer 1 is set in a range of 1:4 to 3:4, that is, the minimum depth of the connection grooves is 1 / 4 of the thickness of the cover plate layer 1, and the maximum depth of the connection grooves is 3 / 4 of the thickness of the cover plate layer 1, which can ensure the reliability of the sealed connection between the cover plate layer 1 and the substrate layer 2.

[0093] Optionally, the ratio of the depth of the connecting groove to the thickness of the cover plate layer 1 is 1:2.

[0094] In this embodiment, when the connecting groove is located on the cover layer 1, the ratio of the depth of the connecting groove to the thickness of the cover layer 1 is preferably 1 / 2, which can ensure that there is sufficient contact area between the second connecting area and the connecting groove, thereby ensuring that the second connecting area and the first connecting area form a good sealing effect, and can also simplify the opening of the connecting groove.

[0095] Optionally, the second connection area is connected to the first connection area by laser welding, ultrasonic welding, hot pressure welding, friction welding, brazing, or diffusion welding. The welding of the second connection area to the first connection area can strengthen the bond between the substrate layer 2 and the cover layer 1, making it less likely to fall off or break, and also extending the service life and durability of the heat exchange component.

[0096] Among them, ultrasonic welding and hot pressing welding are preferred, which can simplify the sealing process of the substrate layer 2 and the cover layer 1, reduce the difficulty of connection, and thus improve the processing efficiency of the heat exchange component.

[0097] The embodiment of the present utility model further provides a heat exchange module, comprising a micro pump and the above-mentioned heat exchange element.

[0098] Optionally, the heat exchange element has a first working fluid inlet 111 and a first working fluid outlet 112, and the micropump has a second working fluid inlet and a second working fluid outlet, the first working fluid inlet 111 and the first working fluid outlet 112 are respectively connected to the flow channel, and the first working fluid inlet 111 is connected to the second working fluid outlet, and the first working fluid outlet 112 is connected to the second working fluid inlet.

[0099] The first working medium inlet 111 and the first working medium outlet 112 are respectively located on the cover layer 1. In this way, the working medium can flow into the flow channel through the second working medium outlet and the first working medium inlet 111, and return to the micro pump from the flow channel through the first working medium outlet 112 and the second working medium inlet, thereby realizing the circulation of the working medium.

[0100] The present invention also provides an electronic device including the aforementioned heat exchange element or the aforementioned heat exchange module. The electronic device may be a small electronic device such as a tablet computer, a laptop computer, smart glasses, a smart watch, a smart headset, etc.

[0101] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0102] Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art will appreciate that the above examples are for illustration only and are not intended to limit the scope of the present invention. Those skilled in the art will appreciate that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A heat exchange element, characterized in that: include: A cover plate layer (1), the cover plate layer (1) comprising a first layer; A substrate layer (2), the substrate layer (2) comprising a second layer, the second layer having a different melting point from the first layer, and a first flow channel groove (21) being provided on a side of the substrate layer (2) close to the cover layer (1); The first layer has a first connection area on one side close to the second layer, and the second layer has a second connection area on one side close to the first layer. The second connection area is welded to the first connection area so that the cover layer (1) and the substrate layer (2) form a sealed connection, and the cover layer (1) and the substrate layer (2) form a flow channel at the first flow channel groove (21).

2. The heat exchange element according to claim 1, characterized in that: Along the thickness direction of the heat exchange element, the second connection area is opposite to the first connection area.

3. The heat exchange element according to claim 1, characterized in that: The first layer is a metal layer or a polymer material layer; and / or the second layer is a metal layer or a polymer material layer.

4. The heat exchange element according to claim 1, characterized in that: The first connection area is provided with a connection groove and / or a connection protrusion, and the second connection area is sealedly connected to the first connection area.

5. The heat exchange element according to claim 4, characterized in that: The second layer has a melting point lower than that of the first layer.

6. The heat exchange element according to claim 5, characterized in that: A linear connection groove (3) is provided on the first connection area, and the second connection area is embedded in the linear connection groove (3) to form a circumferential seal.

7. The heat exchange element according to claim 5, characterized in that: A plurality of grooves (4) are provided on the first connection area, and the second connection area is embedded in the grooves (4) to form a circumferential seal.

8. The heat exchange element according to claim 5, characterized in that: An annular connecting groove (5) is provided on the first connecting area, and the second connecting area is embedded in the annular connecting groove (5) to form a seal.

9. The heat exchange element according to any one of claims 6 to 8, characterized in that: The first connection area is provided with a linear connection groove (3), a plurality of grooves (4) or an annular connection groove (5), and the ratio of the depth of any one of the linear connection groove (3), the groove (4) and the annular connection groove (5) to the thickness of the cover plate layer (1) is in the range of 1:4 to 3:

4.

10. The heat exchange element according to claim 9, characterized in that: The ratio of the depth of any one of the linear connecting groove (3), the groove (4) and the annular connecting groove (5) to the thickness of the cover plate layer (1) is 1:

2.

11. The heat exchange element according to claim 1, characterized in that: A through hole is provided on the cover plate layer (1); on a transverse plane of the cover plate layer (1), the first connection area is arranged around the through hole, and a gap is provided between the first connection area and the through hole.

12. The heat exchange element according to claim 1, characterized in that: The second connection area is connected to the first connection area by laser welding, ultrasonic welding, hot pressing welding, friction welding, brazing or diffusion welding.

13. A heat exchange module, characterized in that: The heat exchange device comprises a micro pump and the heat exchange element according to any one of claims 1 to 12.

14. A heat exchange module according to claim 13, characterized in that: The heat exchange component has a first working fluid inlet (111) and a first working fluid outlet (112), and the micro pump has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet (111) and the first working fluid outlet (112) are respectively connected to the flow channel, and the first working fluid inlet (111) is connected to the second working fluid outlet, and the first working fluid outlet (112) is connected to the second working fluid inlet.

15. An electronic device, characterized in that: It comprises the heat exchange element according to any one of claims 1 to 12 or the heat exchange module according to any one of claims 13 to 14.

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