Module heat dissipation power supply

Abstract

The utility model discloses a power supply for module heat dissipation, which relates to the technical field of heat dissipation of power supplies and comprises a bottom plate and a cooling circulation mechanism, one side of the bottom plate is fixedly connected with the cooling circulation mechanism, the top of the cooling circulation mechanism is fixedly connected with an air channel, and the top of the air channel is fixedly connected with a separation composite plate. One side of each cooling circulation mechanism is fixedly connected with an anti-collision mechanism, the cooling circulation mechanisms are located on the left side and the right side of the bottom plate, and the two cooling circulation mechanisms are perpendicular to the bottom plate. Compared with a conventional common power supply, the power supply can improve the overall strength of the radiator, effectively enlarges the application range of the radiator, guarantees the good electrical insulation performance through the insulating film, prevents the interference between electric appliances, improves the heat insulation effect of the housing in a high-temperature environment, improves the performance of electrical equipment, and improves the reliability of the power supply. Performance and stability of the power supply are improved, and the insulating film can also provide electrical isolation and insulation protection between internal elements of the battery.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of power supply, in particular to a power supply with module heat dissipation. Background Art

[0002] A power supply is an electronic device that converts alternating current (AC) into direct current (DC) and supplies it to computers, televisions, and other electronic devices. It is an essential part of computers and other electronic devices because these devices require stable DC power to operate. A power supply typically includes components such as a transformer, rectifier, and filter to provide stable voltage and current output.

[0003] For example, a power supply heat dissipation structure with application number CN201720104899.0 is described. The power supply heat dissipation structure comprises a housing and a circuit module housed within the housing. The power supply heat dissipation structure includes: at least one heat sink disposed within the housing by insert injection molding, with the housing forming an inner material layer and an outer material layer on the inner and outer sides of the heat sink, respectively; a power component is disposed on the circuit substrate, and a notch is provided in the inner material layer of the housing corresponding to the position of the power component, so that the power chip contacts the heat sink through the notch. This utility model, through the above-mentioned technical means, can improve the heat dissipation efficiency of the power supply and simplify its assembly process, thereby achieving the purpose of reducing costs. However, this module-heated power supply relies solely on a cooling fan for heat dissipation, resulting in poor heat dissipation effect and easy heat accumulation, which can lead to power failure and aging of the power supply. In addition, the surface of the housing is fragile, has low drop and collision resistance, and is easily damaged. Therefore, in view of this, research and improvement are conducted to address the shortcomings of existing structures, and a module-heated power supply is proposed. Utility Model Content

[0004] The purpose of the present invention is to provide a power supply with modular heat dissipation to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a modular heat dissipation power supply, comprising a base plate and a cooling circulation mechanism, wherein one side of the base plate is fixedly connected to the cooling circulation mechanism, and the top of the cooling circulation mechanism is fixedly connected to an air duct, the top of the air duct is fixedly connected to a partition composite plate, and one side of the cooling circulation mechanism is fixedly connected to an anti-collision mechanism.

[0006] Preferably, the cooling circulation mechanism includes a pressurized pipe fixedly connected to one side of the base plate, and the top of the pressurized pipe is fixedly connected to a delivery pipe, and a coolant inlet is opened at the top of the delivery pipe, and a coolant outlet is provided on one side of the coolant inlet.

[0007] Preferably, the anti-collision mechanism includes a shock-absorbing rod fixedly connected to one side of the conveying pipe, and one side of the shock-absorbing rod is fixedly connected to an anti-collision plate, and one end of the anti-collision plate is fixedly connected to a radian block.

[0008] Preferably, an inner fin is fixedly connected to the top of the partition composite plate, and an outer fin is provided on the top of the inner fin, and a cover plate is fixed to the top of the outer fin.

[0009] Preferably, the top of the base plate is movably connected to a shell, and the interior of the shell is fixedly connected to an insulating film.

[0010] Preferably, the interior of the housing is movably connected to a mounting frame, and a heat dissipation fan is provided inside the mounting frame.

[0011] Preferably, a chipset is fixedly connected to the top of the base plate, and a battery pack is provided on one side of the chipset.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. The present invention adopts the arrangement of a cooling circulation mechanism and an anti-collision mechanism. When heat is generated inside the shell, cooling circulation mechanisms are arranged on both sides of the bottom plate. The coolant is transported through the coolant inlet. Under the action of the pressure pump inside the pressure pipe, the coolant circulates quickly, thereby accelerating the cooling of the power supply. The traditional power supply only relies on the cooling fan for heat dissipation, which has a poor heat dissipation effect and heat is easily accumulated, which will cause power failure and aging inside the power supply. In addition, the surface of the shell is fragile and has low anti-fall and anti-collision performance, making it easily damaged. The anti-collision mechanism added by the present invention protects the power supply and the cooling circulation mechanism. When the shock absorber rod and the anti-collision plate are subjected to external impact force, the shock absorber rod disperses most of the impact force, and the anti-collision rod avoids direct impact on the cooling circulation mechanism, thereby providing protection for the power supply.

[0014] 2. The utility model can improve the overall strength of the radiator and effectively expand its application range by setting up internal and external fins and insulating films. The insulating film ensures good electrical insulation, prevents interference between electrical appliances, and increases the thermal insulation effect of the casing in high temperature environments. The insulating film improves the performance of electrical equipment and improves the performance and stability of the power supply. The insulating film can also provide electrical isolation and insulation protection between the internal components of the battery. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the split structure of the main body of the utility model;

[0016] Figure 2 This is a schematic diagram of the three-dimensional structure of the main body of the utility model;

[0017] Figure 3This is a schematic diagram of the structure of the cooling cycle machine 2 of the present invention;

[0018] Figure 4 It is a structural diagram of the top of the shell 9 of the present invention.

[0019] In the figure: 1. Base plate; 2. Cooling circulation mechanism; 201. Coolant inlet; 202. Delivery pipe; 203. Pressurized pipe; 204. Coolant outlet; 3. Air duct; 4. Partition composite plate; 5. Anti-collision mechanism; 501. Shock absorber rod; 502. Anti-collision plate; 503. Curved block; 6. Inner fin; 7. Outer fin; 8. Cover plate; 9. Outer shell; 10. Insulation film; 11. Mounting frame; 12. Cooling fan; 13. Chip set; 14. Battery pack. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] like Figure 1-Figure 2 As shown, a module heat dissipation power supply includes a base plate 1 and a cooling circulation mechanism 2. The cooling circulation mechanism 2 is fixedly connected to one side of the base plate 1, and the top of the cooling circulation mechanism 2 is fixedly connected to an air duct 3. The top of the air duct 3 is fixedly connected to a partition composite plate 4, and one side of the cooling circulation mechanism 2 is fixedly connected to an anti-collision mechanism 5. The cooling circulation mechanism 2 is located on the left and right sides of the base plate 1. The two groups of cooling circulation mechanisms 2 are respectively distributed vertically to the base plate 1. The air duct 3 promotes air circulation. The anti-collision mechanism 5 is distributed on the upper and lower sides of the cooling circulation mechanism 2 to protect the cooling circulation mechanism 2.

[0022] like Figure 3-Figure 4 As shown, the cooling circulation mechanism 2 includes a pressurized pipe 203 fixedly connected to one side of the base plate 1, and the top of the pressurized pipe 203 is fixedly connected to the delivery pipe 202, and the top of the delivery pipe 202 is provided with a coolant inlet 201, and one side of the coolant inlet 201 is provided with a coolant outlet 204, the delivery pipe 202 and the interior of the pressurized pipe 203 are connected through, and a pressurized pump is provided inside the pressurized pipe 203 to accelerate the flow of the coolant.

[0023] Furthermore, the anti-collision mechanism 5 includes a shock-absorbing rod 501 fixedly connected to one side of the conveying pipe 202, and an anti-collision plate 502 is fixedly connected to one side of the shock-absorbing rod 501, and an arc block 503 is fixedly connected to one end of the anti-collision plate 502. The shock-absorbing rod 501 can reduce vibration and impact force, and protect the stability and safety of the cooling circulation mechanism 2. The arc block 503 is located on the left and right sides of the anti-collision plate 502 to alleviate the external impact on the anti-collision plate 502 to the greatest extent.

[0024] Furthermore, the top of the partition composite plate 4 is fixedly connected to the inner fin 6, and the top of the inner fin 6 is provided with an outer fin 7, the top of the outer fin 7 is fixed with a cover plate 8, the top of the bottom plate 1 is movably connected to the outer shell 9, and the inside of the outer shell 9 is fixedly connected with an insulating film 10, and a partition composite plate 4 is provided between the inner fin 6 and the outer fin 7. The inner fin 6 and the outer fin 7 form a strong turbulence in the air in the flow channel in different forms, and break and reorganize the flow boundary layer and the thermal boundary layer, thereby enhancing heat exchange.

[0025] Furthermore, the interior of the outer shell 9 is movably connected to a mounting frame 11, and a cooling fan 12 is provided inside the mounting frame 11. The top of the base plate 1 is fixedly connected to a chipset 13, and a battery pack 14 is provided on one side of the chipset 13. A mounting groove is provided inside the outer shell 9, and a filter is provided on the surface of the outer shell 9 to prevent dust from adhering to the surface of the cooling fan 12.

[0026] Working principle: When using the power supply with module heat dissipation, first, when the chipset 13 and battery pack 14 on the top of the base plate 1 start working, heat will be generated inside the shell 9. At this time, the coolant enters the delivery pipe 202 from the coolant inlet 201 through the coolant on one side of the cooling circulation mechanism 2. The pressure pump inside the pressure pipe 203 accelerates the flow rate of the coolant in the delivery pipe 202 on the other side. The wind channel 3 promotes air circulation, and the inner fins 6 and outer fins 7 on the upper and lower sides of the separating composite plate 4 interact to accelerate the heat exchange rate. The insulating film 10 inside the shell 9 can ensure good electrical insulation. The mounting frame 11 is connected to the shell 9, and then the shock absorbing rod 501 and the anti-collision plate 502 inside the anti-collision mechanism 5 on one side are delivered to protect the cooling circulation mechanism 2. Finally, the cooling fan 12 maintains air circulation inside the shell 9. The cooling fan 12 interacts with the cooling circulation mechanism 2 to accelerate the heat dissipation rate. This is the working principle of the power supply with module heat dissipation.

Claims

1. A module heat dissipation power supply, comprising a base plate (1) and a cooling circulation mechanism (2), characterized in that: A cooling circulation mechanism (2) is fixedly connected to one side of the bottom plate (1), and an air duct (3) is fixedly connected to the top of the cooling circulation mechanism (2), a partitioning composite plate (4) is fixedly connected to the top of the air duct (3), and an anti-collision mechanism (5) is fixedly connected to one side of the cooling circulation mechanism (2).

2. The module heat dissipation power supply according to claim 1, characterized in that: The cooling circulation mechanism (2) comprises a pressurized pipe (203) fixedly connected to one side of the bottom plate (1), a delivery pipe (202) fixedly connected to the top of the pressurized pipe (203), a cooling liquid inlet (201) provided at the top of the delivery pipe (202), and a cooling liquid outlet (204) provided on one side of the cooling liquid inlet (201).

3. The module heat dissipation power supply according to claim 1, characterized in that: The anti-collision mechanism (5) comprises a shock-absorbing rod (501) fixedly connected to one side of the delivery pipe (202), and an anti-collision plate (502) is fixedly connected to one side of the shock-absorbing rod (501), and an arc block (503) is fixedly connected to one end of the anti-collision plate (502).

4. The module heat dissipation power supply according to claim 1, characterized in that: The top of the partition composite plate (4) is fixedly connected with an inner fin (6), and the top of the inner fin (6) is provided with an outer fin (7), and the top of the outer fin (7) is fixed with a cover plate (8).

5. The module heat dissipation power supply according to claim 1, characterized in that: The top of the bottom plate (1) is movably connected to a shell (9), and the interior of the shell (9) is fixedly connected to an insulating film (10).

6. The module heat dissipation power supply according to claim 5, characterized in that: The interior of the housing (9) is movably connected to a mounting frame (11), and a cooling fan (12) is provided inside the mounting frame (11).

7. The module heat dissipation power supply according to claim 1, characterized in that: A chipset (13) is fixedly connected to the top of the base plate (1), and a battery pack (14) is provided on one side of the chipset (13).

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