Vertical heating assembly, electronic atomizer and electronic atomization device

Abstract

The utility model discloses a vertical heating assembly, an electronic atomizer and an electronic atomization device.The heating assembly is arranged in the electronic atomizer in a vertical mode and comprises a plate-shaped base body and a heating element, and the thickness direction of the base body intersects with the depth direction of a liquid storage cavity of the electronic atomizer; the base body is provided with a liquid absorbing surface and an atomizing surface which are oppositely arranged in the thickness direction of the base body, the heating element is arranged on the atomizing surface, the base body is provided with a plurality of liquid guide through holes penetrating through the thickness direction of the base body, the liquid guide through holes are communicated with the liquid storage cavity and the heating element, and the liquid guide through holes are used for guiding an atomizing matrix from the liquid storage cavity to the atomizing surface through the liquid absorbing surface so that the atomizing matrix can be heated by the heating element; along the direction from the bottom to the top of the depth direction of the liquid storage cavity, the apertures of the adjacent liquid guide through holes are gradually increased. According to the scheme, the problem that in the prior art, due to the fact that the hole diameters of the liquid guide through holes in the base body are consistent, upper and lower liquid supply is not uniform can be solved.

Description

Technical Field

[0001] The present application relates to the field of electronic atomization technology, and in particular to a vertical heating component, an electronic atomizer, and an electronic atomization device. Background Art

[0002] Atomization technology is the process of converting liquid into small droplets. An electronic atomizer consists of a liquid reservoir and a heating element. The reservoir holds an atomizing matrix, such as a flavored liquid. The heating element communicates with the liquid in the reservoir and is equipped with multiple microporous holes. This microporous structure is key to the heating element's stable liquid conduction and retention capabilities. Due to surface tension and capillary action, liquid can evenly penetrate the heating element and adsorb onto its surface, generating heat that atomizes the liquid.

[0003] Compared with cylindrical heating components, flat-plate heating components are more flexible to install. However, the design of flat-plate heating components often ignores the impact of gravity on liquid supply, especially when the heating component is placed vertically, that is, the heating component is placed parallel to the axis of the electronic atomizer. The uneven liquid supply will lead to inconsistent atomization effects, thereby affecting the user experience. Utility Model Content

[0004] The present application provides a vertical heating component, an electronic atomizer and an electronic atomizer device to solve the problem of inconsistent atomization effect caused by uneven liquid supply when the heating component is placed vertically.

[0005] In order to solve the above technical problems, the first technical solution provided by this application is:

[0006] A vertical heating component is arranged in an upright manner in an electronic atomizer, and the heating component includes a plate-shaped base and a heating element. The thickness direction of the base intersects with the depth direction of the liquid storage chamber of the electronic atomizer. The base has a liquid absorption surface and an atomization surface arranged opposite to each other in its thickness direction. The heating element is arranged on the atomization surface. The base is provided with a plurality of liquid guide holes running through its thickness direction. The liquid guide holes connect the liquid storage chamber and the heating element. The liquid guide holes are used to guide the atomization matrix from the liquid storage chamber through the liquid absorption surface to the atomization surface for heating by the heating element; along the direction from the bottom to the top in the depth direction of the liquid storage chamber, the apertures of adjacent liquid guide holes gradually increase.

[0007] In one embodiment, the base further defines a first extension direction and a second extension direction, the thickness direction, the first extension direction and the second extension direction are perpendicular to each other, and the first extension direction is parallel to the depth direction of the liquid storage chamber; the hole spacing in the first extension direction is the first hole spacing, and the hole spacing in the second extension direction is the second hole spacing; along the direction from the bottom to the top in the depth direction of the liquid storage chamber, the first hole spacing gradually increases, and / or the second hole spacing gradually increases.

[0008] In one embodiment, the base further defines a first extension direction and a second extension direction, the thickness direction, the first extension direction and the second extension direction are perpendicular to each other, and the first extension direction is parallel to the depth direction of the liquid storage chamber; the plurality of liquid conducting holes are arranged in multiple rows, and the row direction is parallel to the second extension direction, the aperture of each of the liquid conducting holes in the same row is the same, and the aperture of the liquid conducting holes in each row gradually increases from the bottom to the top in the depth direction of the liquid storage chamber.

[0009] In one embodiment, the spacing between adjacent rows in the first extension direction is a first hole spacing, the spacing between adjacent liquid-conducting holes in each of the liquid-conducting holes in the same row is a second hole spacing, and the second hole spacings in the same row are the same; along the direction from the bottom to the top in the depth direction of the liquid storage cavity, the first hole spacing and the second hole spacing gradually increase; the liquid-conducting holes in two adjacent rows are staggered in the first extension direction.

[0010] In one embodiment, the pore size of each of the liquid-conducting through holes ranges from 10 to 120 microns.

[0011] In one embodiment, the base includes an intrinsic silicon substrate; wherein the heating element is a doped conductive silicon substrate, the intrinsic silicon substrate has a receiving groove on the atomized surface, and the conductive silicon substrate is embedded in the receiving groove; or, the heating element is a conductive silicon layer formed by doping on the atomized surface of the intrinsic silicon substrate.

[0012] In one embodiment, the base also includes a bonding substrate, and the bonding substrate is made of glass, ceramic or quartz; the bonding substrate is arranged on the surface of the intrinsic silicon substrate away from the heating element; the intrinsic silicon substrate is provided with a plurality of first liquid guide holes, and the bonding substrate is provided with a plurality of second liquid guide holes aligned one by one with the plurality of first liquid guide holes, and the first liquid guide hole and the second liquid guide hole aligned with each other together constitute the liquid guide through hole.

[0013] In order to solve the above technical problems, the second technical solution provided by this application is:

[0014] An electronic atomizer comprises a liquid storage chamber, an air flow channel and a heating component; the liquid storage chamber is used to store an atomization matrix; the air flow channel extends along the depth direction of the liquid storage chamber; the heating component adopts the above-mentioned vertical heating component, wherein the heating component is arranged in an upright manner in the electronic atomizer, and the thickness direction of the matrix intersects with the depth direction of the liquid storage chamber.

[0015] In one embodiment, the atomizing surface is arranged parallel to the axial direction of the air flow channel; or, the atomizing surface is arranged obliquely relative to the axial direction of the air flow channel, and the axis of the liquid guiding hole is arranged obliquely relative to the radial direction of the air flow channel.

[0016] In order to solve the above technical problems, the third technical solution provided by this application is:

[0017] An electronic atomization device comprises a power supply device and the above-mentioned electronic atomizer, wherein the power supply device is connected to the electronic atomizer.

[0018] The beneficial effects of this application are:

[0019] The vertical heating component, electronic atomizer and electronic atomization device with the electronic atomizer provided by the present application are different from the heating component with a cylindrical structure. The heating component has a plate-like structure and is arranged in an upright state in the electronic atomizer. The heating element generates heat and transfers heat to the base body. The atomized matrix is guided from the base body to the position of the heating element for atomization through the capillary action of the liquid-conducting through-hole, thereby generating atomized gas such as an aerosol. The aerosol is ejected from the liquid-conducting through-hole for the user to inhale. Affected by the gravity of the atomized matrix itself, the atomized matrix in the liquid storage cavity is more likely to enter the liquid-conducting through-hole near the bottom of the base body. In the present application, it is set to be along the direction from the bottom to the top in the depth direction of the liquid storage cavity. The aperture of adjacent liquid-conducting through-holes gradually increases. The gradient design of the aperture of each liquid-conducting through-hole can increase the consistency of the liquid supply in the upper and lower parts of the base body, thereby solving the problem of uneven liquid supply in the upper and lower parts caused by the consistent aperture of each liquid-conducting through-hole on the base body in the related art. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0021] Figure 1 This is a schematic diagram of the three-dimensional structure of an embodiment of the electronic atomizer provided by the present application;

[0022] Figure 2 yes Figure 1 Schematic diagram of the middle AA section;

[0023] Figure 3 yes Figure 1 Schematic diagram of the middle BB section;

[0024] Figure 4 This is a schematic diagram of the three-dimensional structure of an embodiment of a heating component in an electronic atomizer provided by the present application;

[0025] Figure 5 yes Figure 4 A main view of the heating component;

[0026] Figure 6A yes Figure 4 A schematic diagram of the disassembled structure of an embodiment of a heating component;

[0027] Figure 6B yes Figure 4 A schematic diagram of the disassembled structure of another embodiment of the heating component;

[0028] Figure 7 is a structural schematic diagram of another embodiment of the electronic atomizer provided by the present application;

[0029] Figure 8 yes Figure 7 A schematic diagram of the three-dimensional structure of another embodiment of a heating component in an electronic atomizer;

[0030] Figure 9 yes Figure 8 A cross-sectional view of the substrate in the heating component along the axial direction of the electronic atomizer;

[0031] Figure 10 This is a simulation diagram of aerosol migration;

[0032] Figure 11 1 is a schematic diagram of the three-dimensional structure of another embodiment of the heating component 100 in the electronic atomizer provided by the present application;

[0033] Figure 12 yes Figure 11 Schematic diagram of the decomposed structure of the heating component.

[0034] Description of reference numerals:

[0035] Electronic atomizer 10; heating component 100; base 110; receiving groove 1100; liquid guide hole 111; liquid suction surface 110a; atomizing surface 110b; intrinsic silicon substrate 112; first liquid guide hole 1120; bonding substrate 113; second liquid guide hole 1130; heating element 120; first electrode 131; second electrode 132; first end 11; second end 12; suction nozzle 13; shell 14; liquid storage chamber 200; lower liquid chamber 201; air flow channel 300; axial direction R1; axial direction R2; degree direction T; first extension direction E1; second extension direction E2. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0037] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0038] The present application provides a vertical heating component, which is arranged in an upright manner in an electronic atomizer. Based on the heating component provided by the present application, the present application also provides an electronic atomizer. In one embodiment, please refer to Figures 1 to 3 , Figure 1 This is a schematic diagram of the three-dimensional structure of an embodiment of the electronic atomizer provided by this application. Figure 2 yes Figure 1 AA cross-section diagram, Figure 3 yes Figure 1 In the BB cross-sectional diagram, the electronic atomizer 10 includes a liquid storage chamber 200 , an air flow channel 300 and a heating component 100 .

[0039] The liquid storage chamber 200 is used to store an atomized matrix, which may be a flavored liquid. The atomized matrix is heated and atomized to produce a flavored substance, such as an aerosol, for the user to inhale. Specifically, the electronic atomizer 10 includes a housing 14 , and the liquid storage chamber 200 is disposed within the housing 14 .

[0040] The airflow channel 300 extends along the depth direction of the liquid storage chamber 200. In the field of electronic atomizers, the depth direction of the liquid storage chamber 200 is usually the axial direction R1 of the electronic atomizer 10. For the convenience of description, it is collectively referred to as the axial direction R1 of the electronic atomizer 10. When the user inhales, airflow will be generated in the airflow channel 300. The aerosol generated after the atomized matrix is heated and atomized can be combined with the airflow in the airflow channel 300 for the user to inhale. Specifically, the airflow channel 300 can be located on the inner side of the liquid storage chamber 200. For example, the liquid storage chamber 200 can be an annular cavity, and the liquid storage chamber 200 is arranged around the airflow channel 300. And the central axis of the airflow channel 300 coincides with or is parallel to the central axis of the liquid storage chamber 200. Figure 2 and Figure 3 The central axis of the air flow channel 300 and the central axis of the liquid storage chamber 200 are shown to coincide with each other. Of course, the relative position relationship between the air flow channel 300 and the liquid storage chamber 200 is not limited to this. Figure 2 and Figure 3 This is just an example, and the air flow channel 300 may also be located outside the liquid storage chamber 200 .

[0041] The heating component 100 is used to convert the atomized matrix into an aerosol. The heating component 100 provided in the embodiment of the present application can be a heating component based on a micro-electromechanical system (MEMS). MEMS is based on microelectronics, micromechanics and materials science, and studies, designs and manufactures micro devices with specific functions, including microstructure devices, micro sensors, micro actuators, micromechanical optical devices and microsystems. The MEMS processing technology was developed on the basis of traditional microelectronics processing technology (also known as integrated circuit IC technology). Later, some unique technologies for making micromachines were developed. These unique technologies are combined with conventional integrated circuit technology to realize MEMS. These technologies are collectively referred to as micromachining technology. The heating component 100 of the present application is manufactured based on the MEMS process, which is miniaturized, small in size, and can achieve a rapid increase in temperature.

[0042] See also Figures 4 to 6B , Figure 4 1 is a schematic diagram of the three-dimensional structure of an embodiment of the heating component 100 in the electronic atomizer 10 provided in this application. Figure 5 yes Figure 4 A front view of the heating component 100, Figure 6A yes Figure 4 A schematic diagram of the disassembled structure of an embodiment of the heating component 100 is shown. Figure 6B yes Figure 4Schematic diagram of the disassembled structure of another embodiment of the heating component 100. The heating component 100 includes a substrate 110 and a heating element 120. The substrate 110 can be a dense substrate, such as silicon, glass, ceramic or quartz.

[0043] The substrate 110 is defined by a thickness direction T, which intersects the axial direction R1 of the electronic atomizer 10. The intersection of the thickness direction T of the substrate 110 and the axial direction R1 of the electronic atomizer 10 means that the thickness direction T of the substrate 110 and the axial direction R1 of the electronic atomizer 10 are not parallel to each other, but rather have an angle greater than zero degrees between them. For example, the thickness direction T of the substrate 110 and the axial direction R1 of the electronic atomizer 10 can be perpendicular to each other. The following description takes the case where the thickness direction T of the substrate 110 is perpendicular to the axial direction R1 of the electronic atomizer 10 as an example.

[0044] The base 110 has a liquid absorption surface 110a and an atomizing surface 110b arranged opposite to each other in the thickness direction T. The heating element 120 is arranged on the atomizing surface 110b. The base 110 is provided with a plurality of liquid conducting holes 111, which can be circular holes; the liquid conducting holes 111 connect the liquid storage chamber 200 and the heating element 120. The liquid conducting holes 111 are used to guide the atomized matrix from the liquid storage chamber 200 through the liquid absorption surface 110a to the atomizing surface 110b for heating by the heating element 120. Therefore, the function of the base 110 in the heating component 100 is mainly to absorb the atomized matrix in the liquid storage chamber 200 and guide the atomized matrix. The liquid guiding holes 111 are micropores with a micrometer-level pore size, which can absorb the atomized matrix in the liquid storage cavity 200 from the liquid absorption surface 110a of the base 110 into the interior of the base 110 through its capillary action and guide it to the atomization surface 110b of the base 110.

[0045] A lower liquid chamber 201 may also be provided in the housing 14 , and the atomized matrix in the liquid storage chamber 200 may flow into the lower liquid chamber 201 and be absorbed by the base 110 .

[0046] The heating element 120 is provided on the atomized surface 110b, which means that the heating element 120 and the base 110 are independent components. The heating element 120 is connected to the atomized surface 110b of the base 110 ( Figure 6A Alternatively, at least a portion of the substrate 110 on the atomized surface 110b has a conductive heating capability to serve as a heating element 120 ( Figure 6B As shown, the heating element 120 is used to heat the atomized substrate that is directed to the atomizing surface 110b. The heating element 120 can be powered by a power supply. When the heating element 120 is powered, it generates heat, and the capillary action of the liquid-conducting through-holes 111 guides the atomized substrate from the base 110 to the heating element 120 for atomization.

[0047] Along the direction from the bottom to the top in the depth direction of the liquid storage chamber 200, the apertures of adjacent liquid guide holes 111 gradually increase. Typically, along the axial direction R1 of the electronic atomizer 10, the electronic atomizer 10 has a first end 11 and a second end 12 relative to each other, and the first end 11 has a suction nozzle 13 for the user to perform a suction action, and the suction nozzle 13 can be connected to the air flow channel 300. The bottom of the liquid storage chamber 200 in the depth direction is the end of the liquid storage chamber 200 close to the second end 12, the top of the liquid storage chamber 200 in the depth direction is the end of the liquid storage chamber 200 close to the first end 11, and the direction from the bottom to the top in the depth direction of the liquid storage chamber 200 is the direction from the second end 12 to the first end 11. When using the electronic atomizer 10 of the present application, the first end 11 of the electronic atomizer 10 of the present application is usually facing upward and the second end 12 is facing downward. Therefore, the gravity of the atomized matrix at different locations in the electronic atomizer 10 is also different. The closer to the first end 11 of the electronic atomizer 10, the smaller the gravity, and the closer to the second end 12 of the electronic atomizer 10, the greater the gravity.

[0048] In the related art, the apertures of the liquid-conducting holes 111 of the heating component 100 are mostly uniform. In actual use, especially when the heating component 100 is placed vertically, that is, when the heating component 100 is placed parallel to the axial direction R1 of the electronic atomizer 10, the lower holes not only supply liquid due to capillary action, but are also affected by gravity, making the lower liquid supply more sufficient, resulting in a difference in liquid supply between the upper and lower parts. This design can easily lead to insufficient liquid supply in the upper part, thereby affecting the stability of the entire atomization process.

[0049] The present application designs the aperture of the liquid-conducting through hole 111 to be distributed in a gradient. Along the direction from the bottom to the top in the depth direction of the liquid storage chamber 200, the aperture of each liquid-conducting through hole 111 is distributed in a gradient with larger aperture at the top and smaller aperture at the bottom. This can solve the problem of uneven liquid supply in the upper and lower parts caused by the consistent aperture of each liquid-conducting through hole 111 on the base 110 in the related art.

[0050] The specific analysis is as follows:

[0051] The base body 110 absorbs the atomized matrix into the interior of the base body 110 through the capillary action of each liquid-conducting through hole 111. When the apertures of the liquid-conducting through holes 111 of the base body 110 are the same at the top and bottom, for each liquid-conducting through hole 111 at the bottom, i.e., each liquid-conducting through hole 111 close to the second end 12, under the action of the gravity of the atomized matrix itself, the atomized matrix is more likely to enter the liquid-conducting through hole 111 at the bottom. Therefore, the liquid supply to the liquid-conducting through hole 111 at the bottom is more sufficient. However, due to the insufficient liquid supply to the upper liquid-conducting through hole 111, i.e., close to the first end 11, the stability of the entire atomization process will be affected. When the gravity of the atomizing matrix itself is the same, increasing the aperture of the liquid-conducting through hole 111 can increase the liquid supply capacity of the liquid-conducting through hole 111. Therefore, the present application sets the aperture of each liquid-conducting through hole 111 of the substrate 110 to a gradient distribution with larger aperture at the top and smaller aperture at the bottom, which solves the problem of uneven liquid supply in the upper and lower parts caused by the consistent aperture of each liquid-conducting through hole 111 on the substrate 110 in the related technology, and can ensure that the liquid supply in the upper and lower parts of the heating component 100 is uniform, and the atomization process is more stable.

[0052] Furthermore, the aperture size of each liquid-conducting through hole 111 on the base 110 ranges from 10 to 120 microns, that is, the aperture of each liquid-conducting through hole 111 gradually increases from 10 microns to 120 microns along the direction from the second end 12 to the first end 11 .

[0053] In addition to guiding the liquid to the atomized matrix through its capillary action, each liquid-guiding through hole 111 also has another important function of locking the liquid. The curved liquid surface formed by the surface tension of the liquid at the edge of the liquid-guiding through hole 111 is the key force for locking the atomized matrix. Therefore, in theory, the smaller the aperture of the liquid-guiding through hole 111, the stronger its liquid-locking ability and the stronger the capillary action. The stronger the capillary action, the more difficult the ventilation will be. The smaller the aperture, the lower the liquid supply capacity will be. Therefore, in this embodiment, on the one hand, it is necessary to ensure that the minimum aperture of the liquid-guiding through hole 111 is small enough to enhance its liquid-locking ability, and on the other hand, To ensure that the aperture of the liquid-conducting through hole 111 is not too small to affect its liquid supply capacity and ventilation efficiency, the present embodiment sets the minimum aperture of the lower liquid-conducting through hole 111 to 10 microns, so that the liquid-conducting through hole 111 at the lower part of the base 110 can achieve a strong liquid locking ability to avoid leakage, and can maintain sufficient liquid supply, and the maximum aperture of the upper liquid-conducting through hole 111 is set to 120 microns to ensure that the upper liquid-conducting through hole 111 has sufficient liquid supply and ventilation efficiency, and will not affect the transportation of the atomized matrix in the liquid-conducting through hole 111 due to insufficient capillary force caused by an excessively large aperture.

[0054] In this embodiment, the aperture size range of each liquid-conducting through hole 111 on the base 110 is set to 10 to 120 microns, and the aperture of each liquid-conducting through hole 111 on the base 110 is gradiently distributed with larger apertures at the top and smaller apertures at the bottom, thereby ensuring uniformity of liquid supply at the top and bottom, and ensuring that the small apertures at the bottom can lock the atomized matrix to prevent leakage, while the large apertures at the top improve ventilation efficiency. The base 110 of this embodiment adjusts the capillary force through the gradient design of the aperture size of each liquid-conducting through hole 111, so that the base 110 can maintain sufficient liquid supply while avoiding the problem of ventilation difficulty caused by excessive capillary action.

[0055] In the related art, when the liquid-conducting through holes 111 on the base 110 adopt the same aperture, in order to ensure the liquid supply capacity and ventilation efficiency, the aperture of the liquid-conducting through holes 111 is usually set at about 35 microns, and the hole spacing is about twice the aperture. In the present application, the aperture of each liquid-conducting through hole 111 on the base 110 gradually increases from 10 microns to 120 microns in the direction from the second end 12 to the first end 11. The minimum aperture of the lower liquid-conducting through hole 111 is smaller than 35 microns of the same aperture in the related art, and the maximum aperture of the upper liquid-conducting through hole 111 is larger than 35 microns of the same aperture in the related art. Therefore, the problem of liquid leakage in the lower liquid-conducting through hole 111 can be avoided. At the same time, the upper liquid-conducting through hole 111 can also improve the ventilation efficiency, and the overall liquid supply of the base 110 is more sufficient and the ventilation efficiency is higher.

[0056] In one embodiment, the base 110 is further defined with a first extension direction E1 and a second extension direction E2, the thickness direction T, the first extension direction E1 and the second extension direction E2 are perpendicular to each other, and the first extension direction E1 is parallel to the axial direction R1 of the electronic atomizer 10; the hole spacing in the first extension direction E1 is the first hole spacing, and the hole spacing in the second extension direction E2 is the second hole spacing; along the direction from the second end 12 to the first end 11, the first hole spacing gradually increases, and / or the second hole spacing gradually increases.

[0057] In this embodiment, the first and / or second spacings between the liquid-conducting through-holes 111 with larger pore sizes are also larger, thereby avoiding the problem of uneven liquid supply caused by a large porosity difference between the large and small pore areas of the substrate 110. This further improves the uniformity of liquid supply to the substrate 110. Furthermore, in this embodiment, the liquid-conducting through-holes 111 on the substrate 110 may be arranged in rows or not, as long as the pore size of the liquid-conducting through-holes 111 on the substrate 110 gradually increases from the second end 12 toward the first end 11.

[0058] In one embodiment, the base 110 is further defined with a first extension direction E1 and a second extension direction E2, the thickness direction T, the first extension direction E1 and the second extension direction E2 are perpendicular to each other, and the first extension direction E1 is parallel to the axial direction R1 of the electronic atomizer 10; a plurality of liquid conducting holes 111 are arranged in a plurality of rows, and the row direction is parallel to the second extension direction E2, and the apertures of the liquid conducting holes 111 in the same row are the same, and the apertures of the liquid conducting holes 111 in each row gradually increase along the direction from the second end 12 to the first end 11. Figure 4 and Figure 5 It shows that the liquid conducting through holes 111 on the base body 110 are distributed in rows.

[0059] In this embodiment, the liquid-conducting through-holes 111 on the base 110 are arranged in rows. It is understood that in other embodiments, the liquid-conducting through-holes 111 on the base 110 may not be arranged in rows. Furthermore, this embodiment ensures consistent liquid supply capacity at each position in the same row. Furthermore, the gradient distribution of the upper and lower apertures ensures uniform liquid supply, thus maintaining consistent liquid supply capacity across the entire atomizing surface 110b of the base 110.

[0060] Furthermore, the spacing between adjacent rows in the first extension direction E1 is the first hole spacing, the spacing between adjacent liquid conducting holes 111 in each liquid conducting hole 111 in the same row is the second hole spacing, and the second hole spacings in the same row are the same; along the direction from the second end 12 to the first end 11, the first hole spacing and the second hole spacing gradually increase; the liquid conducting holes 111 in two adjacent rows are at least partially staggered in the first extension direction E1.

[0061] In this embodiment, the liquid-conducting through-holes 111 are arranged in rows rather than columns, so that the first hole spacing / second hole spacing between the large-diameter liquid-conducting through-holes 111 is larger, and the first hole spacing / second hole spacing between the small-diameter liquid-conducting through-holes 111 is smaller, thereby maintaining the uniformity of liquid supply to the base 110. It is understood that in other embodiments, the first hole spacing and the second hole spacing may also remain consistent, but it is understood that the first hole spacing and the second hole spacing gradually increase in the direction from the second end 12 to the first end 11, compared to the first hole spacing and the second hole spacing remaining consistent, which can make the liquid supply capacity of the base 110 more consistent across the entire atomizing surface 110b.

[0062] In this embodiment, in the first extension direction E1, along the direction from the second end 12 to the first end 11, the first hole spacing gradually increases from 20 microns to 100 microns; in the second extension direction E2, the second hole spacing can be set to a value between one and two times the hole diameter.

[0063] In the present application, the structure of the base 110 can be various, and the arrangement of the base 110 relative to the axial direction R1 of the electronic atomizer 10 can also be various, which are described in detail below.

[0064] Please refer again Figure 3 In one embodiment, the thickness direction T is perpendicular to the axial direction R1 of the sub-atomizer 10, and the liquid suction surface 110a and the atomizing surface 110b are both arranged parallel to the axial direction R1 of the electronic atomizer 10. This embodiment illustrates the structure of the base 110 and the first arrangement of the base 110 relative to the axial direction R1 of the electronic atomizer 10. In this embodiment, the dimensions of the base 110 in the thickness direction T are uniform at all locations, the base 110 is a flat plate, and the base 110 is arranged parallel to the axial direction R1 of the electronic atomizer 10.

[0065] In another embodiment, the thickness direction T is tilted relative to the axial direction R1 of the sub-atomizer 10, and the liquid suction surface 110a and the atomizing surface 110b are parallel to each other and are both tilted relative to the axial direction R1 of the electronic atomizer 10. This embodiment shows a second situation of the structure of the base 110 and the arrangement of the base 110 relative to the axial direction R1 of the electronic atomizer 10. In this embodiment, the dimensions of the base 110 in the thickness direction T are uniform at all locations, the base 110 has a flat plate structure, and the base 110 is tilted relative to the axial direction R1 of the electronic atomizer 10.

[0066] In yet another embodiment, see Figure 7 and Figure 8 , Figure 7 is a structural diagram of another embodiment of the electronic atomizer 10 provided in this application. Figure 8 yes Figure 7 A schematic diagram of the three-dimensional structure of another embodiment of the heating component 100 in the electronic atomizer 10. In this embodiment, the thickness direction T is perpendicular to the axial direction R1 of the sub-atomizer 10, the liquid suction surface 110a is arranged parallel to the axial direction R1 of the electronic atomizer 10, and the atomizing surface 110b is arranged obliquely relative to the axial direction R1 of the electronic atomizer 10. Along the axial direction R1 of the electronic atomizer 10, the size of the base 110 in the thickness direction T increases with the increase in the aperture of each liquid guide hole 111. This embodiment shows the structure of the base 110 and the third case of the arrangement of the base 110 relative to the axial direction R1 of the electronic atomizer 10. In this embodiment, the base 110 is a wedge-shaped plate structure.

[0067] It can be understood that in other embodiments, the liquid suction surface 110a can be tilted relative to the axial direction R1 of the electronic atomizer 10, and the atomization surface 110b can be parallel to the axial direction R1 of the electronic atomizer 10, or both the liquid suction surface 110a and the atomization surface 110b can be tilted relative to the axial direction R1 of the electronic atomizer 10; as for the size of the base 110 in the thickness direction T, it can also be that along the axial direction R1 of the electronic atomizer 10, the size of the base 110 in the thickness direction T decreases as the aperture of each liquid guide hole 111 increases.

[0068] Judging from the various structures of the above-mentioned base 110 and the various arrangements of the base 110 relative to the axial direction R1 of the electronic atomizer 10, the liquid absorption surface 110a and the atomization surface 110b can be set parallel to or inclined relative to the axial direction R1 of the electronic atomizer 10. The liquid absorption surface 110a and the atomization surface 110b can be flat or curved. As long as the aperture of each liquid-conducting through hole 111 of the base 110 is set to a gradient distribution with larger apertures at the top and smaller apertures at the bottom, no matter what the structure of the base 110 is and how it is arranged relative to the axial direction R1 of the electronic atomizer 10, it will not affect the uniform liquid supply effect of the upper and lower parts of the heating component 100 in this application.

[0069] See also Figure 9 , Figure 9 yes Figure 8 The cross-sectional view of the base 110 of the heating component 100 along the axial direction R1 of the electronic atomizer 10 is shown in FIG. 1 . In the above embodiment, when the atomizing surface 110b is tilted relative to the axial direction R2 of the air flow channel 300, and the axis of the liquid guide hole 111 is tilted relative to the radial direction of the air flow channel 300, the direction of the aerosol ejected from the liquid guide hole 111 is also tilted. The tilt angle α of the axis of the liquid guide hole 111 relative to the radial direction of the air flow channel 300, the tilt angle β of the atomizing surface 110b relative to the axial direction R2 of the air flow channel 300, and the total velocity of the aerosol ejected along the liquid guide hole 111 is set as the tilt velocity v. total , the tilt velocity v total It has a radial component along the airflow channel 300 (lateral velocity v horizontal ) and the component along the axial direction R2 of the airflow channel 300 (vertical velocity v vertical ), and the tilt velocity v total , lateral velocity v horizontal With vertical velocity v vertical The relationship between them is: And v horizontal =cosα*v total , so the lateral velocity v horizontal must be less than the tilt velocity v total .

[0070] In the related art, the axis of the liquid-conducting hole 111 is arranged parallel to the radial direction of the airflow channel 300, so the lateral velocity of the aerosol ejected from the liquid-conducting hole 111 is the total velocity. In the present application, the axis of the liquid-conducting hole 111 is arranged obliquely relative to the radial direction of the airflow channel 300, so the lateral velocity of the aerosol ejected from the liquid-conducting hole 111 is the radial component of the total velocity. Therefore, the lateral velocity is smaller than the total velocity. Therefore, the present application can effectively reduce the lateral velocity of the aerosol, making the generated aerosol more easily carried by the airflow, thereby reducing the possibility of hitting the wall.

[0071] See also Figure 10 , Figure 10 This is a simulation diagram of aerosol migration. Figure 10 (a) shows the situation where the direction of the aerosol ejected from the liquid guide hole 111 is parallel to the radial direction of the airflow channel 300. Figure 10 (b) is a case where the direction of the aerosol ejected from the liquid guide hole 111 is tilted relative to the radial direction of the air flow channel 300, and Figure 10 The middle line indicates the direction of airflow. Figure 10 The black particles represent aerosol solid particles. It can be seen that the risk of aerosol hitting the wall is reduced by tilting the liquid-conducting through hole 111 relative to the radial direction of the airflow channel 300.

[0072] Further, see again Figure 9 , along the direction from the second end 12 to the first end 11, the distance between the atomizing surface 110b and the axis of the airflow channel 300 gradually decreases. In this embodiment, the base 110 has a wedge-shaped structure with a larger thickness at the top and a smaller thickness at the bottom. When the user inhales, the airflow in the airflow channel 300 can fully contact the atomizing surface 110b, and at the same time, the atomizing surface 110b does not affect the movement of the airflow in the airflow channel 300. It is understood that in other embodiments, along the direction from the second end 12 to the first end 11, the distance between the atomizing surface 110b and the axis of the airflow channel 300 can also gradually increase, which can also make the direction of the aerosol ejected from the liquid guide hole 111 also inclined, reducing the risk of the aerosol hitting the wall.

[0073] Further, see again Figure 9In one embodiment, the inclination angle of the atomizing surface 110b relative to the axial direction R2 of the air flow channel 300 is 5° to 15°, and / or the inclination angle of the axis of the liquid guiding hole 111 relative to the radial direction of the air flow channel 300 is 5° to 15°. Within the inclination angle range of 5° to 15°, it is possible to effectively reduce the lateral velocity of the aerosol ejected from the liquid guiding hole 111 and avoid excessive obstruction of the air flow in the air flow channel 300 by the atomizing surface 110b. It is understandable that in other embodiments, the inclination angle β of the atomizing surface 110b relative to the axial direction R2 of the air flow channel 300 and the inclination angle α of the axis of the liquid guiding hole 111 relative to the radial direction of the air flow channel 300 may also be other values.

[0074] Further, see again Figure 9 , the liquid guiding hole 111 is perpendicular to the atomizing surface 110b, therefore, the inclination angle β of the atomizing surface 110b relative to the axial direction R2 of the air flow channel 300 is the same as the inclination angle α of the axis of the liquid guiding hole 111 relative to the radial direction of the air flow channel 300. In this embodiment, when the liquid suction surface 110a is arranged parallel to the axial direction R1 of the electronic atomizer 10 and the atomizing surface 110b is arranged at an angle relative to the axial direction R1 of the electronic atomizer 10, the liquid guiding hole 111 is arranged perpendicular to the atomizing surface 110b, which makes it easier to process the liquid guiding hole 111 and can also avoid the influence of the atomizing surface 110b on the aerosol ejected from the liquid guiding hole 111 as much as possible. It can be understood that in other embodiments, the liquid guiding hole 111 may not be perpendicular to the atomizing surface 110b. As long as the axis of the liquid guiding hole 111 is arranged at an angle relative to the axial direction of the air flow channel 300, the risk of the aerosol ejected from the liquid guiding hole 111 hitting the wall can be reduced.

[0075] See again Figure 4 and Figure 5 In the present application, the heating element 120 can be a sheet-like structure that covers a portion of the atomizing surface 110b in its entirety, and its thickness can be set to 0 to 10 microns. It can be understood that since the aerosol generated after the atomized matrix in the base 110 is heated by the heating element 120 needs to escape from the atomizing surface 110b, the heating element 120 should not block the liquid guide hole 111 so that the aerosol can escape from the liquid guide hole 111. When the heating element 120 is a sheet-like structure covering the entire surface, the liquid guide hole 111 can pass through the heating element 120. Of course, it is not ruled out that the heating element 120 adopts other shapes, such as strips, wires, meshes, etc.

[0076] The heating element 120 may be a rectangular sheet structure, or further, an octagonal structure formed by cutting corners of the rectangular sheet structure. Of course, the heating element 120 may be in other shapes besides a rectangle, such as a polygon, a circle, etc.

[0077] Corresponding to the shape of the heating element 120, the base 110 can be roughly a rectangular plate structure, the size of the long side of the rectangle can be 4.7 mm, the size of the short side of the rectangle can be 3 mm, the thickness of the base 110 can be 0.8 mm, the size of the base 110 can also be other values, and the base 110 does not exclude other shapes other than rectangles, such as polygons, circles, etc.

[0078] In one embodiment, the substrate 110 includes an intrinsic silicon substrate. Intrinsic silicon refers to a silicon single crystal with a complete lattice and no impurities. The heating element 120 is a doped conductive silicon substrate. Intrinsic silicon has a relatively weak conductivity, while doped conductive silicon has a relatively high conductivity. Figure 6A As shown, the intrinsic silicon substrate has a receiving groove 1100 on the atomized surface 110b, and the conductive silicon substrate is embedded in the receiving groove 1100; or, as shown Figure 6B As shown, the heating element 120 is a conductive silicon layer formed by doping the atomized surface 110b of the intrinsic silicon substrate. The doping process can be achieved by ion implantation.

[0079] In this embodiment, when the heating element 120 is a conductive silicon layer formed by doping on the atomized surface 110b of the intrinsic silicon substrate, the steps of processing the substrate 110 with the liquid conducting holes 111 are as follows: first, ion implantation is performed on the designated area of the atomized surface 110b of the intrinsic silicon substrate to form the heating element 120 with higher conductivity, and then each liquid conducting hole 111 is processed to form an intrinsic silicon substrate with the liquid conducting holes 111.

[0080] In addition, in this embodiment, since the heating element 120 is a doped conductive silicon substrate, which is a non-metallic material, compared with metal materials, since metal materials are usually exposed to the outside and in direct contact with the atomized matrix, due to the high temperature and the complexity of the atomized matrix components during the heating process, these exposed metal elements are very prone to oxidation or metal migration. The result of oxidation or metal migration not only leads to a decrease in heating efficiency, but also causes the atomized matrix components to be contaminated and may cause the risk of excessive heavy metals. When the heating element 120 is a doped conductive silicon substrate, the risk of metal precipitation is greatly reduced, thereby reducing the possibility of contamination of the atomized matrix components during the use of the electronic atomizer 10.

[0081] In one embodiment, see Figure 11 and Figure 12 , Figure 11 1 is a schematic diagram of the three-dimensional structure of another embodiment of the heating component 100 in the electronic atomizer 10 provided in the present application. Figure 12 yes Figure 11The schematic diagram of the decomposed structure of the heating component 100 is shown in FIG. 1 . In this embodiment, in addition to the intrinsic silicon substrate 112, the base body 110 also includes a bonding substrate 113. The intrinsic silicon substrate 112 and the bonding substrate 113 can both be roughly rectangular plate-shaped structures, and other shapes are of course not excluded. The bonding substrate 113 is made of glass, ceramic or quartz. The bonding substrate 113 is arranged on the surface of the intrinsic silicon substrate 112 away from the heating element 120, and the bonding substrate 113 can be fixed to the intrinsic silicon substrate 112 by bonding; the intrinsic silicon substrate 112 is provided with a plurality of first liquid guide holes 1120, and the bonding substrate 113 is provided with a plurality of second liquid guide holes 1130 aligned one by one with the plurality of first liquid guide holes 1120, and the mutually aligned first liquid guide hole 1120 and the second liquid guide hole 1130 together constitute the liquid guide through hole 111. In this embodiment, the base 110 includes two substrates, wherein the bonding substrate 113 is made of a material such as glass, ceramic or quartz sheet with a smaller thermal conductivity coefficient. Therefore, the bonding substrate 113 can play a heat insulating role to prevent the temperature of the atomized matrix near the liquid absorption surface 110a of the base 110 from being too high.

[0082] When the intrinsic silicon substrate 112 is roughly in the shape of a rectangular plate, the bonding substrate 113 can also be roughly in the shape of a rectangular plate, and the bonding substrate 113 can completely cover the intrinsic silicon substrate 112. The shape and size of the bonding substrate 113 and the intrinsic silicon substrate 112 can be set to be the same, so that the edge of the bonding substrate 113 and the intrinsic silicon substrate 112 just fits together. The size of the long side of the rectangle of the intrinsic silicon substrate 112 and the bonding substrate 113 can be 4.7 mm, and the size of the short side of the rectangle can be 3 mm. The thickness of the intrinsic silicon substrate 112 can be 0.3 mm, and the thickness of the bonding substrate 113 can be 0.5 mm. The sizes of the intrinsic silicon substrate 112 and the bonding substrate 113 can also be other values, and the intrinsic silicon substrate 112 and the bonding substrate 113 do not exclude other shapes other than rectangles, such as polygons, circles, etc.

[0083] In this embodiment, when the heating element 120 is a conductive silicon layer formed by doping on the surface of the intrinsic silicon substrate 112 away from the bonding substrate 113, the steps of processing the substrate 110 with the liquid conducting holes 111 are as follows: first, ion implantation is performed on the specified area of the atomized surface 110b of the intrinsic silicon substrate 112 to form a heating element 120 with higher conductivity, and then each first liquid conducting hole 1120 is processed to form the intrinsic silicon substrate 112 with the first liquid conducting holes 1120; then, each second liquid conducting hole 1130 is processed on the bonding substrate 113; finally, the intrinsic silicon substrate 112 and the bonding substrate 113 are connected and fixed by bonding, and each first liquid conducting hole 1120 is aligned one by one with each second liquid conducting hole 1130 to form each liquid conducting hole 111.

[0084] See again Figure 4 and Figure 5 In one embodiment, the heating component 100 further includes a first electrode 131 and a second electrode 132, which are electrically connected to opposite sides of the heating element 120. The first electrode 131 and the second electrode 132 are provided in this embodiment to facilitate electrical connection between the power supply device and the heating element 120, thereby providing power to the heating element 120.

[0085] In summary, in the present application, the aperture of the liquid-conducting through-holes 111 gradually increases from the second end 12 toward the first end 11, thereby improving the uniformity of the liquid supply to the upper and lower ends of the heating component 100 and making the atomization process more stable. Furthermore, the aperture of each liquid-conducting through-hole 111 gradually increases from 10 microns to 120 microns from the second end 12 toward the first end 11. Compared to the related art in which each liquid-conducting through-hole 111 has an aperture of 35 microns, the present application provides a significantly greater liquid supply, higher atomization efficiency, lower overall ventilation pressure, and smoother ventilation.

[0086] The following is a comparison between the apertures of the liquid-conducting through holes 111 on the flat substrate 110 in the related art being the same, and the apertures of the liquid-conducting through holes 111 on the flat substrate 110 in the present application being distributed in a gradient with larger apertures at the top and smaller apertures at the bottom. When the resistance values (in ohms) of the heating components 100 are roughly the same, the respective parameters such as "0-100 TPM", " " and "average ventilation pressure" are tested to obtain the following table.

[0087] Among them, TPM refers to total particulate matter; "0-100 TPM" means the average atomization volume within 0 to 100 puffs of the electronic atomizer, which is a commonly used parameter for evaluating the atomization effect of the electronic atomizer, and the unit is milligram (mg); similarly, "300-400 TPM" means the average atomization volume within 300 to 400 puffs of the electronic atomizer, which is a commonly used parameter for evaluating the atomization effect of the electronic atomizer, and the unit is milligram (mg).

[0088] type Resistance / Ω 0~100 TPM / mg 300~400 TPM / mg Average ventilation pressure / Pa Uniform distribution① 0.891 3.89 3.61 1223 Uniform distribution② 0.902 3.12 2.90 1143 Gradient pore ① 0.819 5.85 5.63 879 Gradient pores② 0.843 5.12 4.95 915

[0089] As can be seen from the above table, the pore size gradient distribution of the present application has a higher TPM compared with the uniform pore size in the related art, so the liquid supply is more sufficient, the ventilation pressure is lower, and the ventilation is smoother.

[0090] The present application also provides an electronic atomization device, which includes a power supply device and an electronic atomizer 10, wherein the power supply device is connected to the electronic atomizer 10 for supplying power to the electronic atomizer 10. The specific structure of the electronic atomizer 10 is referred to the above embodiment. Since the present electronic atomization device adopts all the technical solutions of the above embodiment, it has at least all the beneficial effects brought about by the technical solutions of the above embodiment, which will not be described in detail here.

[0091] The terms "first", "second" and "third" in this application are used for descriptive purposes only and should not be understood as indicating the number of technical features indicated. Thus, the features defined as "first", "second" and "third" may explicitly or implicitly include at least one of such features. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0092] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A vertical heating component, characterized in that: The heating component is arranged in an upright manner in the electronic atomizer, and includes a plate-shaped substrate and a heating element. The thickness direction of the substrate intersects with the depth direction of the liquid storage chamber of the electronic atomizer. The substrate has a liquid absorption surface and an atomization surface arranged opposite to each other in the thickness direction. The heating element is arranged on the atomization surface. The substrate is provided with a plurality of liquid guide holes running through the thickness direction thereof. The liquid guide holes connect the liquid storage chamber and the heating element. The liquid guide holes are used to guide the atomized matrix from the liquid storage chamber through the liquid absorption surface to the atomization surface for heating by the heating element. Along the direction from the bottom to the top in the depth direction of the liquid storage cavity, the apertures of adjacent liquid-conducting through holes gradually increase.

2. The vertical heating component according to claim 1, characterized in that: The base body further defines a first extension direction and a second extension direction, wherein the thickness direction, the first extension direction and the second extension direction are perpendicular to each other, and the first extension direction is parallel to the depth direction of the liquid storage cavity; The hole spacing in the first extension direction is a first hole spacing, and the hole spacing in the second extension direction is a second hole spacing; Along the direction from the bottom to the top in the depth direction of the liquid storage cavity, the first hole spacing gradually increases, and / or the second hole spacing gradually increases.

3. The vertical heating component according to claim 1, characterized in that: The base body further defines a first extension direction and a second extension direction, wherein the thickness direction, the first extension direction and the second extension direction are perpendicular to each other, and the first extension direction is parallel to the depth direction of the liquid storage cavity; The plurality of liquid-conducting through holes are arranged in a plurality of rows, and the row direction is parallel to the second extension direction. The apertures of the liquid-conducting through holes in the same row are the same, and the apertures of the liquid-conducting through holes in each row gradually increase from the bottom to the top of the liquid storage cavity.

4. The vertical heating component according to claim 3, characterized in that: The spacing between adjacent rows in the first extension direction is a first hole spacing, the spacing between adjacent liquid conducting through holes in the same row is a second hole spacing, and the second hole spacings in the same row are the same; Along the direction from the bottom to the top in the depth direction of the liquid storage cavity, the first hole spacing and the second hole spacing both gradually increase; The liquid-conducting through holes in two adjacent rows are staggered in the first extending direction.

5. The vertical heating component according to claim 1, characterized in that: The pore size of each of the liquid-conducting through holes ranges from 10 to 120 microns.

6. The vertical heating component according to claim 1, characterized in that: The base includes an intrinsic silicon substrate; wherein the heating element is a doped conductive silicon substrate, the intrinsic silicon substrate has a receiving groove on the atomized surface, and the conductive silicon substrate is embedded in the receiving groove; or, the heating element is a conductive silicon layer formed by doping on the atomized surface of the intrinsic silicon substrate.

7. The vertical heating component according to claim 6, characterized in that: The base also includes a bonding substrate, which is made of glass, ceramic or quartz; the bonding substrate is arranged on the surface of the intrinsic silicon substrate away from the heating element; the intrinsic silicon substrate is provided with a plurality of first liquid guide holes, and the bonding substrate is provided with a plurality of second liquid guide holes aligned one by one with the plurality of first liquid guide holes, and the first liquid guide hole and the second liquid guide hole aligned with each other together constitute the liquid guide through hole.

8. An electronic atomizer, characterized in that: The electronic atomizer comprises: A liquid storage chamber, used for storing aerosolized matrix; an air flow channel extending along the depth direction of the liquid storage cavity; The heating component adopts the vertical heating component described in any one of claims 1 to 7, wherein the heating component is arranged in the electronic atomizer in an upright manner, and the thickness direction of the base intersects with the depth direction of the liquid storage chamber.

9. The electronic atomizer according to claim 8, characterized in that: The atomizing surface is arranged parallel to the axial direction of the air flow channel; Alternatively, the atomizing surface is arranged to be tilted relative to the axial direction of the air flow channel, and the axis of the liquid guiding hole is arranged to be tilted relative to the radial direction of the air flow channel.

10. An electronic atomization device, characterized in that: It comprises a power supply device and the electronic atomizer according to any one of claims 8 to 9, wherein the power supply device is connected to the electronic atomizer.

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