Cleaning device and electroplating equipment with same

Abstract

The utility model discloses a cleaning device and electroplating equipment with the cleaning device, and the cleaning device comprises a cleaning tank in which a spraying assembly is arranged; the liquid discharging pipeline is communicated with the cleaning tank, and a detection component is arranged on the liquid discharging pipeline and used for detecting the PH value of the cleaning solution in the liquid discharging pipeline; a first circulation branch; a liquid outlet of the first circulation branch and a liquid outlet of the second circulation branch are communicated with the spraying assembly, a reaction chamber is arranged on the second circulation branch, and the PH value of the cleaning solution is adjusted through the reaction chamber; a first control valve is arranged between a liquid outlet of the liquid discharging pipeline and a liquid inlet of the first circulation branch and between the liquid outlet of the liquid discharging pipeline and a liquid inlet of the second circulation branch, and the first control valve controls the liquid discharging pipeline to be communicated with the first circulation branch and / or the second circulation branch according to the PH value of the cleaning solution. According to the utility model, the problem of high cleaning cost of the conductive clamp in the prior art is solved.

Description

Technical Field

[0001] The present application relates to the technical field of conductive clip cleaning, and in particular to a cleaning device and electroplating equipment having the same. Background Art

[0002] Ion batteries are widely used in the field of new energy due to their many advantages such as high energy density, excellent power performance, and long cycle life. In the process of manufacturing ion batteries, the current collector is an important component, which is mainly welded on the tab to collect current for better output.

[0003] Currently, in the process of producing a current collector, a conductive layer is formed on a film by electroplating using electroplating equipment. Specifically, the film is clamped by a conductive clamp and passed through a plating solution, and the film is conductively conductive through the conductive clamp.

[0004] During this process, the conductive clamp will inevitably come into contact with the plating solution, causing metal ions (usually copper ions) in the plating solution to deposit on the surface of the conductive clamp, eventually forming raised particles or copper thorns. During the clamping process, the film will be scratched or punctured, affecting product quality.

[0005] In the prior art, sodium sulfate is used to strip metal ions deposited on the surface of the conductive clip. However, the sodium sulfate is continuously consumed during the stripping process and cannot be recycled, which increases the cleaning cost of the conductive clip. Utility Model Content

[0006] The main purpose of the present application is to provide a cleaning device and an electroplating device having the same, so as to solve the problem of high cleaning cost of the conductive clip in the prior art.

[0007] According to one aspect of the present application, a cleaning device is provided for cleaning a conductive clamp, the cleaning device comprising: a cleaning tank, a spray assembly being provided in the cleaning tank, the spray assembly being used to spray a cleaning solution onto the conductive clamp when the conductive clamp passes through the cleaning tank; a drainage pipeline being connected to the cleaning tank, a detection component being provided on the drainage pipeline for detecting the pH value of the cleaning solution in the drainage pipeline; a first circulation branch; a second circulation branch, the drainage port of the first circulation branch and the drainage port of the second circulation branch being respectively connected to the spray assembly, a reaction chamber being provided on the second circulation branch, and the pH value of the cleaning solution being adjusted by the reaction chamber; wherein a first control valve is provided between the liquid outlet of the drainage pipeline and the liquid inlet of the first circulation branch and the liquid inlet of the second circulation branch, the first control valve controlling the drainage pipeline to be connected to the first circulation branch and / or the second circulation branch according to the pH value of the cleaning solution.

[0008] Furthermore, the reaction chamber includes a first chamber and a second chamber; the cleaning device also includes: an evaporator; a condenser, along the direction from the liquid inlet to the liquid outlet of the second circulation branch, the evaporator and the condenser are sequentially arranged on the second circulation branch and connected to the second circulation branch, the first chamber is arranged in the evaporator, and the second chamber is arranged in the condenser.

[0009] Furthermore, the cleaning device also includes: a first pump body, which is arranged on the second circulation branch and connected to the second circulation branch; a storage tank, which is arranged on the second circulation branch and is located at the liquid outlet end of the condenser, and is used to store the cleaning solution.

[0010] Furthermore, the cleaning device further includes: a second control valve, which is arranged between the storage tank and the liquid outlet of the second circulation branch, and the second circulation branch is controlled to be on and off by the second control valve.

[0011] Furthermore, the cleaning device further comprises: a detection tank body, which is arranged on the first circulation branch and communicated with the first circulation branch, and at least a part of the detection component is arranged in the detection tank body.

[0012] Furthermore, the cleaning device further includes: a second pump body, which is arranged on the first circulation branch and communicated with the first circulation branch, and the second pump body is located between the detection tank body and the first control valve.

[0013] Furthermore, the spray assembly includes: a plurality of nozzles, each nozzle being connected to the liquid outlet of the first circulation branch and / or the liquid outlet of the second circulation branch, the plurality of nozzles being arranged at intervals above the cleaning tank, and each nozzle being rotatably arranged to spray a cleaning solution toward the conductive clamp; a gas injection pipeline being arranged in the cleaning tank, and spraying gas toward the conductive clamp through the gas injection pipeline.

[0014] Furthermore, the cleaning device further comprises: a liquid inlet pipeline, a liquid inlet of the liquid inlet pipeline being connected to the first circulation branch and the second circulation branch respectively, and a liquid outlet of the liquid inlet pipeline being connected to each nozzle respectively.

[0015] Furthermore, the cleaning device also includes: a water washing tank, which is arranged on the side of the cleaning tank. There is a water source in the water washing tank. After the conductive clip is cleaned in the cleaning tank, it is washed with water in the water washing tank.

[0016] On the other hand, the present application also provides an electroplating device, including a cleaning device and an electroplating tank, wherein the cleaning device is arranged on the side of the electroplating tank, and the cleaning device is the above-mentioned cleaning device.

[0017] Compared with the existing technology, the technical solution of this application has at least the following technical effects:

[0018] The cleaning device provided by the present invention has the following characteristics: in the process of spraying the cleaning solution onto the conductive clamp by the spray component, the cleaning solution reacts with the metal ions deposited on the conductive clamp to strip off the metal ions; the solution after the reaction is collected in the cleaning tank and discharged by the drain pipe; the pH value of the solution in the drain pipe is detected by the detection component; when the pH value shows that the cleaning solution is still alkaline, the first control valve controls the drain pipe to be connected with the first circulation branch, and the cleaning solution is recycled to clean the conductive clamp; if the pH value shows that the cleaning solution is close to acidic, the first control valve controls the drain pipe to be connected with the second circulation branch, and the reaction chamber is used to perform a reduction reaction on the cleaning solution close to acidic, so that the cleaning solution reaches the applicable alkalinity again to clean the conductive clamp and avoid damage to the product caused by the copper plating of the conductive clamp. In addition, this can also reduce resource waste, recycle the cleaning solution, and reduce the cleaning cost of the conductive clamp. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0020] Figure 1 This is a schematic structural diagram of an embodiment of a cleaning device disclosed in this application;

[0021] Figure 2 This is a top view of the cleaning tank and the water washing tank in the cleaning device disclosed in this application.

[0022] The above drawings include the following reference numerals:

[0023] 100, conductive clip; 200, electroplating tank; 1, cleaning tank; 2, spray assembly; 20, nozzle; 21, gas injection pipeline; 22, air compressor; 3, drainage pipeline; 4, first circulation branch; 5, second circulation branch; 50, reaction chamber; 6, first control valve; 501, first chamber; 502, second chamber; 51, evaporator; 52, condenser; 53, first pump body; 54, storage tank; 55, second control valve; 40, detection tank body; 41, second pump body; 7, liquid inlet pipeline; 8, water washing tank. DETAILED DESCRIPTION

[0024] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0026] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to actual proportional relationships. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values should be interpreted as being merely exemplary, not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0027] As mentioned in the background technology, during electroplating, the film in the prior art is clamped by a conductive clamp for conductivity, and during the process of passing through the electroplating tank, it reacts with the plating solution in the electroplating tank to form a plating layer. During this process, due to the contact between the conductive clamp and the plating solution, metal ions will form deposits on the surface of the conductive clamp, which will cause the surface of the conductive clamp to become rough over a long period of time, forming granular protrusions or burrs, causing damage to the film during the clamping process. In the prior art, sodium sulfate is used to accommodate and strip the metal ions on the surface of the conductive clamp. However, sodium sulfate cannot be recycled, which increases the cleaning cost of the conductive clamp. Therefore, the present application provides a cleaning device for cleaning the conductive clamp 100, and a spray component 2 is provided in the cleaning tank 1. When the spray component 2 sprays the cleaning solution onto the conductive clamp 100, the cleaning tank 1 is used to recycle the waste liquid. , and discharged through the drain pipe 3. A detection component is set on the drain pipe 3 to detect the pH value of the discharged cleaning solution. When the pH value is large, it indicates that the cleaning solution is still alkaline. At this time, the first control valve 6 controls the drain pipe 3 to be connected with the first circulation branch 4, and the cleaning solution circulates back to the spray assembly 2 to continue cleaning the conductive clamp 100. When the pH value is detected to be small, it indicates that the cleaning solution is close to acidic. At this time, the first control valve 6 controls the drain pipe 3 to be connected with the second circulation branch 5. In the process of flowing through the reaction chamber 50, the cleaning solution undergoes a series of chemical reduction or physical reduction, and after adjusting the pH value to alkaline, it flows into the spray assembly 2, thereby achieving the purpose of recycling the cleaning solution, which will reduce the continuous consumption of the cleaning solution, reduce resource waste, and reduce the cleaning cost of the conductive clamp.

[0028] See also Figure 1 and Figure 2 As shown, the present application provides a cleaning device for cleaning a conductive clamp 100, and the cleaning device includes: a cleaning tank 1, a spray assembly 2 is provided in the cleaning tank 1, and the spray assembly 2 is used to spray a cleaning solution onto the conductive clamp 100 when the conductive clamp 100 passes through the cleaning tank 1; a drainage pipeline 3, which is connected to the cleaning tank 1, and a detection component is provided on the drainage pipeline 3, for detecting the pH value of the cleaning solution in the drainage pipeline 3; a first circulation branch 4; a second circulation branch 5, the drainage port of the first circulation branch 4 and the drainage port of the second circulation branch 5 are respectively connected to the spray assembly 2, and the second circulation branch 5 is provided with a reaction chamber 50, and the pH value of the cleaning solution is adjusted by the reaction chamber 50; wherein, a first control valve 6 is provided between the liquid outlet of the drainage pipeline 3 and the liquid inlet of the first circulation branch 4 and the liquid inlet of the second circulation branch 5, and the first control valve 6 controls the drainage pipeline 3 to be connected with the first circulation branch 4 and / or the second circulation branch 5 according to the pH value of the cleaning solution.

[0029] According to the cleaning device provided by the present invention, it includes a cleaning tank 1, a spray component 2, a drain pipe 3, a first circulation branch 4 and a second circulation branch 5. The spray component 2 is provided in the cleaning tank 1, and the spray component 2 is used to spray a cleaning solution onto the conductive clamp 100 when the conductive clamp 100 passes through the cleaning tank 1; the drain pipe 3 is connected to the cleaning tank 1, and a detection component is provided on the drain pipe 3 for detecting the pH value of the cleaning solution in the drain pipe 3; the drain port of the first circulation branch 4 and the drain port of the second circulation branch 5 are respectively connected to the spray component 2, and the second circulation branch 5 is provided with a reaction chamber 50, and the pH value of the cleaning solution is adjusted by the reaction chamber 50; wherein, a first control valve 6 is provided between the liquid outlet of the drain pipe 3 and the liquid inlet of the first circulation branch 4 and the liquid inlet of the second circulation branch 5, and the first control valve 6 controls the drain pipe 3 to be connected with the first circulation branch 4 and / or the second circulation branch 5 according to the pH value of the cleaning solution. During the process of spraying the cleaning solution onto the conductive clamp 100 by the spray component 2, the cleaning solution reacts with the metal ions deposited on the conductive clamp 100 to strip off the metal ions. The reacted solution is collected in the cleaning tank 1 and discharged using the drain pipe 3. The pH value of the solution in the drain pipe 3 is detected by the detection component. When the pH value shows that the cleaning solution is still alkaline, the first control valve 6 controls the drain pipe 3 to be connected to the first circulation branch 4, and the cleaning solution is recycled to clean the conductive clamp 100. If the pH value shows that the cleaning solution is close to acidic, the first control valve 6 controls the drain pipe 3 to be connected to the second circulation branch 5, and the reaction chamber 50 is used to perform a reduction reaction on the cleaning solution that is close to acidic, so that the cleaning solution reaches alkalinity again to clean the conductive clamp 100. This can reduce resource waste, recycle the cleaning solution, and reduce the cleaning cost of the conductive clamp.

[0030] In the present invention, the cleaning solution is preferably ammonia. Ammonia is used to dissolve copper on the upper and lower clamping surfaces of the conductive clip, which can be recycled to reduce the consumption of stripping agents. The copper stripped with ammonia is heated to form a copper oxide precipitate, which can then be dissolved with sulfuric acid and reintroduced into the electroplating tank for use.

[0031] Specifically, the reaction chamber 50 includes a first chamber 501 and a second chamber 502. The cleaning device also includes an evaporator 51 and a condenser 52. Evaporator 51 and condenser 52 are sequentially disposed on and in communication with the second circulation branch 5, along the direction from the liquid inlet to the liquid outlet of the second circulation branch 5. The first chamber 501 is disposed within the evaporator 51, and the second chamber 502 is disposed within the condenser 52. When the cleaning solution has a low concentration, it first enters the evaporator 51 to be heated and evaporated, causing the solution to evaporate into a gaseous state. The solution is then condensed by the condenser 52 to form a liquid state, which is then sprayed out of the spray assembly 2.

[0032] To accelerate the circulation of the cleaning solution, the cleaning device further includes: a first pump 53 disposed on and in communication with the second circulation branch 5; and a storage tank 54 disposed on the second circulation branch 5 and located at the liquid outlet of the condenser 52. The storage tank 54 is used to store the cleaning solution. The first pump 53 is used to provide power to the cleaning solution in the second circulation branch 5.

[0033] Furthermore, the cleaning device also includes a second control valve 55, which is disposed between the storage tank 54 and the liquid outlet of the second circulation branch 5. The second control valve 55 controls the opening and closing of the second circulation branch 5. To prevent the solution in the storage tank 54 from flowing into the spray assembly 2 during operation of the first circulation branch 4, the second control valve 55 is disposed between the storage tank 54 and the liquid outlet of the second circulation branch 5.

[0034] In the specific implementation process, the cleaning device further includes: a detection tank 40, which is arranged on the first circulation branch 4 and communicated with the first circulation branch 4, and at least part of the detection component is arranged in the detection tank 40. Preferably, the detection component is a pH detector.

[0035] Furthermore, the cleaning device further includes: a second pump body 41, which is arranged on the first circulation branch 4 and communicates with the first circulation branch 4, and the second pump body 41 is located between the detection tank body 40 and the first control valve 6. The second pump body 41 provides power for the cleaning solution in the first circulation branch 4.

[0036] In the embodiment provided by the present invention, the spray assembly 2 includes: a plurality of spray heads 20, each of which is connected to the liquid outlet of the first circulation branch 4 and / or the liquid outlet of the second circulation branch 5. The plurality of spray heads 20 are spaced apart above the cleaning tank 1 and are rotatably arranged to spray cleaning solution toward the conductive clamp 100; and a gas injection pipeline 21, which is arranged between two adjacent spray heads 20 and injects gas toward the conductive clamp 100 through the gas injection pipeline 21. The gas inlet end of the gas injection pipeline 21 is connected to an air compressor 22. Since the dissolution of copper in ammonia requires oxygen, the gas injection pipeline 21 can accelerate the dissolution of copper. The plurality of spray heads 20 are rotatable, and during the spraying process, various locations on the conductive clamp 100 can be cleaned to prevent metal ion residue on the two clamping surfaces of the conductive clamp 100. Preferably, the plurality of spray heads 20 are arranged in two rows, corresponding to the upper and lower clamping surfaces of the conductive clamp, respectively, with one or more spray heads 20 in each row.

[0037] Furthermore, the cleaning device also includes: a liquid inlet pipeline 7, the liquid inlet of the liquid inlet pipeline 7 is connected to the first circulation branch 4 and the second circulation branch 5 respectively, and the liquid outlet of the liquid inlet pipeline 7 is connected to each nozzle 20 respectively. The cleaning device also includes: a water washing tank 8, which is arranged on the side of the cleaning tank 1. The water washing tank 8 has a water source. After the conductive clamp 100 is cleaned in the cleaning tank 1, it is washed with water through the water washing tank 8. The cleaning solution flowing out of the first circulation branch 4 and / or the second circulation branch 5 is converged through the liquid inlet pipeline 7 to supply liquid to each nozzle 20; since ammonia water will remain on the surface of the conductive clamp 100 after cleaning, and the ammonia water will react with the plating solution, the water washing tank 8 is provided. After the conductive clamp 100 is cleaned with the cleaning solution, it enters the water washing tank 8 to wash the conductive clamp.

[0038] The present invention further provides an electroplating device, comprising a cleaning device and an electroplating tank 200 . The cleaning device is arranged on the side of the electroplating tank 200 , and the cleaning device is the cleaning device of the above embodiment.

[0039] In the present application, a cleaning device is used to clean the copper ions deposited on the conductive clip 100. The cleaning solution is ammonia water. A cleaning tank 1 is set on both sides of the electroplating tank 200. The end of the cleaning tank 1 is provided with a gap for the conductive clip 100 to pass through. During the continuous plating process, the conductive clip 100 runs to the outside of the electroplating tank and separates from the film, and then enters the cleaning tank 1 through the gap. Ammonia water is continuously sprayed through each nozzle 20 in the cleaning tank 1 to rinse the upper and lower clamping surfaces of the conductive clip 100. At the same time, oxygen is sprayed from the side of the nozzle 20 to dissolve the copper deposited on the surface of the conductive clip 100 into the ammonia water. After cleaning, the solution enters the detection tank 40 through the drainage pipe 3. A pH detector is provided in the detection tank 40. First, there is a large amount of ammonia in the ammonia storage tank (the pH value is about 11.7). After spraying, due to efficiency problems, part of the ammonia in the sprayed ammonia does not react. Therefore, after the solution enters the detection tank 40 after cleaning, the pH value of the solution in the detection tank 40 can be detected by the pH detector. Generally speaking, if the ammonia reacts completely during spraying, the pH value of the detection tank 40 should be low, around 7. However, the ammonia does not react completely during spraying. Therefore, at the initial stage of cleaning, the pH value of the solution in the detection tank 40 is still high, which means that the ammonia concentration is high. At this time, the first control valve 6 (the first control valve 6 is a three-way valve) is adjusted so that the solution in the detection tank 40 does not enter the evaporator, but is sprayed out again through the spray head to clean the conductive clip. When the detected pH value is close to the preset value, such as 8 or 9, this pH value is low, indicating that the ammonia concentration is low. The first control valve 6 (three-way valve) can be adjusted so that the solution in the detection tank 40 only enters the evaporator for heating and evaporation, so that the solution evaporates under heat to form ammonia gas. The evaporated ammonia gas passes through the steam condenser to form ammonia water and then enters the ammonia water storage tank, which can be re-introduced into the cleaning tank for recycling. The copper dissolved in the solution is precipitated in the form of copper oxide and can be dissolved with sulfuric acid, so that the copper can be recycled. When the pH value of the ammonia water in the detection tank 40 is above 9, the first control valve 6 can be opened, so that the first circulation branch 4 and the second circulation branch 5 work together to supply liquid to each spray head 20.

[0040] The chemical formula for cleaning the upper and lower clamping surfaces of the conductive clip is: 2Cu+8NH3+2H2O+O2=2[Cu(NH3)4](OH)2

[0041] The expression of ammonia obtained by evaporating the solution is: [Cu(NH3)4](OH)2=CuO+H2O+NH3↑

[0042] Copper oxide is dissolved using sulfuric acid: CuO + H2SO4 = CuSO4 + H2O.

[0043] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0044] According to the cleaning device provided by the present invention, it includes a cleaning tank 1, a spray component 2, a drain pipe 3, a first circulation branch 4 and a second circulation branch 5. The spray component 2 is provided in the cleaning tank 1, and the spray component 2 is used to spray a cleaning solution onto the conductive clamp 100 when the conductive clamp 100 passes through the cleaning tank 1; the drain pipe 3 is connected to the cleaning tank 1, and a detection component is provided on the drain pipe 3 for detecting the pH value of the cleaning solution in the drain pipe 3; the drain port of the first circulation branch 4 and the drain port of the second circulation branch 5 are respectively connected to the spray component 2, and the second circulation branch 5 is provided with a reaction chamber 50, and the pH value of the cleaning solution is adjusted by the reaction chamber 50; wherein, a first control valve 6 is provided between the liquid outlet of the drain pipe 3 and the liquid inlet of the first circulation branch 4 and the liquid inlet of the second circulation branch 5, and the first control valve 6 controls the drain pipe 3 to be connected with the first circulation branch 4 and / or the second circulation branch 5 according to the pH value of the cleaning solution. During the process of spraying the cleaning solution onto the conductive clamp 100 by the spray component 2, the cleaning solution reacts with the metal ions deposited on the conductive clamp 100 to strip off the metal ions. The reacted solution is collected in the cleaning tank 1 and discharged using the drain pipe 3. The pH value of the solution in the drain pipe 3 is detected by the detection component. When the pH value shows that the cleaning solution is still alkaline, the first control valve 6 controls the drain pipe 3 to be connected to the first circulation branch 4, and the cleaning solution is recycled to clean the conductive clamp 100. If the pH value shows that the cleaning solution is close to acidic, the first control valve 6 controls the drain pipe 3 to be connected to the second circulation branch 5, and the reaction chamber 50 is used to perform a reduction reaction on the cleaning solution that is close to acidic, so that the cleaning solution reaches alkalinity again to clean the conductive clamp 100. This can reduce resource waste, recycle the cleaning solution, and reduce the cleaning cost of the conductive clamp.

[0045] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0046] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0047] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A cleaning device for cleaning a conductive clip (100), characterized in that: The cleaning device comprises: A cleaning tank (1), wherein a spray assembly (2) is provided in the cleaning tank (1), and the spray assembly (2) is used to spray a cleaning solution onto the conductive clip (100) when the conductive clip (100) passes through the cleaning tank (1); A liquid discharge pipeline (3) is connected to the cleaning tank (1), and a detection component is provided on the liquid discharge pipeline (3) for detecting the pH value of the cleaning solution in the liquid discharge pipeline (3); First circulation branch (4); a second circulation branch (5), wherein the discharge port of the first circulation branch (4) and the discharge port of the second circulation branch (5) are respectively connected to the spray assembly (2); a reaction chamber (50) is provided on the second circulation branch (5), and the pH value of the cleaning solution is adjusted through the reaction chamber (50); A first control valve (6) is provided between the liquid outlet of the drainage pipeline (3), the liquid inlet of the first circulation branch (4), and the liquid inlet of the second circulation branch (5). The first control valve (6) controls the communication between the drainage pipeline (3) and the first circulation branch (4) and / or the second circulation branch (5) according to the pH value of the cleaning solution.

2. The cleaning device according to claim 1, characterized in that The reaction chamber (50) includes a first chamber (501) and a second chamber (502); the cleaning device further includes: Evaporator (51); The condenser (52) is arranged in sequence on the second circulation branch (5) from the liquid inlet to the liquid outlet of the second circulation branch (5), and is connected to the second circulation branch (5); the first chamber (501) is arranged in the evaporator (51), and the second chamber (502) is arranged in the condenser (52).

3. The cleaning device according to claim 2, characterized in that The cleaning device also includes: a first pump body (53) disposed on the second circulation branch (5) and in communication with the second circulation branch (5); A storage tank (54) is provided on the second circulation branch (5), and the storage tank (54) is located at the liquid outlet end of the condenser (52). The storage tank (54) is used to store the cleaning solution.

4. The cleaning device according to claim 3, characterized in that The cleaning device also includes: The second control valve (55) is arranged between the storage tank (54) and the liquid outlet of the second circulation branch (5), and the second circulation branch (5) is controlled to be on and off by the second control valve (55).

5. The cleaning device according to claim 1, characterized in that The cleaning device also includes: A detection tank (40) is arranged on the first circulation branch (4) and communicated with the first circulation branch (4); at least a portion of the detection component is arranged in the detection tank (40).

6. The cleaning device according to claim 5, characterized in that The cleaning device also includes: The second pump body (41) is arranged on the first circulation branch (4) and is in communication with the first circulation branch (4). The second pump body (41) is located between the detection tank body (40) and the first control valve (6).

7. The cleaning device according to any one of claims 1 to 6, characterized in that The spray assembly (2) comprises: a plurality of nozzles (20), each of the nozzles (20) being in communication with a liquid outlet of the first circulation branch (4) and / or a liquid outlet of the second circulation branch (5), the plurality of nozzles (20) being arranged at intervals above the cleaning tank (1), and each of the nozzles (20) being rotatably arranged to spray a cleaning solution toward the conductive clip (100); A gas injection pipeline (21) is provided in the cleaning tank (1), and gas is injected toward the conductive clip (100) through the gas injection pipeline (21).

8. The cleaning device according to claim 7, characterized in that The cleaning device also includes: A liquid inlet pipeline (7), wherein the liquid inlet of the liquid inlet pipeline (7) is respectively connected to the first circulation branch (4) and the second circulation branch (5), and the liquid outlet of the liquid inlet pipeline (7) is respectively connected to each of the nozzles (20).

9. The cleaning device according to any one of claims 1 to 6, characterized in that The cleaning device also includes: A water washing tank (8) is arranged on the side of the cleaning tank (1). A water source is provided in the water washing tank (8). After the conductive clip (100) is cleaned in the cleaning tank (1), it is washed with water in the water washing tank (8).

10. An electroplating device, comprising a cleaning device and an electroplating tank (200), wherein the cleaning device is arranged on the side of the electroplating tank (200), characterized in that: The cleaning device is the cleaning device according to any one of claims 1 to 9.

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