Circuit board chip reflow soldering device

Abstract

The utility model discloses a circuit board chip reflow soldering device, and relates to the technical field of circuit board production. Comprising a fixing frame assembly and transverse clamping plates, a positioning groove is formed in the fixing frame assembly, the transverse clamping plates slide at the left end and the right end of the positioning groove, butterfly bolts are installed on the transverse clamping plates in a threaded mode, the transverse clamping plates are fastened in the positioning groove through the butterfly bolts, and the fixing frame assembly comprises a rear half frame, a front half frame, screws, limiting nuts and high-temperature-resistant springs. According to the circuit board chip reflow soldering device, the transverse distance between the transverse clamping plates is adjusted in advance, the longitudinal distance of the fixing frame assembly is adjusted, the size of a positioning groove is made to be matched with the size of a circuit board to be soldered, a high-temperature-resistant spring is used for controlling the longitudinal clamping force, and by means of the elasticity characteristic of the spring, the circuit board chip can be firmly soldered. The circuit board can be conveniently taken down after being welded, the positioning requirements of square circuit boards of different sizes in the reflow soldering process can be met, and the universality is high.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production, in particular to a circuit board chip reflow soldering device. Background Art

[0002] Reflow soldering technology is not unfamiliar in the field of electronic manufacturing. The components on various boards used in our computers are soldered to the circuit board through this process. Reflow soldering heats air or nitrogen to a high enough temperature and blows it towards the circuit board with components already attached, allowing the solder on both sides of the components to melt and bond to the motherboard. The advantage of this process is that the temperature is easy to control, oxidation can be avoided during the soldering process, and manufacturing costs are easier to control.

[0003] During the reflow soldering process, the circuit board needs to be positioned and loaded, so a positioning tooling mechanism is needed. Due to the rapid replacement of circuit boards and the wide variety of types, each type of circuit board requires specific tooling to place it, which increases production costs. Utility Model Content

[0004] The utility model provides a circuit board chip reflow soldering device to solve the problems in the background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a circuit board chip reflow soldering device, comprising a fixing frame assembly and a transverse clamping plate, wherein the fixing frame assembly is provided with a positioning groove, the transverse clamping plate slides on the left and right ends of the positioning groove, and the transverse clamping plate is threadedly mounted with a butterfly bolt and is fastened in the positioning groove by the butterfly bolt;

[0006] The fixed frame assembly includes a rear half frame, a front half frame, a screw, a limiting nut and a high-temperature resistant spring. Through slots are provided on both sides of the front half frame and the rear half frame. The two ends of the screw are respectively sleeved in the through slots and locked in the through slots by limiting nuts. The high-temperature resistant spring is arranged in the through slot of the rear half frame and is located between the inner wall of the through slot and the limiting nut.

[0007] Furthermore, transverse strip holes are provided at the front and rear ends of the positioning slot, and the transverse strip holes are located at the left and right ends of the positioning slot.

[0008] Furthermore, the head end of the butterfly bolt passes upward through the transverse strip hole and is fastened to the transverse clamping plate.

[0009] Furthermore, the transverse splint is provided with longitudinal strip holes, and the longitudinal strip holes are located at the front and rear ends of the transverse splint.

[0010] Furthermore, the head end of the butterfly bolt passes upward through the longitudinal strip hole, so that the transverse clamping plate is fastened in the positioning groove.

[0011] Furthermore, the middle portion of the positioning groove is hollow, and the screw rods are located on the left and right sides of the front half frame and the rear half frame.

[0012] Compared with the prior art, the present invention provides a circuit board chip reflow soldering device with the following beneficial effects:

[0013] This circuit board chip reflow soldering device pre-adjusts the horizontal spacing between the horizontal clamping plates and adjusts the vertical spacing of the fixed frame components so that the size of the positioning groove is compatible with the size of the circuit board to be soldered. The high-temperature resistant spring is used to control the longitudinal clamping force, and the elastic characteristics of the spring itself can be used to facilitate the removal of the circuit board after soldering. It can meet the positioning requirements of square circuit boards of different sizes during the reflow soldering process and has strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a top view of the utility model;

[0015] Figure 2 It is a front sectional view of the present utility model;

[0016] Figure 3 This is a structural diagram of the fixed frame assembly of the present utility model.

[0017] In the figure: 1. Fixed frame assembly; 11. Positioning slot; 12. Rear half frame; 13. Front half frame; 14. Screw; 15. Limit nut; 16. High temperature resistant spring; 17. Through slot; 18. Horizontal strip hole; 2. Horizontal splint; 21. Longitudinal strip hole; 3. Butterfly bolt. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] See also Figure 1-Figure 3The utility model discloses a circuit board chip reflow soldering device, including a fixing frame assembly 1 and a horizontal clamping plate 2. A positioning groove 11 is provided in the fixing frame assembly 1. The horizontal clamping plate 2 slides at the left and right ends of the positioning groove 11. The horizontal clamping plate 2 is threadedly installed with a butterfly bolt 3 and is fastened in the positioning groove 11 by the butterfly bolt 3. The horizontal spacing between the horizontal clamping plates 2 is pre-adjusted, and the longitudinal spacing of the fixing frame assembly 1 is adjusted so that the size of the positioning groove 11 is adapted to the size of the circuit board to be soldered. The high-temperature resistant spring 16 is used to control the longitudinal clamping force, and the elastic characteristics of the spring itself are utilized to facilitate the removal of the circuit board after soldering, and can meet the positioning requirements of square circuit boards of different sizes during the reflow soldering process, and has strong versatility.

[0020] The fixed frame assembly 1 includes a rear half frame 12, a front half frame 13, a screw 14, a limiting nut 15 and a high-temperature resistant spring 16. Through slots 17 are provided on both sides of the front half frame 13 and the rear half frame 12. The two ends of the screw 14 are respectively sleeved in the through slots 17 and locked in the through slots 17 by the limiting nut 15. The high-temperature resistant spring 16 is arranged in the through slot 17 of the rear half frame 12 and is located between the inner wall of the through slot 17 and the limiting nut 15.

[0021] Specifically, transverse strip holes 18 are formed at the front and rear ends of the positioning slot 11 , and the transverse strip holes 18 are located at the left and right ends of the positioning slot 11 .

[0022] In this embodiment, the transverse strip holes 18 are long strips and are used to connect or fix two objects. The shapes of the strip holes can be different, such as round, square, trapezoidal, etc., but they all have a certain length and width and usually extend in one direction.

[0023] Specifically, the head end of the butterfly bolt 3 passes upward through the transverse strip hole 18 and is fastened to the transverse clamping plate 2 .

[0024] In this embodiment, the transverse strip-shaped hole 18 is used to fix the transverse clamping plate 2 in the positioning groove 11 through the butterfly bolt 3 .

[0025] Specifically, the transverse splint 2 is provided with longitudinal strip holes 21 , and the longitudinal strip holes 21 are located at the front and rear ends of the transverse splint 2 .

[0026] In this embodiment, the longitudinal strip hole 21 is long and strip-shaped and is used to connect or fix two objects.

[0027] Specifically, the head end of the butterfly bolt 3 passes upward through the longitudinal strip hole 21 , so that the transverse clamping plate 2 is fastened in the positioning groove 11 .

[0028] In this embodiment, when the longitudinal spacing of the fixing frame assembly 1 is adjusted, the longitudinal strip holes 21 are used to avoid structural interference without affecting the connectivity of the transverse clamping plates 2 .

[0029] Specifically, the middle portion of the positioning slot 11 is hollowed out, and the screw rods 14 are located on the left and right sides of the front half frame 13 and the rear half frame 12 .

[0030] In this embodiment, the longitudinal spacing of the fixing frame assembly 1 is adjusted by adjusting the spacing between the front half frame 13 and the rear half frame 12 .

[0031] When in use, pre-adjust the horizontal spacing between the horizontal clamps 2 (the specific operation is to loosen the nut of the butterfly bolt 3 so that the horizontal clamp 2 can move laterally in the positioning groove 11, and after the position is determined, tighten the butterfly bolt 3 again), and adjust the longitudinal spacing of the fixed frame assembly 1 (by adjusting the spacing of the front half frame 13 relative to the rear half frame 12, the specific operation is to screw in the limiting nut 15 in the front half frame 13, so that the limiting nut 15 moves linearly along the screw 14, thereby promoting the linear movement of the front half frame 13), so that the size of the positioning groove 11 is adapted to the size of the circuit board to be welded, and the high-temperature resistant spring 16 is used to control the longitudinal clamping force, and the elastic characteristics of the spring itself can be used to facilitate the removal of the circuit board after welding, which can meet the positioning requirements of square circuit boards of different sizes during the reflow soldering process, and has strong versatility.

[0032] To sum up, the circuit board chip reflow soldering device pre-adjusts the horizontal spacing between the horizontal clamping plates 2 and adjusts the longitudinal spacing of the fixed frame assembly 1 so that the size of the positioning groove 11 is adapted to the size of the circuit board to be soldered. The high-temperature resistant spring 16 is used to control the longitudinal clamping force and utilizes the elastic characteristics of the spring itself to facilitate the removal of the circuit board after soldering. It can meet the positioning requirements of square circuit boards of different sizes during the reflow soldering process and has strong versatility.

[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board chip reflow soldering device, comprising a fixed frame assembly (1) and a transverse clamping plate (2), characterized in that: A positioning groove (11) is provided in the fixing frame assembly (1), and the transverse clamping plate (2) slides on the left and right ends of the positioning groove (11). A butterfly bolt (3) is threadedly mounted on the transverse clamping plate (2) and is fastened in the positioning groove (11) by the butterfly bolt (3); The fixed frame assembly (1) comprises a rear half frame (12), a front half frame (13), a screw (14), a limiting nut (15) and a high temperature resistant spring (16). Through slots (17) are provided on both sides of the front half frame (13) and the rear half frame (12). Both ends of the screw (14) are respectively sleeved in the through slots (17) and locked in the through slots (17) by the limiting nut (15). The high temperature resistant spring (16) is arranged in the through slot (17) of the rear half frame (12) and is located between the inner wall of the through slot (17) and the limiting nut (15).

2. A circuit board chip reflow soldering device according to claim 1, characterized in that: Transverse strip holes (18) are provided at the front and rear ends of the positioning groove (11), and the transverse strip holes (18) are located at the left and right ends of the positioning groove (11).

3. A circuit board chip reflow soldering device according to claim 2, characterized in that: The head end of the butterfly bolt (3) passes through the transverse strip hole (18) upwards and is firmly connected to the transverse clamping plate (2).

4. A circuit board chip reflow soldering device according to claim 1, characterized in that: The transverse clamping plate (2) is provided with longitudinal strip holes (21), and the longitudinal strip holes (21) are located at the front and rear ends of the transverse clamping plate (2).

5. A circuit board chip reflow soldering device according to claim 4, characterized in that: The head end of the butterfly bolt (3) passes through the longitudinal strip hole (21) upwards, so that the transverse clamping plate (2) is fastened in the positioning groove (11).

6. The circuit board chip reflow soldering device according to claim 1, characterized in that: The middle portion of the positioning groove (11) is hollowed out, and the screw rod (14) is located on the left and right sides of the front half frame (13) and the rear half frame (12).

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