Capacitor film evaporation processing equipment

Abstract

The utility model provides capacitor film evaporation processing equipment, including evaporator main part, support pillar, fan, heater, condensation plate, emptying table, said evaporator main part bottom periphery is equipped with four support pillar, said support pillar mutually parallel is equipped with crossbeam, one side of said support pillar is equipped with vacuum machine, the other side is equipped with motor and condenser, the condenser is equipped with the fan, heater, condenser plate, emptying table. The fan is installed at the top of the evaporator main body, the heater is installed at the top in the evaporator main body, the heater comprises a connecting rod, a ventilation opening is formed in the connecting rod in a penetrating mode, a plurality of connecting columns are installed on the connecting rod, heating plates are installed on the connecting columns, and a plurality of condensation plates are installed on the inner wall of the evaporator main body. And a second connecting pipe is connected between the condensation plates, a discharging table is installed at the bottom of the interior of the evaporator body, a partition plate is installed on the discharging table, and a placing table is installed below the partition plate.

Description

Technical Field

[0001] The utility model relates to the field of evaporation, in particular to capacitor film evaporation processing equipment. Background Art

[0002] Evaporation is a physical vapor deposition technology (PVD for short). In this process, an evaporation source (usually a high-purity solid substance such as a metal or compound) is placed in a vacuum chamber and evaporated by heating. Before the evaporated atoms or molecules reach the surface of the substrate, they will collide with gas molecules in the vacuum chamber. These collisions will cause the energy of the atoms or molecules to decrease, thereby forming a uniform and dense thin film on the surface of the substrate.

[0003] Capacitor film is a thin film structure made of a layer of dielectric material coated on a conductive substrate. Due to its unique capacitance properties, this film is widely used in electronics, electricity, communications and other fields. Capacitor film can optimize the performance of capacitors, such as capacitance value and dielectric loss, by adjusting parameters such as the type and thickness of the dielectric material and the preparation process.

[0004] In the existing capacitor thin film evaporation technology, a thin film with certain capacitance properties is formed on the surface of the substrate. This process involves heating the evaporation source or source material to a gaseous state, and then condensing and solidifying it into a thin film on the substrate. In the process of performing capacitor thin film evaporation, it is first necessary to create a high-precision vacuum environment to reduce the interference of background gas on the deposition process. Subsequently, the selected material source is placed in the evaporator and heated to the evaporation temperature by resistance heating, electron beam heating or laser heating. As the material evaporates, it condenses on the surface of the substrate to form a solid film. Since heating treatment is required during evaporation and the gas cannot circulate in the chamber, it needs to be stationary for cooling after heating is completed. Since heat dissipation is not performed, the film deposited on the capacitor surface is easily oxidized during cooling, and the entire stationary cooling time is too long, which affects production quality and efficiency. To address this problem, the following technical solution is proposed. Utility Model Content

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] Capacitor thin film evaporation processing equipment, including: evaporation machine main body;

[0007] Support columns, there are four support columns, each of which is installed at the four corners of the bottom of the evaporation machine body, and the support columns are installed with beams parallel to each other, a vacuum machine is installed on one side of the support column, and a motor and a condenser are installed on the other side;

[0008] A fan, the fan being installed on the top of the evaporation machine body;

[0009] A heater is mounted on the top of the vapor deposition machine body, the heater includes a connecting rod, and a vent is provided inside the connecting rod, a plurality of connecting columns are mounted on the connecting rod, and a heating plate is mounted on each of the connecting columns;

[0010] Condensation plates, wherein a plurality of condensation plates are provided, and the plurality of condensation plates are all mounted on the inner wall of the vapor deposition machine body, and the condensation plates are interconnected by second connecting pipes;

[0011] A material discharging table is welded to the bottom of the interior of the evaporation machine body. A partition is installed on the material discharging table, and a placement table is provided under the partition. The placement table is installed at the bottom of the interior of the evaporation machine body.

[0012] As a preferred solution of the present invention, it is characterized in that: a hinge is installed on the outer wall of the vapor deposition machine body, the other end of the hinge is connected to the box door, and a sealing ring is installed on the back of the box door, a handle is installed on one side of the box door, and a control panel is installed on the side away from the handle.

[0013] As a preferred solution of the present invention, a valve is provided in the vent, and the vent is connected to a fan.

[0014] As a preferred solution of the present invention, a first connecting pipe is provided at the top of the condenser, and the other end of the first connecting pipe is connected to the bottom of the condensing plate.

[0015] As a preferred solution of the present invention, a third connecting pipe is provided on the top of the vacuum machine, the other end of the third connecting pipe is connected to the inner wall of the vapor deposition machine body, and a ventilation net is provided on the outer wall of the vacuum machine.

[0016] As a preferred solution of the present invention, the motor is electrically connected to the condenser, the fan, the vacuum machine, the valve, and the control panel.

[0017] Compared with the prior art, the advantages of the present invention are:

[0018] A plurality of condensing plates are installed on the inner wall of the vapor deposition machine body, and a second connecting pipe is connected to each other among the plurality of condensing plates. The condenser delivers cold air to the condensing plates through the first connecting pipe. The cold air passes through each of the condensing plates, so that the interior of the vapor deposition machine body is quickly cooled. At the same time, while cooling, the internal gas is not prevented from not circulating during cooling. A fan is installed on the top of the vapor deposition machine body. The fan and the connecting rod are connected to each other. The valve is opened through the control panel to quickly reduce the temperature inside the vapor deposition machine body. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is the overall structural diagram of the utility model;

[0020] Figure 2This is a structural diagram of the box door of the utility model;

[0021] Figure 3 This is a diagram showing the internal structure of the main body of the vapor deposition machine of the present utility model;

[0022] Figure 4 This is a cross-sectional view of the interior of the main body of the vapor deposition machine of the present invention;

[0023] Figure 5 This is a top view of the internal structure of the main body of the vapor deposition machine of the utility model;

[0024] In the figure: 1. Vapor deposition machine body; 2. Placement table; 3. Material discharge table; 4. Partition; 5. Condensation plate; 6. First connecting pipe; 7. Condenser; 8. Motor; 9. Heater; 10. Connecting column; 11. Heating plate; 12. Fan; 13. Ventilation port; 14. Connecting rod; 15. Sealing ring; 16. Box door; 17. Handle; 18. Hinge; 19. Control panel; 20. Vacuum machine; 21. Second connecting pipe; 22. Support column; 23. Third connecting pipe; 24. Valve; 25. Beam; 26. Ventilation net. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] Example:

[0027] See also Figure 1-Figure 5 , capacitor thin film evaporation processing equipment, including:

[0028] Evaporation machine main body 1;

[0029] Support columns 22, there are four support columns 22, the four support columns 22 are installed at the four corners of the bottom of the vapor deposition machine body 1, and the support columns 22 are installed with crossbeams 25 parallel to each other. The vacuum machine 20 is installed on one side of the support column 22, and the motor 8 and the condenser 7 are installed on the other side;

[0030] A fan 12 is installed on the top of the vapor deposition machine body 1;

[0031] A heater 9 is mounted on the top of the vapor deposition machine body 1. The heater 9 includes a connecting rod 14, and a vent 13 is provided inside the connecting rod 14. A plurality of connecting posts 10 are mounted on the connecting rod 14, and a heating plate 11 is mounted on each of the connecting posts 10.

[0032] Condensation plates 5, wherein a plurality of condensation plates 5 are provided, and the plurality of condensation plates 5 are all mounted on the inner wall of the vapor deposition machine body 1, and the condensation plates 5 are interconnected by second connecting pipes 21;

[0033] The material discharging platform 3 is welded to the bottom of the interior of the vapor deposition machine body 1 , a partition 4 is installed on the material discharging platform 3 , and a placement platform 2 is provided below the partition 4 , and the placement platform 2 is installed at the bottom of the interior of the vapor deposition machine body 1 .

[0034] In this embodiment, a vacuum machine 20 is installed on one side of the support column 22 installed at the bottom of the evaporation machine body 1. The function of the vacuum machine 20 is to evacuate the interior of the evaporation machine body 1 to a high vacuum state, creating a pure and impurity-free environment for the subsequent metal evaporation process. A motor 8 and a condenser 7 are installed on the other side. The function of the motor 8 is to provide power to the entire evaporation machine body 1. The function of the condenser 7 is to quickly cool down the interior of the evaporation machine body 1 and prevent the film reinforced on the outer surface of the capacitor from undergoing oxidation reaction. At the same time, a fan 12 is installed on the top of the evaporation machine body 1. The fan 12 is to allow the gas inside the evaporation machine body 1 to circulate during heat dissipation. The heater 9 is connected to the connecting rod 14. In order to make the heating more uniform, multiple heaters 9 are provided, which can fully heat the capacitor to be evaporated. A partition 4 is installed on the discharge table 3. The partition 4 can be replaced according to processing requirements. A prevention table is provided under the partition 4. A concave block is provided in the placement table 2. The metal material added to the concave block is evaporated into atoms and diffused between the electrodes through the vacuum environment to form a uniform and dense metal film.

[0035] Specifically, it is characterized in that: a hinge 18 is installed on the outer wall of the vapor deposition machine body 1, the other end of the hinge 18 is connected to the box door 16, and a sealing ring 15 is installed on the back of the box door 16, a handle 17 is installed on one side of the box door 16, and a control panel 19 is installed on the side away from the handle 17.

[0036] In this embodiment, the sealing ring 15 installed on the back of the box door 16 plays a sealing role. At the same time, a sealing ring 15 is also installed at the connection part of the box door 16 to the evaporation machine body 1, so that the evaporation machine body 1 remains completely closed after the box door 16 is closed.

[0037] Specifically, a valve 24 is provided in the vent 13 , and the vent 13 is connected to the fan 12 .

[0038] In this embodiment, a vent 13 is provided inside the connecting rod 14, and a valve 24 is installed in the vent 13. When vacuum is required during heating and evaporation, the fan 12 does not work and the valve 24 is closed to maintain a vacuum state inside the evaporation machine body.

[0039] Specifically, a first connecting pipe 6 is provided at the top of the condenser 7 , and the other end of the first connecting pipe 6 is connected to the bottom of the condensing plate 5 .

[0040] In this embodiment, the condensation plate 5 conveys cold air to the condensation plate 5 through the first connecting pipe 6. At the same time, the condensation plates 5 are interconnected with the second connecting pipe 21 to quickly cool down the interior of the entire vapor deposition machine body 1.

[0041] Specifically, a third connecting pipe 23 is provided at the top of the vacuum machine 20 , and the other end of the third connecting pipe 23 is connected to the inner wall of the vapor deposition machine body 1 . A ventilation net 26 is provided on the outer wall of the vacuum machine 20 .

[0042] In this embodiment, the vacuum machine 20 is used to extract the air inside the evaporation machine body 1 so that a vacuum effect is achieved inside during heating, creating a pure and impurity-free environment for the subsequent metal evaporation process. At the same time, a ventilation net 26 is installed on the outer wall of the vacuum machine 20 body, and the extracted air will be discharged through the ventilation net 26.

[0043] Specifically, the motor 8 is electrically connected to the condenser 7 , the fan 12 , the vacuum machine 20 , the valve 24 , and the control panel 19 .

[0044] The motor 8 provides power to the condenser 7, fan 12, vacuum machine 20, valve 24, and control board 19. The control board 19 makes the vapor deposition machine body intelligent, and each parameter can be strictly controlled to meet the processing requirements of higher precision standards.

[0045] The principle of the present invention is as follows: first, the capacitor to be processed is placed on a suitable partition 4, and the metal material is placed in the concave block of the placement table 2. Then, the box door 16 is closed, and the control panel 19 sends an instruction to the vacuum machine 20 to extract air. The air inside the vapor deposition machine body 1 is extracted by the vacuum machine 20 through the third connecting pipe 23 and finally discharged through the ventilation net 26. When the interior of the vapor deposition machine body 1 is completely in a vacuum state, the heater 9 is turned on by control to heat it. During heating, the metal material in the concave block of the placement table 2 evaporates. It is an atom and diffuses between the electrodes through a vacuum environment, forming a uniform and dense metal film on the outer surface of the capacitor. When the processing requirements are met, the condenser 7 is turned on through the control board 19, and the condenser 7 transports the cold air through the first connecting pipe 6 to the multiple condensing plates 5 installed on the inner wall of the vapor deposition machine body 1. The multiple condensing plates 5 are interconnected by a second connecting pipe 21 to achieve the effect of cold air circulation, cooling the interior of the vapor deposition machine body 1. At the same time, the fan 12 and the valve 24 in the vent 13 are opened to circulate the gas inside the vapor deposition machine body 1.

[0046] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and improved ideas of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. Capacitor thin film evaporation processing equipment, characterized in that, include: Evaporation machine body; Support columns, there are four support columns, each of which is installed at the four corners of the bottom of the evaporation machine body, and the support columns are installed with beams parallel to each other, a vacuum machine is installed on one side of the support column, and a motor and a condenser are installed on the other side; A fan, the fan being installed on the top of the evaporation machine body; A heater is mounted on the top of the vapor deposition machine body, the heater includes a connecting rod, and a vent is provided inside the connecting rod, a plurality of connecting columns are mounted on the connecting rod, and a heating plate is mounted on each of the connecting columns; Condensation plates, wherein a plurality of condensation plates are provided, and the plurality of condensation plates are all mounted on the inner wall of the vapor deposition machine body, and the condensation plates are interconnected by second connecting pipes; A material discharging table is welded to the bottom of the interior of the evaporation machine body. A partition is installed on the material discharging table, and a placement table is provided below the partition. The placement table is installed at the bottom of the interior of the evaporation machine body.

2. The capacitor thin film evaporation processing equipment according to claim 1, characterized in that: A hinge is installed on the outer wall of the vapor deposition machine body, the other end of the hinge is connected to a box door, and a sealing ring is installed on the back of the box door. A handle is installed on one side of the box door, and a control panel is installed on the side away from the handle.

3. The capacitor thin film evaporation processing equipment according to claim 2, characterized in that: A valve is provided in the vent, and the vent is connected to the fan.

4. The capacitor thin film evaporation processing equipment according to claim 3, characterized in that: A first connecting pipe is provided at the top of the condenser, and the other end of the first connecting pipe is connected to the bottom of the condensing plate.

5. The capacitor thin film evaporation processing equipment according to claim 4, characterized in that: A third connecting pipe is provided on the top of the vacuum machine, and the other end of the third connecting pipe is connected to the inner wall of the vapor deposition machine body. A ventilation net is provided on the outer wall of the vacuum machine.

6. The capacitor thin film evaporation processing equipment according to claim 5, characterized in that: The motor is electrically connected to the condenser, fan, vacuum machine, valve and control panel.

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