Press-fit jig for anodic oxidation of middle frame of mobile phone

Abstract

The utility model discloses a press-fit jig for anodizing a middle frame of a mobile phone. The press-fit jig comprises a bottom plate assembly and a cover plate assembly buckled above the bottom plate assembly, the bottom plate assembly comprises a bottom plate, a plurality of supporting blocks arranged at the top of the bottom plate at intervals and at least one guide pin arranged at the top of the bottom plate. Two conducting strips are embedded in the bottom plate and are used for being conductively connected with an anode hanger; the cover plate assembly comprises a cover plate, a plurality of conductive pressing pins arranged at the bottom of the cover plate at intervals, and at least one buckle arranged corresponding to the guide pin; a guide hole is formed in the cover plate corresponding to each guide pin, and each buckle is arranged at the top of the cover plate corresponding to one guide hole; the conductive pressing pin is used for being in conductive contact with the mobile phone middle frame. The bottom plate assembly and the cover plate assembly are arranged to form a semi-protection positioning and pressing structure, the bottom plate assembly and the cover plate assembly are matched to press the mobile phone middle frame, positioning is carried out through the jig positioning face, the placing and positioning precision of the mobile phone middle frame is guaranteed, and the product yield and the production efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of mobile phone production, in particular to a pressing jig for anodizing a mobile phone middle frame. Background Art

[0002] The anodizing process of a mobile phone midframe is an electrochemical process that forms a protective oxide film on its surface. This process improves the corrosion and wear resistance of the midframe and also provides a decorative color. In the prior art, anodizing of a mobile phone midframe involves welding spring clips to an anode hanger to secure the midframe, then attaching a hinge and proceeding with the anodizing process. However, securing the midframe to the anode hanger solely with spring clips presents the following deficiencies during the anodizing process:

[0003] 1) The spring cannot firmly clamp and support the phone's middle frame, resulting in uneven conductivity;

[0004] 2) The phone's middle frame cannot be effectively positioned, and the phone's middle frame is prone to shaking during the anodizing process;

[0005] 3) After anodizing, the color difference of the mobile phone frame is serious, affecting the appearance quality. Utility Model Content

[0006] The purpose of the utility model is to provide a pressing jig for anodizing a mobile phone middle frame. A semi-protective positioning and pressing structure is formed by arranging a bottom plate assembly and a cover plate assembly. The bottom plate assembly and the cover plate assembly cooperate to press the mobile phone middle frame, and the jig positioning surface is used for positioning, thereby ensuring the placement and positioning accuracy of the mobile phone middle frame and improving product yield and production efficiency.

[0007] In order to achieve the above objectives, the following technical solutions are adopted:

[0008] A pressing jig for anodizing a mobile phone middle frame comprises a base plate assembly and a cover plate assembly buckled onto the base plate assembly; the base plate assembly comprises a base plate, a plurality of support blocks spaced apart at the top of the base plate, and at least one guide pin disposed at the top of the base plate; two conductive sheets are embedded in the base plate for conductive connection with an anode rack; the cover plate assembly comprises a cover plate, a plurality of conductive pressure pins spaced apart at the bottom of the cover plate, and at least one clip disposed corresponding to the guide pins; a guide hole is provided on the cover plate corresponding to each guide pin, and a guide hole is disposed at the top of the cover plate corresponding to each clip; the conductive pressure pins are used for conductive contact with the mobile phone middle frame.

[0009] Preferably, the two conductive sheets are distributed at both ends of the bottom plate; each conductive sheet is provided with a limiting block on a side away from the end of the bottom plate.

[0010] Preferably, the conductive sheet is a conductive spring sheet.

[0011] Preferably, a limiting groove is provided in the middle of the guide pin, and a sliding slot hole matching the limiting groove is provided on the buckle; the buckle is slidably connected to the cover plate so that the sliding slot hole of the buckle is locked into the limiting groove of the guide pin.

[0012] Preferably, the support block is made of an insulating material that is acid-resistant, alkali-resistant and high-temperature-resistant.

[0013] Preferably, the conductive sheet, bottom plate, guide pin, buckle, cover plate, and conductive voltage pin are all made of titanium alloy conductive material.

[0014] By adopting the above solution, the beneficial effects of the utility model are:

[0015] The present invention forms a semi-protective positioning and clamping structure by providing a base plate assembly and a cover plate assembly. The base plate assembly and the cover plate assembly cooperate to clamp the mobile phone middle frame, and the positioning is performed by the fixture positioning surface, thereby ensuring the placement and positioning accuracy of the mobile phone middle frame and improving product yield and production efficiency. In addition, 1) the multiple conductive voltage pins on the cover plate assembly are spaced apart, and the conductive voltage pins are in conductive contact with the mobile phone middle frame, ensuring that the current is evenly distributed to the mobile phone middle frame during the entire anodizing process. The stable current reacts with the anode cell solution to ensure the stability of the entire anode surface quality; 2) by providing a support block on the top of the base plate, the mobile phone middle frame is supported and positioned, solving the problem of the mobile phone middle frame shaking during the anodizing process; 3) by providing a conductive voltage pin at the bottom of the cover plate, the mobile phone middle frame is subjected to a certain amount of pressure after placement, making the conductivity of the mobile phone middle frame consistent, thereby solving the appearance problems such as severe color difference that occur after the mobile phone middle frame is anodized. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a three-dimensional diagram of the utility model in use;

[0017] Figure 2 It is a three-dimensional diagram of the utility model;

[0018] Figure 3 A perspective view of the base plate assembly of the present invention;

[0019] Figure 4 This is an exploded view of the cover assembly of the present invention;

[0020] The accompanying drawings illustrate:

[0021] 1—base plate assembly, 2—cover plate assembly,

[0022] 3—conductive sheet, 4—limiting block,

[0023] 5—mobile phone middle frame, 11—bottom plate,

[0024] 12—Support block, 13—Guide pin,

[0025] 14—limiting groove, 21—cover plate,

[0026] 22—conductor pin, 23—clip,

[0027] 24—guide hole, 25—slide hole. DETAILED DESCRIPTION

[0028] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0029] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0030] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on the positions or locations shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0031] Reference Figures 1 to 4 As shown, the utility model provides a pressing jig for anodizing a mobile phone middle frame, comprising a base plate assembly 1 and a cover plate assembly 2 buckled on top of the base plate assembly 1; the base plate assembly 1 comprises a base plate 11, a plurality of support blocks 12 spaced apart at the top of the base plate 11, and at least one guide pin 13 provided at the top of the base plate 11; two conductive sheets 3 are embedded on the base plate 11 for conductive connection with the anode rack; the cover plate assembly 2 comprises a cover plate 21, a plurality of conductive voltage pins 22 spaced apart at the bottom of the cover plate 21, and at least one buckle 23 provided corresponding to the guide pin 13; a guide hole 24 is provided on the cover plate 21 corresponding to each guide pin 13, and each buckle 23 corresponds to a guide hole 24 provided at the top of the cover plate 21; the conductive voltage pin 22 is used for conductive contact with the mobile phone middle frame 5.

[0032] In a specific embodiment, specific points are arranged on the mobile phone middle frame 5, and several conductive voltage pins 22 of the cover assembly 2 are welded to the bottom of the cover 21 according to these specific points. By evenly arranging the specific points on the mobile phone middle frame 5, the current is evenly distributed to the mobile phone middle frame 5 during the entire anodizing process.

[0033] After the mobile phone middle frame 5 is placed and the buckle 23 of the cover assembly 2 is locked and fixed with the guide pin 13, a pressure of 8 to 12N is applied to the mobile phone middle frame to ensure that the contact pressure between the conductive pin 22 and the mobile phone middle frame 5 and the contact surface are balanced and consistent, thereby ensuring consistent conductivity.

[0034] The two conductive sheets 3 are located at both ends of the base plate 11. Each conductive sheet 3 is provided with a stopper 4 on the side away from the end of the base plate 11. The stopper 4 effectively positions the pressing jig when it is inserted into the slot of the anode rack and prevents it from moving.

[0035] In another specific embodiment, the conductive sheet 3 is a conductive spring sheet. The conductive sheet 3, bottom plate 11, guide pin 13, buckle 23, cover plate 21, and conductive voltage pin 22 are all made of titanium alloy conductive material. When the pressing jig is placed in the anode rack, the conductive spring sheet of the pressing jig contacts and clamps with the card slot of the anode rack. The conductive spring sheet has a conductive and clamping function. The current is transmitted from the anode rack through the conductive spring sheet to the entire pressing jig, and then to the mobile phone middle frame 5, so that the mobile phone middle frame 5 reacts with the anode solution in the anode tank to complete the anodizing process. During the anodizing process of the mobile phone middle frame 5, the current conduction direction is: anode rack - conductive sheet 3 - bottom plate 11 - guide pin 13 - buckle 23 - cover plate 21 - conductive voltage pin 22 - mobile phone middle frame 5.

[0036] The guide pin 13 has a limit slot 14 defined in the middle thereof, and the buckle 23 has a slide hole 25 that matches the limit slot 14. The buckle 23 is slidably connected to the cover plate 21, so that the slide hole 25 of the buckle 23 is locked in the limit slot 14 of the guide pin 13. The buckle 23 can be pushed along the length direction of the cover plate 21.

[0037] Specifically, support block 12 is located at the top edge of base plate 11, and guide pin 13 is located in the center of the top of base plate 11. Support block 12 serves both as support and positioning, addressing the issue of mobile phone midframe 5 shaking during the anodizing process. Made of an acid-, alkali-, and high-temperature-resistant insulating material, support block 12 also prevents scratches on mobile phone midframe 5.

[0038] The working process of this utility model is as follows:

[0039] 1) Place the mobile phone middle frame 5 to be anodized into the bottom plate assembly 1 and support and position it with the support blocks 12;

[0040] 2) Place the cover plate 21 on top of the mobile phone middle frame 5, and pass the guide pins 13 through the corresponding guide holes 24, so that the conductive pins 22 contact the specific points of the mobile phone middle frame 5;

[0041] 3) Push the buckle 23 so that the slide slot 25 of the buckle 23 is locked and fixed with the limiting slot 14 of the guide pin 13;

[0042] 4) The conductive sheet 3 together with the bottom plate 11 are inserted into the slot of the anode hanger to perform the anodizing process on the mobile phone middle frame 5 .

[0043] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention. Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention and are not intended to limit the implementation methods of the present invention. For ordinary technicians in the relevant field, various obvious changes, readjustments, and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A pressing jig for anodizing a mobile phone middle frame, characterized in that: It includes a base plate assembly and a cover plate assembly that is buckled onto the top of the base plate assembly; the base plate assembly includes a base plate, a plurality of support blocks spaced apart at the top of the base plate, and at least one guide pin provided at the top of the base plate; two conductive sheets are embedded in the base plate for conductive connection with the anode rack; the cover plate assembly includes a cover plate, a plurality of conductive voltage pins spaced apart at the bottom of the cover plate, and at least one clip provided corresponding to the guide pins; a guide hole is provided on the cover plate corresponding to each guide pin, and each clip corresponds to a guide hole provided on the top of the cover plate; the conductive voltage pins are used for conductive contact with the middle frame of the mobile phone.

2. The pressing jig for anodizing the mobile phone middle frame according to claim 1, characterized in that: The two conductive sheets are distributed at both ends of the bottom plate; each conductive sheet is provided with a limiting block on a side away from the end of the bottom plate.

3. The pressing jig for anodizing the mobile phone middle frame according to claim 2, characterized in that: The conductive sheet is a conductive spring sheet.

4. The pressing jig for anodizing the mobile phone middle frame according to claim 1, characterized in that: A limiting groove is provided in the middle of the guide pin, and a sliding slot hole matching the limiting groove is provided on the buckle; the buckle is slidably connected to the cover plate so that the sliding slot hole of the buckle is locked into the limiting groove of the guide pin and fixed.

5. The pressing jig for anodizing the mobile phone middle frame according to claim 1, characterized in that: The support block is made of acid, alkali and high temperature resistant insulating material.

6. The pressing jig for anodizing the mobile phone middle frame according to claim 1, characterized in that: The conductive sheet, bottom plate, guide pin, buckle, cover plate and conductive voltage pin are all made of titanium alloy conductive material.

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