Electrotinning tool for semiconductor element

Abstract

The utility model discloses an electrotinning tool for a semiconductor element, which comprises a first fixing pore plate and a second fixing pore plate, positioning holes are formed in the end surfaces of the first fixing pore plate and the second fixing pore plate, and clamping pins are mounted in the positioning holes; after the first fixing hole plate and the second fixing hole plate are attached, the positioning holes of the first fixing hole plate and the second fixing hole plate coincide with each other, and the clamping pins on the two coincide positioning holes tend to get close to each other. Electrodes are installed on the first fixing plate and the second fixing plate and connected with conductive columns, and hooks are arranged at the upper ends of the conductive columns. According to the utility model, the two fixing pore plates are adopted, the clamping pins are utilized to fix a single tube core in the positioning holes, the tube core is fixed, in addition, the conductive columns are utilized to realize electrode conduction, and the hooks are formed on the upper sections of the conductive columns, so that current transmission is realized while hanging is carried out.

Description

Technical Field

[0001] The utility model belongs to the technical field of electroplating tooling, and in particular relates to an electrotinning tooling for semiconductor components. Background Art

[0002] In the semiconductor manufacturing process, molybdenum sheets need to be welded on the upper and lower surfaces of the chip as upper and lower electrodes, and then a glue filling process is carried out, and finally a layer of tin is electroplated on the surface. In the existing tin plating process, there is no standardized tooling hanger. For example, the published utility model patent CN212113670U discloses an auxiliary tooling for tin plating of semiconductor components, which adopts a combination of gears and screws to adjust the position of the tooling. This type of tooling is not suitable for use in electroplating tanks, because the electroplating tank is for the electroplating process of batch tube cores. One electroplating tank can accommodate multiple sets of hanger tools at the same time. One hanger tooling can hold twenty or thirty tube cores for electroplating operations at the same time.

[0003] Therefore, this industry needs an economical and applicable tooling hanger suitable for batch electroplating. Utility Model Content

[0004] The purpose of the present invention is to provide a tinning tool for semiconductor components to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a tinning tool for a semiconductor component, comprising a first fixing hole plate and a second fixing hole plate, wherein the end surfaces of the first fixing hole plate and the second fixing hole plate are both provided with positioning holes, and clamping pins are installed in the positioning holes;

[0006] After the first fixing hole plate and the second fixing hole plate are attached, the positioning holes of the first fixing hole plate and the second fixing hole plate overlap with each other, and the ends of the clamping pins on the two overlapping positioning holes are tilted inwards;

[0007] Electrodes are installed on the first fixed hole plate and the second fixed plate. The electrodes are connected to conductive columns. The upper ends of the conductive columns are provided with hooks.

[0008] It should be noted that the conductive column includes a first conductive column and a second conductive column, the first conductive column is connected to the first fixed hole plate, and the second conductive column is fixed to the second fixed hole plate.

[0009] It is further worth mentioning that the end of the first conductive column is electrically connected to the upper electrode through a wire, and the second conductive column is connected to the lower electrode.

[0010] It should be further explained that the upper section of the first conductive pillar is detachably connected to the second conductive pillar.

[0011] As a preferred embodiment, two first conductive pillars and two second conductive pillars are provided, which are respectively arranged on the left and right sides, and the upper section of the second conductive pillar is connected to a cross bar.

[0012] As a preferred embodiment, the first conductive pillar and the second conductive pillar are both made of conductive metal material, and an insulating layer is wrapped around the periphery of the first conductive pillar and the second conductive pillar.

[0013] As a preferred embodiment, the clamping pins are connected as a whole to form a pin plate structure, which is clamped in the middle by the first fixed hole plate and the second fixed hole plate;

[0014] There are two groups of first fixed orifice plates, needle plates and combinations of fixed orifice plates. The upper electrode is electrically connected to the needle plates of one group, and the lower electrode is electrically connected to the needle plates of the other group.

[0015] Compared with the prior art, the electrotinning tooling for semiconductor components provided by the present invention has at least the following beneficial effects:

[0016] The fixed hole plate is used for installation, and the clamping pins are used to fix the single tube core in the positioning hole to achieve the fixation of the tube core. In addition, the conductive column is used to realize the conduction of the electrode, and the upper part of the conductive column forms a hook to realize current transmission while mounting;

[0017] The overall structure of the tooling is compact and suitable for the electroplating process of batch products. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is the main view of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the needle plate structure of the utility model;

[0020] Figure 3 It is a side view of the utility model. DETAILED DESCRIPTION

[0021] See also Figure 1-2 The present invention provides a tinning tool for electroplating semiconductor components, comprising a first fixing hole plate 2 and a second fixing hole plate 7. Positioning holes are provided on the end surfaces of the first fixing hole plate 2 and the second fixing hole plate 7. Clamping pins 61 are installed in the positioning holes. The clamping pins 61 are made of elastic material, such as thin metal wire.

[0022] After the first fixing hole plate 2 and the second fixing hole plate 7 are attached, the positioning holes of the first fixing hole plate 2 and the second fixing hole plate 7 overlap with each other, and the ends of the clamping pins 61 on the two overlapping positioning holes are tilted inwards;

[0023] Electrodes are installed on the first fixed hole plate 2 and the second fixed plate 7. The electrodes are connected to conductive columns. The upper ends of the conductive columns are provided with hooks 10. The hooks are made of bare metal.

[0024] Reference Figure 1 as well as Figure 2 As shown, the conductive posts include a first conductive post 3 and a second conductive post 9. The first conductive post 3 is connected to the first fixed orifice plate 2, and the second conductive post 9 is fixed to the second fixed orifice plate 7. The end of the first conductive post 3 is electrically connected to an upper electrode 51 via a wire 5, while the second conductive post 9 is connected to a lower electrode 8. The lower electrode 8 is the anode surface. The upper electrode is the cathode surface. The wire 5 used for connection provides better contact and helps improve electroplating quality.

[0025] The first conductive pillar 3 and the second conductive pillar 9 are both made of conductive metal materials. Except for the parts that need to be electrically connected, the peripheries of the first conductive pillar 3 and the second conductive pillar 9 are wrapped with an insulating layer.

[0026] The upper section of the first conductive post 3 is detachably connected to the second conductive post 9. The upper section of the first conductive post 3 comprises an arcuate segment, with a gasket 31 disposed at the end thereof. This segment is bolted to the second conductive post 9, and the metal contact surfaces provide electrical connection. Since the first conductive post 3 and the second conductive post 9 are respectively fixed to the first fixed orifice plate 2 and the second fixed orifice plate 7, in addition to the detachable connection between the two conductive posts 3, the two orifice plates are also detachably connected. Specifically, screw holes 4 can be provided in the two orifice plates, allowing for bolt connection. Alternatively, the bracket can be secured at the edge using a dovetail clamp.

[0027] There are two first conductive pillars 3 and two second conductive pillars 9, which are respectively arranged on the left and right sides. The upper section of the second conductive pillar 9 is connected to the cross bar 1 for easy manual extraction.

[0028] The tooling is composed of two parts. Each part includes a first fixed hole plate 2 and a second fixed hole plate 7. A needle plate 6 is fixed between the first fixed hole plate 2 and the second fixed hole plate 7. The structure of the needle plate 6 is shown in FIG. Figure 2 As shown, the overall structure is a grid. After the first and second fixing orifice plates 2 and 7 clamp the needle plate 6, clamping pins 61 are exposed in the positioning holes of the orifice plates. In other words, the tooling comprises two sets of fixing orifice plates and needle plates 6. The two sets of needle plates 6 are connected to the upper electrode 51 and the lower electrode 8, respectively, using copper studs. The first and second fixing orifice plates 2 and 7 are made of epoxy board material.

[0029] In use, the two parts are first separated from each other, and the template containing the tube core (the template is a plate structure with holes and slots) is directly pressed into the positioning holes of one part. The template is then separated, and the tube core naturally falls into the positioning holes. Then the second part is buckled on, so that the upper and lower sets of clamping pins 6 fix the tube core. The two parts are fixed with a dovetail clamp, and then the two conductive posts are fixedly connected. Finally, it is hung on the charged copper post in the electroplating tank with a hook.

Claims

1. A tinning tool for semiconductor components, characterized in that: It comprises a first fixing hole plate (2) and a second fixing hole plate (7), wherein the end surfaces of the first fixing hole plate (2) and the second fixing hole plate (7) are both provided with positioning holes, and clamping pins (61) are installed in the positioning holes; After the first fixing hole plate (2) and the second fixing hole plate (7) are attached, the positioning holes of the first fixing hole plate (2) and the second fixing hole plate (7) overlap with each other, and the ends of the clamping pins (61) on the two overlapping positioning holes are both tilted inwards; Electrodes are installed on both the first fixed hole plate (2) and the second fixed hole plate (7), and the electrodes are connected to conductive columns, and the upper ends of the conductive columns are provided with hooks (10).

2. The electrotinning tool for semiconductor components according to claim 1, characterized in that: The conductive column comprises a first conductive column (3) and a second conductive column (9), wherein the first conductive column (3) is connected to the first fixed hole plate (2), and the second conductive column (9) is fixed to the second fixed hole plate (7).

3. The electrotinning tool for semiconductor components according to claim 2, characterized in that: The end of the first conductive column (3) is electrically connected to an upper electrode (51) via a wire (5), and the second conductive column (9) is connected to a lower electrode.

4. The electrotinning tool for semiconductor components according to claim 3, characterized in that: The upper section of the first conductive column (3) is detachably connected to the second conductive column (9).

5. The electrotinning tool for semiconductor components according to claim 4, characterized in that: Two first conductive columns (3) and two second conductive columns (9) are provided, which are respectively arranged on the left and right sides. The upper section of the second conductive column (9) is connected to the crossbar (1).

6. The electrotinning tool for semiconductor components according to claim 5, characterized in that: The first conductive column (3) and the second conductive column (9) are both made of conductive metal materials, and the peripheries of the first conductive column (3) and the second conductive column (9) are wrapped with an insulating layer.

7. The electrotinning tool for semiconductor components according to claim 5, characterized in that: The clamping pins (61) are connected as a whole to form a pin plate (6) structure, which is clamped in the middle by the first fixed hole plate (2) and the second fixed hole plate (7); Two groups of the first fixed orifice plate (2), the needle plate (6), and the fixed orifice plate (7) are provided, the upper electrode (51) is electrically connected to the needle plate (6) of one group, and the lower electrode (8) is electrically connected to the needle plate (6) of the other group.

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