Refrigeration head joint for semiconductor refrigeration

Abstract

According to the refrigeration head connector for semiconductor refrigeration, in the refrigeration head connector, a cooling medium inlet is formed in one end of a refrigeration head body so that a cooling medium can be guided in; the internal flow channel is arranged in the refrigeration head body and is communicated with the cooling medium inlet; the flow channel plugs are arranged on the end face of the internal flow channel to change the flowing direction of the cooling medium in the internal flow channel, so that the cooling medium flows in the refrigeration head body in an S-shaped route; the cooling medium outlet is formed in the other end, opposite to the cooling medium inlet, of the refrigeration head body, and the cooling medium outlet communicates with the internal flow channel so as to guide out the cooling medium. The refrigerating head connector can achieve circular flow, and it is guaranteed that the heat dissipation capacity on the heat dissipation face is basically consistent.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor refrigeration, in particular to a refrigeration head joint used for semiconductor refrigeration. Background Art

[0002] Most existing semiconductor cooling heads utilize an internal grid-like flow channel structure. This structure results in uneven cooling medium flow within the cooling head. The flow rate in the channel near the baffle outlet is greater than that in the channel farther from the baffle outlet. This leads to uneven cooling flow and localized uneven heat dissipation across the cooling surface. This results in poor heat dissipation for high-power heat sources.

[0003] The above information disclosed in the background technology section is only for enhancing understanding of the background of the present invention and therefore may contain information that does not constitute the prior art known to ordinary technicians in this field. Utility Model Content

[0004] In order to solve the above problems, the utility model provides a cooling head joint for semiconductor refrigeration, which ensures that the heat dissipation capacity on the heat dissipation surface is basically consistent, and effectively solves the problem of unsatisfactory heat dissipation effect caused by uneven internal flow of cooling medium in existing cooling heads.

[0005] The purpose of this utility model is achieved through the following technical solutions.

[0006] A refrigeration head connector for semiconductor refrigeration includes:

[0007] Refrigeration head body;

[0008] A cooling medium inlet is provided at one end of the cooling head body for introducing the cooling medium;

[0009] an internal flow channel, which is provided in the refrigeration head body and communicated with the cooling medium inlet;

[0010] Multiple flow channel plugs, which are provided on the end faces of the internal flow channels to change the flow direction of the cooling medium in the internal flow channels, so that the cooling medium flows in an S-shaped route in the refrigeration head;

[0011] A cooling medium outlet is provided at the other end of the refrigeration head body relative to the cooling medium inlet, and the cooling medium outlet is connected to the internal flow channel to conduct the cooling medium.

[0012] In the refrigeration head joint for semiconductor refrigeration, the internal flow channel includes a multi-layer fluid channel located between the cooling medium inlet and the cooling medium outlet.

[0013] In the refrigeration head joint used for semiconductor refrigeration, two waist-shaped holes are processed on the end surfaces of two adjacent layers of fluid channels.

[0014] In the cooling head joint for semiconductor refrigeration, the flow channel plug is a waist-shaped flow channel plug fixed to the two waist-shaped holes.

[0015] In the cooling head joint for semiconductor refrigeration, the cooling medium inlet is a through hole provided on the top of the cooling head body.

[0016] In the cooling head joint for semiconductor refrigeration, the cooling medium outlet is a through hole provided at the bottom of the cooling head body.

[0017] In the cooling head joint for semiconductor refrigeration, the cooling head body is a cubic structure.

[0018] In the cooling head joint for semiconductor refrigeration, the upper end and the lower end of the cubic structure are respectively provided with hanging ears.

[0019] In the cooling head joint for semiconductor refrigeration, the internal flow channel is a serpentine flow channel.

[0020] In the cooling head joint for semiconductor refrigeration, the flow rates of all cross sections of the internal flow channel are consistent.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] The structural dimensions of the flow channel plug and the dimensions of the waist-shaped hole in this utility model ensure that the equivalent flow area is equal to the cross-sectional area of the circular hole. This ensures uniform fluid flow within the internal cavity, preventing short-circuiting of the cooling medium within the internal cavity and ensuring uniform cooling. Circulating flow is achieved, with consistent flow across all sections of the internal flow channel, ensuring essentially uniform heat dissipation across the heat dissipation surface.

[0023] The above description is only an overview of the technical solution of the present invention. In order to make the technical means of the present invention clearer and easier to understand, so that those skilled in the art can implement it according to the contents of the specification, and to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are illustrated below. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Various other advantages and benefits of the present invention will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are intended only to illustrate preferred embodiments and are not intended to limit the present invention. Obviously, the drawings described below are merely examples of the present invention, and those skilled in the art will be able to derive other drawings based on these drawings without inventive effort. Throughout the drawings, identical reference numerals are used to represent identical components.

[0025] In the attached figure:

[0026] Figure 1 It is a structural schematic diagram of a refrigeration head joint for semiconductor refrigeration of the present invention.

[0027] The present invention will be further explained below with reference to the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0028] The following will refer to the attached Figure 1 Specific embodiments of the present invention will now be described in greater detail. While specific embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to facilitate a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0029] It should be noted that certain words are used in the specification and claims to refer to specific components. Those skilled in the art should understand that technicians may use different nouns to refer to the same component. This specification and claims do not use the difference in nouns as a way to distinguish components, but use the difference in the functions of the components as the criterion for distinction. For example, "including" or "comprising" mentioned throughout the specification and claims is an open term, so it should be interpreted as "including but not limited to". The subsequent description of the specification is a preferred embodiment of the present invention, but the description is based on the general principles of the specification and is not intended to limit the scope of the present invention. The scope of protection of the present invention shall be determined by the definition of the attached claims.

[0030] To facilitate understanding of the embodiments of the present invention, further explanation will be given below using specific embodiments as examples in conjunction with the accompanying drawings, and the accompanying drawings do not constitute a limitation on the embodiments of the present invention.

[0031] For better understanding, Figure 1 As shown, a refrigeration head connector for semiconductor refrigeration includes:

[0032] Refrigeration head body 4;

[0033] A cooling medium inlet 1 is provided at one end of the cooling head body 4 for introducing the cooling medium;

[0034] An internal flow channel 2, which is provided in the cooling head body 4 and communicates with the cooling medium inlet 1;

[0035] Multiple flow channel plugs 3, which are arranged on the end surface of the internal flow channel 2 to change the flow direction of the cooling medium in the internal flow channel 2, so that the cooling medium flows in an S-shaped route in the refrigeration head;

[0036] The cooling medium outlet 5 is provided at the other end of the cooling head body 4 relative to the cooling medium inlet 1 , and the cooling medium outlet 5 is connected to the internal flow channel 2 to discharge the cooling medium.

[0037] In a preferred embodiment of the refrigeration head connector for semiconductor refrigeration, the internal flow channel 2 includes a multi-layer fluid channel located between the cooling medium inlet 1 and the cooling medium outlet 5 .

[0038] In a preferred embodiment of the cooling head connector for semiconductor refrigeration, two waist-shaped holes are processed on the end surfaces of two adjacent layers of fluid channels.

[0039] In the preferred embodiment of the cooling head joint for semiconductor refrigeration, the flow channel plug 3 is a waist-shaped flow channel plug 3 fixed to two waist-shaped holes.

[0040] In a preferred embodiment of the cooling head connector for semiconductor refrigeration, the cooling medium inlet 1 is a through hole provided on the top of the cooling head body 4 .

[0041] In a preferred embodiment of the cooling head connector for semiconductor refrigeration, the cooling medium outlet 5 is a through hole provided at the bottom of the cooling head body 4 .

[0042] In the preferred embodiment of the cooling head joint for semiconductor refrigeration, the cooling head body 4 is a cubic structure.

[0043] In a preferred embodiment of the cooling head connector for semiconductor refrigeration, the upper and lower ends of the cubic structure are respectively provided with hanging ears.

[0044] In a preferred embodiment of the cooling head joint for semiconductor refrigeration, the internal flow channel 2 is a serpentine flow channel.

[0045] In a preferred embodiment of the cooling head connector for semiconductor refrigeration, the flow rates of all cross sections of the internal flow channel 2 are consistent.

[0046] In one embodiment, the refrigeration head joint for semiconductor refrigeration consists of a cooling medium inlet 1, an internal flow channel 2, a flow channel plug 3, a refrigeration head body 4, and a cooling medium outlet 5. The cooling medium inlet 1 is the entrance for the cooling medium to enter the internal flow channel; the internal flow channel 2 is the flow path for the cooling medium to flow inside the refrigeration head body 4; the flow channel plug 3 is a flow-blocking structure on the end face of the internal flow channel, which changes the flow direction of the fluid in the internal flow channel 2, and the cooling medium flows in an S-shaped route in the refrigeration head body 4; the refrigeration head body 4 is the carrier of all internal structures, and all internal structures are machined on this basic structure. The cooling medium outlet 5 is the outlet of the cooling medium that has undergone heat exchange with the heat source in the internal flow channel. This structure is a structure that ensures the circulation of the internal fluid. Five rows of deep holes are machined in the thickness direction of the blank of the refrigeration head body 4, and then the holes are milled on a milling machine. Figure 1 Two waist-shaped holes are processed on the right end face of the thickness, and two waist-shaped holes are processed on the left end face of the thickness. Then, the waist-shaped flow channel plug 3 processed in advance is placed in the waist-shaped holes of the cooling head body for welding to ensure the quality of the weld, no leaks and no slag inside the weld. The cooling medium inlet 1 and the cooling medium outlet 5 are processed at the position shown in the figure, so as to form an internal flow channel 2. The cooling medium flows from the cooling medium inlet 1 into the internal flow channel 2 of the cooling head body 4; the cooling medium flows in the internal flow channel 2 as shown in the figure. Figure 1 The direction shown is from left to right, and the leftmost side of the flow channel collides with the left end flow channel plug 3 to change the flow direction, and flows from top to bottom into the second layer internal flow channel 2, and so on. The cooling medium flows in an S shape in the internal flow channel 2 until it finally flows into the cooling medium outlet 5 and flows out of the refrigeration head body 4. The cooling medium is cooled by the external system, and the cooled cooling medium flows into the refrigeration head body from the cooling medium inlet 1, thus achieving the effect of circulating cooling.

[0047] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this application are merely illustrative and not restrictive, and it should not be assumed that these advantages, strengths, and effects are required of each embodiment of this application. In addition, the specific details disclosed above are merely illustrative and facilitating understanding, and are not restrictive. The above details do not limit this application to necessarily being implemented using the above specific details.

[0048] The above description has been provided for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A cooling head connector for semiconductor refrigeration, characterized in that: It includes, Refrigeration head body; A cooling medium inlet is provided at one end of the cooling head body for introducing the cooling medium; an internal flow channel disposed in the cooling head body and connected to the cooling medium inlet; Multiple flow channel plugs, which are provided on the end faces of the internal flow channels to change the flow direction of the cooling medium in the internal flow channels, so that the cooling medium flows in an S-shaped route in the refrigeration head; A cooling medium outlet is provided at the other end of the refrigeration head body relative to the cooling medium inlet, and the cooling medium outlet is connected to the internal flow channel to conduct the cooling medium.

2. The refrigeration head connector for semiconductor refrigeration according to claim 1, characterized in that: The internal flow passage includes a multi-layer fluid channel located between a cooling medium inlet and a cooling medium outlet.

3. The refrigeration head connector for semiconductor refrigeration according to claim 2, characterized in that: Two waist-shaped holes are machined on the end surfaces of two adjacent layers of fluid channels.

4. The refrigeration head connector for semiconductor refrigeration according to claim 3, characterized in that: The flow channel plug is a waist-shaped flow channel plug fixed to two waist-shaped holes.

5. The refrigeration head connector for semiconductor refrigeration according to claim 1, characterized in that: The cooling medium inlet is a through hole provided on the top of the refrigeration head body.

6. The refrigeration head connector for semiconductor refrigeration according to claim 1, characterized in that: The cooling medium outlet is a through hole provided at the bottom of the refrigeration head body.

7. The refrigeration head connector for semiconductor refrigeration according to claim 1, characterized in that: The cooling head body is a cubic structure.

8. The refrigeration head connector for semiconductor refrigeration according to claim 7, characterized in that: The upper end and the lower end of the cubic structure are respectively provided with hanging ears.

9. The refrigeration head connector for semiconductor refrigeration according to claim 1, characterized in that: The internal flow channel is a serpentine flow channel.

10. The refrigeration head connector for semiconductor refrigeration according to claim 1, characterized in that: The flow rates of all cross sections of the internal flow channel are consistent.

Images