Circuit board test circuit and circuit board test fault analysis device

Abstract

The utility model discloses a circuit board test circuit and a circuit board test fault analysis device, and relates to the technical field of circuit board testing, the circuit board test circuit comprises a control unit, the control unit comprises a processor; at least two types of test units are arranged, and the test units are in communication connection with the control unit; the communication unit is in communication connection with the control unit, and the communication unit is used for communicating with a circuit board to be tested; and the output unit is in communication connection with the control unit. According to the application, the various test units are arranged, and communication with the to-be-tested circuit board is realized through the communication unit, so that the problems of too long test time and too long test flow caused by the fact that the to-be-tested circuit board needs to be connected with various test devices are avoided, and the use is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board testing, in particular to a circuit board testing circuit and a circuit board testing fault analysis device. Background Art

[0002] Circuit board testing is a crucial step in the electronics manufacturing process, ensuring that the circuit board and the components on it function properly. Circuit board testing is generally divided into two types: prototype testing during the manufacturing process and final product testing.

[0003] During the prototype testing phase, the circuit board will undergo a series of functional tests, connectivity tests, voltage tests, etc. to ensure that the design of the circuit board meets the specifications and that all components are working properly.

[0004] During the final product testing phase, the assembled circuit boards will undergo more comprehensive testing, including functional testing, reliability testing, temperature testing, vibration testing, etc., to ensure that the products meet customer requirements and standards.

[0005] For example, Chinese patent publication number CN211698077U discloses a circuit board fault detection device, comprising a microprocessor module, a power supply module, a display module, a voltage sampling module, a current sampling module, a DC plug, and test leads. The voltage sampling module is connected to the positive terminal of one end of the DC plug; the current sampling module is connected to the negative terminal of one end of the DC plug; and the other end of the DC plug is connected to the test leads. The red lead of the test lead is removably connected to the point to be tested on the circuit board, and the black lead of the test lead is fixedly connected to the common terminal of the circuit board. The microprocessor module is connected to the voltage sampling module and the current sampling module respectively to display the detected voltage and current through the display module. The power supply module is connected to the microprocessor module, the voltage sampling module, the current sampling module, and the display module respectively to provide power. This device can heat up or directly burn out short-circuited components on the circuit board, achieving a rapid troubleshooting effect.

[0006] However, current automated circuit board testing equipment requires external connection to different devices to verify whether the circuit board is normal, which results in a long overall testing process.

[0007] Therefore, there is an urgent need to develop a circuit board testing circuit and a circuit board testing fault analysis device to solve the problems in the prior art. Utility Model Content

[0008] The purpose of the present utility model is to provide a circuit board test circuit and a circuit board test fault analysis device. By setting up multiple test units and communication units, the circuit board to be tested can be controlled by the communication unit to implement testing through multiple test units, so as to solve the problem proposed in the above background technology that the circuit board to be tested needs to be connected to multiple devices externally, resulting in a long testing process.

[0009] To achieve the above objectives, the present invention provides the following technical solutions:

[0010] A circuit board testing circuit, comprising:

[0011] a control unit, the control unit comprising a processor;

[0012] Testing units, wherein at least two types of testing units are provided, and both of the testing units are communicatively connected to the control unit;

[0013] a communication unit, the communication unit being communicatively connected to the control unit and configured to communicate with the circuit board to be tested;

[0014] An output unit is communicatively connected to the control unit.

[0015] Furthermore, the test unit includes a power information acquisition unit, an interface status acquisition unit, a dry contact control unit, a temperature and humidity sensing unit and / or a serial communication unit.

[0016] Furthermore, the power information acquisition unit includes a current transformer and a metering chip, one side of the current transformer is used to be electrically connected to the circuit board to be tested, and the other side of the current transformer is connected to the metering chip, and the metering chip is communicatively connected to the processor.

[0017] Furthermore, the interface status acquisition unit includes an optical coupler, one side of the optical coupler is used to be electrically connected to the circuit board to be tested, and the other side of the optical coupler is electrically connected to the processor;

[0018] The dry contact control unit includes a first dry node control module, wherein the first dry node control module is provided with a plurality of modules, and one of the first dry node control modules includes a first relay and a first wiring terminal, wherein the first end of the first relay is connected to a power supply, the second end is used for communication connection with the processor, the fourth end is connected to the first pin of the wiring terminal, the fifth end is connected to the third pin of the wiring terminal, and the sixth end is connected to the second pin of the wiring terminal;

[0019] The dry contact control unit also includes a second dry node control module, which includes a second relay and a second terminal. The first end of the second relay is connected to the power supply, the second end is used to communicate with the processor, the third end is connected to the second pin of the terminal, the fourth end is connected to the third pin of the terminal, and the fifth end is connected to the first pin of the terminal.

[0020] Furthermore, the temperature and humidity sensing unit includes a temperature and humidity sensor, and the temperature and humidity sensor is communicatively connected to the processor.

[0021] Furthermore, the serial communication unit includes an RS232 communication unit and / or an RS485 communication unit, and the serial communication unit is communicatively connected to the processor.

[0022] Further, the RS232 communication unit includes an RS232 communication chip, and the RS232 communication chip is communicatively connected to the processor;

[0023] The RS485 communication unit includes an RS485 communication chip, and the RS485 communication chip is communicatively connected with the processor.

[0024] Furthermore, the communication unit includes a network communication unit, the network communication unit includes a network communication chip, and the network communication chip is communicatively connected to the processor.

[0025] Furthermore, the output unit includes a sound output unit and a display unit, the sound output unit is electrically connected to the processor, and the display unit is electrically connected to the processor.

[0026] A circuit board test fault analysis device comprises the circuit board test circuit.

[0027] Compared with the prior art, the beneficial effects of the present invention are:

[0028] This application sets up multiple test units and communicates with the circuit board to be tested through a communication unit to realize automatic testing of multiple faults of the circuit board to be tested, avoiding the problems of long testing time and testing process caused by the need to connect multiple test devices to the circuit board to be tested. It is easy to use and saves labor costs.

[0029] Other features and advantages of the present invention will be disclosed in detail in the following specific embodiments and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is the overall circuit diagram of the utility model;

[0031] Figure 2 It is a schematic diagram of the circuit structure of the processor;

[0032] Figure 3 This is a circuit diagram of the power information acquisition unit;

[0033] Figure 4 This is a circuit diagram of the interface status acquisition unit;

[0034] Figure 5 It is a circuit diagram of the network communication unit;

[0035] Figure 6 This is the circuit diagram of the RS232 communication unit;

[0036] Figure 7 This is the circuit diagram of the RS485 communication unit;

[0037] Figure 8 is a circuit diagram of the first dry node control module;

[0038] Figure 9 This is a circuit diagram of the second dry node control module;

[0039] Figure 10 This is the circuit diagram of the temperature and humidity acquisition unit;

[0040] Figure 11 This is a circuit diagram of the sound output unit. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the internal communication of two components or the interaction relationship between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0042] A circuit board test circuit, such as Figure 1 Shown, including:

[0043] a control unit, the control unit including a processor for controlling other units in the test circuit;

[0044] A test unit, at least one of which is provided and all of which are communicatively connected to the control unit and used to test the circuit board to be tested;

[0045] a communication unit, the communication unit being communicatively connected to the control unit and configured to communicate with the circuit board to be tested;

[0046] An output unit is communicatively connected to the control unit.

[0047] Optionally, the test unit, communication unit, and output unit are all communicatively connected to the processor, and the processor is further configured to determine the cause of the fault based on the data from the test unit and the communication unit, and output the cause of the fault via the output unit. In this embodiment, the processor can compare the data obtained from the test unit with data indicating normal operation of the circuit board to determine the cause of the fault. This is prior art and can be obtained from the processor manual, etc., and will not be further described in this application.

[0048] The test unit includes a power information acquisition unit, an interface status acquisition unit, a dry contact control unit, a temperature and humidity sensing unit and / or a serial communication unit.

[0049] The control unit includes a processor, and optionally, the processor may be an MCU. Figure 2 As shown, in this embodiment, the processor model is LPC1768.

[0050] The power supply information acquisition unit is used to acquire relevant power supply information such as voltage circuit, such as 220V power supply information data acquisition, 24V power supply information data acquisition, 12V power supply information data acquisition or 5V power supply information data acquisition, etc. These data are used to compare with the data of the target circuit board.

[0051] The power information acquisition unit includes at least one metering chip to realize power information data acquisition. In this embodiment, the model of the metering chip is HT7017.

[0052] Specifically, if Figure 3 As shown, the power information acquisition unit includes an interface P12, two pins of the interface P12 are respectively connected to the first pin and the second pin on one side of the current transformer T1, the third pin of the current transformer T1 is respectively connected to one end of the resistor R84 and the second pin of the metering chip U23, and is grounded through the resistor R83 and the capacitor C73; the fourth pin of the current transformer T1 is respectively connected to the other end of the resistor R84 and the third pin of the metering chip U23, and is grounded through the resistor R86 and the capacitor C74.

[0053] The signal pin of the metering chip U23 is electrically connected to the signal pin of the processor U4; in this embodiment, the 11th pin of the metering chip U23 is electrically connected to the 64th pin of the processor U4, and the 10th pin of the metering chip U23 is electrically connected to the 65th pin of the processor U4.

[0054] The interface status acquisition unit is used to collect the output interface status of the target circuit board, whether it is a data power supply state or a power-off state. The interface status acquisition unit includes 220V interface status data acquisition, 24V interface status data acquisition, 12V interface status data acquisition, 5V interface status data acquisition, etc.

[0055] The interface status acquisition unit includes an optical coupler, an interface electrically connected to one side of the optical coupler, and a processor electrically connected to the other side of the optical coupler.

[0056] In this embodiment, the first pin of the optocoupler is electrically connected to a pin of the interface through a resistor, the second pin of the optocoupler is electrically connected to another pin of the interface, the third pin of the optocoupler is electrically connected to the corresponding pin of the processor and to the power supply voltage VDD through a resistor, and the fourth pin of the optocoupler is grounded.

[0057] like Figure 4 As shown, in this embodiment, there are a total of 8 interface status acquisition units, and the 8 interface status acquisition units share the two interfaces P15 and P16. The 8 interface status acquisition units include 8 optocouplers, and the fourth pins of the 8 optocouplers are all connected to the pins of the processor U4. In this embodiment, they are respectively connected to the 48th, 49th, 50th, 51st, 52nd, 56th, 57th and 60th pins of the processor U4.

[0058] The communication unit includes a network communication unit, which is electrically connected to the processor. In this embodiment, the network communication unit includes a network communication chip, which is electrically connected to the processor. Optionally, the network communication chip is DP83848KSQ. Optionally, the communication unit may also be a serial communication unit.

[0059] like Figure 5 As shown, the communication pins of the network communication chip U9 include pin 4, pin 5, pin 36 and pin 37. Pin 4 and pin 5 of the network communication chip U9 are electrically connected to pin 95 and pin 94 of the processor, respectively. Pin 36 and pin 37 of the network communication chip U9 are electrically connected to pin 91 and pin 90 of the processor, respectively.

[0060] The network communication unit communicates with the target circuit board, determines whether the network interface is normal, obtains relevant data information of the target circuit board, controls the closing and disconnection of the corresponding interface, and combines the data of other parts of this circuit to determine whether there is any fault abnormality in the target circuit board.

[0061] At least one serial communication unit is provided. In this embodiment, the serial communication unit includes an RS232 communication unit and an RS485 communication unit, the RS232 communication unit is electrically connected to the processor, and the RS485 communication unit is also electrically connected to the processor.

[0062] The RS232 communication unit is used to connect to the RS232 interface of the circuit board to be tested to determine whether the circuit of the circuit board to be tested is normal; the RS485 communication unit is used to connect to the RS485 interface of the target circuit board to determine whether the circuit of the target circuit board is normal.

[0063] like Figure 6 As shown, in this embodiment, the RS232 communication unit includes an RS232 communication chip that is communicatively connected to the processor. Optionally, the model of the RS232 communication chip U21 can be SP3232EEN-L / TR. The communication pins of the RS232 communication chip U21 include pin 10 and pin 9, and the pin 10 and pin 9 of the RS232 communication chip U21 are electrically connected to pin 98 and pin 99 of the processor U4, respectively.

[0064] like Figure 7 As shown, in this embodiment, the RS485 communication unit includes an RS485 communication chip connected to the processor for communication. Optionally, the model of the RS485 communication chip U20 can be SP485EEN. The communication pins of the RS485 communication chip U20 include pin 1 and pin 4, and the pin 1 and pin 4 of the RS485 communication chip U20 are electrically connected to pin 85 and pin 82 of the processor U4, respectively.

[0065] The dry contact control unit is used to control the short-circuit related dry contacts. Figure 8 As shown, the dry contact control unit includes a first dry node control module, and several first dry node control modules are provided. One of the first dry node control modules includes a first relay and a first wiring terminal. Optionally, the model of the first relay is HFD23 / 012-1ZS, and the model of the wiring terminal is WJ15EDGVC-3.81-3P. The first end of the first relay is connected to a 12V power supply, the second end is connected to the communication pin of the processor U4, the fourth end is connected to the first pin of the wiring terminal, the fifth end is connected to the third pin of the wiring terminal, and the sixth end is connected to the second pin of the wiring terminal.

[0066] Optional, such as Figure 9 As shown, the communication pin of the first relay is connected to the communication pin of the processor U4 through the composite transistor array U44. Optionally, the model of the composite transistor array U44 is ULN2003.

[0067] Optional, such as Figure 9 As shown, the dry contact control unit also includes a second dry node control module, and the second dry node control module includes a second relay K8 and a second terminal P28. Optionally, the model of the second relay K8 is HF3FA-012-ZSTF, and the model of the terminal P28 is CH5.08-3A. The first end of the second relay K8 is connected to a 12V power supply, the second end is connected to the processor U4 through a composite transistor array U44, the third end is connected to the second pin of the terminal P28, the fourth end is connected to the third pin of the terminal P28, and the fifth end is connected to the first pin of the terminal P28.

[0068] The temperature and humidity sensing unit is used to collect the current test environment temperature and humidity information for reference and comparison with the temperature and humidity sensor data of the target circuit board under test.

[0069] like Figure 10 As shown, the temperature and humidity acquisition unit includes a temperature and humidity sensor U5, which is communicatively connected to the processor. In this embodiment, the model of the temperature and humidity sensor U5 is SHT30DIS.

[0070] The output unit includes a sound output unit and a display unit.

[0071] The sound output unit is in communication with the processor. Figure 11 As shown, the sound output unit is a buzzer LS1. One pin of the buzzer LS1 is connected to a 12V power supply, and the other pin is connected to the processor U4. Optionally, the model of the buzzer is PS1720P02. In this embodiment, the buzzer LS1 is connected to the processor via a composite transistor array U44.

[0072] The display unit is electrically connected to the processor and is used to display the current test progress and related test results. The display unit can be a display, etc., which is a prior art and will not be described in detail in this application. At the same time, in this embodiment, the connection relationship of other pins in the unit can be referred to the drawings or device specifications of this application, and will not be described in detail in this application.

[0073] It also includes a power supply module, which is used to supply power to each unit. This is existing technology and will not be described in detail in this application.

[0074] A circuit board test fault analysis device comprises the circuit board test circuit.

[0075] After connecting the product of this application to the circuit board to be tested, the fault testing process of this application is as follows:

[0076] S1: The network sends the data into test mode;

[0077] S2: Determine whether the test command is responded normally; if not, directly enter S12;

[0078] S3: Collect relevant data of the target circuit board;

[0079] S4: Determine whether the temperature data is normal. If abnormal, the temperature abnormality flag is set.

[0080] S5: Determine whether the humidity data is normal. If it is abnormal, the humidity abnormality bit is set;

[0081] S6: Determine whether the power data is normal. If abnormal, the power data abnormality bit is set.

[0082] S7: Control the dry contact to change state;

[0083] S8: Collect target dry contact data;

[0084] S9: Determine whether the dry contact state is normal. If abnormal, the dry contact abnormality is set;

[0085] S10: Send a control instruction to change the target output interface state;

[0086] S11: Determine whether the output status is normal. If abnormal, the output interface abnormality is set;

[0087] S12: Display the result and issue a sound reminder for the change.

[0088] The utility model provides a circuit board testing circuit and a circuit board testing fault analysis device, which have simple structure, convenient use and high reliability.

[0089] Although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A circuit board test circuit, characterized in that: include: a control unit, the control unit comprising a processor; Testing units, wherein at least two types of testing units are provided, and both of the testing units are communicatively connected to the control unit; a communication unit, the communication unit being communicatively connected to the control unit and configured to communicate with the circuit board to be tested; An output unit is communicatively connected to the control unit.

2. The circuit board test circuit according to claim 1, characterized in that: The test unit includes a power information acquisition unit, an interface status acquisition unit, a dry contact control unit, a temperature and humidity sensing unit and / or a serial communication unit.

3. The circuit board test circuit according to claim 2, characterized in that: The power information acquisition unit includes a current transformer and a metering chip. One side of the current transformer is used to be electrically connected to the circuit board to be tested, and the other side of the current transformer is connected to the metering chip. The metering chip is communicatively connected to the processor.

4. The circuit board test circuit according to claim 3, characterized in that: The interface status acquisition unit includes an optical coupler, one side of the optical coupler is used to be electrically connected to the circuit board to be tested, and the other side of the optical coupler is electrically connected to the processor; The dry contact control unit includes a first dry node control module, wherein the first dry node control module is provided with a plurality of modules, and one of the first dry node control modules includes a first relay and a first wiring terminal, wherein the first end of the first relay is connected to a power supply, the second end is used for communication connection with the processor, the fourth end is connected to the first pin of the wiring terminal, the fifth end is connected to the third pin of the wiring terminal, and the sixth end is connected to the second pin of the wiring terminal; The dry contact control unit also includes a second dry node control module, which includes a second relay and a second terminal. The first end of the second relay is connected to the power supply, the second end is used to communicate with the processor, the third end is connected to the second pin of the terminal, the fourth end is connected to the third pin of the terminal, and the fifth end is connected to the first pin of the terminal.

5. The circuit board testing circuit according to claim 3, characterized in that: The temperature and humidity sensing unit includes a temperature and humidity sensor, and the temperature and humidity sensor is communicatively connected to the processor.

6. The circuit board testing circuit according to claim 2, characterized in that: The serial communication unit includes an RS232 communication unit and / or an RS485 communication unit, and the serial communication unit is communicatively connected with the processor.

7. The circuit board testing circuit according to claim 6, characterized in that: The RS232 communication unit includes an RS232 communication chip, and the RS232 communication chip is communicatively connected to the processor; The RS485 communication unit includes an RS485 communication chip, and the RS485 communication chip is communicatively connected with the processor.

8. The circuit board testing circuit according to claim 1, wherein: The communication unit includes a network communication unit, and the network communication unit includes a network communication chip. The network communication chip is communicatively connected to the processor.

9. The circuit board testing circuit according to claim 1, characterized in that: The output unit includes a sound output unit and a display unit. The sound output unit is electrically connected to the processor, and the display unit is electrically connected to the processor.

10. A circuit board test failure analysis device, characterized in that: The circuit board test circuit comprises the circuit board test circuit according to any one of claims 1 to 9.

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