Vehicle-mounted computer heat dissipation liquid cooling plate structure

Abstract

The utility model discloses a heat dissipation liquid cooling plate structure of a vehicle-mounted computer, relates to the technical field of heat dissipation of the vehicle-mounted computer, and provides the following scheme aiming at the problem that heat in a high-temperature environment is difficult to effectively and quickly discharge by an existing air cooling heat dissipation mode under the condition that the heat in the high-temperature environment is difficult to effectively and quickly discharge: the heat dissipation liquid cooling plate structure of the vehicle-mounted computer comprises a runner plate, a flow channel is formed in the flow channel plate, two flow deflectors are symmetrically arranged in the flow channel, staggered-tooth FINs and heat dissipation bosses are arranged in the flow channel, the heat dissipation bosses are connected to the upper face and the lower face of the flat plate respectively, and the flat plate, the flow channel plate and the heat dissipation bosses are tightly connected through the integrated brazing technology. The liquid-cooled heat dissipation device is novel in structure, the liquid-cooled heat dissipation technology is adopted, and the flow deflectors and the staggered-tooth FINs are arranged in the flow channel plate, so that cooling liquid flows in the flow channel more uniformly, and the flow resistance is smaller.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of vehicle-mounted computers, in particular to a heat dissipation liquid cooling plate structure of a vehicle-mounted computer. Background Art

[0002] As a core component of modern automotive intelligence and automation, the stability and durability of vehicle computers are crucial for ensuring driving safety and enhancing the driving experience. Traditionally, vehicle computers rely primarily on air-cooling systems to maintain a suitable operating temperature. This mechanism utilizes efficient fans installed on the chassis and carefully designed heat sinks, using the principle of air convection to quickly dissipate heat generated within the computer to the external environment.

[0003] However, in the hot summer, when a vehicle is exposed to high outdoor temperatures, the temperature inside the vehicle can quickly rise to uncomfortable levels. Traditional air cooling methods are unable to effectively dissipate the heat in high-temperature environments. Excessive system temperature not only affects the operational stability of the onboard computer, resulting in reduced processing speed and sluggish response, but may even cause the system to crash or restart. Excessive operating temperature will also accelerate the aging process of internal computer components, shorten their service life, and increase repair and replacement costs. Utility Model Content

[0004] The utility model provides a vehicle-mounted computer heat dissipation liquid cooling plate structure, which solves the existing problems.

[0005] In order to achieve the above-mentioned purpose, the present utility model adopts the following technical solutions: a vehicle-mounted computer heat dissipation liquid cooling plate structure, comprising: a flat plate;

[0006] A flow channel plate, wherein a flow channel is provided inside the flow channel plate, and two guide vanes are symmetrically provided inside the flow channel, and a staggered fin is provided inside the flow channel. The guide vanes and the staggered fin cooperate with each other to optimize the flow of coolant and enhance the heat dissipation effect;

[0007] Two heat dissipation bosses are provided, and the two heat dissipation bosses are respectively connected to the upper and lower surfaces of the flat plate. The heat dissipation bosses are in contact with the heating chip of the onboard computer, and the heat dissipation bosses are used to transfer heat to the coolant;

[0008] The flat plate, the flow channel plate and the heat dissipation boss are tightly connected by an integrated brazing process, and the brazing process is used to improve the flatness and the penetration rate of the heat dissipation boss.

[0009] Preferably, a connecting platform is connected below one end of the flat plate, two water inlet and outlet nozzles are arranged inside the connecting platform, and the upper end of the flat plate is connected to a flow channel plate through a guide column, and a plug is connected above the flow channel plate at a position opposite to the water inlet and outlet nozzles.

[0010] Preferably, the shapes, sizes and angles of the two guide vanes are precisely calculated and designed, and the guide vanes are used to form an optimal flow path for the coolant in the flow channel.

[0011] Preferably, the staggered FIN is provided with a variety of shapes and sizes, and the staggered FIN is used to increase the contact area between the coolant and the outer wall of the flow channel.

[0012] Preferably, the heat dissipation boss is made of a material with high thermal conductivity, and a plurality of flow channels are provided on one side of the heat dissipation boss. One side of the two heat dissipation bosses is respectively connected to one side of the flat plate and the flow channel plate.

[0013] The beneficial effects of the utility model are as follows: the device adopts liquid cooling heat dissipation technology, and through the guide plates and staggered fins arranged inside the flow channel plate, the coolant flows more evenly in the flow channel, the flow resistance is smaller, and the heat dissipation effect is significantly improved; the various components are connected into a whole through the brazing process, ensuring the sealing and strength of the structure while ensuring the flatness and welding penetration rate of the heat dissipation boss, optimizing the structure, reducing space occupancy, and improving heat conduction efficiency; the improvement of heat dissipation efficiency allows the heat generated by the on-board computer during operation to be taken away more quickly, thereby reducing energy consumption and temperature rise. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural diagram of the present utility model.

[0015] Figure 2 It is a schematic diagram of a flat plate of the present utility model.

[0016] Figure 3 This is a schematic diagram of the flow channel plate of the present utility model.

[0017] Figure 4 This is a schematic diagram of the heat dissipation boss of the present utility model.

[0018] Numbers in the figure: 1, flat plate; 101, connecting platform; 102, water inlet and outlet nozzles; 103, plug; 2, flow channel plate; 201, flow channel; 202, guide vane; 203, staggered tooth FIN; 3, heat dissipation boss. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] Reference Figure 1-Figure 4 A vehicle-mounted computer heat dissipation liquid cold plate structure includes a flat plate 1, a flow channel plate 2, a flow channel 201 is provided inside the flow channel plate 2, and two guide plates 202 are symmetrically provided inside the flow channel 201, and a staggered fin 203 is provided inside the flow channel 201, the guide plates 202 and the staggered fin 203 cooperate with each other to optimize the flow of coolant and enhance the heat dissipation effect, a heat dissipation boss 3, two heat dissipation bosses 3 are provided, the two heat dissipation bosses 3 are respectively connected to the upper and lower surfaces of the flat plate 1, the heat dissipation boss 3 and the heating chip of the vehicle-mounted computer are bonded to each other, and the heat dissipation boss 3 is used to transfer heat to the coolant, the flat plate 1, the flow channel plate 2 and the heat dissipation boss 3 are tightly connected by an integrated brazing process, and the brazing process is used to improve the flatness and welding penetration rate of the heat dissipation boss 3.

[0021] refer to Figure 2 A connecting platform 101 is connected to the bottom of one end of the flat plate 1, and two water inlet and outlet nozzles 102 are arranged inside the connecting platform 101. The upper end of the flat plate 1 is connected to the flow channel plate 2 through a guide column, and a plug 103 is connected to the top of the flow channel plate 2 at a position opposite to the inlet and outlet nozzles 102. The coolant enters and is discharged through the two inlet and outlet nozzles 102.

[0022] refer to Figure 3 The shapes, sizes and angles of the two guide plates 202 are precisely calculated and designed. The guide plates 202 are used to form the best flow path for the coolant in the flow channel 201. The staggered FIN203 is provided with a variety of shapes and sizes, and multiple staggered FIN203 are placed in the flow channel 201 according to specific angles and arrangements. The staggered FIN203 is used to increase the contact area between the coolant and the outer wall of the flow channel 201. The heat dissipation boss 3 is made of a material with high thermal conductivity. Multiple flow channels 201 are provided on one side of the heat dissipation boss 3. One side of the two heat dissipation bosses 3 is respectively connected to one side of the flat plate 1 and the flow channel plate 2. The structure and placement angles of the guide plates 202 and the staggered FIN203 are precisely designed to reduce the space occupied in the vertical direction, and the heat-generating chip and the heat dissipation boss 3 are fitted together, so that heat can be directly and efficiently transferred from the chip to the coolant.

[0023] Working principle: First, fit the heat-generating chip of the on-board computer tightly onto the heat dissipation boss 3 to ensure that it can absorb and transfer heat quickly and effectively. Fit the heat dissipation boss 3 to the flat plate 1 and one side of the flow channel plate 2. Make the coolant circulate in the flow channel 201 in the flow channel plate 2 through the inlet and outlet nozzles 102. This flow process is driven by a water pump. There are guide plates 202 and staggered FIN203 inside the flow channel 201 to optimize the flow path of the coolant, ensuring that the coolant can evenly cover the entire outer wall of the flow channel plate 2 and take away as much heat as possible. The coolant that has absorbed the heat flows out from the inlet and outlet nozzles 102 and enters other parts of the cooling system for further cooling treatment.

[0024] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A vehicle-mounted computer heat dissipation liquid cold plate structure, characterized in that: include: Flat plate (1); A flow channel plate (2), wherein a flow channel (201) is provided inside the flow channel plate (2), two guide plates (202) are symmetrically provided inside the flow channel (201), and a staggered fin (203) is provided inside the flow channel (201), and the guide plates (202) and the staggered fin (203) cooperate with each other; A heat dissipation boss (3), wherein two heat dissipation bosses (3) are provided, and the two heat dissipation bosses (3) are respectively connected to the upper and lower surfaces of the flat plate (1), the heat dissipation bosses (3) are mutually attached to the heating chip of the vehicle-mounted computer, and the heat dissipation bosses (3) are used to transfer heat to the coolant; The flat plate (1), the flow channel plate (2) and the heat dissipation boss (3) are tightly connected using an integrated brazing process, wherein the brazing process is used to improve the flatness and welding penetration of the heat dissipation boss (3).

2. The vehicle-mounted computer heat dissipation liquid cold plate structure according to claim 1, characterized in that: A connecting platform (101) is connected below one end of the flat plate (1), and two water inlet and outlet nozzles (102) are arranged inside the connecting platform (101).

3. The vehicle-mounted computer heat dissipation liquid cold plate structure according to claim 2, characterized in that: The upper end of the flat plate (1) is connected to a flow channel plate (2) via a guide column, and a plug (103) is connected above the flow channel plate (2) at a position opposite to the water inlet and outlet nozzles (102).

4. The vehicle-mounted computer heat dissipation liquid cold plate structure according to claim 1, characterized in that: The guide plate (202) is used to form a flow path for the cooling liquid in the flow channel (201).

5. The vehicle-mounted computer heat dissipation liquid cold plate structure according to claim 1, characterized in that: The staggered-tooth FIN (203) is provided with various shapes and sizes, and the staggered-tooth FIN (203) is used to increase the contact area between the coolant and the outer wall of the flow channel (201).

6. The vehicle-mounted computer heat dissipation liquid cold plate structure according to claim 1, characterized in that: The heat dissipation boss (3) is made of a material with high thermal conductivity, and a plurality of flow channels (201) are provided on one side of the heat dissipation boss (3). One side of the two heat dissipation bosses (3) is respectively connected to one side of the flat plate (1) and the flow channel plate (2).

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