Resistor structure

Abstract

The utility model discloses a resistor structure which comprises a shell, a resistance wire and pin parts, the shell is made of high heat conduction ceramic, the resistance wire is long, is wrapped and embedded in the shell and is bent for multiple times in the length direction, and the pin parts are arranged at the two ends of the resistance wire in the length direction and used for being externally connected with a load. In the embodiment provided by the utility model, the resistance wire is bent for multiple times to provide high resistance and is simultaneously injected into the high-thermal-conductivity ceramic, so that on one hand, the resistance wire can be arranged in the shell in a multi-layer and three-dimensional manner and can occupy a smaller area of a PCB (Printed Circuit Board) under the same resistance, and on the other hand, the resistance wire realizes multi-directional heat dissipation by utilizing the good heat dissipation performance of the high-thermal-conductivity ceramic; the heat dissipation performance is better, and the load capacity is higher.

Description

Technical Field

[0001] The utility model relates to the field of electronic devices, in particular to a resistor structure. Background Art

[0002] Existing high-resistance resistors are typically chip resistors, which generally consist of a substrate, a resistor film, a protective film, and pins. The protective film provides mechanical protection, preventing the resistor film from physical damage, and insulates the surface of the resistor wire, preventing contact with adjacent conductors and causing malfunction. However, the protective film is typically made of glass paste, which has poor thermal conductivity. This means that chip resistors rely primarily on the pins for heat transfer, resulting in insufficient heat dissipation and low load capacity. Furthermore, the single-layer resistor film design of chip resistors causes them to occupy a large area on the PCB. Utility Model Content

[0003] The utility model aims to provide a resistor structure with better heat dissipation performance and smaller occupied area.

[0004] In order to solve the above technical problems, the present invention provides a resistor structure, comprising:

[0005] A shell, wherein the shell is made of high thermal conductivity ceramic;

[0006] a resistance wire, wrapped and embedded in the housing, the resistance wire being elongated, the resistance wire being bent multiple times in the length direction, and having a first end and a second end that are oppositely disposed in the length direction; and

[0007] The pin portion includes a first pin connected to the first end and a second pin connected to the second end, and the first pin and the second pin are respectively arranged outside the housing.

[0008] In one embodiment, the cross section of the resistance wire is an equilateral triangle.

[0009] In one embodiment, the housing is in a rectangular parallelepiped shape, and the first end and the second end are respectively exposed from the same outer surface of the housing.

[0010] In one embodiment, the housing has a first side surface and a second side surface that are arranged opposite to each other, and the first end and the second end are respectively exposed from the first side surface. The housing also has a top surface and a bottom surface that are spaced apart in the upper and lower directions, and the top surface and the bottom surface are respectively arranged between the first side surface and the second side surface, and the bottom surface is used to be attached to a PCB board. The resistance wire includes a plurality of layers of resistance units, and the resistance units in each layer are respectively bent. The plurality of layers of resistance units are arranged in sequence between the top surface and the bottom surface, and the two adjacent layers of resistance units are connected end to end. The head end of the resistance unit closest to the top surface in the plurality of layers of resistance units is exposed from the first side surface to constitute the first end, and the tail end of the resistance unit closest to the bottom surface in the plurality of layers of resistance units is exposed from the first side surface to constitute the second end.

[0011] In one embodiment, the first end and the second end are arranged sequentially from top to bottom, and the projections of the first end and the second end in the vertical direction overlap.

[0012] In one embodiment, the housing further has a third side surface and a fourth side surface that are arranged opposite to each other, and the third side surface and the fourth side surface extend in the up and down directions respectively and are arranged between the first side surface and the second side surface. The resistance units in each layer respectively include multiple long-segment resistors parallel to the first side surface and the second side surface, and short-segment resistors connected between each adjacent two long-segment resistors, and each short-segment resistor is parallel to the third side surface and the fourth side surface.

[0013] In one embodiment, the first pin and the second pin are brass sheets, respectively, and the first pin and the second pin are respectively attached to the outer surface of the housing.

[0014] In one embodiment, the first pin includes a first portion attached to the first side surface, a second portion attached to the bottom surface, and a third portion attached to the third side surface, wherein the third portion connects the first portion and the second portion; the second pin includes a fourth portion attached to the first side surface, and a fifth portion attached to the bottom surface and connected to the fourth portion, wherein the first portion and the fifth portion are spaced apart to form a gap, and the projections of the fourth portion, the fifth portion and the gap in the upper and lower directions cover the bottom surface.

[0015] In one embodiment, the minimum distance between the outer periphery of the resistance wire and the outer surface of the housing is d, the side length of the cross section of the resistance wire is L, and d is greater than or equal to 1 / 4L.

[0016] In one embodiment, the shell is made of aluminum nitride ceramic, beryllium oxide ceramic or silicon carbide ceramic.

[0017] The technical solution provided by the utility model has the following advantages:

[0018] The resistor structure provided by the present invention includes a shell, a resistance wire and a pin portion, wherein the shell is made of high thermal conductivity ceramic, the resistance wire is long, is wrapped and embedded in the shell, and is bent multiple times in the length direction, and the resistance wire is provided with pin portions at both ends in the length direction for external load. In the embodiment provided by the present invention, the resistance wire is bent multiple times to provide a high resistance value, and is injection molded in the high thermal conductivity ceramic. On the one hand, the resistance wire can be distributed in multiple layers and three dimensions in the shell, and can occupy a smaller PCB board area at the same resistance value. On the other hand, the resistance wire utilizes the good heat dissipation performance of the high thermal conductivity ceramic to achieve multi-directional heat dissipation, better heat dissipation performance, and higher load capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A front view of an embodiment of a resistor structure provided by the present invention;

[0021] Figure 2 for Figure 1 Top view of the middle resistor structure;

[0022] Figure 3 for Figure 1 Left side view of the middle resistor structure;

[0023] Figure 4 for Figure 1 Bottom view of the middle resistor structure;

[0024] Figure 5 for Figure 1 Schematic diagram of the cross section of the middle shell and the resistance wire;

[0025] Figure 6 for Figure 2 Schematic diagram of the cross section of the middle shell and the resistance wire;

[0026] Figure 7 for Figure 3 Schematic diagram of the cross-section of the middle shell and resistance wire.

[0027] Description of reference numerals:

[0028] 100-resistance structure; 10-housing; 11-first side; 12-second side; 13-third side; 14-fourth side; 15-top surface; 16-bottom surface; 20-resistance wire; 21-first end; 22-second end; 23-resistance unit; 231-long resistor; 232-short resistor; 30-first pin; 31-first part; 32-second part; 33-third part; 40-second pin; 41-fourth part; 42-fifth part; 50-gap. DETAILED DESCRIPTION

[0029] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments. It should be noted that the embodiments of the present invention and the features in the embodiments may be combined with each other unless there is a conflict.

[0030] It should be noted that the terms "first", "second", etc. in the specification and claims of the present utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0031] See also Figures 1 to 7 This embodiment provides a resistor structure 100 having a high resistance value, comprising a housing 10, a resistance wire 20, and a lead portion. The housing 10 is made of a high-thermal-conductivity ceramic, a type of ceramic material with excellent thermal conductivity and insulation properties. Specifically, the high-thermal-conductivity ceramic may be aluminum nitride ceramic, beryllium oxide ceramic, or silicon carbide ceramic. The housing 10 provides reliable insulation and mechanical protection for the resistance wire 20 therein.

[0032] The specific shape of the housing 10 can be designed as needed. In an optional embodiment, please refer to Figures 1 to 4The housing 10 is in the shape of a rectangular parallelepiped for ease of manufacture and installation. The housing 10 has a first side surface 11 and a second side surface 12 extending in the up-down direction and arranged opposite to each other, and a top surface 15 and a bottom surface 16 spaced apart in the up-down direction, wherein the top surface 15 and the bottom surface 16 are respectively arranged between the first side surface 11 and the second side surface 12. The housing 10 also has a third side surface 13 and a fourth side surface 14 arranged opposite to each other, wherein the third side surface 13 and the fourth side surface 14 extend in the up-down direction and are respectively arranged between the first side surface 11 and the second side surface 12. The bottom surface 16 is used to be attached to a PCB board. It should be noted that, in this embodiment, the up-down direction is roughly perpendicular to the PCB board, and the downward direction is the direction of the resistor structure 100 toward the mounting side of the PCB board, and the upward direction is opposite to the downward direction, and is the direction of the resistor structure 100 away from the mounting side of the PCB board.

[0033] In this embodiment, please refer to Figures 5 to 7 The resistance wire 20 is enclosed and embedded in the housing 10. The resistance wire 20 is elongated and has multiple bends along its length. The resistance wire 20 can have a variety of shapes, such as a circular shape for ease of manufacture and precision control. In a preferred embodiment, the cross-section of the resistance wire 20 is an equilateral triangle. This design increases the surface area of the resistance wire 20, thereby improving heat dissipation efficiency, allowing the resistance structure 100 to carry higher currents and achieve better load-bearing performance.

[0034] In this embodiment, the resistance wire 20 utilizes the good heat dissipation performance of high thermal conductivity ceramics to achieve multi-directional heat dissipation, thereby achieving better heat dissipation performance and higher load capacity.

[0035] The resistance wire 20 has a first end 21 and a second end 22 disposed opposite each other in the longitudinal direction. The first end 21 and the second end 22 may be directly exposed from the housing 10 or externally connected to the exterior of the housing 10 via pins, thereby enabling connection to a PCB and loading the resistance wire 20. In a preferred embodiment, the first end 21 and the second end 22 are respectively exposed from the same outer surface of the housing 10. Preferably, the first end 21 and the second end 22 are respectively exposed from the first side surface 11 to facilitate soldering and assembly with the PCB.

[0036] The bending manner of the resistance wire 20 in the housing 10 is not limited. In one embodiment, please continue to refer to Figures 5 to 7The resistance wire 20 includes multiple layers of resistance units 23, each layer of resistance units 23 being bent and arranged in sequence between the top surface 15 and the bottom surface 16. The multiple layers of resistance units 23 are arranged in sequence between the top surface 15 and the bottom surface 16, and two adjacent layers of resistance units 23 are connected end to end. The head end of the resistance unit 23 closest to the top surface 15 in the multiple layers of resistance units 23 is exposed at the first side surface 11 to form the first end 21, and the tail end of the resistance unit 23 closest to the bottom surface 16 in the multiple layers of resistance units 23 is exposed at the first side surface 11 to form the second end 22. In this embodiment, the resistance wire 20 can be distributed in multiple layers and in three dimensions in the housing 10, which can occupy a smaller PCB board area at the same resistance value and has a wider range of application scenarios. Preferably, the first end 21 and the second end 22 are arranged in sequence from top to bottom, and the projections of the first end 21 and the second end 22 in the vertical direction overlap.

[0037] Please continue reading Figures 5 to 7 Each layer of resistor units 23 includes multiple long resistor segments 231 parallel to the first side 11 and the second side 12, and short resistor segments 232 connected between each pair of adjacent long resistor segments 231. Each short resistor segment 232 is parallel to the third side 13 and the fourth side 14. In this embodiment, the resistance wire 20 in each layer of resistor units 23 extends in a serpentine shape to provide a sufficient length and a higher resistance value.

[0038] This design allows the resistor wire 20 to form a multi-layer, three-dimensional structure within the housing 10, thereby occupying a smaller PCB area for the same resistance value. Furthermore, the highly thermally conductive ceramic housing 10 effectively dissipates heat generated by the resistor wire 20, improving the heat dissipation performance and load capacity of the resistor structure 100.

[0039] For further information, please refer to Figures 1 to 4 The pin portion includes a first pin 30 connected to the first end 21 and a second pin 40 connected to the second end 22. The first pin 30 and the second pin 40 are respectively arranged on the outside of the housing 10, and are used to electrically connect the electrical components on the PCB board to achieve loading of the resistor structure 100. Preferably, the first pin 30 and the second pin 40 are respectively brass sheets, and are respectively attached to the outer surface of the housing 10. In this way, a large area of pins is provided, which further enhances the heat dissipation of the resistor structure 100 and improves the heat dissipation performance of the resistor structure 100. Brass has good electrical conductivity and mechanical strength, which can ensure the reliable connection of the resistor structure 100.

[0040] Preferably, the first pin 30 includes a first portion 31 attached to the first side surface 11, a second portion 32 attached to the bottom surface 16, and a third portion 33 attached to the third side surface 13. The second pin 40 includes a fourth portion 41 attached to the first side surface 11, and a fifth portion 42 attached to the bottom surface 16 and connected to the fourth portion 41. The first portion 31 and the fifth portion 42 are spaced apart to form a gap 50 to prevent a short circuit between the first pin 30 and the second pin 40. The fourth portion 41, the fifth portion 42, and the gap 50 are projected in the vertical direction to cover the bottom surface 16 to provide the largest possible heat conduction area, thereby improving the heat dissipation performance of the resistor structure 100. In addition, this design can ensure stable installation of the resistor structure 100 on the PCB board while providing good electrical connection.

[0041] In a preferred embodiment, the minimum distance between the outer periphery of the resistance wire 20 and the outer surface of the housing 10 is d, the side length of the cross section of the resistance wire 20 is L, and d is greater than or equal to 1 / 4 L. This design ensures the safety and good heat dissipation of the resistance wire 20 within the housing 10, while also providing reliable mechanical protection for the resistance wire 20, preventing the resistance structure 100 from being easily damaged in a vibrating environment, causing a short circuit or other malfunction.

[0042] Through the detailed description of the above-mentioned multiple embodiments, the resistor structure 100 provided by the present invention has significant advantages in terms of thermal conductivity, mechanical strength, heat dissipation effect and load capacity, and can effectively improve the service life and reliability of the resistor structure 100.

[0043] Obviously, the embodiments described above are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, those skilled in the art can make other variations or modifications without creative work, which should fall within the scope of protection of the present invention.

Claims

1. A resistor structure, characterized in that: include: A shell, wherein the shell is made of high thermal conductivity ceramic; a resistance wire wrapped and embedded in the housing, the resistance wire being elongated, the resistance wire being bent multiple times in the length direction, and having a first end and a second end that are oppositely disposed in the length direction; as well as, The pin portion includes a first pin connected to the first end and a second pin connected to the second end, and the first pin and the second pin are respectively arranged outside the housing.

2. The resistor structure according to claim 1, wherein: The cross section of the resistance wire is an equilateral triangle.

3. The resistor structure according to claim 2, wherein: The shell is in a rectangular parallelepiped shape, and the first end and the second end are respectively exposed from the same outer surface of the shell.

4. The resistor structure according to claim 3, wherein: The housing has a first side surface and a second side surface that are arranged opposite to each other, and the first end and the second end are respectively exposed from the first side surface. The housing also has a top surface and a bottom surface that are spaced apart in the upper and lower directions, and the top surface and the bottom surface are respectively arranged between the first side surface and the second side surface, and the bottom surface is used to be attached to a PCB board. The resistance wire includes a plurality of layers of resistance units, and the resistance units in each layer are respectively bent. The plurality of layers of resistance units are arranged in sequence between the top surface and the bottom surface, and the two adjacent layers of resistance units are connected end to end. The head end of the resistance unit closest to the top surface in the plurality of layers of resistance units is exposed from the first side surface to constitute the first end, and the tail end of the resistance unit closest to the bottom surface in the plurality of layers of resistance units is exposed from the first side surface to constitute the second end.

5. The resistor structure according to claim 4, wherein: The first end and the second end are arranged sequentially from top to bottom, and the projections of the first end and the second end in the up-down direction overlap.

6. The resistor structure according to claim 5, wherein: The housing also has a third side surface and a fourth side surface that are arranged opposite to each other, and the third side surface and the fourth side surface extend in the up and down directions respectively, and are arranged between the first side surface and the second side surface. The resistance units in each layer respectively include multiple long-segment resistors parallel to the first side surface and the second side surface, and short-segment resistors connected between each adjacent two long-segment resistors, and each short-segment resistor is parallel to the third side surface and the fourth side surface.

7. The resistor structure according to claim 6, wherein: The first pin and the second pin are respectively brass sheets, and the first pin and the second pin are respectively attached to the outer surface of the shell.

8. The resistor structure according to claim 7, wherein: The first pin includes a first portion attached to the first side surface, a second portion attached to the bottom surface, and a third portion attached to the third side surface, and the third portion connects the first portion and the second portion; the second pin includes a fourth portion attached to the first side surface, and a fifth portion attached to the bottom surface and connected to the fourth portion, the first portion and the fifth portion are spaced apart to form a gap, and the projections of the fourth portion, the fifth portion and the gap in the upper and lower directions cover the bottom surface.

9. The resistor structure according to any one of claims 2 to 8, wherein: The minimum distance between the outer periphery of the resistance wire and the outer surface of the housing is d, the side length of the cross section of the resistance wire is L, and d is greater than or equal to 1 / 4L.

10. The resistor structure according to any one of claims 1 to 9, wherein: The shell is made of aluminum nitride ceramics, beryllium oxide ceramics or silicon carbide ceramics.

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