Power electronic device and vehicle

Abstract

The utility model provides a power electronic device and a vehicle, the power electronic device comprises a power module, a capacitor module and a heat-conducting bearing plate, the power module and the capacitor module are fixed on a first surface of the bearing plate, the power electronic device further comprises a first cooling channel, a second cooling channel and a third cooling channel, the cooling part is used for cooling the power module and is limited by the first surface and the bottom of the power module located on the first surface; and the second cooling channel is used for cooling the capacitor module and is communicated with the first cooling channel, the second cooling channel is limited by a second surface of the bearing plate and an additional cover plate fixed on the second surface, and the second surface is opposite to the first surface. The power electronic device is improved in overall heat dissipation capability and high in integration degree.

Description

Technical Field

[0001] The utility model relates to the field of electronic devices, in particular to a power electronic device and a vehicle comprising the same. Background Art

[0002] The power electronics of electric vehicle drive systems typically include power modules and capacitor modules, both of which generate significant heat during operation. For example, the core of a capacitor module, due to material limitations, has a limited temperature tolerance. Prolonged operation above this temperature tolerance can damage the core, reduce capacitance, and potentially affect product performance.

[0003] Various cooling structures for power electronic devices are known in the prior art. For example, capacitor modules and power modules are placed on the same metal water-cooling plate, directly cooling the power module and indirectly cooling the capacitor module by leveraging the excellent thermal conductivity of metal. Alternatively, thermally conductive pads are placed between the capacitor module and the metal water-cooling plate to improve thermal conductivity. However, further improvements in the heat dissipation of power electronic devices are still desirable.

[0004] It should be noted that the content introduced here only provides background information related to the present disclosure and does not necessarily belong to the prior art. Utility Model Content

[0005] According to different aspects, the present invention aims to provide a power electronic device and a vehicle comprising the same, wherein the power electronic device has an improved heat dissipation effect and can achieve a higher degree of integration.

[0006] In addition, the present invention is also intended to solve or alleviate other technical problems existing in the prior art.

[0007] The utility model solves the above problems by providing a power electronic device. Specifically, the power electronic device includes a power module, a capacitor module and a heat-conducting carrier plate. The power module and the capacitor module are fixed on the first surface of the carrier plate.

[0008] The power electronic device further comprises:

[0009] a first cooling channel, which is used to cool the power module and is limited by the first surface and the bottom of the power module located thereon;

[0010] A second cooling channel is used to cool the capacitor module and is connected to the first cooling channel. The second cooling channel is limited by a second surface of the carrier plate and an additional cover plate fixed on the second surface, wherein the second surface is opposite to the first surface.

[0011] In the power electronic device proposed according to the first aspect of the present invention, a first containing structure is integrally formed on the first surface of the carrier plate, wherein the power module is fixed with its bottom to the first containing structure and together with the first containing structure limits a first closed chamber, and the first closed chamber serves as part of the first cooling channel.

[0012] In the power electronic device proposed according to the first aspect of the present invention, the first containing structure includes a closed first wall portion protruding outward or recessed inward from the first surface, which limits the first closed chamber, and a first inlet and a first outlet passing through the carrier plate are provided in the first closed chamber, wherein a cooling medium from an external source flows into the first closed chamber through the first inlet and flows into the second cooling channel through the first outlet.

[0013] In the power electronic device according to the first aspect of the present invention, heat dissipation fins are further provided on the bottom of the power module, and the heat dissipation fins extend into the first closed chamber in an assembled state.

[0014] In the power electronic device proposed according to the first aspect of the present invention, the additional cover plate and the second surface of the carrier plate jointly limit a second enclosed chamber that is part of the second cooling channel, wherein a portion of the additional cover plate is aligned with the capacitor module in position, and another portion extends to the area where the power module is located so that the cooling medium from the first cooling channel flows directly into the second enclosed chamber.

[0015] In the power electronic device proposed according to the first aspect of the present invention, the additional cover plate includes a bottom and a closed third wall portion protruding from the bottom, wherein the third wall portion faces the carrier plate, and a second outlet is provided on the bottom of the additional cover plate to discharge the cooling medium from the first cooling channel.

[0016] In the power electronic device proposed according to the first aspect of the present invention, a stop portion is provided on the bottom of the additional cover plate to divide the second closed chamber into two partially connected sub-chambers, wherein one sub-chamber is used for allowing the cooling medium from the first cooling channel to flow in, and the second outlet is provided in the other sub-chamber.

[0017] In the power electronic device proposed according to the first aspect of the present invention, a second containing structure is integrally formed on the first surface of the carrier plate, which includes a closed second wall portion protruding outward from the first surface, and the capacitor module is encapsulated in the space limited by the second wall portion.

[0018] In the power electronic device according to the first aspect of the present invention, the carrier plate is a plastic plate

[0019] According to a second aspect of the present invention, a vehicle comprising such a power electronic device is also provided, which can have the features set forth above.

[0020] Here, the power electronic device according to the present disclosure may have improved overall heat dissipation capability and a higher degree of integration. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other features of the present invention will become apparent with reference to the accompanying drawings, in which:

[0022] Figure 1 A perspective view of a power electronic device according to the present invention is schematically shown from obliquely above, wherein a capacitor module and a power module are removed for clarity;

[0023] Figure 2 A perspective view of the power electronic device is schematically shown from obliquely below;

[0024] Figure 3 An embodiment of the additional cover of the power electronic device is shown separately. DETAILED DESCRIPTION

[0025] It is easy to understand that according to the technical solution of the present invention, without changing the essential spirit of the present invention, a person skilled in the art can propose a variety of interchangeable structural methods and implementation methods. Therefore, the following specific embodiments and drawings are only illustrative of the technical solution of the present invention and should not be regarded as the entire present invention or as a limitation or restriction of the technical solution of the present invention.

[0026] The terms "up," "down," "left," "right," "front," "back," "front," "back," "top," and "bottom" mentioned or potentially mentioned in this specification are defined relative to the structures shown in the accompanying drawings. They are relative concepts and may vary depending on their location or usage. Therefore, these or other directional terms should not be interpreted as restrictive. In addition, the terms "first," "second," "third," and similar expressions are used only for descriptive and distinguishing purposes and should not be understood to indicate or imply the relative importance of the corresponding components.

[0027] refer to Figure 1, which shows an embodiment of the power electronic device 100 according to the present invention when the capacitor module and the power module are removed or when the main components of the two are removed, wherein a first accommodating structure 120 and a second accommodating structure 130 are provided on the same side (i.e., the first surface 111) of the carrier board 110 of the power electronic device. The first accommodating structure 120 is used to accommodate or accept the power module, and the second accommodating structure 130 is used to accommodate or accept the capacitor module. At the same time, an additional cover plate 140 (which is on the back side of the carrier board 110) is provided (i.e., the second surface 112, which is opposite to the first surface 111) Figure 2 and Figure 3 ), which can be connected to the carrier plate 110 by welding, and the cooling fluid is sealed therein.

[0028] Here, it should be noted that the capacitor module can be, but is not limited to, a DC link capacitor (abbreviated as DC-Link), an electrolytic capacitor, or a ceramic capacitor. The power module can be, but is not limited to, an IGBT (Insulated Gate Bipolar Transistor) module, a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) module, a SiC (Silicon Carbide) module, or a GaN (Gallium Nitride) module. In addition, the capacitor module and the power module located on the same side can transmit electrical energy through a bus bar, which can be made of, for example, copper with low resistivity and excellent conductivity, and the connection between the two bus bars can be achieved by means of screws or welding.

[0029] In addition, it should be noted that the power electronic device is not limited to use in the PEU (Power Electronic Unit) of electric vehicles. The PEU generally integrates a capacitor module, a power module, a motor control unit (MCU, Microcontroller Unit), a DC-DC converter (DC-DC), and an on-board charger (OBC, On-Board Charger). The power electronic device may also involve any type of electrical component including a capacitor module and a power module. Of course, the power electronic device is not limited to use only in the vehicles claimed for protection in this application (for example, electric vehicles, hybrid vehicles), and can also be used in other feasible scenarios, such as drives.

[0030] To improve heat dissipation from the power module and capacitor module, the present invention provides interconnected cooling channels for each. Specifically, the power module is cooled via a first cooling channel bounded by the first surface 111 of the carrier plate 110 and the bottom of the power module secured thereto. The capacitor module is cooled via a second cooling channel bounded by the second surface 112 of the carrier plate 110 and the additional cover 140 secured thereto. The second cooling channel is positionally related to, and particularly aligned with, the capacitor module on the first surface 111. Both cooling channels are connected to an external cooling source for supplying a cooling medium and, if necessary, a circulating pump. Cooling medium from the cooling source circulates sequentially through the first and second cooling channels, or vice versa. In particular, cooling the power module or capacitor module first can be selected based on their respective heat outputs. Specifically, whether the cooling medium from the cooling source flows first into the first or second cooling channel can be selected. For example, given that the power module typically generates more heat than the capacitor module, the power module can be cooled first. The cooling medium is a coolant, such as cooling water.

[0031] In summary, according to the main concept of the present invention, the cooling of the power module can be achieved with the help of the carrier plate (which can be understood as the so-called water-cooling plate in the prior art), which is also consistent with the structural design of the power module itself; in contrast, the cooling of the capacitor module is achieved through an "external" cooling channel. First, compared with the prior art in which the capacitor module is not cooled separately or is cooled by contact heat conduction of a metal plate, the technical solution of the present application can significantly improve the overall heat dissipation capacity. Secondly, by arranging the two cooling channels on both sides of the carrier plate, the spatial layout of the power electronic device can be optimized and a higher degree of integration can be achieved. In addition, the relevant heat dissipation components for the capacitor module are purposefully placed on the back side of the carrier plate, which fully takes into account the higher insulation requirements of the capacitor module and thereby avoids problems such as short circuits caused by coolant leakage.

[0032] The following describes the two cooling channels separately based on the assumption that the heat generation capacity of the power module is large and the coolant from the cooling source first flows into the first cooling channel.

[0033] First, regarding the power module and the first cooling channel therefor. Figure 1As shown, a first containment structure 120 is integrally formed on the first surface 111 of the carrier plate 110. That is, the first containment structure 120 and the carrier plate 110 are integrally formed and can be formed from the same material through injection molding. The power module is placed or secured to the first containment structure 120 with its bottom, for example, by screws. Together with the first containment structure 120, the power module defines a first enclosed chamber that forms a first cooling channel.

[0034] Due to the improved heat dissipation capabilities afforded by this integrated cooling channel design, the thermal conductivity requirements for the carrier plate are lower, and it need not necessarily be a metal plate. In one embodiment, the carrier plate 110, or the integrally formed first and second containment structures 120 and 130, can all be made of plastic. This approach enables a lightweight and cost-effective design of the power electronic device.

[0035] It should be noted here that the first closed chamber and the second closed chamber mentioned below are used to accommodate coolant and allow the coolant to flow therein, and are sealed except for the parts for the coolant to flow in or out, which can be achieved with the help of sealing rings or other forms of seals.

[0036] exist Figure 1 In the illustrated embodiment, the first containment structure 120 includes a first wall portion 121 protruding outward from the first surface 111, which is closed and limits the first closed chamber in the circumferential direction. When the power module is assembled, the power module (especially its bottom) and the first wall portion 121 and the first surface 111 jointly limit the first closed chamber. In the first closed chamber, especially on the first surface 111 of the carrier plate, a first inlet 122 and a first outlet 123 are provided, both of which pass through the carrier plate 110 respectively. Here, the first inlet 122 is connected to the carrier plate through a first interface 124 on the back side of the carrier plate (which can be integrally injection-molded with the carrier plate and Figure 2 The first outlet 123 is connected to the second cooling channel on the back side of the carrier plate 110. The cooling liquid flows into the first closed chamber through the first inlet 122 and then flows out from the first outlet 123. This sub-circuit realizes heat dissipation cooling of the power module.

[0037] In particular, the first closed chamber can be rectangular, and the first inlet 122 and the first outlet 123 are respectively arranged on two opposite sides thereof, such as Figure 1 As shown in .

[0038] In another optional embodiment, the first wall portion can also be configured to be recessed toward the interior of the carrier plate, that is, a recessed portion is provided on the first surface of the carrier plate, which is enclosed at the top by the power module and serves as a first enclosed chamber, wherein the power module is directly fixed with its bottom to the first surface of the carrier plate.

[0039] In an optional embodiment, to improve heat dissipation efficiency, heat dissipation fins (e.g., pin-fins) are further provided on the bottom of the power module. These fins are arranged in an orderly manner on the bottom of the power module or indirectly fixed to the bottom via a thermally conductive substrate. In the assembled state, the heat dissipation fins extend into the first enclosed chamber and are circulated by coolant, thereby cooling the power module. During assembly, the power module body, heat dissipation fins, and pressure frame components can be fixed to the first containment structure with screws, and can generate alternating current while effectively dissipating heat.

[0040] In addition, it is also feasible that, considering that the housing (i.e., the bottom) of the power module is usually electrically insulated, the coolant can directly cool and dissipate heat for the entire power module by contacting its bottom, which is simpler in structure and feasibility.

[0041] Here, the first containment structure 120 is not used for heat conduction, but is actually used to fix the power module and form a closed chamber. Therefore, the first containment structure 120 does not have to be made of metal. Like the carrier plate 110, it can be made of lightweight plastic.

[0042] Next, regarding the capacitor module and the second cooling channel therefor. Figure 1 As shown, the second containment structure 130, adjacent to the first containment structure 120, includes a closed second wall portion 131 protruding outward from the first surface 111. This wall portion 131 can be integrally formed with the carrier plate 110, for example, made of plastic. In this case, the capacitor module core, filter components, such as EMC (Electromagnetic Compatibility) filter components, busbars, etc., can be encapsulated with epoxy resin in the space enclosed by the second wall portion 131. The epoxy resin provides both fixation and electrical insulation, and the second wall portion can be considered the outer shell of the capacitor module. This method achieves smooth current flow, reduced voltage fluctuations, reduced noise interference, and an integrated design.

[0043] Here, fixing the capacitor module on the carrier plate is not limited to being achieved through the above-mentioned second receiving structure and potting process, but can also be achieved through corresponding fastening components.

[0044] The second surface 112 of the carrier plate and the additional cover plate 140 thereon jointly define a second enclosed chamber, which serves as part of the second cooling channel. In one embodiment, a portion of the additional cover plate 140 is aligned with the capacitor module, and in particular, is aligned exactly (that is, the spatial range occupied by this portion on the second surface 112 is exactly equal to the spatial range occupied by the capacitor module on the first surface 111 of the carrier plate). For details, please refer to Figure 2 The other part of the additional cover plate 140 extends to the area where the power module is located, especially to the area where the first outlet 123 is located, wherein the coolant can flow directly from the first outlet 123 into the second cooling channel, thereby omitting the additional connecting structure. For more information, please refer to Figure 2 The roughly trapezoidal part of the lower right section.

[0045] Specifically, in the assembled state, the coolant flows directly into the second enclosed chamber below through the first outlet 123 extending through the carrier plate 110, cooling the capacitor module. By integrating the cooling circuits for the power module and capacitor module, the circulation of the coolant achieves simultaneous, mandatory and efficient cooling of both, thereby reducing structural complexity and manufacturing difficulty while improving integration.

[0046] refer to Figure 3 , which shows one embodiment of an additional cover plate, with the coolant flow direction indicated by arrows. The additional cover plate 140 includes a bottom 141 and a third wall portion 142 protruding therefrom. The third wall portion 142 is closed and fixed to the carrier plate 110, specifically welded to the second surface 112 of the carrier plate. Furthermore, it is also possible for the additional cover plate to have a dedicated fixing portion, such as a lip or ear, which is fixed to the carrier plate using fasteners or by welding.

[0047] A through hole is provided on the bottom 141 of the additional cover plate as a second outlet 143, which is connected to the cooling source through the second interface 144 so as to discharge the coolant to the outside, that is, to circulate the coolant back to the cooling source. Figure 3 In the illustrated embodiment, the second outlet 143 of the second cooling channel is arranged adjacent to the second inlet (i.e., the location of the first outlet 123 of the first cooling channel) to simplify the communication path with the cooling source. Specifically, a stopper 145 is provided on the bottom 141 of the additional cover plate to divide the second closed chamber into two partially connected sub-chambers, one of which is used for the flow of coolant from the first cooling channel, and the other sub-chamber is provided with the second outlet 143. Here, the stopper 145 is used to ensure that the coolant flows along a predetermined flow path (e.g., Figure 3and avoids the reduction of heat dissipation effect caused by directly flowing to the second outlet.

[0048] In another feasible embodiment, the second outlet and the second inlet of the second cooling channel are opposite to each other, so as to omit the stopper mentioned above. Figure 3 The second outlet is arranged in the leftmost corner region of the portion of the additional cover plate that is intended for the capacitor module.

[0049] In another possible embodiment, a cavity is recessed in the second surface of the carrier plate, and the carrier plate seals the cavity, thereby forming the second enclosed cavity described above. The first outlet of the first cooling channel connects to the cavity (or, alternatively, flows into the cavity through the second inlet), and the coolant then flows out of the second outlet, which extends through the additional cover plate, back to the cooling source. In this case, the second outlet and the second inlet can be arranged opposite each other, or adjacently, with a similar stop provided on the second surface of the additional cover plate facing the carrier plate.

[0050] In another possible embodiment, based on the improved cooling effect achieved by integrating the first and second cooling channels, the additional cover plate 140 can be entirely made of lightweight plastic. Alternatively, in the power electronic device according to this application, all cooling components, including the integrally formed carrier plate and additional cover plate, can be made of lightweight plastic. This approach achieves a highly integrated and lightweight design, which is advantageous for power electronic devices.

[0051] In summary, the power electronic device according to the present invention has achieved significant improvements in overall heat dissipation capacity and integration. In some embodiments, by arranging an external cooling device for the capacitor module on the opposite side of the capacitor module, short circuit problems caused by coolant leakage can be effectively avoided. In other embodiments, based on a plastic carrier plate and an additional cover plate, manufacturing costs and product weight can be further reduced. In other embodiments, by encapsulating the main components of the capacitor module in the space enclosed by the second wall portion, a smooth current flow is achieved, and voltage fluctuations and noise interference are reduced.

[0052] In addition, the present application also proposes a vehicle including such a power electronic device, which can be a common new energy vehicle, such as a pure electric vehicle, a hybrid vehicle, etc. The vehicle according to the present application can have the characteristics and advantages of the power electronic device according to the present application, and for details of its structure, reference can be made to the above description of the power electronic device.

[0053] It should be understood that all the above preferred embodiments are illustrative rather than restrictive, and various modifications or variations made by those skilled in the art to the above-described specific embodiments under the concept of the present invention should be within the legal protection scope of the present invention.

Claims

1. A power electronic device comprising a power module, a capacitor module and a heat-conducting carrier plate, wherein the power module and the capacitor module are fixed on a first surface of the carrier plate, characterized in that: The power electronic device further comprises: a first cooling channel, which is used to cool the power module and is limited by the first surface and the bottom of the power module located thereon; A second cooling channel is used to cool the capacitor module and is connected to the first cooling channel. The second cooling channel is limited by a second surface of the carrier plate and an additional cover plate fixed on the second surface, wherein the second surface is opposite to the first surface.

2. The power electronic device according to claim 1, characterized in that A first containing structure is integrally formed on the first surface of the carrier plate, wherein the power module is fixed at the first containing structure with its bottom and together with the first containing structure defines a first closed chamber, which serves as part of the first cooling channel.

3. The power electronic device according to claim 2, characterized in that: The first containing structure includes a closed first wall portion protruding outward or recessed inward from the first surface, which limits the first closed chamber, and a first inlet and a first outlet penetrating the carrier plate are provided in the first closed chamber, wherein a cooling medium from an external source flows into the first closed chamber through the first inlet and flows into the second cooling channel through the first outlet.

4. The power electronic device according to claim 2, characterized in that: Heat dissipation fins are further provided on the bottom of the power module, and the heat dissipation fins extend into the first closed chamber in an assembled state.

5. The power electronic device according to claim 1, characterized in that: The additional cover plate and the second surface of the carrier plate jointly define a second enclosed chamber that is part of the second cooling channel, wherein a portion of the additional cover plate is aligned with the capacitor module, and another portion extends to the area where the power module is located so that the cooling medium from the first cooling channel flows directly into the second enclosed chamber.

6. The power electronic device according to claim 5, characterized in that: The additional cover plate includes a bottom and a closed third wall portion protruding from the bottom, wherein the third wall portion faces the carrier plate. A second outlet is opened on the bottom of the additional cover plate to discharge the cooling medium from the first cooling channel.

7. The power electronic device according to claim 6, characterized in that: A stopper is provided on the bottom of the additional cover plate to divide the second closed chamber into two partially connected sub-chambers, wherein one sub-chamber is used for allowing the cooling medium from the first cooling channel to flow in, and the second outlet is provided in the other sub-chamber.

8. The power electronic device according to claim 1, characterized in that: A second accommodating structure is integrally formed on the first surface of the carrier plate, and includes a closed second wall portion protruding outward from the first surface. The capacitor module is potted in a space limited by the second wall portion.

9. The power electronic device according to claim 1, characterized in that: The carrying plate is a plastic plate.

10. A vehicle, characterized in that: The method comprises a power electronic device according to any one of claims 1 to 9.

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