Wafer adsorption device

Abstract

The utility model belongs to the technical field of wafer production equipment, and particularly relates to a wafer adsorption device. The device comprises a strip-shaped adsorption main body, and a vacuum tunnel is formed in the adsorption main body in the length direction of the adsorption main body; the adsorption opening is formed in one end of the adsorption main body and communicates with one end of the vacuum tunnel; the vacuum interface is arranged at the other end of the adsorption main body and is communicated with the other end of the vacuum tunnel; the fixing holes are formed in the end, close to the vacuum connector, of the adsorption body. The wafer transfer device is used for solving the problem that wafers are inconvenient to transfer in narrow space. The adsorption body is arranged to be in a long strip shape, the adsorption opening and the vacuum connector are formed in the two ends of the long-strip-shaped adsorption body respectively, the adsorption opening and the vacuum connector are communicated through the internal vacuum tunnel, then the adsorption body is fixed through the fixing hole in the other end, and the end, serving as the free end, of the adsorption opening can stretch into some narrow space. And actions of a mechanical arm and the like connected with the other end of the adsorption main body are not influenced.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer production equipment, and particularly relates to a wafer adsorption device. Background Art

[0002] Wafers are silicon wafers used to make silicon semiconductor circuits. The starting material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form cylindrical single crystals. Silicon ingots are then ground, polished, and sliced to form silicon wafers, also known as wafers.

[0003] During the semiconductor chip manufacturing process, wafers must undergo multiple steps for processing, and inevitably undergo multiple transfers during the processing: from the transfer fixture to the processing station on the equipment; on the same equipment, they also need to be transferred from one station to another. This transfer usually starts with the conveyor belt lifting the wafer and then a robot equipped with a vacuum suction cup sucks it from the back of the wafer, lifts it up and transfers it to the destination station. After it reaches its destination, the control system of the equipment removes the vacuum and puts down the wafer.

[0004] At present, conventional suction cup-type vacuum suction cups need to be used in conjunction with a large three-axis drive mechanism to complete actions such as adsorption and transfer. However, in some occasions where the moving space is narrow, this suction cup installed on the robotic arm is difficult to use because the size of the robotic arm cannot extend into some small spaces. Utility Model Content

[0005] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a wafer adsorption device for solving the problem of inconvenience in transferring wafers in a narrow space.

[0006] The present invention solves the above-mentioned technical problems with the following technical solutions: A wafer adsorption device comprising:

[0007] The adsorption body is in a strip shape and has a vacuum tunnel opened inside along its length;

[0008] At least one adsorption port is provided at one end of the adsorption body, and the adsorption port is connected to one end of the vacuum tunnel;

[0009] A vacuum interface is provided at the other end of the adsorption body, and the vacuum interface is connected to the other end of the vacuum tunnel;

[0010] A plurality of fixing holes are provided on the adsorption body near one end of the vacuum interface.

[0011] Compared with the existing technology, the above technical solution has the following beneficial effects:

[0012] By setting the adsorption body into a long strip shape, and then setting the adsorption port and vacuum interface at the two ends of the long strip adsorption body respectively, the adsorption port and vacuum interface are connected through the internal vacuum tunnel, and then the adsorption body is fixed through the fixing hole on the other end. The end with the adsorption port is used as the free end to extend into some narrow spaces, and the movement of the robotic arm connected to the other end of the adsorption body is not affected.

[0013] Based on the above technical solution, the embodiment of the present application can also be improved as follows:

[0014] In one embodiment, the adsorption body is a flat strip structure, and the adsorption port and the vacuum interface are respectively provided on any one or both of the two flat surfaces of the adsorption body.

[0015] By setting the adsorption body as a flat strip structure, it is easier to pass through some narrow spaces.

[0016] In one embodiment, a suction plane higher than the suction port is formed on the suction body at the suction port.

[0017] The higher adsorption plane set near the adsorption port ensures that only the adsorption plane contacts the wafer, preventing the wafer surface from contacting other places.

[0018] In one embodiment, a vacuum cavity is formed inwardly on the adsorption plane of the adsorption body, and the vacuum cavity is communicated with the adsorption port.

[0019] The vacuum cavity formed on the adsorption plane enables the adsorption port to have a larger adsorption plane, which can better adsorb the wafer.

[0020] In one embodiment, the adsorption body comprises:

[0021] An adsorption strip, wherein the adsorption strip is provided with a strip-shaped step groove along its length, and the vacuum tunnel is opened in the step groove;

[0022] A cover plate is matched to cover the vacuum tunnel, and the periphery of the cover plate is welded and fixed to the step groove in the adsorption strip.

[0023] In one embodiment, the flatness of the adsorption surface does not exceed 10 μm.

[0024] In one embodiment, the surface roughness of the adsorption plane does not exceed 1 μm.

[0025] In one embodiment, a fork-shaped arm is provided on the adsorption body near one end of the adsorption port and extends outward, and an escape area is formed in the center of the fork-shaped arm.

[0026] The fork-shaped arm not only provides good support, but also forms an avoidance area that can avoid the ejection mechanism supporting the wafer in the upstream and downstream processes, while being able to receive the wafer on the ejection mechanism.

[0027] In one embodiment, a supporting protrusion is provided on the end of the fork-shaped arm away from the adsorption body.

[0028] The support protrusion provided on the far end of the fork-shaped arm can better play a supporting role and prevent the edge of a larger wafer from being suspended in the air due to being unable to support it. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0031] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure along the AA direction.

[0032] Figure 3 This is a schematic diagram of the explosion structure of the cover plate and the adsorption strip in the utility model.

[0033] Figure 4 It is a schematic diagram of the structure with fork-shaped arms in the utility model.

[0034] Reference numerals:

[0035] 1. Adsorption body; 2. Vacuum tunnel; 3. Adsorption port; 4. Vacuum interface; 5. Fixing hole; 6. Adsorption plane; 7. Vacuum chamber; 8. Adsorption strip; 9. Step groove; 10. Cover plate;

[0036] 11. Fork-shaped arm; 12. Avoidance area; 13. Support protrusion. DETAILED DESCRIPTION

[0037] The following embodiments of the technical solution of the present invention are described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are therefore only examples and are not intended to limit the scope of protection of the present invention.

[0038] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by those skilled in the art to which this utility model belongs.

[0039] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0040] In this application, unless otherwise expressly specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0041] like Figure 1-2 As shown, the utility model provides a wafer adsorption device, which includes: an adsorption body 1, the adsorption body 1 is strip-shaped, and a vacuum tunnel 2 is opened inside the adsorption body 1 along its length direction; an adsorption port 3 is arranged at one end of the adsorption body 1, and the adsorption port 3 is connected to one end of the vacuum tunnel 2; a vacuum interface 4 is arranged at the other end of the adsorption body 1, and the vacuum interface 4 is connected to the other end of the vacuum tunnel 2; a plurality of fixing holes 5 are arranged on the adsorption body 1 near the end of the vacuum interface 4, and the end near the vacuum interface 4 is connected to the robotic arm through four fixing holes 5. At this time, the vacuum interface 4 is connected to the vacuum channel on the robotic arm, which is used to provide negative pressure to the adsorption port 3 connected through the vacuum tunnel 2. The end of the adsorption body 1 near the adsorption port 3 is a free end, which is driven to move by an external robotic arm.

[0042] By setting the adsorption body 1 into a long strip shape, and then setting the adsorption port 3 and the vacuum interface 4 at the two ends of the long strip adsorption body 1 respectively, the adsorption port 3 and the vacuum interface 4 are connected through the internal vacuum tunnel 2, and then the adsorption body 1 is fixed through the fixing hole 5 on the other end. The end with the adsorption port 3 is used as the free end to extend into some narrow spaces, and the movement of the robotic arm connected to the other end of the adsorption body 1 is not affected.

[0043] Specifically, the adsorption body 1 is a flat strip structure, and the adsorption port 3 and the vacuum interface 4 are respectively provided on any one or both of the two flat surfaces of the adsorption body 1 .

[0044] By setting the adsorption body 1 as a flat strip structure, it is easier to pass through some narrow spaces. Then the two sides of the flat adsorption body 1 are more convenient to form the surface supporting the wafer, and the adsorption port 3 and the vacuum interface 4 are set on the same side of the adsorption body 1 or respectively on two sides, which can be selected according to the actual usage scenario.

[0045] To ensure that the surface of the wafer is not scratched during transfer, an adsorption plane 6 that is higher than the adsorption port 3 is formed on the adsorption body 1 at the adsorption port 3. The higher adsorption plane 6 is arranged near the adsorption port 3, and the wafer can be adsorbed on the adsorption plane 6 by providing negative pressure through the adsorption port 3, so that only the adsorption plane 6 contacts the wafer, preventing the wafer surface from contacting other places.

[0046] A vacuum cavity 7 is formed inwardly on the adsorption plane 6 of the adsorption body 1, and the vacuum cavity 7 is connected to the adsorption port 3. The vacuum cavity 7 connected to the adsorption port 3 is formed by widening the adsorption plane 6 to expand the negative pressure contact surface. The vacuum cavity 7 formed on the adsorption plane 6 can make the adsorption port 3 have a larger adsorption plane 6, which can better adsorb the wafer.

[0047] like Figure 3 As shown, in this embodiment, the adsorption body 1 includes: an adsorption strip 8 and a cover plate 10.

[0048] The adsorption strip 8 is provided with a strip-shaped step groove 9 along its length, and the vacuum tunnel 2 is opened in the step groove 9. The strip-shaped step groove 9 is first opened, and then the vacuum tunnel 2 is opened in the step groove 9. Then, the cover plate 10 is matched and covered on the vacuum tunnel 2. The periphery of the cover plate 10 is welded and fixed to the step groove 9 in the adsorption strip 8 to seal the vacuum tunnel 2, leaving only the two ends connected to the adsorption port 3 and the vacuum interface 4.

[0049] In order to ensure that the adsorption plane 6 does not scratch the wafer surface, the flatness of the adsorption plane 6 does not exceed 10 μm.

[0050] At the same time, in order to ensure reliable adsorption of the wafer, the surface roughness of the adsorption plane 6 does not exceed 1 μm.

[0051] like Figure 4 As shown, in order to better support the wafer, a fork-shaped arm 11 is provided on the adsorption body 1 near one end of the adsorption port 3 to extend outward, and an avoidance area 12 is formed in the center of the fork-shaped arm 11.

[0052] The fork-shaped arm 11 not only provides good support, but also forms an avoidance area 12 which can avoid the ejection mechanism supporting the wafer in the upstream and downstream processes, and can receive the wafer on the ejection mechanism.

[0053] In order to achieve a better supporting effect at the distal end of the fork-shaped arm 11 , a supporting protrusion 13 is provided on the distal end of the fork-shaped arm 11 away from the adsorption body 1 , and the surface of the supporting protrusion 13 is in the same plane as the adsorption plane 6 .

[0054] The support protrusion 13 provided on the distal end of the fork-shaped arm 11 can better play a supporting role and prevent the edge of a larger wafer from being suspended in the air due to being unable to support it.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer adsorption device, characterized in that: include: The adsorption body is in a strip shape and has a vacuum tunnel opened inside along its length; At least one adsorption port is provided at one end of the adsorption body, and the adsorption port is connected to one end of the vacuum tunnel; A vacuum interface is provided at the other end of the adsorption body, and the vacuum interface is connected to the other end of the vacuum tunnel; A plurality of fixing holes are provided on the adsorption body near one end of the vacuum interface.

2. The wafer adsorption device according to claim 1, characterized in that: The adsorption body is a flat strip structure, and the adsorption port and the vacuum interface are respectively arranged on any one side or both sides of the two flat surfaces of the adsorption body.

3. The wafer adsorption device according to claim 2, characterized in that: An adsorption plane higher than the adsorption port is formed on the adsorption main body at the adsorption port.

4. The wafer adsorption device according to claim 3, characterized in that: A vacuum cavity is formed inwardly on the adsorption plane of the adsorption body, and the vacuum cavity is communicated with the adsorption port.

5. The wafer adsorption device according to claim 1, wherein: The adsorption body comprises: An adsorption strip, wherein the adsorption strip is provided with a strip-shaped step groove along its length, and the vacuum tunnel is opened in the step groove; A cover plate is matched to cover the vacuum tunnel, and the periphery of the cover plate is welded and fixed to the step groove in the adsorption strip.

6. The wafer adsorption device according to claim 3, characterized in that: The flatness of the adsorption plane does not exceed 10 μm.

7. The wafer adsorption device according to claim 6, characterized in that: The surface roughness of the adsorption plane does not exceed 1 μm.

8. The wafer adsorption device according to claim 3, characterized in that: A fork-shaped arm is provided on the adsorption body and extends outwards from one end close to the adsorption port, and a avoidance area is formed in the center of the fork-shaped arm.

9. The wafer adsorption device according to claim 8, characterized in that: A supporting protrusion is provided on the end of the fork-shaped arm away from the adsorption body.

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