Inverter

Abstract

The utility model relates to the technical field of electrical equipment, in particular to an inverter. The utility model aims to solve the problems that the heat dissipation capability of the power module and the first device is insufficient, and the volume heat consumption density of the inverter is difficult to improve. According to the inverter provided by the embodiment of the invention, the circuit board is provided with the first side and the second side which are opposite, the first device is arranged on the first side of the circuit board, the power module is arranged on the second side of the circuit board, and the first device and the power module are located on different sides of the circuit board, so that the layout on the circuit board is more dispersed; the heat dissipation space of the first device and the power module is increased, so that the heat dissipation of the first device and the power module is more sufficient. The first device extends into the first groove, so that the first device obtains an independent heat dissipation space, the heat dissipation capability of the first device is improved, and the volume heat consumption density of the inverter is improved. The radiator is arranged on the side, away from the circuit board, of the power module, the heat dissipation capacity of the power module can be improved, and therefore the volume heat consumption density of the inverter is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electrical equipment, and in particular to an inverter. Background Art

[0002] The inverter includes a power module and a first device, which includes at least one of a capacitor and an inductor. The power module and the first device are the main sources of heat in the inverter. Because the power module and the first device have high power and are prone to heat generation, a heat sink is usually installed in the inverter to prevent the power module and the first device from burning out. However, the heat dissipation capacity of the power module and the first device under this heat dissipation solution is insufficient, making it difficult to increase the volumetric heat dissipation density of the inverter. Utility Model Content

[0003] The embodiments of the present application provide an inverter that can improve the heat dissipation capacity of the power module and the first device, and enhance the volume heat dissipation density of the inverter.

[0004] In a first aspect, an embodiment of the present application provides an inverter comprising a circuit board, a first component, a cover plate, a power module, and a heat sink. The circuit board has a first side and a second side opposite each other. The first component is disposed on the first side of the circuit board, and the first component includes at least one of an inductor and a capacitor. The cover plate is disposed on a side of the first component facing away from the circuit board, and the cover plate has a first groove into which the first component extends. The power module is disposed on the second side of the circuit board, and the heat sink is disposed on a side of the power module facing away from the circuit board.

[0005] The first device and the power module are located on different sides of the circuit board, making the layout on the circuit board more dispersed, increasing the heat dissipation space for the first device and the power module, and ensuring more effective heat dissipation for the first device and the power module. The first device extends into the first groove, separating the first device from other nearby devices, providing the first device with independent heat dissipation space, improving the first device's heat dissipation capacity, and preventing overheating and failure of other devices caused by heat generation from the first device, thereby increasing the inverter's volumetric heat dissipation density. A heat sink is provided on the side of the power module facing away from the circuit board, which can improve the power module's heat dissipation capacity, thereby increasing the inverter's volumetric heat dissipation density.

[0006] In some embodiments including the above embodiments, a plurality of fins are provided on a side of the cover plate facing away from the circuit board, and the plurality of fins are arranged at intervals.

[0007] The cover plate is equipped with multiple fins on the side facing away from the circuit board, which increases the heat dissipation area and improves the heat dissipation capacity of the cover plate, thereby improving the inverter's volumetric heat dissipation density. The number and spacing of the fins can also be adjusted according to actual heat dissipation requirements to ensure a balance between heat dissipation effect and cost.

[0008] In some embodiments that may include the above embodiments, the fin includes a first fin, and a partial area of the cover plate is recessed in a direction away from the circuit board to form a first groove on a side of the cover plate facing the first device, and a cavity is formed on a side of the cover plate away from the circuit board, wherein a plurality of first fins are arranged in the cavity.

[0009] A plurality of first fins are arranged in the concave cavity, which can increase the heat dissipation area of the cover plate while keeping the volume of the inverter unchanged, improve the heat dissipation capacity of the cover plate, and thus improve the volume heat consumption density of the inverter.

[0010] In some embodiments that may include the above embodiments, the fin further includes second fins, and a plurality of second fins are provided on the side of the cover plate facing away from the circuit board and on a portion protruding relative to the cavity.

[0011] A plurality of second fins are provided on the side of the cover plate facing away from the circuit board and on the portion protruding relative to the cavity, which can increase the heat dissipation area of the portion of the cover plate corresponding to the first device, increase the heat dissipation capacity of the first device, and thus improve the volume heat dissipation density of the inverter.

[0012] In some embodiments that may include the above embodiments, the inverter also includes a panel, which is arranged on the side of the cover plate facing away from the circuit board, a second groove is provided on the side of the panel close to the cover plate, and a plurality of holes connected to the second groove are provided on the side wall surface of the panel.

[0013] A second groove is provided on the side of the panel close to the cover plate 23 to facilitate air circulation. The panel is arranged on the side of the cover plate away from the circuit board. The panel is in contact with the cover plate, and the heat of the cover plate can be transferred to the panel. A plurality of holes connected to the second groove are provided on the panel, which can allow the hot air generated by the heat to flow out of the inverter, introduce more cold air, increase the cooling speed of the cover plate, and thus improve the heat dissipation capacity of the cover plate.

[0014] In some embodiments including the above embodiments, along the extension direction of the fin, the side wall surface includes a first surface and a second surface opposite to each other, and a plurality of holes are provided on both the first surface and the second surface.

[0015] The connection direction between the opposing first and second surfaces is nearly aligned with the direction of air flow, enabling convection. This connection direction aligns with the fin extension direction, increasing the contact area between the cold air and the fins, accelerating heat dissipation from the cover, and improving the inverter's heat dissipation capacity and volumetric heat density. The number and size of the holes can also be adjusted based on actual heat dissipation requirements.

[0016] In some embodiments, which may include the above embodiments, the plurality of holes in the sidewall surface are spaced circumferentially along the sidewall surface.

[0017] The multiple holes spaced circumferentially on the side wall can increase the contact area between the panel and the outside air, facilitate convection, further accelerate the heat dissipation speed of the cover, and improve the heat dissipation capacity and volume heat density of the inverter.

[0018] In some embodiments that may include the above embodiments, the circuit board includes a first circuit board and a second circuit board that are stacked, the first circuit board and the second circuit board being electrically connected. The first device is disposed on a side of the first circuit board facing away from the second circuit board, and the power module is disposed on a side of the second circuit board facing away from the first circuit board.

[0019] The first device and power module are arranged on two separate circuit boards, reducing the device density on the circuit boards. This allows for a more dispersed layout of the first device and power module, increasing their independent heat dissipation space, and reducing thermal coupling between the first device and power module. This also facilitates more uniform distribution of the first device on the first circuit board and the power module on the second circuit board, preventing localized overheating of the circuit boards and facilitating heat transfer. This improves the heat dissipation capacity of the first device and power module, thereby increasing the volumetric heat dissipation density of the inverter. Furthermore, the reduced device density on the circuit boards facilitates miniaturization of the circuit boards, resulting in a smaller inverter and increased power density.

[0020] In some embodiments, which may include the above embodiments, a gap is provided between the first circuit board and the second circuit board.

[0021] There is a gap between the first circuit board and the second circuit board, which can increase the distance between the first device and the power module, reduce the thermal coupling between the first device and the power module, and thus improve the volume heat loss density of the inverter.

[0022] In some embodiments that may include the above embodiments, a heat pipe is provided on a side of the heat sink facing the power module, and a third fin is provided on a side of the heat sink facing away from the power module.

[0023] The heat pipe on the side of the radiator facing the power module further enhances the radiator's heat dissipation capacity, thereby improving the heat dissipation capacity of the power module and the volumetric heat dissipation density of the inverter. The fins on the side of the radiator facing away from the power module increase the radiator's heat dissipation area, improving the heat dissipation capacity of the power module and, consequently, the volumetric heat dissipation density of the inverter. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 An exploded diagram of the structure of the inverter provided in an embodiment of the present application;

[0025] Figure 2 Schematic diagram of the structure of the inverter provided in the embodiment of the present application Figure 1 ;

[0026] Figure 3 Schematic diagram of the structure of the inverter provided in the embodiment of the present application Figure 2 ;

[0027] Figure 4 Schematic diagram of the structure of the inverter provided in the embodiment of the present application Figure 3 ;

[0028] Figure 5 Schematic diagram of the structure of the inverter provided in the embodiment of the present application Figure 4 ;

[0029] Figure 6 A schematic diagram of the structure of a panel provided in an embodiment of the present application;

[0030] Figure 7 Schematic diagram of the structure of the inverter provided in the embodiment of the present application Figure 5 ;

[0031] Figure 8 Schematic diagram of the structure of the inverter provided in the embodiment of the present application Figure 6 ;

[0032] Figure 9 Schematic diagram of the structure of the inverter provided in the embodiment of the present application Figure 7 ;

[0033] Figure 10 Schematic diagram of the structure of the inverter provided in the embodiment of the present application Figure 8 ;

[0034] Figure 11 A schematic structural diagram of the radiator provided in an embodiment of the present application.

[0035] Description of Reference Numerals

[0036] 20: Inverter; 21: Circuit board; 211: First side; 212: Second side; 22: First device; 23: Cover; 231: First groove; 232: Cavity; 24: Thermal conductive material; 25: Power module; 26: Heat sink; 261: Third groove; 27: Panel; 271: Hole; 272: Sidewall; 272a: First surface; 272b: Second surface; 273: Second groove; 28: Heat pipe; 30: Fin; 31: First fin; 32: Second fin; 33: Third fin; 41: First circuit board; 42: Second circuit board; 43: Connector. DETAILED DESCRIPTION

[0037] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0038] In the following, the terms "first," "second," etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first," "second," etc. may explicitly or implicitly include one or more of the features.

[0039] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left", "right", "horizontal" and "vertical" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0040] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, an electrical connection, a detachable connection, or an integrated connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0041] Please refer to Figure 1 and Figure 2 The embodiment of the present application further provides an inverter 20 , including a circuit board 21 , a first device 22 and a cover plate 23 . Figure 2 The figure shows a rear view of the inverter 20. The circuit board 21 has a first side 211 and a second side 212 opposite each other. A first component 22 is disposed on the first side 211 of the circuit board 21. The first component 22 includes at least one of a capacitor and an inductor. A cover plate 23 is disposed on a side of the first component 22 facing away from the circuit board 21. The cover plate 23 has a first groove 231, into which the first component 22 extends. The first component 22 may include one or more first components 22. In embodiments where the first component 22 includes multiple first components, the first grooves 231 correspond to the first components 22, and the cover plate 23 has multiple first grooves 231.

[0042] The material of the cover plate 23 may include aluminum. The present embodiment does not limit the manufacturing process of the cover plate 23. For example, the manufacturing process of the cover plate 23 may include die-casting, profiles, and skived teeth. Compared with the manufacturing process of the cover plate 23 using profiles, the manufacturing process of the cover plate 23 using die-casting facilitates the formation of the first groove 231.

[0043] The cover plate 23 has a first groove 231, and the first device 22 extends into the first groove 231, separating the first device 22 from other devices on the circuit board 21, ensuring that each first device 22 dissipates heat independently, and preventing the first device 22 from generating excessive heat and affecting the heat dissipation of other devices. At the same time, the first groove 231 increases the contact area between the first device 22 and the cover plate 23, thereby increasing the heat dissipation area of the first device 22 and improving the heat dissipation effect, thereby improving the heat dissipation effect of the inverter 20.

[0044] Continue to refer to Figure 1 and Figure 2 The inverter 20 also includes a power module 25 and a heat sink 26. The power module 25 is arranged on the second side 212 of the circuit board 21, and the heat sink 26 is arranged on the side of the power module 25 away from the circuit board 21. It can be understood that the embodiment of the present application does not limit the power module 25. For example, the power module 25 may include a thyristor, an insulated gate bipolar transistor (IGBT), a field effect transistor, etc. The heat sink 26 may include a planar heat sink 26. The material of the heat sink 26 may include aluminum. Similar to the manufacturing process of the cover plate 23, the manufacturing process of the heat sink 26 may also include die casting, profiles, skiving, etc., which will not be repeated here.

[0045] It is understood that the inverter 20 may further include a thermally conductive material 24, which is disposed on a side of the first device 22 near the cover plate 23, and the first device 22 and the cover plate 23 are connected via the thermally conductive material 24. The present embodiment of the application does not limit the thermally conductive material 24. For example, the thermally conductive material 24 may include an interface thermally conductive material such as a thermal pad or a thermally conductive gel. The thermally conductive material 24 has high viscosity, compressibility, and thermal conductivity, which can ensure sufficient contact between the thermally conductive material 24, the first device 22, and the cover plate 23, thereby significantly improving the heat dissipation capability of the first device 22.

[0046] The first device 22 and the power module 25 are located on different sides of the circuit board 21, making the layout on the circuit board 21 more dispersed, increasing the heat dissipation space for the first device 22 and the power module 25, and ensuring more effective heat dissipation for the first device 22 and the power module 25. The first device 22 extends into the first groove 231, separating the first device 22 from other nearby devices, providing the first device 22 with independent heat dissipation space, improving the heat dissipation capacity of the first device 22, and preventing overheating and failure of other devices caused by heat generated by the first device 22, thereby improving the volumetric heat dissipation density of the inverter 20. A heat sink 26 is provided on the side of the power module 25 facing away from the circuit board 21, which can improve the heat dissipation capacity of the power module 25, thereby improving the volumetric heat dissipation density of the inverter 20.

[0047] In addition to the inverter 20 described above, other power equipment can also use the same method to improve heat dissipation capacity and volumetric heat dissipation density. The embodiments of the present application are not limited to power equipment. For example, the power equipment may include blade power supplies, uninterruptible power supplies (UPS), remote radio units (RRUs), etc.

[0048] Continue to refer to Figure 1 and Figure 2 In some implementations, the height of the first component 22 is greater than the height of the power module 25. It is understood that when the height of the first component 22 is greater than the height of the power module 25, the first component 22 will hinder the natural convection of the power module 25, resulting in a reduction in the heat dissipation capacity of the power module 25. In the embodiment of the present application, the first component 22 and the power module 25 are located on different sides of the circuit board 21, which can avoid this situation and ensure the heat dissipation capacity of the power module 25.

[0049] In embodiments where the first device 22 includes an inductor, the inductor is typically positioned adjacent to the circuit board 21, connected to the circuit board 21 via leads, and heat dissipated from the inductor via an interface thermally conductive material such as a thermal pad. Compared to the aforementioned embodiment, the present embodiment utilizes a cover plate 23 to dissipate heat from the inductor, thereby enabling the inductor to be positioned on the circuit board 21 and reducing the size of the inverter 20.

[0050] Please refer to Figure 3 In some embodiments, the side of the cover plate 23 facing away from the circuit board 21 is not provided with the fin 30 ( Figure 4 As shown), the first device 22 ( Figure 2 heat dissipation).

[0051] Please refer to Figure 4 In some implementations, a plurality of fins 30 are provided on a side of the cover plate 23 facing away from the circuit board 21, and the fins 30 are arranged at intervals. The present embodiment does not limit the number and spacing of the fins 30, and the number and spacing of the fins 30 can be adjusted based on actual heat dissipation requirements. For example, a greater number of fins 30 results in a larger heat dissipation area and a better heat dissipation effect. However, an increase in the number of fins 30 also increases processing difficulty and cost. A smaller spacing between the fins 30 results in a larger heat dissipation area and a better heat dissipation effect. However, an excessively small spacing between the fins 30 can reduce air flow velocity and reduce heat dissipation effect.

[0052] The cover plate 23 is provided with multiple fins 30 on the side facing away from the circuit board 21. These fins increase the heat dissipation area of the cover plate 23, improving its heat dissipation capacity and thereby increasing the volumetric heat dissipation density of the inverter 20. Furthermore, the number and spacing of the fins 30 can be adjusted based on actual heat dissipation requirements to ensure a balance between heat dissipation efficiency and cost.

[0053] Continue to refer to Figure 4 In some implementations, the fin 30 includes a first fin 31, and a portion of the cover plate 23 is recessed in a direction away from the circuit board 21 to form a first groove 231 ( Figure 2 As shown in FIG, a concave cavity 232 is formed on the side of the cover plate 23 facing away from the circuit board 21 , and a plurality of first fins 31 are arranged in the concave cavity 232 .

[0054] A plurality of first fins 31 are provided in the cavity 232 , which can increase the heat dissipation area of the cover plate 23 while maintaining the volume of the inverter 20 unchanged, thereby improving the heat dissipation capacity of the cover plate 23 and enhancing the volume heat dissipation density of the inverter 20 .

[0055] In some embodiments, the thickness of the cavity 232 provided with the first fin 31 is equal to the thickness of the first groove 231, thereby increasing the heat dissipation area of the cover plate 23 while keeping the thickness of the cover plate 23 unchanged, thereby improving the volume heat consumption density of the inverter 20 while keeping the volume of the inverter 20 unchanged.

[0056] Please refer to Figure 5 In some implementations, the fin 30 further includes a second fin 32. A plurality of second fins 32 are provided on the side of the cover 23 facing away from the circuit board 21 and on a portion protruding relative to the cavity 232. It is understood that the first groove 231 ( Figure 2 Correspondingly, a plurality of second fins 32 are provided on the side of the cover plate 23 facing away from the circuit board 21, which can increase the heat dissipation area of the portion of the cover plate 23 corresponding to the first device 22, increase the heat dissipation capacity of the first device 22, and thus improve the volume heat dissipation density of the inverter 20.

[0057] Please refer to Figure 6 In some implementations, the inverter 20 further includes a panel 27, which is disposed on the cover plate 23 ( Figure 5 away from the circuit board 21 (shown) Figure 2As shown in FIG, a side of the panel 27 close to the cover plate 23 is provided with a second groove 273, and a plurality of holes 271 communicating with the second groove 273 are provided on the side wall surface 272 of the panel 27. The side of the panel 27 facing away from the cover plate 23 may be provided with buttons and a display screen to facilitate viewing and controlling the operating status of the inverter 20. The embodiment of the present application does not limit the material of the panel 27. For example, the material of the panel 27 may be plastic or metal. In some embodiments, the panel 27 may be bonded to the cover plate 23 by glue. In some embodiments, the panel 27 may be connected to the cover plate 23 by mechanical parts such as bolts and nuts.

[0058] Continue to refer to Figure 5 and Figure 6 In an embodiment where multiple first fins 31 are disposed within the concave cavity 232, the length of the first fins 31 along the thickness direction of the cover plate 23 can be equal to the thickness of the first groove 231. This makes the surface of the cover plate 23 smoother, increases the contact area between the cover plate 23 and the panel 27, facilitates maximum heat transfer, and improves the heat dissipation capacity and volumetric heat dissipation density of the inverter 20. Similarly, in an embodiment where multiple second fins 32 are disposed on the portion protruding from the concave cavity 232, the length of the second fins 32 can be shorter than the length of the first fins 31, so that the protruding portion where the second fins 32 are disposed is equal to the thickness of the concave cavity 232 where the first fins 31 are disposed, thereby making the surface of the cover plate 23 smoother.

[0059] A second groove 273 is provided on the side of the panel 27 close to the cover plate 23 to facilitate air circulation. The panel 27 is provided on the side of the cover plate 23 away from the circuit board 21. The panel 27 is in contact with the cover plate 23. The heat of the cover plate 23 can be transferred to the panel 27. A plurality of holes 271 connected to the second groove 273 are provided on the panel 27, which can allow the hot air generated by the heat to flow to the outside of the inverter 20, introduce more cold air, and increase the cooling rate of the cover plate 23, thereby improving the heat dissipation capacity of the cover plate 23 and the volume heat consumption density of the inverter 20.

[0060] Please refer to Figure 7 In some implementations, along the fin 30 ( Figure 5The sidewall surface 272 includes a first surface 272a and a second surface 272b that are opposite to each other, and a plurality of holes 271 are provided on each of the first surface 272a and the second surface 272b. It is understood that along the extension direction of the fins 30, hot air will flow upward through the gaps between the fins 30. The connection direction between the first surface 272a and the second surface 272b is almost consistent with the flow direction of the hot air. External cold air can enter the panel 27 through the holes 271 on the second surface 272b, achieving convection. Hot air can then flow from the holes 271 on the first surface 272a to the outside of the inverter 20. Because the connection direction between the first surface 272a and the second surface 272b is consistent with the extension direction of the fins 30, the contact area between the cold air and the fins 30 is larger, which accelerates the heat dissipation rate of the cover plate 23 and improves the heat dissipation capacity and volumetric heat density of the inverter 20.

[0061] It is understood that the embodiment of the present application does not limit the shape of the holes 271. For example, the shapes of the holes 271 may include circular, square, hexagonal, etc. The embodiment of the present application does not limit the number and size of the holes 271. The number and size of the holes 271 can be adjusted according to actual heat dissipation requirements. For example, the more holes 271 there are, the more exchange with the outside cold air, and the better the heat dissipation effect; the larger the holes 271, the greater the ventilation volume, the more convenient the airflow, and the better the heat dissipation effect. However, if the holes 271 are too large, dust and other impurities are more likely to enter the interior of the panel 27, affecting the heat dissipation effect of the cover plate 23.

[0062] The direction of communication between the opposing first and second surfaces 272a, 272b is nearly aligned with the direction of air flow, enabling convection. This alignment of the first and second surfaces 272a, 272b with the extension direction of the fins 30 increases the contact area between the cold air and the fins 30, accelerating heat dissipation from the cover plate 23 and improving the heat dissipation capacity and volumetric heat density of the inverter 20. Furthermore, the number and size of the holes 271 can be adjusted based on actual heat dissipation requirements.

[0063] Please refer to Figure 8 In some implementations, the plurality of holes 271 on the side wall surface 272 are spaced apart circumferentially along the side wall surface 272. The plurality of holes 271 spaced apart circumferentially along the side wall surface 272 can increase the contact area between the panel 27 and the outside air, facilitate convection, further accelerate the heat dissipation of the cover plate 23, and improve the heat dissipation capacity and volumetric heat density of the inverter 20.

[0064] Please refer to Figure 9 and Figure 10 , Figure 10FIG2 is a rear view of the inverter 20. In some implementations, the circuit board 21 includes a first circuit board 41 and a second circuit board 42 stacked together, with the first circuit board 41 and the second circuit board 42 being electrically connected. The first device 22 is disposed on a side of the first circuit board 41 facing away from the second circuit board 42, and the power module 25 is disposed on a side of the second circuit board 42 facing away from the first circuit board 41.

[0065] Continue to refer to Figure 9 and Figure 10 In some implementations, a connector 43 is provided between the first circuit board 41 and the second circuit board 42. The present application does not limit the connector 43. For example, the connector 43 may include a bent copper busbar. In embodiments where the connector 43 includes a bent copper busbar, some pins of the connector 43 connect to the first circuit board 41, and some pins connect to the second circuit board 42, thereby achieving a connection between the first circuit board 41 and the second circuit board 42.

[0066] The first device 22 and the power module 25 are disposed on two circuit boards 21, respectively, which can reduce the device density on the circuit boards 21, making the layout of the first device 22 and the power module 25 more dispersed, and providing more independent heat dissipation space, thereby reducing thermal coupling between the first device 22 and the power module 25. At the same time, it facilitates a more uniform distribution of the first device 22 on the first circuit board 41 and the power module 25 on the second circuit board 42, thus avoiding local overheating of the circuit boards 21, facilitating heat transfer, and improving the heat dissipation capacity of the first device 22 and the power module 25, thereby increasing the volumetric heat dissipation density of the inverter 20. Furthermore, the reduced device density on the circuit boards 21 facilitates the miniaturization of the circuit boards 21, resulting in a smaller size and higher power density for the inverter 20.

[0067] Continue to refer to Figure 9 and Figure 10 In some implementations, a gap is provided between the first circuit board 41 and the second circuit board 42. It is understood that the connector 43 may be disposed within the gap. The gap between the first circuit board 41 and the second circuit board 42 can increase the distance between the first device 22 and the power module 25, reduce the thermal coupling between the first device 22 and the power module 25, and thereby improve the volumetric heat dissipation density of the inverter 20. Compared to embodiments in which the connector 43 is disposed adjacent to the first circuit board 41 and the second circuit board 42, the location of the connector 43 within the gap can reduce the size of the inverter 20 and improve the power density of the inverter 20.

[0068] Please refer to Figure 11In some implementations, a heat pipe 28 is provided on the side of the heat sink 26 facing the power module 25, and a third fin 33 is provided on the side of the heat sink 26 facing away from the power module 25. It will be understood that the heat pipe 28 is a heat transfer element that utilizes the principles of heat conduction and the rapid heat transfer properties of a phase change medium.

[0069] Heat pipe 28 may comprise a hollow copper tube filled with pure water. When heated, the pure water in the heated portion of heat pipe 28 absorbs heat and evaporates into gas. Driven by a pressure differential, the vapor flows to the rest of heat pipe 28, releasing heat and condensing into liquid. This improves the heat dissipation capacity of power module 25 and the volumetric heat dissipation density of inverter 20.

[0070] In some embodiments, a third groove 261 is provided on the side of the heat sink 26 facing the power module 25, and the heat pipe 28 is disposed in the third groove 261. The embodiment of the present application does not limit the position, quantity, shape, size, type, etc. of the heat pipe 28. For example, the heat pipe 28 can be disposed directly below the power module 25.

[0071] The side of the heat sink 26 facing the power module 25 is provided with a heat pipe 28, which further improves the heat dissipation capacity of the heat sink 26, thereby improving the heat dissipation capacity of the power module 25 and the volumetric heat dissipation density of the inverter 20. The side of the heat sink 26 facing away from the power module 25 is provided with a third fin 33, which increases the heat dissipation area of the heat sink 26, improves the heat dissipation capacity of the power module 25, and thus improves the volumetric heat dissipation density of the inverter 20.

[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An inverter, characterized in that: include: a circuit board having opposing first and second sides; A first component is disposed on the first side of the circuit board, wherein the first component includes at least one of an inductor and a capacitor; a cover plate, disposed on a side of the first component facing away from the circuit board, the cover plate having a first groove on a side facing the first component, the first component extending into the first groove; a power module, disposed on the second side of the circuit board; A heat sink is provided on a side of the power module away from the circuit board.

2. The inverter according to claim 1, characterized in that A plurality of fins are provided on a side of the cover plate facing away from the circuit board, and the plurality of fins are arranged at intervals.

3. The inverter according to claim 2, characterized in that: The fins include first fins, and a partial area of the cover plate is recessed in a direction away from the circuit board to form the first groove on the side of the cover plate facing the first device, and a cavity is formed on the side of the cover plate away from the circuit board, wherein a plurality of the first fins are arranged in the cavity.

4. The inverter according to claim 3, characterized in that: The fin further includes second fins. A plurality of second fins are provided on the side of the cover plate that is away from the circuit board and on a portion that protrudes relative to the cavity.

5. The inverter according to any one of claims 2 to 4, characterized in that: The inverter further includes: A panel is provided on a side of the cover plate away from the circuit board, a second groove is provided on a side of the panel close to the cover plate, and a plurality of holes communicating with the second groove are provided on a side wall surface of the panel.

6. The inverter according to claim 5, characterized in that Along the extending direction of the fin, the side wall surface includes a first surface and a second surface opposite to each other, and the plurality of holes are provided on both the first surface and the second surface.

7. The inverter according to claim 5, characterized in that The plurality of holes on the side wall surface are spaced apart along the circumference of the side wall surface.

8. The inverter according to any one of claims 1 to 7, characterized in that: The circuit board includes a first circuit board and a second circuit board that are stacked. The first circuit board and the second circuit board are electrically connected; The first component is arranged on a side of the first circuit board facing away from the second circuit board; The power module is arranged on a side of the second circuit board facing away from the first circuit board.

9. The inverter according to claim 8, characterized in that: A connector is provided between the first circuit board and the second circuit board.

10. The inverter according to claim 8 or 9, characterized in that: There is a gap between the first circuit board and the second circuit board.

11. The inverter according to any one of claims 1 to 10, characterized in that: A heat pipe is provided on a side of the radiator facing the power module, and a third fin is provided on a side of the radiator facing away from the power module.

12. The inverter according to any one of claims 1 to 11, characterized in that: The height of the first component is greater than the height of the power module.

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