Heat dissipation structure and electronic equipment

Abstract

The utility model provides a heat dissipation structure and electronic equipment. The heat dissipation structure comprises a base body; the mainboard is arranged on the base body, the mainboard is provided with a first side and a second side, and the first side is provided with a chip; the heat dissipation plate is arranged on the first side of the main board, the heat dissipation plate is connected with the main board and / or the base body, a plurality of bends are arranged on the heat dissipation plate, and an installation space is formed between the heat dissipation plate and the chip; the radiator is arranged in the mounting space and is connected with the chip; and the heat insulation pad is arranged between the top of the radiator and the radiating plate. The heat dissipation plate extends to the top of the heat dissipation device, and the heat insulation pad is arranged between the top of the heat dissipation device and the heat dissipation plate, so that the heat dissipation area (heat dissipation performance) of the heat dissipation plate can be increased, and heat generated by the mainboard can be effectively dispersed. Meanwhile, thermal isolation between the heat dissipation plate and the radiator can be achieved, then heat transfer between the heat dissipation plate and the radiator is reduced, the heat dissipation efficiency is guaranteed, and meanwhile temperature balance of all components is kept.

Description

Technical Field

[0001] The utility model generally relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation structure and electronic equipment. Background Art

[0002] With the development of science and technology, electronic products are becoming more and more sophisticated, with more and more functions, but the prices of products are getting lower and lower, resulting in increasing pressure on production costs. This requires excellent structural product design to simplify the product manufacturing and assembly processes in order to improve production efficiency, reduce labor costs, and achieve high-quality and low-cost products.

[0003] As the performance of electronic devices continues to improve, heat dissipation has become increasingly critical, as it directly impacts device performance and long-term reliability. In some electronic devices, multiple electronic components are integrated onto a single circuit board. High-power electronic components (such as chips) are typically cooled by dedicated heat sinks, while low-power electronic components (such as resistors and capacitors) are collectively cooled by heat sinks. However, because the size of the heat sink is limited by the internal space of the device, it may not provide sufficient surface area to effectively dissipate the heat generated by the numerous electronic components. This can lead to device overheating, which can cause system instability, shorten device life, and even cause failure.

[0004] The contents of the background technology section are merely the technologies known to the inventors and do not necessarily represent the existing technologies in this field. Utility Model Content

[0005] In view of one or more deficiencies in the prior art, the present invention provides a heat dissipation structure, comprising:

[0006] matrix;

[0007] A mainboard is arranged on the base, the mainboard has a first side and a second side, and the first side is provided with a chip;

[0008] a heat dissipation plate, disposed on a first side of the mainboard, connected to the mainboard and / or the substrate, with a plurality of bends formed on the heat dissipation plate to form a mounting space between the heat dissipation plate and the chip;

[0009] a heat sink, disposed in the installation space and connected to the chip, with a preset interval between the heat sink and the heat dissipation plate;

[0010] A thermal insulation pad is arranged between the top of the radiator and the heat dissipation plate.

[0011] According to one aspect of the present invention, the heat dissipation plate includes a first plate segment, a second plate segment, a third plate segment and a fourth plate segment connected in sequence by bending, wherein the installation space is formed between the second plate segment, the third plate segment, the fourth plate segment and the chip.

[0012] According to one aspect of the present invention, the thermal insulation pad is connected between the radiator and the third plate segment.

[0013] According to one aspect of the present invention, a first buckle is provided on the fourth plate segment, and a second buckle is provided on the base, and the first buckle is engaged with the second buckle.

[0014] According to one aspect of the present invention, the heat dissipation plate further includes a fifth plate segment and / or a sixth plate segment, wherein the fifth plate segment is connected to the first plate segment by bending, and the sixth plate segment is connected to the first plate segment by bending.

[0015] According to one aspect of the present invention, the first plate segment is connected to one or more connecting plate segments, and the connecting plate segments are screw-connected to the base.

[0016] According to one aspect of the present invention, the thermal insulation pad includes a silica gel pad, a ceramic pad, an aerogel pad or a polyurethane pad.

[0017] According to one aspect of the present invention, the radiator is a heat dissipation fin or a heat pipe.

[0018] According to one aspect of the present invention, the base has a receiving cavity, and the main board is arranged in the receiving cavity.

[0019] An embodiment of the present invention further provides an electronic device, comprising the heat dissipation structure described above.

[0020] Compared to the prior art, the embodiments of the present invention provide a heat dissipation structure and electronic device. By extending the heat dissipation plate to the top of the radiator and placing a thermal insulation pad between the top of the radiator and the heat dissipation plate, the heat dissipation area (heat dissipation performance) of the heat dissipation plate can be increased, thereby effectively dissipating the heat generated by the motherboard. Simultaneously, thermal isolation is achieved between the heat dissipation plate and the radiator, thereby reducing heat transfer between the two, ensuring heat dissipation efficiency while maintaining temperature balance among various components. Furthermore, the heat dissipation plate can also secure the radiator, eliminating the need for screws to secure the radiator, simplifying the structure and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0022] Figure 1 A cross-sectional view of a heat dissipation structure according to an embodiment of the present invention is shown;

[0023] Figure 2 A schematic diagram of a heat dissipation structure according to an embodiment of the present utility model is shown;

[0024] Figure 3 A schematic diagram of a heat dissipation plate according to an embodiment of the present utility model is shown.

[0025] In the figure: 100, heat dissipation structure; 110, base; 111, screw column; 112, second clip; 120, main board; 121, chip; 130, heat dissipation plate; 131, first plate segment; 132, second plate segment; 133, third plate segment; 134, fourth plate segment; 135, fifth plate segment; 136, sixth plate segment; 137, connecting plate segment; 138, first clip; 140, radiator; 150, thermal insulation pad. DETAILED DESCRIPTION

[0026] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0027] In the description of the present invention, it should be understood that terms such as "center," "longitudinal," "transverse," "length," "width," "thickness," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," "clockwise," and "counterclockwise" are used to indicate positions or locations based on those shown in the accompanying drawings. These terms are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed to indicate or imply relative importance or to implicitly specify the number of the technical features referred to. Therefore, features designated "first" or "second" may explicitly or implicitly include one or more of the aforementioned features. In the description of the present invention, "plurality" means two or more, unless otherwise clearly defined.

[0028] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed, removable, or integral connections; mechanical, electrical, or intercommunication connections; direct or indirect connections through an intermediary; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on specific circumstances.

[0029] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact via another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or diagonally above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly above or diagonally above the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0030] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but a person of ordinary skill in the art will recognize the application of other processes and / or the use of other materials.

[0031] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention and are not used to limit the present invention.

[0032] Figure 1 FIG. 1 shows a cross-sectional view of a heat dissipation structure 100 according to an embodiment of the present invention. Figure 2 A schematic diagram of a heat dissipation structure 100 according to an embodiment of the present invention is shown below. Figure 1 Provide a detailed description.

[0033] like Figure 1 and Figure 2As shown, the heat dissipation structure 100 includes a base 110, a mainboard 120, a heat sink 130, a heat sink 140, and a thermal pad 150. The base 110 provides mounting space (space) for other components, ensuring the stability and integrity of the heat dissipation structure 100. The mainboard 120 can be a circuit board, on which various electronic components can be mounted as needed. The mainboard 120 can be secured to the base 110 using screws, snap-fit connections, adhesive bonding, welding, or other connection methods. The mainboard 120 has a first side and a second side (also referred to as an upper side and a lower side). A chip 121 is disposed on the first side of the mainboard 120, and a heat sink 140 is connected to the chip 121. The heat sink 140 absorbs heat generated by the chip 121 and dissipates the heat to the surrounding environment through its large surface area, thereby preventing the chip 121 from overheating and preventing performance degradation or damage to the chip 121 due to overheating. The heat sink 130 is disposed on the first side of the mainboard 120 and is connected to the mainboard 120 and / or the base 110. The heat sink 130 can absorb the heat generated by the mainboard 120 and the various electronic components on the mainboard 120 except the chip 121, and dissipate the heat to the surrounding environment through its large surface area, thereby preventing the mainboard 120 and the electronic components from being overheated, and avoiding the mainboard 120 and the electronic components from being degraded or damaged due to overheating. Figure 1 and Figure 2 As shown, a plurality of bends are provided on the heat sink 130, at least part of which is located above the chip 121 to form an installation space between the heat sink 130 and the chip 121. The heat sink 140 is located in the installation space, and there is a preset gap between the heat sink 140 and the heat sink 130 to prevent direct heat transfer between the heat sink 130 and the heat sink 140. The thermal insulation pad 150 is provided between the top of the heat sink 140 and the heat sink 130 to reduce heat transfer between the heat sink 130 and the heat sink 140, while allowing the heat sink 130 to fix the heat sink 140, thereby eliminating the need to use screws to fix the heat sink 140, which is conducive to simplifying the structure and reducing costs.

[0034] Figure 3 A schematic diagram of a heat dissipation plate according to an embodiment of the present invention is shown in FIG. Figure 2 and Figure 3As shown, the heat sink 130 may include a first plate segment 131, a second plate segment 132, a third plate segment 133, and a fourth plate segment 134, which are connected in sequence by bending. A mounting space is formed between the second plate segment 132, the third plate segment 133, and the fourth plate segment 134 and the chip 121. Optionally, the first plate segment 131 is substantially parallel to the third plate segment 133, and the second plate segment 132 is substantially parallel to the fourth plate segment 134. The second plate segment 132, the third plate segment 133, and the fourth plate segment 134 form a substantially "U"-shaped structure that is inverted on the chip 121 and, together with the chip 121, forms the aforementioned mounting space.

[0035] According to one embodiment of the present invention, Figure 3 As shown, the heat sink 130 may further include a fifth plate segment 135 and / or a sixth plate segment 136, each of which is connected to the first plate segment 131 via a bend. The provision of the fifth plate segment 135 and / or the sixth plate segment 136 further expands the heat dissipation area of the heat sink 130, improving the heat dissipation performance of the heat sink 130, thereby effectively dissipating heat generated by the mainboard 120 and preventing heat accumulation on the mainboard 120. Optionally, the fifth plate segment 135 and the second plate segment 132 are located at opposite ends of the first plate segment 131, with the fifth plate segment 135 and the second plate segment 132 being parallel to each other. Optionally, the sixth plate segment 136 is connected to one side of the first plate segment 131.

[0036] According to one embodiment of the present invention, Figures 1 to 3 As shown, the thermal insulation pad 150 can be one of a silicone pad, a ceramic pad, an aerogel pad, and a polyurethane pad, or a combination of multiple of silicone pads, ceramic pads, aerogel pads, and polyurethane pads. Optionally, the thermal insulation pad 150 is connected between the radiator 140 and the third plate segment 133. Optionally, the thermal insulation pad 150 is bonded between the radiator 140 and the third plate segment 133 by an adhesive to prevent the thermal insulation pad 150 from falling off between the radiator 140 and the heat dissipation plate 130. At the same time, using an adhesive to fix the thermal insulation pad 150 can also reduce the use of mechanical fasteners, which is conducive to simplifying the assembly process and reducing costs.

[0037] According to one embodiment of the present invention, Figure 1 and Figure 2 As shown, the base 110 can be a housing having a housing cavity, in which the mainboard 120 is disposed. The housing can be fully enclosed to provide comprehensive protection and sealing, or semi-enclosed to allow air circulation and heat exchange. The present invention does not impose specific restrictions on the degree of enclosure of the housing, aiming to provide diverse solutions to suit different application requirements and environmental conditions. In some embodiments, the base 110 can also be a base, etc., but the present invention is not limited to this.

[0038] According to one embodiment of the present invention, Figures 1 to 3 As shown, one or more screw posts 111 are provided on the base 110, and the heat sink 130 is fixed to the screw posts 111 via screws. Optionally, one or more connecting plate segments 137 are connected to the first plate segment 131 of the heat sink 130. The connecting plate segments 137 overlap corresponding screw posts 111 and are fixed via screws. By fixing the heat sink 130 to the screw posts 111, the heat sink 130 can be precisely positioned, so that the heat sink 130 (first plate segment 131) is precisely attached to the first side of the motherboard 120 (or, the heat sink 130 (first plate segment 131) maintains a predetermined distance from the motherboard 120). This allows the heat sink 130 to absorb heat generated by the motherboard 120 and the various electronic components on the motherboard 120, excluding the chip 121, and dissipate the heat to the surrounding environment through its large surface area.

[0039] According to one aspect of the present invention, Figure 1 and Figure 3 As shown, a first snap 138 can be provided on the fourth plate segment 134, and a second snap 112 can be provided on the base 110. The first snap 138 and the second snap 112 engage with each other to improve the installation stability of the heat sink 130, thereby improving the fixing effect of the heat sink 130 on the heat sink 140 and preventing the heat sink 140 from falling off. Optionally, the first snap 138 is a protrusion provided on the fourth plate segment 134, and the second snap 112 is a hole or groove provided on the base 110. During the process of installing the heat sink 130 on the base 110, the protrusion on the heat sink 130 can be accurately snapped into the groove or hole on the base 110.

[0040] According to one embodiment of the present invention, Figure 1 As shown, the heat sink 140 can be a heat sink fin or a heat pipe. Both heat sink fins and heat pipes have good heat dissipation performance. The heat sink fins have a large contact area with the air, which can quickly absorb the heat generated by the chip 121 and transfer the heat from the surface of the chip 121 to the surrounding environment through natural convection or forced convection. The heat pipe uses its internal phase change principle to efficiently transfer heat from the chip 121 to the surrounding environment, achieving rapid heat transfer.

[0041] An embodiment of the present invention further provides an electronic device, such as a camera, a speaker, or a smart screen. The electronic device includes the heat dissipation structure 100 described above to ensure good performance and stability under various operating conditions. Optionally, the housing (or a portion of the housing) of the electronic device serves as the base of the heat dissipation structure.

[0042] Compared to the prior art, the embodiments of the present invention provide a heat dissipation structure 100 and an electronic device. By extending the heat dissipation plate 130 to the top of the radiator 140 and providing a thermal insulation pad 150 between the top of the radiator 140 and the heat dissipation plate 130, the heat dissipation area (heat dissipation performance) of the heat dissipation plate 130 can be increased, thereby effectively dissipating the heat generated by the motherboard 120. Simultaneously, thermal isolation can be achieved between the heat dissipation plate 130 and the radiator 140, thereby reducing heat transfer between the heat dissipation plate 130 and the radiator 140, ensuring heat dissipation efficiency while maintaining temperature balance among various components. Furthermore, the heat dissipation plate 130 can also secure the radiator 140, eliminating the need for screws to secure the radiator 140, thereby simplifying the structure and reducing costs.

[0043] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A heat dissipation structure, characterized in that: include: matrix; A mainboard is arranged on the base, the mainboard has a first side and a second side, and the first side is provided with a chip; a heat dissipation plate, disposed on a first side of the mainboard, connected to the mainboard and / or the substrate, with a plurality of bends formed on the heat dissipation plate to form a mounting space between the heat dissipation plate and the chip; a heat sink, disposed in the installation space and connected to the chip, with a preset interval between the heat sink and the heat dissipation plate; A thermal insulation pad is arranged between the top of the radiator and the heat dissipation plate.

2. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation plate includes a first plate segment, a second plate segment, a third plate segment, and a fourth plate segment connected in sequence by bending, wherein the mounting space is formed between the second plate segment, the third plate segment, the fourth plate segment, and the chip.

3. The heat dissipation structure according to claim 2, characterized in that: The thermal insulation pad is connected between the radiator and the third plate segment.

4. The heat dissipation structure according to claim 2, characterized in that: The fourth plate segment is provided with a first buckle, and the base is provided with a second buckle, and the first buckle is engaged with the second buckle.

5. The heat dissipation structure according to claim 2, characterized in that: The heat dissipation plate further includes a fifth plate segment and / or a sixth plate segment, wherein the fifth plate segment is connected to the first plate segment by bending, and the sixth plate segment is connected to the first plate segment by bending.

6. The heat dissipation structure according to claim 2, characterized in that: The first plate segment is connected to one or more connecting plate segments, and the connecting plate segments are screw-connected to the base.

7. The heat dissipation structure according to any one of claims 1 to 6, characterized in that: The thermal insulation pad includes a silica gel pad, a ceramic pad, an aerogel pad or a polyurethane pad.

8. The heat dissipation structure according to any one of claims 1 to 6, characterized in that: The radiator is a heat dissipation fin or a heat pipe.

9. The heat dissipation structure according to any one of claims 1 to 6, characterized in that: The base body has a receiving cavity, and the main board is arranged in the receiving cavity.

10. An electronic device, characterized in that: The heat dissipation structure comprises the heat dissipation structure according to any one of claims 1 to 9.

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