Modularized integrated circuit board

Abstract

The utility model relates to the field of modularized integrated circuit boards, and discloses an integrated circuit board which is provided with connecting holes at four corners of the surface, a module connecting port I is connected with the left end of the integrated circuit board in a tin soldering manner, and a pre-module connecting port and a module connecting port III are fixed at the right end of the surface of the integrated circuit board in a tin soldering manner. A module at the top end of the first module connecting port is connected with a second function module in a matched mode, a second module connecting port is fixed to the lower right portion of the first module connecting port in a tin soldering mode, and the top end of the second module connecting port is connected with a first function module in a matched mode. A multifunctional shell is fixed to the bottom of the integrated circuit board in a matched mode. The multifunctional shell at the right end of the third module connecting port is fixedly provided with a metal heat dissipation plate in a matched mode, the functional module circuit boards and the functional modules are connected with the integrated circuit board in a matched mode, and therefore the circuit board is different from a common integrated circuit board, and when the function of one module of the circuit board fails, operation of other functional blocks is not affected.

Description

Technical Field

[0001] The utility model relates to the field of modular integrated circuit boards. Link holes are opened at the four corners of the surface of the integrated circuit board. A module connection port is fixed to the left end of the integrated circuit board by soldering. A pre-module connection port and a module connection port are fixed to the right end of the surface of the integrated circuit board by soldering. The module at the top of the module connection port is connected to a functional module. A module connection port is fixed to the lower right of the module connection port by soldering. The top of the module connection port is connected to the functional module. A multifunctional housing is fixed to the bottom of the integrated circuit board. A bottom metal heat sink is fixed to the bottom of the integrated circuit board and the bottom of the multifunctional housing. A metal heat sink is fixed to the multifunctional housing to the right of the module connection port. Each functional module circuit board and the functional module are connected to the integrated circuit board, thereby distinguishing it from a general integrated circuit board. When the function of one module of the circuit board fails, it does not affect the operation of other functional blocks. In addition, the modular integrated circuit board is provided with reserved connection ports. Background Art

[0002] Traditional integrated circuit boards (ICs) generate concentrated heat due to the high density of components within their circuits. Their inherent heat dissipation capabilities are poor, requiring external cooling technology, which increases manufacturing costs. Furthermore, high-power operation generates even more heat. Failure to dissipate heat in a timely manner can shorten the lifespan of the IC board and its components. Furthermore, traditional ICs can become inoperable if a component fails. To address this, we propose a modular IC board. Summary of the Invention

[0003] In view of the deficiencies in the prior art, the present invention provides a modular integrated circuit board with a novel structure, which solves the above-mentioned problems.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a modular integrated circuit board, comprising connection holes at the four corners of the modular integrated circuit board, module connection port one being soldered to the left end of the integrated circuit board, a pre-module connection port and module connection port three being soldered and fixed to the right end of the surface of the integrated circuit board, the module at the top of module connection port one being connected to functional module two, module connection port two being soldered and fixed to the lower right side of module connection port one, the top of module connection port two being connected to functional module one, a multifunctional housing being fixed to the bottom of the integrated circuit board, a bottom metal heat dissipation plate being fixed to the bottom of the multifunctional housing, and a metal heat dissipation plate being fixed to the multifunctional housing at the right end of module connection port three.

[0005] Preferably, the functional module 2 is composed of a connecting silver foot fixed at the left end of the surface and components fixed by soldering at the right end.

[0006] Preferably, the cross-section of the multifunctional shell is concave, and penetrating heat sink placement holes are provided on the bottom and sides of the multifunctional shell, and connection holes 2 are provided at the four corners of the bottom of the multifunctional shell, four connection holes 3 are provided at the four corners of the bottom of the multifunctional shell corresponding to the heat sink placement holes, and connection holes 4 are provided at the four corners of the side of the multifunctional shell corresponding to the heat sink placement holes.

[0007] Preferably, adjustable connecting grooves are provided on both sides of the bottom metal heat sink, and the bottom of the bottom metal heat sink is integrally formed with multiple groups of metal heat sink fins 2, and the multiple groups of metal heat sink fins 2 are equidistantly arranged. The position of the adjustable connecting groove corresponds to the position of the connecting hole 3, and the screws are fixed through the connecting hole 3 and the adjustable connecting groove.

[0008] Preferably, connection holes five are provided at the four corners of the metal heat sink, and multiple groups of metal heat sink fins one are integrally formed at the bottom of the metal heat sink. The multiple groups of metal heat sink fins one are equidistantly arranged, and the position of connection hole five corresponds to the position of connection hole four, and screws are passed through connection hole four and connection hole five for fixing.

[0009] Compared with the prior art, the present invention provides a modular integrated circuit board with the following beneficial effects:

[0010] 1. This modular integrated circuit board is different from a general integrated circuit board because it connects various functional module circuit boards with the integrated circuit board. When the function of one module on the circuit board fails, it does not affect the operation of other functional blocks. In addition, the modular integrated circuit board will have a reserved connection port.

[0011] 2. The modular integrated circuit board is also designed with a multifunctional shell, which can fix the position of the integrated circuit, metal heat sink, metal heat sink and functional modules, thereby enhancing the stability of the functional modules and structures of the circuit board and reducing the overall temperature during operation, thereby improving service life and efficiency.

[0012] 3. The modular integrated circuit board also has a pre-module connection port and a connection pin on the integrated circuit board reserved on the integrated circuit board, so as to carry out the expansion connection and module replacement of other functional modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the structure of the practical modular integrated circuit board;

[0014] Figure 2 This is the overall circuit board schematic diagram of this utility;

[0015] Figure 3 This is a schematic diagram of the functional module structure of this utility;

[0016] Figure 4 This is a schematic diagram of the structure of the practical multifunctional housing;

[0017] Figure 5 This is a schematic diagram of the structure of the metal heat sink at the bottom of this utility model;

[0018] Figure 6 This is a schematic diagram of the structure of a practical metal heat sink.

[0019] In the figure: 1-integrated circuit board; 2-multi-function housing; 3-metal heat sink; 4-functional module one; 5-bottom metal heat sink; 6-module connection port one; 7-module connection port two; 8-pre-module connection port; 9-functional module two; 10-module connection port three; 11-connecting silver pins on the integrated circuit board; 101-connecting hole one; 201-connecting hole two; 202-connecting hole three; 203-connecting hole four; 204-heat sink placement hole; 301-connecting hole five; 302-metal heat sink fin one; 501-adjustable connection slot; 502-metal heat sink fin two; 601-module connection port four; 901-connecting silver pins; 902-components. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1-6 A modular integrated circuit board includes a modular integrated circuit board 1 with connection holes 101 opened at the four corners, the left end of the integrated circuit board 1 is soldered to a module connection port 1 6, the right end of the surface of the integrated circuit board 1 is soldered and fixed with a pre-module connection port 8 and a module connection port 3 10, the module at the top of the module connection port 1 6 is matched with a functional module 2 9, the lower right side of the module connection port 1 6 is soldered and fixed with a module connection port 2 7, the top of the module connection port 2 7 is matched with a functional module 1 4, the bottom of the integrated circuit board 1 is matched with a multifunctional housing 2, the bottom of the multifunctional housing 2 is fixed with a bottom metal heat dissipation plate 5, and the multifunctional housing 2 at the right end of the module connection port 3 10 is matched with a metal heat dissipation plate 3.

[0022] Functional module 2 9 is composed of a connecting silver pin 901 fixed at the left end of the surface and a component 902 fixed by soldering at the right end.

[0023] The cross-section of the multifunctional housing 2 is concave, and penetrating heat sink placement holes 204 are provided on the bottom and sides of the multifunctional housing 2, and connection holes 201 are provided at the four corners of the bottom of the multifunctional housing 2. Four connection holes 3 202 are provided at the four corners of the bottom of the multifunctional housing 2 corresponding to the heat sink placement holes 204, and connection holes 4 203 are provided at the four corners of the side of the multifunctional housing 2 corresponding to the heat sink placement holes 204.

[0024] Adjustable connecting grooves 501 are provided on both sides of the bottom metal heat dissipation plate 5, and the bottom of the bottom metal heat dissipation plate 5 is integrally formed with multiple groups of metal heat dissipation fins 2 502, and the multiple groups of metal heat dissipation fins 2 502 are arranged at equal intervals. The position of the adjustable connecting groove 501 corresponds to the position of the connecting hole 3 202, and the screws are fixed through the connecting hole 3 202 and the adjustable connecting groove 501.

[0025] Connection holes five 301 are provided at the four corners of the metal heat sink 3, and multiple groups of metal heat sink fins one 302 are integrally formed at the bottom of the metal heat sink 3. The multiple groups of metal heat sink fins one 302 are arranged at equal intervals. The position of the connection hole five 301 corresponds to the position of the connection hole four 203, and the screws are fixed through the connection hole four 203 and the connection hole five 301.

[0026] Working principle: Each functional module circuit board 4 and functional module 9 are connected with the integrated circuit board 1, which distinguishes it from a general integrated circuit board. When the function of a module on the circuit board fails, it does not affect the operation of other functional blocks, and the modular integrated circuit board will be provided with a reserved connection port; in addition, the circuit board is also designed with a multifunctional shell 2, which can fix the position of the integrated circuit 1, metal heat sink 1 3, metal heat sink 2 5 and functional module 9, thereby enhancing the stability of each functional module and structure of the circuit board and reducing the overall temperature during operation, thereby improving service life and efficiency; a pre-module connection port 8 and a connection silver pin 11 on the integrated circuit board 1 are also reserved on the integrated circuit board 1, so as to carry out expansion connection and module replacement of the remaining functional modules.

[0027] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A modular integrated circuit board, comprising: a modular integrated circuit board (1) having connection holes (101) at four corners, a module connection port 1 (6) being soldered to the left end of the integrated circuit board (1), a pre-module connection port (8) and a module connection port 3 (10) being soldered and fixed to the right end of the surface of the integrated circuit board (1), a module at the top end of the module connection port 1 (6) being connected to a functional module 2 (9), a module connection port 2 (7) being soldered and fixed to the lower right side of the module connection port 1 (6), a functional module 1 (4) being connected to the top end of the module connection port 2 (7), a multifunctional housing (2) being fixed to the bottom end of the integrated circuit board (1), a bottom metal heat dissipation plate (5) being fixed to the bottom end of the multifunctional housing (2), and a metal heat dissipation plate (3) being fixed to the right end of the multifunctional housing (2) at the right end of the module connection port 3 (10).

2. The modular integrated circuit board according to claim 1, wherein: Functional module 2 (9) is composed of a connecting silver foot (901) fixed at the left end of the surface and a component (902) fixed by soldering at the right end.

3. The modular integrated circuit board according to claim 1, wherein: The cross section of the multifunctional housing (2) is concave-shaped. The bottom and side surfaces of the multifunctional housing (2) are provided with penetrating heat sink placement holes (204). Four connecting holes (201) are provided at the four corners of the bottom of the multifunctional housing (2). Four connecting holes (202) are provided at the four corners of the bottom of the multifunctional housing (2) corresponding to the heat sink placement holes (204). Four connecting holes (203) are provided at the four corners of the side surfaces of the multifunctional housing (2) corresponding to the heat sink placement holes (204).

4. The modular integrated circuit board according to claim 1, wherein: Adjustable connection grooves (501) are provided on both sides of the bottom metal heat dissipation plate (5), and a plurality of sets of metal heat dissipation fins (502) are integrally formed at the bottom of the bottom metal heat dissipation plate (5), and the plurality of sets of metal heat dissipation fins (502) are arranged at equal intervals. The position of the adjustable connection groove (501) corresponds to the position of the connection hole (202), and the screw passes through the connection hole (202) and the adjustable connection groove (501) for fixing.

5. The modular integrated circuit board according to claim 1, wherein: The metal heat dissipation plate (3) is provided with connection holes five (301) at the four corners, and the bottom of the metal heat dissipation plate (3) is integrally formed with multiple sets of metal heat dissipation fins one (302), the multiple sets of metal heat dissipation fins one (302) are arranged at equal intervals, the position of the connection hole five (301) corresponds to the position of the connection hole four (203), and the screws pass through the connection hole four (203) and the connection hole five (301) for fixing.

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