Pressing plate structure and electronic equipment

Abstract

The utility model provides a pressure plate structure and electronic equipment, its pressing force is adjustable, the pressure plate structure includes a first plate surface, a second plate surface, a third plate surface, a first connecting plate and a second connecting plate, the first plate surface, the second plate surface and the third plate surface are parallel to each other, the surface projection of the second plate surface and the surface projection of the third plate surface are at least partially overlapped, and the first connecting plate and the second connecting plate are parallel to each other. The first plate surface and the third plate surface are staggered; the first connecting plate is connected with the first plate surface and the second plate surface, the second connecting plate is connected with the second plate surface and the third plate surface, and the second connecting plate is a U-shaped plate; bolt mounting holes which are aligned and matched are also formed in the second plate surface and the third plate surface. According to the pressing plate structure and the electronic equipment provided by the utility model, the pressing force from the first plate surface to the opponent piece can be adjusted by adjusting the entering depth from the bolt to the opponent piece, the flexible adjustment of the pressing force of the heat conduction structure layer of the electronic component can be realized through the single pressing plate structure, and the development and test cost of the heat dissipation design of the electronic component is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a pressing plate structure and electronic equipment. Background Art

[0002] As power controllers for new energy vehicles become increasingly powerful, the heat generated by electronic components is also increasing. Good thermal conductivity and heat dissipation are required to keep these components within their operating temperature range. To effectively dissipate heat from electronic components, high-conductivity thermal pads or adhesives are often used to fill the gaps between components and heat dissipation structures.

[0003] Among them, through process summary, it was found that the actual thermal conductivity effect is related to the pressing force of electronic components on the thermal conductive material, and the optimal pressing force is related to the material properties and thermal conductive structure of the thermal conductive material.

[0004] Therefore, to achieve optimal clamping force, conventional techniques involve producing multiple sizes of press plates to test various clamping forces, ultimately achieving the optimal clamping force and heat dissipation. Proofing these multiple sizes of press plates consumes significant time, and each press requires replacing different sizes of press plates to accommodate different components. This results in a large number of press plates required for product development, leading to high development costs. Furthermore, the process of testing the optimal clamping force requires repeated replacement of press plates, which is time-consuming and ultimately slows down the product development cycle. Utility Model Content

[0005] Based on this, the purpose of the present invention is to provide a pressure plate structure and electronic equipment to solve the problem in the prior art that a large number of pressure plates of different specifications are required in the heat dissipation development stage of electronic equipment, which has high development costs and drags down the product development cycle.

[0006] On one hand, the present invention provides a pressing plate structure for adjusting the pressing force, wherein the pressing plate structure comprises a first plate surface, a second plate surface, a third plate surface, a first connecting plate and a second connecting plate, wherein:

[0007] The first plate surface, the second plate surface and the third plate surface are parallel to each other, the surface projections of the second plate surface and the third plate surface at least partially overlap, and the first plate surface and the third plate surface are staggered;

[0008] The first connecting plate connects the first plate surface and the second plate surface, the second connecting plate connects the second plate surface and the third plate surface, and the second connecting plate is a U-shaped plate;

[0009] The second plate surface and the third plate surface are also provided with matching bolt mounting holes, so that when the second plate surface and the third plate surface are fixed to the opponent part by bolts, the distance between the second plate surface and the third plate surface can be adjusted by adjusting the entry depth of the bolts into the opponent part, so as to adjust the compression amount of the second plate surface to the opponent part, and then adjust the compression amount of the first plate surface to the opponent part.

[0010] Optionally, the second plate surface and the third plate surface are both provided with at least two bolt mounting holes.

[0011] Optionally, the third plate surface is located between the first plate surface and the second plate surface.

[0012] Optionally, the first plate surface, the first connecting plate and the second plate surface form an inclined plane step structure, and the connection section from the first connecting plate to the first plate surface and the second plate surface is a rounded corner connection structure or a broken line connection structure.

[0013] Optionally, the first connecting plate is bent in a Z shape or a C shape, and the bent section is a rounded corner connection structure or a broken line connection structure.

[0014] Optionally, the second plate surface and the third plate surface are connected by at least one second connecting plate, and the second connecting plates are evenly arranged along the circumference of the second plate surface.

[0015] Optionally, the second connecting plate is a curved U-shaped plate or a right-angled U-shaped plate.

[0016] Optionally, the thickness of each part of the pressure plate structure is 0.4 mm to 1.0 mm, and the material includes stainless steel.

[0017] The present utility model also provides an electronic device for performance testing in the product development stage, wherein the electronic device includes a device body and the above-mentioned pressure plate structure, wherein the pressure plate structure is fixed to the device body by bolts, a heat dissipation structure is fixedly provided on the device body, and target electronic components and a heat-conducting structure layer are clamped and fixed between the first plate surface of the pressure plate structure and the heat dissipation structure.

[0018] The utility model provides a pressure plate structure for adjusting the pressing force, the pressure plate structure includes a first plate surface, a second plate surface, a third plate surface, a first connecting plate and a second connecting plate, wherein the first plate surface, the second plate surface and the third plate surface are parallel to each other, the surface projections of the second plate surface and the third plate surface at least partially overlap, and the first plate surface and the third plate surface are staggered; the first connecting plate connects the first plate surface and the second plate surface, the second connecting plate connects the second plate surface and the third plate surface, and the second connecting plate is a U-shaped plate; the second plate surface and the third plate surface are also provided with matching bolt mounting holes, so that when the second plate surface and the third plate surface are fixed to the opponent part by bolts, the distance between the second plate surface and the third plate surface can be adjusted by adjusting the entry depth of the bolts to the opponent part, so as to adjust the compression amount of the second plate surface to the opponent part, and then adjust the pressing force of the first plate surface to the opponent part. The pressure plate structure provided by the utility model can adjust the compression amount of the first plate surface to the opponent part by adjusting the entry depth of the bolt to the opponent part, and can flexibly adjust the clamping force of the thermal conductive structure layer of the electronic component through a single pressure plate structure, thereby reducing the demand for the number of pressure plates for clamping force adjustment and reducing development costs. Moreover, there is no need to replace the pressure plate to adjust the clamping force, which can save operating hours and improve development and test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the main structure of the pressing plate structure in the embodiment of the present utility model;

[0020] Figure 2 This is a schematic structural diagram of the pressure plate structure in the embodiment of the present utility model in the use state;

[0021] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0022] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. The drawings illustrate several embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0023] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are intended only to describe specific embodiments and are not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] To solve the problem in the prior art that a large number of press plates of different specifications are required during the heat dissipation development stage of electronic equipment, which results in high development costs and a slowdown in product development cycles. The utility model provides a pressure plate structure for adjusting the pressing force, the pressure plate structure includes a first plate surface, a second plate surface, a third plate surface, a first connecting plate and a second connecting plate, wherein the first plate surface, the second plate surface and the third plate surface are parallel to each other, the surface projections of the second plate surface and the third plate surface at least partially overlap, and the first plate surface and the third plate surface are staggered; the first connecting plate connects the first plate surface and the second plate surface, the second connecting plate connects the second plate surface and the third plate surface, and the second connecting plate is a U-shaped plate; the second plate surface and the third plate surface are also provided with matching bolt mounting holes, when the second plate surface and the third plate surface are fixed to the opponent part by bolts, the distance between the second plate surface and the third plate surface can be adjusted by adjusting the entry depth of the bolts to the opponent part, so as to adjust the compression amount of the second plate surface to the opponent part, and then adjust the pressing force of the first plate surface to the opponent part. According to the material of the specific target, the compression amount of the first plate surface to the opponent part may remain unchanged or vary within a certain range.

[0026] Specifically, if Figure 1 As shown, the pressure plate structure 100 includes a first plate surface 111, a second plate surface 112, a third plate surface 113, a first connecting plate 121 and a second connecting plate 122. The first plate surface 111 and the second plate surface 112 are fixedly connected by the first connecting plate 121, and the second plate surface 112 and the third plate surface 113 are fixedly connected by the second connecting plate 122. The first plate surface 111, the second plate surface 112 and the third plate surface 113 are parallel to each other, and the surface projections of the second plate surface 112 and the third plate surface 113 at least partially overlap. The first plate surface 111 and the third plate surface 113 are staggered, and matching bolt mounting holes 131 are also provided on the second plate surface 112 and the third plate surface 113 (mainly provided in the area where the surface projections overlap to achieve alignment).

[0027] When using, such as Figure 2As shown, when the second plate surface 112 and the third plate surface 113 are fixed to the counterpart (the counterpart is the electronic device body or the heat dissipation structure layer fixedly provided on the electronic device) by means of bolts 132, the distance between the second plate surface 112 and the third plate surface 113 can be adjusted by adjusting the penetration depth of the bolts 132 into the counterpart to adjust the compression amount of the second plate surface 112 to the counterpart, and then the compression amount of the first plate surface 111 to the counterpart is adjusted to achieve the adjustment of the pressing force of the thermal conductive structure layer 212 between the target electronic component 201 and the heat dissipation structure layer 213. Moreover, the penetration depth of the bolts 132 into the counterpart can be linearly and quantitatively adjusted by the number of rotations of the bolts, which can achieve linear adjustment of the pressing force, improve the continuity of the test data, facilitate obtaining the optimal pressing force, thereby improving the development test effect, improving development efficiency, and reducing the development cycle.

[0028] To ensure the uniformity of the clamping force, in this embodiment, the second plate surface 112 and the third plate surface 113 are each provided with at least two bolt mounting holes 131. Synchronous adjustment of the bolts 132 can improve the force uniformity of the second plate surface 112 and the third plate surface 113, thereby improving their parallel maintenance capabilities during adjustment, improving the translational stability of the first plate surface 111 during the clamping adjustment, and thereby improving the uniformity of the applied clamping force.

[0029] The specific structure of the pressure plate structure 100 can be adaptively adjusted according to the specific structure of the counterpart. For example, in this embodiment, the third plate surface 113 is located between the first plate surface 111 and the second plate surface 112. When the pressure plate structure 100 is fixed to the counterpart, the first plate surface 111 is located below the downward pressure direction of the third plate surface 113, and the corresponding pressing surface in contact with the target electronic component 201 is located below the fixed surface of the third plate surface 113. It can be understood that according to the actual positional relationship between the fixed surface of the third plate surface 113 and the pressing surface in contact with the target electronic component 201, the step difference between the first plate surface 111 and the second plate surface 112 can be adaptively adjusted to adapt to specific needs.

[0030] In this embodiment, the first plate surface 111, the first connecting plate 121 and the second plate surface 112 constitute a bevel step structure, and the connecting section from the first connecting plate 121 to the first plate surface 111 and the second plate surface 112 is a rounded connection structure or a broken line connection structure. The specific parameters of the bevel step structure can be selected according to the specific position difference between the target electronic component 201 and the fixed position of the third plate surface 113. Among them, the stability of the rounded connection structure is generally higher, which is convenient for ensuring that the first plate surface 111 maintains a planar posture during the clamping force adjustment and ensuring the uniformity of the applied clamping force.

[0031] According to the specific arrangement of the fixed positions of the target electronic components 201 and the third board surface 113, the first connecting plate 121 can also be bent in a Z shape or a C shape, and the bending section can be a rounded corner connection structure or a broken line connection structure, which is suitable for the case where the fixed positions of the target electronic components 201 and the third board surface 113 are stacked vertically.

[0032] In order to improve the parallel maintenance ability of the second plate surface 112 and the third plate surface 113, the second plate surface 112 and the third plate surface 113 are connected by at least one second connecting plate 122, and the second connecting plate 122 is evenly arranged along the circumference of the second plate surface 112, so that when the bolt 132 adjusts the entry amount, at least one second connecting plate 122 can synchronously limit the spacing between the second plate surface 112 and the third plate surface 113 in each direction from multiple directions, reducing the problem of the second plate surface 112 and the third plate surface 113 being tilted due to uneven distribution of supporting force, and then causing the first plate surface 111 connected to the second plate surface 112 to be tilted, thereby improving the uniformity of the clamping force applied by the first plate surface 111.

[0033] According to actual process requirements, the second connecting plate 122 is a curved U-shaped plate or a right-angled U-shaped plate. When the second connecting plate 122 is a right-angled U-shaped plate, the alignment posture of the second plate surface 112 and the third plate surface 113 is generally more prone to tilt, and when two second connecting plates 122 are arranged in alignment, the distance between the second plate surface 112 and the third plate surface 113 is difficult to adjust, while the curved U-shaped plate is not prone to the above problems. Therefore, the curved U-shaped plate is a better choice for the second connecting plate 122, and the actual selection can be made according to specific needs.

[0034] To ensure the structural strength and adjustability of the pressing force of the pressure plate structure 100, the material of the pressure plate structure 100 can be stainless steel, and the thickness of each part can be selected from 0.4 mm to 1.0 mm. Other types of steel with rust-proof surface treatment can also be used.

[0035] The present utility model also provides an electronic device for performance testing in the product development stage. The electronic device includes a device body and the above-mentioned pressure plate structure. The pressure plate structure is fixed to the device body by bolts. A heat dissipation structure is fixedly provided on the device body, and target electronic components and a heat-conducting structure layer are clamped and fixed between the first plate surface of the pressure plate structure and the heat dissipation structure.

[0036] Among them, the pressure plate structure can also be used on finished products. When the thermal conductive structure layer material ages, the pressing force can be further adjusted to restore a certain heat dissipation capacity and improve the availability of electronic equipment.

[0037] The pressure plate structure provided by the utility model can flexibly adjust the pressing force, reduce the number of pressure plates required for the test of the optimal pressing force in the development of heat dissipation design, reduce the development test cost, and reduce the need for pressure plate replacement, saving operation time, shortening the development cycle, and improving development efficiency.

[0038] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0039] The above-described embodiments merely represent several specific implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A pressing plate structure for adjusting the pressing force, characterized in that: The pressure plate structure includes a first plate surface, a second plate surface, a third plate surface, a first connecting plate and a second connecting plate, wherein: The first plate surface, the second plate surface and the third plate surface are parallel to each other, the surface projections of the second plate surface and the third plate surface at least partially overlap, and the first plate surface and the third plate surface are staggered; The first connecting plate connects the first plate surface and the second plate surface, the second connecting plate connects the second plate surface and the third plate surface, and the second connecting plate is a U-shaped plate; The second plate surface and the third plate surface are also provided with matching bolt mounting holes, so that when the second plate surface and the third plate surface are fixed to the opponent part by bolts, the distance between the second plate surface and the third plate surface can be adjusted by adjusting the entry depth of the bolts into the opponent part, so as to adjust the compression amount of the second plate surface to the opponent part, and then adjust the compression amount of the first plate surface to the opponent part.

2. The pressure plate structure according to claim 1, characterized in that: The second plate surface and the third plate surface are both provided with at least two bolt mounting holes.

3. The pressure plate structure according to claim 1, characterized in that: The third plate surface is located between the first plate surface and the second plate surface.

4. The pressing plate structure according to claim 3, characterized in that: The first plate surface, the first connecting plate and the second plate surface form an inclined plane step structure, and the connection section from the first connecting plate to the first plate surface and the second plate surface is a rounded corner connection structure or a broken line connection structure.

5. The pressure plate structure according to claim 1, characterized in that: The first connecting plate is bent in a Z shape or a C shape, and the bent section is a rounded corner connection structure or a broken line connection structure.

6. The pressure plate structure according to claim 1, characterized in that: The second plate surface and the third plate surface are connected by at least one second connecting plate, and the second connecting plates are evenly arranged along the circumference of the second plate surface.

7. The pressure plate structure according to claim 1, characterized in that: The second connecting plate is a curved U-shaped plate or a right-angled U-shaped plate.

8. The pressure plate structure according to claim 1, characterized in that: The thickness of each part of the pressure plate structure is 0.4 mm to 1.0 mm, and the material includes stainless steel.

9. An electronic device used for performance testing in the product development stage, characterized in that: The electronic device includes a device body and a pressure plate structure according to any one of claims 1 to 8, wherein the pressure plate structure is fixed to the device body by bolts, a heat dissipation structure is fixedly provided on the device body, and target electronic components and a heat-conducting structure layer are clamped and fixed between the first plate surface of the pressure plate structure and the heat dissipation structure.

Images