Heat dissipation structure of heat dissipation patch

Abstract

A heat dissipation structure of a heat dissipation patch effectively solves the problem that the heat dissipation effect of the heat dissipation patch cannot be optimal due to the fact that a PI film affects the heat dissipation effect of the heat dissipation patch to a certain extent. Comprising a heat dissipation patch body, and the heat dissipation patch body comprises a graphene heat dissipation layer with an exposed surface; the metal heat conduction layer is arranged on the surface of the graphene heat dissipation layer; the bonding layer is bonded or coated on one side, far away from the graphene heat dissipation layer, of the metal heat conduction layer; the area of the contact surface of the bonding layer is smaller than that of the contact surface of the metal heat-conducting layer, and an overflow area is formed between the bonding layer and the metal heat-conducting layer; the heat dissipation patch is ingenious in structure and convenient to use, and the heat dissipation performance of the heat dissipation patch body is further improved by eliminating a PI film, so that the heat dissipation performance of the heat dissipation patch body is optimal.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation patches, in particular to a heat dissipation structure of a heat dissipation patch. Background Art

[0002] The heat sink of electronic products is usually a thermally conductive material between the heating component (such as CPU, GPU, etc.) and the radiator, which is used to improve the thermal contact between the two and improve the heat conduction efficiency.

[0003] The Chinese patent application number CN202111570926.0 discloses a new type of heat dissipation patch that is beneficial to the heat dissipation of equipment, including a release film, a PI film, a thermal conductive adhesive 1, an inner layer film and a thermal conductive adhesive 2. The front surface of the PI film is coated with the thermal conductive adhesive 1, the front surface of the thermal conductive adhesive 1 is flattened with the inner layer film, and the inner layer film is adhered and fixed to the thermal conductive adhesive 1, the front surface of the inner layer film is coated with the thermal conductive adhesive 2, the front surface of the thermal conductive adhesive 2 is provided with the release film, and the release film is adhered and fixed to the thermal conductive adhesive 2; in the present invention, the designed heat dissipation patch is in the form of a thin sheet as a whole, which can be directly adhered to the electronic device, occupies a small space, and compared with the traditional heat dissipation method, the cooling effect is doubled, which can greatly reduce the high temperature generated by COF and IC during operation.

[0004] The existing heat dissipation stickers still have the following problems:

[0005] 1. Existing heat sinks use PI film as an insulating material to prevent electrical short circuits between the heat sink and electronic components. However, the PI film affects the heat dissipation effect of the heat sink to a certain extent, making the heat dissipation effect of the heat sink less than optimal.

[0006] 2. In order to fix the heat sink on the heating element, the heat sink contains a double-sided adhesive layer. However, the double-sided adhesive layer may overflow when under high pressure, high temperature or defects in the adhesive material. Some of the adhesive overflowing from the double-sided adhesive layer will cause sticking in the post-production process. For example, sticking to the processing jig or mechanical equipment will cause downtime, and the reel material may stick to the back of the roll, making it impossible to process. Utility Model Content

[0007] In view of the above problems, the present invention provides a heat dissipation structure of a heat dissipation patch, which has the advantages of further improving the heat dissipation performance of the heat dissipation patch body, preventing the overflow of the thermal conductive colloid, and avoiding loose adhesion of the outer edge of the heat dissipation patch body.

[0008] The technical solution is that the utility model includes a heat dissipation patch body, and the heat dissipation patch body includes:

[0009] a graphene heat dissipation layer having an exposed surface;

[0010] a metal heat-conducting layer, the metal heat-conducting layer being disposed on the surface of the graphene heat-dissipating layer;

[0011] An adhesive layer, which is adhered or coated on a side of the metal heat-conducting layer away from the graphene heat-dissipating layer and is used to be attached to a heat source;

[0012] The contact surface area of the adhesive layer is smaller than the contact surface area of the metal heat-conducting layer, and an overflow area is formed between the adhesive layer and the metal heat-conducting layer;

[0013] The side of the metal heat-conducting layer close to the adhesive layer is an upper surface, and the upper surface is rolled with a placement portion and a reinforcement portion;

[0014] The shape of the placement portion is consistent with the shape of the adhesive layer;

[0015] The depth of the placement portion is greater than the thickness of the adhesive layer, and the reinforcement portion is located in the overflow area and communicates with the placement portion.

[0016] Preferably, the adhesive layer is a thermally conductive double-sided tape.

[0017] Preferably, the shape of the adhesive layer is consistent with the shape of the metal heat-conducting layer.

[0018] Preferably, the outer edge of the heat dissipation patch body is rounded.

[0019] Preferably, the reinforcement portion is composed of a plurality of grooves with irregular cross-sections, and a side of the groove communicating with the placement portion is rounded.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. By removing the PI film, the heat dissipation of the heat sink body is further improved, so that the heat dissipation of the heat sink body is optimized.

[0022] 2. By setting the area relationship between the adhesive layer and the metal thermal conductive layer, the overflow area formed provides a buffer zone for the thermal conductive colloid. Even if the colloid of the double-sided adhesive layer overflows, the metal thermal conductive layer and the graphene heat dissipation layer can block the colloid and prevent the thermal conductive colloid from flowing directly onto the electronic equipment.

[0023] 3. Through the arrangement of the placement portion and the reinforcement portion, when using the heat sink patch body, the user presses the heat sink patch body, especially the outer edge of the heat sink patch body. After pressing, the thermal conductive colloid overflowing from the adhesive layer enters the reinforcement portion under the guidance of the edge of the placement portion, and the overflowed thermal conductive colloid is gathered and collected, so that part of the overflow area of the heat sink patch body also has an adhesive effect, which not only prevents the thermal conductive colloid from overflowing onto the electronic components, but also reuses the overflowed thermal conductive colloid to enhance the fit of the heat sink patch body and prevent warping at the outer edge. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a three-dimensional schematic diagram of the present utility model.

[0025] Figure 2 It is a three-dimensional explosion schematic diagram of the utility model.

[0026] Figure 3 It is a three-dimensional schematic diagram of Example 1 of the present utility model.

[0027] Figure 4 It is an explosion diagram of Example 1 of the present utility model.

[0028] Figure 5 It is a three-dimensional schematic diagram of Example 2 of the present utility model.

[0029] Figure 6 It is an explosion diagram of Example 2 of the present utility model.

[0030] Figure 7 It is a three-dimensional schematic diagram of Example 3 of the present utility model.

[0031] Figure 8 It is an explosion diagram of Example 3 of the present utility model.

[0032] Explanation of the numbers in the schematic diagram:

[0033] 1. Heat sink body; 2. Graphene heat dissipation layer; 3. Metal thermal conductive layer; 4. Adhesive layer; 5. Overflow area; 6. Placement part; 7. Reinforcement part. DETAILED DESCRIPTION

[0034] The following will be combined with the accompanying drawings in the embodiment of the present invention. Figure 1-8 The back surface of each is facing upward (i.e., the adhesive layer is facing upward) to facilitate the introduction of its structure and to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] Depend on Figures 1 to 2 A heat dissipation patch body 1 is provided, wherein the heat dissipation patch body 1 comprises:

[0036] a graphene heat dissipation layer 2 having an exposed surface;

[0037] A metal heat-conducting layer 3, wherein the metal heat-conducting layer 3 is provided on the surface of the graphene heat dissipation layer 2;

[0038] An adhesive layer 4 is adhered or coated on a side of the metal heat-conducting layer 3 away from the graphene heat-dissipating layer 2 and is used for attaching to a heat source;

[0039] The contact surface area of the adhesive layer 4 is smaller than the contact surface area of the metal heat-conducting layer 3 , and an overflow area 5 is formed between the adhesive layer 4 and the metal heat-conducting layer 3 ;

[0040] The side of the metal heat-conducting layer 3 close to the adhesive layer 4 is the upper surface, and the upper surface is rolled with a placement portion 6 and a reinforcement portion 7;

[0041] The shape of the placement portion 6 is consistent with the shape of the adhesive layer 4;

[0042] The depth of the placement portion 6 is greater than the thickness of the adhesive layer 4 , and the reinforcement portion 7 is located in the overflow area 5 and communicates with the placement portion 6 .

[0043] In order to further improve the heat dissipation performance of the heat dissipation patch body 1, the heat dissipation patch body 1 includes:

[0044] The graphene heat dissipation layer 2 has an exposed surface and a thickness of 0.5 to 100 μm;

[0045] A metal heat-conducting layer 3 is provided on the surface of the graphene heat-dissipating layer 2, and the thickness of the metal heat-conducting layer 3 is 9 to 250 μm;

[0046] Adhesive layer 4, which is attached to the side of the metal heat-conducting layer 3 away from the graphene heat dissipation layer 2. The thickness of the adhesive layer 4 is 3 to 500 μm. The adhesive layer 4 can be in the form of a patch or directly coating the metal heat-conducting layer 3 with a thermally conductive colloid.

[0047] The PI film is removed, further improving the heat dissipation performance of the heat dissipation patch body 1, so that the heat dissipation performance of the heat dissipation patch body 1 is optimized;

[0048] In order to prevent the double-sided adhesive layer from overflowing when the pressure is high, the temperature is high, or the adhesive material is defective, the contact surface area of the adhesive layer 4 is smaller than the contact surface area of the metal thermal conductive layer 3. An overflow area 5 is formed between the adhesive layer 4 and the metal thermal conductive layer 3. The overflow area 5 is a buffer zone for the overflow of the thermal conductive colloid. Even if the colloid of the double-sided adhesive layer overflows, the metal thermal conductive layer 3 and the graphene heat dissipation layer 2 can block the colloid and prevent the thermal conductive colloid from flowing directly onto the electronic device.

[0049] To further supplement the adhesive layer 4, the adhesive layer 4 is a thermally conductive double-sided adhesive, which is usually composed of a thermally conductive material (such as ceramic powder, metal oxide, etc.) and an adhesive (such as silicone, acrylate, etc.), and sometimes also contains a layer of base material (such as PET, PI film, etc.) to enhance its mechanical properties.

[0050] It should be supplemented with respect to the shape of the adhesive layer 4 that the shape of the adhesive layer 4 is consistent with the shape of the metal heat-conducting layer 3 .

[0051] The outer edge of the heat dissipation patch body 1 is rounded.

[0052] refer to Figures 3 to 8 As shown, considering that after the adhesive layer 4 is retracted, the outer edge of the heat dissipation patch body 1 may have a problem of weak adhesion, which may cause the metal thermal conductive layer 3 and the graphene heat dissipation layer 2 to warp in severe cases, affecting the use of the heat dissipation patch, the side of the metal thermal conductive layer 3 close to the adhesive layer 4 is the upper surface, and the upper surface is rolled with a placement portion 6 and a reinforcement portion 7;

[0053] The shape of the placement portion 6 is consistent with the shape of the adhesive layer 4;

[0054] The depth of the placement portion 6 is greater than the thickness of the adhesive layer 4 . The reinforcement portion 7 is located in the overflow area 5 and communicates with the placement portion 6 . The increased height has a certain blocking and guiding effect on the thermal conductive colloid, guiding the overflowed thermal conductive colloid to the reinforcement portion 7 .

[0055] Further supplementing the reinforcing portion 7 is that the reinforcing portion 7 is composed of a plurality of grooves with irregular cross-sections, and the side of the groove connected to the placement portion 6 is rounded. Through the placement portion 6 and the reinforcing portion 7, before the adhesive layer 4 is connected to the metal thermal conductive layer 3, a placement portion 6 matching the shape of the adhesive layer 4 is rolled out on the metal thermal conductive layer 3, and the shape and position of the reinforcing portion 7 are changed accordingly according to the different shapes of the adhesive layer 4, and the adhesive layer 4 is placed in the placement portion 6. When using the heat dissipation patch body 1, the user presses the heat dissipation patch body 1, especially the outer edge of the heat dissipation patch body 1. After pressing, the thermal conductive glue overflowing from the adhesive layer 4 enters the reinforcing portion 7 under the guidance of the edge of the placement portion 6, and the overflowed thermal conductive glue is gathered and collected, so that part of the overflow area 5 of the heat dissipation patch body 1 also has a bonding effect, which not only prevents the thermal conductive glue from overflowing onto the electronic components, but also reuses the overflowed thermal conductive glue to enhance the fit of the heat dissipation patch body 1 and prevent warping at the outer edge.

[0056] Based on the above conditions, the following examples 1-3 are listed to further illustrate:

[0057] Example 1:

[0058] In this embodiment, the heat sink body 1 is rectangular in shape, the adhesive layer 4 is consistent in shape with the metal thermal conductive layer 3, the length and width of the adhesive layer 4 are proportionally reduced and located in the middle of the metal thermal conductive layer 3, and the overflow area 5 is the blank area formed by the adhesive layer 4 and the outer edge of the metal thermal conductive layer 3;

[0059] The shape of the placement portion 6 is consistent with the shape of the adhesive layer 4, and the length and width of the placement portion 6 may be proportionally greater than the length and width of the adhesive layer 4;

[0060] The grooves of the reinforcing portion 7 are mainly distributed at the four corners of the metal heat conducting layer 3 and the middle of the long sides and the short sides.

[0061] Example 2:

[0062] The heat sink body 1 is in the shape of an "I" character, and each corner of the heat sink body 1 is rounded. The shape of the adhesive layer 4 is consistent with the shape of the metal thermal conductive layer 3. The length and width of the adhesive layer 4 are proportionally reduced and located in the middle of the metal thermal conductive layer 3. In other embodiments, the adhesive layer 4 may not be located in the middle of the metal thermal conductive layer 3, depending on the use requirements. In this case, the overflow area 5 is the blank area formed by the adhesive layer 4 and the outer edge of the metal thermal conductive layer 3.

[0063] The shape of the placement portion 6 is consistent with the shape of the adhesive layer 4, and the length and width of the placement portion 6 may be proportionally greater than the length and width of the adhesive layer 4;

[0064] The grooves of the reinforcement portion 7 are mainly distributed at the corners and the middle of the long sides of the metal heat conducting layer 3 .

[0065] Example 3:

[0066] The heat sink body 1 is circular in shape, and the adhesive layer 4 is consistent in shape with the metal thermal conductive layer 3. The length and width of the adhesive layer 4 are proportionally reduced and located in the middle of the metal thermal conductive layer 3. The overflow area 5 is the blank area formed by the adhesive layer 4 and the outer edge of the metal thermal conductive layer 3.

[0067] The shape of the placement portion 6 is consistent with the shape of the adhesive layer 4, and the length and width of the placement portion 6 may be proportionally greater than the length and width of the adhesive layer 4;

[0068] The grooves of the reinforcing part 7 are evenly distributed around the outer edge of the metal thermal conductive layer 3. The number of grooves is selected according to the type of thermal conductive double-sided tape used in the adhesive layer 4. Some thermal conductive double-sided tapes carry more thermal conductive colloids, and the number of grooves opened can also be increased accordingly.

[0069] When using this utility model:

[0070] First, before the adhesive layer 4 is attached to the metal heat-conducting layer 3, a corresponding rolling die is selected according to the shape of the heat-dissipating patch, and a placement portion 6 and a reinforcement portion 7 are rolled out on the metal heat-conducting layer 3 by stamping.

[0071] Then, the adhesive layer 4 is attached to the metal heat-conducting layer 3, and an overflow area 5 is formed between the adhesive layer 4 and the metal heat-conducting layer 3;

[0072] Finally, when in use, the heat dissipation patch body 1 is attached to the heat source, and the graphene heat dissipation layer 2 is pressed. At this time, the thermal conductive colloid overflowing from the adhesive layer 4 enters the reinforcement part 7 along the placement part 6, and then the edge of the heat dissipation patch body 1 is pressed hard to make the reinforcement part 7 fit better with the bonding surface.

[0073] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation structure of a heat dissipation patch, comprising a heat dissipation patch body (1), characterized in that: The heat dissipation patch body (1) comprises: A graphene heat dissipation layer (2) having an exposed surface; A metal heat-conducting layer (3), the metal heat-conducting layer (3) being arranged on the surface of the graphene heat-dissipating layer (2); An adhesive layer (4), the adhesive layer (4) being adhered to or coated on a side of the metal heat-conducting layer (3) away from the graphene heat-dissipating layer (2), and being used for attaching to a heat source; The contact surface area of the adhesive layer (4) is smaller than the contact surface area of the metal heat-conducting layer (3), and an overflow area (5) is formed between the adhesive layer (4) and the metal heat-conducting layer (3); The side of the metal heat-conducting layer (3) close to the adhesive layer (4) is an upper surface, and a placement portion (6) and a reinforcement portion (7) are rolled on the upper surface; The shape of the placement portion (6) is consistent with the shape of the adhesive layer (4); The depth of the placement portion (6) is greater than the thickness of the adhesive layer (4), and the reinforcement portion (7) is located in the overflow area (5) and communicates with the placement portion (6).

2. The heat dissipation structure of a heat dissipation patch according to claim 1, characterized in that: The adhesive layer (4) is a heat-conductive double-sided adhesive.

3. The heat dissipation structure of a heat dissipation patch according to claim 2, characterized in that: The shape of the adhesive layer (4) is consistent with the shape of the metal heat-conducting layer (3).

4. The heat dissipation structure of the heat dissipation patch according to claim 3, characterized in that: The outer edge of the heat dissipation patch body (1) is rounded.

5. The heat dissipation structure of the heat dissipation patch according to claim 4, characterized in that: The reinforcement portion (7) is composed of a plurality of grooves, and the side of the groove communicating with the placement portion (6) is rounded.

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