Heat dissipation device

Abstract

The utility model discloses a heat dissipation device which is used for being arranged on a circuit board with an electronic element, the heat dissipation device comprises a heat dissipation piece and an operation piece, the operation piece is located above the heat dissipation piece, the operation piece is arranged on the heat dissipation piece in a crossing mode from the two sides of the heat dissipation piece, and therefore the heat dissipation piece is arranged on the heat dissipation piece. When the heat dissipation device is placed on the circuit board and the heat dissipation piece is fastened on the electronic element by pulling the operating piece, the problem that the operating path of the operating piece is blocked by other higher elements on the circuit board can be avoided.

Description

Technical Field

[0001] The present application relates to the technology of heat dissipation components, and in particular to a heat dissipation device. Background Art

[0002] Electronic components are typically mounted on a circuit board's socket. Due to their high performance and power, these components generate a significant amount of waste heat during operation. Without a proper heat dissipation mechanism, these components will overheat, impacting their operation and even causing damage. Therefore, a heat sink must be installed on the circuit board to dissipate the waste heat away from the electronic components, ensuring proper operation.

[0003] Currently, most heat sinks are fixed to circuit boards using a rotary method. A turntable mechanism is provided between the heat sink fins and the press-fit head, and an operating lever extends from the turntable mechanism. The user can press the heat sink onto the circuit board by turning the operating lever horizontally (parallel to the circuit board). However, this fixing method requires space for the operating lever to swing horizontally. With the increasing number of components and accessories on circuit boards today, such as memory and other functional chips stacked next to the base and a cooling fan for providing heat dissipation for the memory or functional chips, a rotary heat sink does not have enough space for the operating lever to swing. Alternatively, a pressure rod method is used for fixing. In this method, the pressure rod is pivotally connected to the heat sink fins and contacts the press-fit head via a cam. By turning the pressure rod downward, which is perpendicular to the circuit board, the cam is driven to press the press-fit head onto the electronic component on the circuit board, and the pressure rod is tightly fitted with the surface of the electronic component to provide effective heat dissipation for the electronic component. However, the cam still wears out after frequent use.

[0004] In view of the above problems, how to provide a heat dissipation device, especially how to avoid the problem of wear and tear of the cam caused by frequent use when the cam is not in use, while also avoiding the defects of the rotating fixing method caused by the height problem of electronic components on the circuit board, will become a goal that people in this technical field are eager to pursue. Utility Model Content

[0005] In order to solve the problems of the above-mentioned prior art, the present application discloses a heat dissipation device, which is used to be arranged on a circuit board having an electronic component, and the heat dissipation device includes: a heat dissipation member, which includes a crimping joint for contacting the electronic component and a frame covering the outside of the crimping joint; and an operating member, which includes a gripping rod located above the heat dissipation member and two pivoting rods respectively connected to the gripping rod and extending toward the frame, each of the pivoting rods is pivoted to both sides of the frame and has a pushing portion extending from the pivoting point toward the crimping joint, so that when the gripping rod is pulled to move the pivoting rod to a test position, the pushing portion is driven to push the crimping joint so that the crimping joint is tightly attached to the electronic component.

[0006] In one embodiment, when the operating member releases the push against the crimping head, the pivot rod returns to an initial position, wherein the initial position is the pivot rod upright relative to the heat sink, and the test position is the pivot rod obliquely relative to the heat sink.

[0007] In a specific embodiment, the operating member further includes two connecting rods respectively having a first end and a second end relative to each other, the first end being pivotally connected to the crimping head, and the second end being pivotally connected to the corresponding pushing portion, so that when the pivot rod is not located in the test position, the pivot connection between the pushing portion and the connecting rod is in a non-linear state, and when the pivot rod is located in the test position, the pivot connection between the pushing portion and the connecting rod is substantially in a linear state, so that the pushing portion pushes the crimping head through the connecting rod.

[0008] In one embodiment, the connecting rod has a pivot disposed at the first end, so that the first end is pivotally connected to the crimping head via the pivot.

[0009] In one embodiment, the frame has a guide groove corresponding to the pivot, so that the pivot is suitable for sliding in the guide groove.

[0010] In another embodiment, the heat dissipation device of the present application also includes a fixing component having a press button and a card block connected to the press button, wherein when the press button is not pressed, the card block is suitable for fixing the crimping head, and when the press button is pressed, the press button is suitable for pushing the card block to move, so that the crimping head is separated from the fixing of the card block.

[0011] In one embodiment, the card block has an oblique groove, and the push button has a guide rod extending into the oblique groove. When the push button is pressed and the guide rod moves in the pressed direction, the guide rod pushes against the oblique groove to drive the card block to move.

[0012] In one embodiment, the heat dissipation device of the present application further includes a buffer member disposed between the frame and the crimping head.

[0013] In one embodiment, the buffer member includes a main body disposed on the frame and a push rod extending from the main body and abutting against the crimping head.

[0014] In one embodiment, the buffer member is a pneumatic rod, a hydraulic rod or a spring.

[0015] In one embodiment, the heat dissipation device of the present application further includes a blocking piece disposed between the push rod and the crimping head.

[0016] In one embodiment, the heat sink further includes a fin group connected to the compression joint and having a plurality of fins arranged at intervals from each other, and a fan disposed on a side of the fin group.

[0017] In another embodiment, the top of the fan has a slot, and the operating member also has an anti-opening piece pivotally arranged between each of the pivot rods and having a fixing portion. When the pivot rod is not in the test position, the anti-opening piece is located above the fin group. When the pivot rod is in the test position, the anti-opening piece is moved to the top of the fan, so that the fixing portion enters the slot to fix the operating member.

[0018] In another embodiment, the operating member further includes a baffle disposed on the outer side of the top of the fan.

[0019] As can be seen from the above, the heat dissipation device of the present application, by arranging the operating member above the heat dissipation member, can avoid being blocked by other electronic components when the heat dissipation device is installed on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a three-dimensional structural diagram of the heat dissipation device of this application.

[0021] Figure 2 This is a three-dimensional structural diagram of the heat dissipation device of the present application when the operating member is in the operating position.

[0022] Figure 3 for Figure 1 A partial perspective view of the connecting rod in the initial position in area S1 of FIG.

[0023] Figure 4 for Figure 2 A partial perspective view of the connecting rod in the test position in area S2.

[0024] Figure 5 This is a three-dimensional structural exploded view of the fixing assembly of the heat dissipation device of the present application.

[0025] Figure 6 This is a schematic diagram of the state of the fastening component of this application when it is not subjected to force.

[0026] Figure 7 This is a schematic diagram of the state of the fastening component of this application when it is subjected to force.

[0027] Figure 8 A three-dimensional partial exploded view of the heat dissipation device of the present application provided with a buffer member.

[0028] Main component symbols

[0029] 1. Heat dissipation device

[0030] 11 heat sink

[0031] 111 crimping head

[0032] 112 Framework

[0033] 1122 storage tank

[0034] 1123 First guide hole

[0035] 1124 assembly hole

[0036] 1121 guide groove

[0037] 113 fixture

[0038] 114 fin set

[0039] 1141 Fins

[0040] 115 Fan

[0041] 1151 card slot

[0042] 12 operating parts

[0043] 121 Grip

[0044] 122 pivot rod

[0045] 123 Pushing part

[0046] 124 Anti-cracking

[0047] 1241 Fixing Department

[0048] 125 baffle

[0049] 1251 fixing plate

[0050] 1252 barrier

[0051] 126 connecting rod

[0052] 1261 First End

[0053] 1262 Second End

[0054] 1263 Pivot

[0055] 13 Fastening components

[0056] 131 Push Button

[0057] 1311 Second Guide Hole

[0058] 1312 guide rod

[0059] 132 card blocks

[0060] 1321 Oblique Groove

[0061] 1322 first guide bump

[0062] 133 fixings

[0063] 1331 second guide protrusion

[0064] 14 Buffer

[0065] 141 Subject

[0066] 142 Putter

[0067] 15 Fixed plate

[0068] 16 baffles

[0069] 9 Circuit Board

[0070] 91 electronic components

[0071] D Horizontal direction

[0072] F Pressure

[0073] R: Turn direction

[0074] S1, S2 area

[0075] X direction of movement. DETAILED DESCRIPTION

[0076] The following describes the technical content of this application through specific embodiments. Those skilled in the art can easily understand the advantages and effects of this application from the contents disclosed in this specification. However, this application can also be implemented or applied through other different specific embodiments.

[0077] Figure 1 This is a three-dimensional structural diagram of the heat dissipation device of this application. Figure 2 This is a three-dimensional structural diagram of the heat dissipation device of the present application when the operating member is in the operating position. As shown in the figure, the heat dissipation device 1 of the present application includes a heat dissipation member 11 and an operating member 12, and is used to be assembled to a circuit board 9 having an electronic component 91, a base for mounting the electronic component 91, and an assembly member for connecting to the heat dissipation device 1. In detail, the heat dissipation device 1 of the present application utilizes the heat dissipation member 11 and the assembly member of the circuit board 9 to be assembled to the circuit board 9. Then, by pulling the operating member 12, the heat dissipation member 11 is pressed and fixed to the circuit board 9, so that the heat dissipation member 11 contacts the electronic component 91 directly or through thermal interface materials (TIM) to achieve the purpose of dissipating heat from the electronic component 91. A detailed description of the heat dissipation device 1 of the present application is set out below.

[0078] The heat sink 11 includes a crimping head 111 and a frame 112, wherein the heat sink 11 contacts the electronic component 91 directly or through a thermal interface material via the crimping head 111, allowing heat conduction between the electronic component 91 and the crimping head 111, so that the heat sink 1 of the present application can provide heat dissipation for the electronic component 91, or provide temperature control when testing the electronic component 91. The frame 112 is disposed outside the crimping head 111. In one embodiment, the frame 112 can be a shell and cover the crimping head 111, so that the heat sink 1 can be assembled to the circuit board 9 by combining the frame 112 with the assembly. For example, the assembly can have clips located on opposite sides, and the frame 112 has clamps 113 corresponding to the clips, so that the heat sink 11 can be clamped to the circuit board 9 by the clamps 113.

[0079] The operating member 12 is located above the heat sink 11 and includes a grip 121 and two pivot rods 122 connected to the ends of the grip 121. Each pivot rod 122 is located on two opposite sides of the heat sink 11. In this embodiment, the operating member 12 can be generally in an inverted U-shape and spans the heat sink 11. Each pivot rod 122 is pivotally connected to the frame 112 and has a push portion 123 extending from the pivot point toward the crimping head 111. That is, when the pivot rod 122 swings, it can drive the push portion 123 through the pivot point. In one embodiment, the pivot rod 122 and the push portion 123 are integrally formed to form a rod structure.

[0080] In actual operation, the heat dissipation device 1 of the present application drives the pivot rod 122 by pulling the handle 121, so that the pivot rod 122 moves from an initial position (such as Figure 1 as shown) to a test position (as Figure 2As shown in FIG, the pivot rod 122 links the pushing portion 123 to push the pressing head 111, so that the pressing head 111 moves relative to the frame 112 toward the electronic component 91 or presses against the electronic component 91. At this time, since the frame 112 and the assembly are combined with each other on the circuit board 9, the pressing head 111 will press the electronic component 91 and fit closely with the surface of the electronic component 91, so as to achieve good heat conduction between the electronic component 91 and the heat dissipation device 1. In addition, when the heat dissipation device 1 of the present application is to be removed, it is only necessary to return the operating member 12 from the test position to the initial position, release the state in which the operating member 12 pushes against the crimping head 111, so that the crimping head 111 does not press the electronic component 91, and then separate the clamp 113 of the frame 112 from the fastener of the assembly member, and finally lift the operating member 12 to move the heat dissipation device 1 away from the circuit board 9. Therefore, due to the position design of the operating member 12 of the present application, it is possible to avoid being blocked by other components around the electronic component 91 on the circuit board 9 during the process of pulling the operating member 12, thereby affecting the assembly of the heat dissipation device 1.

[0081] In one embodiment, if Figure 1 As shown, the initial position is that the pivot rod 122 is upright relative to the heat sink 11. Figure 2 As shown, the test position is when the pivot rod 122 is tilted relative to the heat sink 11. That is, when using the heat sink 1 of the present application, the operation method is to move the upright pivot rod 122 toward the side of the heat sink 11, which is more intuitive in operation (the action is similar to pressing down the heat sink 11). In one embodiment, when the pivot rod 122 is in the upright position, the pivot rod 122 is located at the middle position or center of gravity of the heat sink 11, and the operating member 12 can be used as a handle to directly carry the heat sink 1.

[0082] like Figure 2As shown, the heat sink 11 also includes a fin group 114 having a plurality of fins 1141 arranged at intervals from each other, and a fan 115 provided on the side of the fin group 114, wherein the fin group 114 is connected to the crimping joint 111 (for example, directly or through a metal pipe such as a copper tube, aluminum tube, etc.), and heat conduction can be performed between the fin group 114 and the crimping joint 111, thereby providing the crimping joint 111 with a heat dissipation function, so that the waste heat received by the crimping joint 111 from the electronic component 91 is blown into the environment through the fan 115. Furthermore, the top of the fan 115 has a slot 1151, and the operating member 12 also has an anti-opening piece 124 pivotally arranged between the two pivot rods 122 and having a fixing portion 1241. In this embodiment, the fan 115 has two slots 1151 and is located on both sides of the top, and the anti-opening piece 124 also has two fixing portions 1241 corresponding to each of the slots 1151. When the pivot rod 122 is not in the test position (such as in the initial position), the anti-opening piece 124 is located above the fin group 114. When the pivot rod 122 moves to the test position, the anti-opening piece 124 will be displaced above the fan 115, so that the fixing portion 1241 enters the slot 1151 to produce a fixing effect to fix the position of the operating member 12, thereby preventing the operating member 12 in the test position from detaching from the test position or resetting to the initial position during the operation or testing of the electronic component 91. In addition, when the operating member 12 is to be detached from the test position, one only needs to insert a finger into the gap between the anti-opening piece 124 and the top of the fan 115, and use the finger to pull the anti-opening piece 124 upward so that each fixing portion 1241 leaves the slot 1151, and the operating member 12 can be moved toward the initial position.

[0083] In one embodiment, the operating member 12 further has a baffle 125 provided on the outer side of the top of the fan 115. The baffle 125 can be L-shaped. Specifically, the baffle 125 has a fixing plate 1251 for fixing to the fan 115 and a blocking plate 1252 connected to the top side of the fixing plate 1251. The purpose of the blocking plate 1252 is that when the pivot rod 122 is in the test position, the user can only insert a finger into the gap between the anti-opening plate 124 and the top of the fan 115 to pry open the anti-opening plate 124, and cannot pry open the anti-opening plate 124 from the blocking plate 1252. This can avoid the situation where the fingers are pinched, or accidentally inserted into the fan 115 and cut by the blades of the fan 115, thereby achieving the purpose of protecting the fingers.

[0084] Figure 3 for Figure 1 A partial perspective view of the connecting rod in the initial position in region S1, Figure 4 for Figure 2Please refer to the partial perspective view of the connecting rod in the test position in the area S2 of FIG. As shown in the figure, the operating member 12 further includes two connecting rods 126 respectively connected to each pivot rod 122. Specifically, each connecting rod 126 has a first end 1261 and a second end 1262 opposite to each other, so that the first end 1261 is pivotally connected to the crimping head 111, and the second end 1262 is pivotally connected to the corresponding pushing portion 123. Figure 3 As shown, when the pivot rod 122 is in the initial position or not in the test position, the pushing portion 123 and the connecting rod 126 are in a non-straight state, that is, as shown in the figure, the pushing portion 123 and the connecting rod 126 are bent, so that the pushing portion 123 does not push the pressing head 111. Furthermore, when the pushing portion 123 is intended to push the pressing head 111, the pivot rod 122 is swung along the pulling direction R. At this time, the pivot rod 122 will drive the pivotal connection between the pushing portion 123 and the second end 1262 of the connecting rod 126 to move along the moving direction X, so that the distance between the pivotal connection between the pivotal connection between the pivotal connection between the pivotal connection between the frame 112 and the pivotal connection between the connecting rod 126 and the pressing head 111 gradually increases, thereby causing the pushing portion 123 to push the pressing head 111 via the connecting rod 126. Figure 4 As shown, when the pivotal connection between the pushing portion 123 and the second end 1262 moves to a point where the pushing portion 123 and the connecting rod 126 are substantially in a straight line, the operating member 12 is located at the testing position, so that good heat conduction effect can be achieved between the crimping head 111 and the electronic component.

[0085] In this embodiment, the connecting rod 126 has a pivot 1263 provided at the first end 1261, so that the first end 1261 is pivotally connected to the crimping head 111 via the pivot 1263. In this regard, the frame 112 has a guide groove 1121 corresponding to the pivot 1263 (see FIG. 1 ). Figure 2 ), so that the pivot 1263 extends into the guide groove 1121 and can be freely slidably arranged in the guide groove 1121, and the pivot 1263 is allowed to slide therein through the guide groove 1121 to guide the movement of the pivot 1263, so that the connecting rod 126 can indeed form a straight structure with the pushing portion 123.

[0086] In summary, the heat dissipation device 1 of the present application is pivotally connected to the frame 112 through the rod body formed by the pivot rod 122 and the pushing portion 123 to form a lever structure, that is, the pivot point is used as a fulcrum, and the length of the pivot rod 122 is greater than the length of the pushing portion 123, thereby achieving the purpose of saving effort. In addition, the operating member 12 is pivotally connected to the pressing joint 111 through the pushing portion 123 and the connecting rod 126. Therefore, when the operating member 12 pushes against the pressing joint 111, the wear problem between the operating member 12 and the pressing joint 111 can be reduced, thereby extending the service life of the heat dissipation device 1.

[0087] Figure 5 This is a three-dimensional structural exploded view of the fixing assembly of the heat dissipation device of this application. Figure 6 This is a schematic diagram of the state of the clamping assembly of this application when it is not under force. Figure 7 The following is a schematic diagram of the state of the clamping assembly of the present application when it is under force, please refer to it. As shown in the figure, the heat dissipation device of the present application also includes at least one clamping assembly 13. In this embodiment, the number of the clamping assembly 13 is four, and they are respectively arranged at the four corners of the frame 112. Specifically, each corner of the frame 112 has a receiving groove 1122 for installing the clamping assembly 13, and a first guide hole 1123 and an assembly hole 1124 are respectively provided on the two adjacent side walls of the receiving groove 1122. Furthermore, the clamping assembly 13 includes a pressing button 131, a card block 132 connected to the pressing button 131, and a fixing member 133 combined with the pressing button 131, wherein the card block 132 is provided with an oblique groove 1321 and a first guide protrusion 1322 corresponding to the first guide hole 1123. The pressing button 131 has two opposite sides. Each of the fixing member 133 has a second guide hole 1311 and a guide rod 1312 extending into the oblique groove 1321. The fixing member 133 has a second guide protrusion 1331 corresponding to the second guide hole 1311. Accordingly, the clamping block 132 is inserted into the first guide hole 1123 with the first guide protrusion 1322, and the oblique groove 1321 is directed toward the assembly hole 1124, so that the clamping block 132 can move axially along the first guide hole 1123. Then, the guide rod 1312 of the pressing button 131 is inserted into the oblique groove 1321, and the second guide hole 1311 is directed toward the assembly hole 1124. The fixing member 133 is also covered on the assembly hole 1124, and the second guide protrusion 1331 protrudes into the second guide hole 1311.

[0088] like Figure 6 As shown, the heat sink is viewed from the bottom. When not under pressure, the push button 131 protrudes from the bottom surface of the frame 112, and the clamping block 132 protrudes from the bottom surface of the crimping head 111 and is suitable for clamping the crimping head 111 horizontally, so that the crimping head 111 cannot move relative to the frame 112 due to the clamping of the clamping block 132. That is, in this state, since the crimping head 111 cannot move, the operating member cannot be moved (if the operating member is pulled, it means that the crimping head 111 must be displaced). Accordingly, when the heat sink is lifted to move, the purpose of preventing the heat sink from swinging arbitrarily can be achieved (because the heat sink is large in size, the heat sink may swing left and right when the heat sink is lifted). Therefore, it can stabilize the heat sink when the heat sink is moved.

[0089] like Figure 7 As shown, it is also viewed from the bottom of the heat sink. Please also refer to Figure 5When the heat sink is to be placed on the circuit board, the pressing button 131 will be retracted into the receiving groove 1122 of the frame 112 due to the weight of the heat sink (i.e., the heat sink is pressed down onto the circuit board as a whole) or the pressure F applied by the user. The pressing button 131 is guided vertically into the receiving groove 1122 by the second guide hole 1311 and the second guide protrusion 1331. At this time, the guide rod 1312 presses an inclined surface of the oblique groove 1321, so that the guide rod 1312 pushes against the oblique groove 1321 and is suitable for driving the clamping block 132 to move along the lateral direction D. At this time, the clamping block 132 is simultaneously guided by the first guide hole 1123 and the first guide protrusion 1322 and retracted into the receiving groove 1122, so that the pressing head 111 is released from the state of being fixed by the clamping block 132. In this state, the operating member can be actuated.

[0090] Figure 8 This is a partially exploded perspective view of the heat dissipation device of the present application, illustrating the configuration of the buffer member. As shown, the heat dissipation device of the present application further includes a buffer member 14 disposed between the frame 112 and the crimping head 111. In this embodiment, the heat dissipation device is provided with six buffer members 14, but the number can vary depending on actual needs and is not limited thereto.

[0091] In actual use, since many elastic metal parts are provided in the base on the circuit board, as the chip size increases, the number of elastic metal parts must also increase accordingly, and hundreds of kilograms of elastic force will be generated. Therefore, when the operating part is moved away from the test position to release the pressure on the crimping head 111, the crimping head 111 and the connected fin group will be instantly bounced up by the aforementioned elastic force, which may cause injury to the user. Therefore, the buffer part 14 of the present application can provide a buffering effect when the crimping head 111 is forced to bounce up, so as to achieve the purpose of protecting the user, and can also protect the heat sink from damage caused by instantaneous elastic force.

[0092] In this embodiment, the buffer member 14 may include a main body 141 and a push rod 142, wherein the main body 141 is arranged on the frame 112, and the push rod 142 extends from the main body 141 and abuts against the crimping head 111. In other embodiments, the main body 141 may also be arranged on the crimping head 111, and the push rod 142 abuts against the frame 112. Specifically, the main body 141 may be first fixed on a fixing plate 15 and arranged on the frame 112 through the fixing plate 15. In addition, the heat dissipation device of the present application also includes a baffle 16 arranged between the push rod 142 and the crimping head 111 to isolate the push rod 142 from the crimping head 111, to prevent the temperature of the crimping head 111 from affecting the buffering function of the buffer member 14, and to protect the crimping head 111 from being deformed or damaged due to collision with the push rod 142 during the buffering process. In one embodiment, the buffer member 14 can be an elastic member such as a piston, a pneumatic rod, a hydraulic rod, or a spring.

[0093] The above embodiments are merely illustrative and are not intended to limit this application. Any person skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application is defined by the claims appended hereto, and any claims that do not affect the effectiveness and implementation objectives of this application shall be encompassed by this disclosed technical content.

Claims

1. A heat dissipation device, characterized in that: Used to be arranged on a circuit board having an electronic component, the heat dissipation device includes: a heat sink comprising a crimping head for contacting the electronic component and a frame covering the crimping head; and The operating member includes a handle located above the heat sink and two pivot rods connected to the handle and extending toward the frame. Each pivot rod is pivotally connected to both sides of the frame and has a push portion extending from the pivot point toward the crimping head. When the handle is pulled to move the pivot rod to a test position, the push portion is driven to push the crimping head so that the crimping head is tightly attached to the electronic component.

2. The heat dissipation device according to claim 1, wherein: When the operating member releases the pressing head, the pivot rod returns to an initial position, wherein the initial position is the pivot rod upright relative to the heat sink, and the test position is the pivot rod oblique relative to the heat sink.

3. The heat dissipation device according to claim 1, wherein: The operating member further includes two connecting rods respectively having opposite first and second ends, the first end being pivotally connected to the crimping head, and the second end being pivotally connected to the corresponding pushing portion, so that when the pivoting rod is not located at the test position, the pivoting connection between the pushing portion and the connecting rod is in a non-linear state, and when the pivoting rod is located at the test position, the pivoting connection between the pushing portion and the connecting rod is substantially in a linear state, so that the pushing portion pushes the crimping head through the connecting rod.

4. The heat dissipation device according to claim 3, wherein: The connecting rod has a pivot shaft arranged at the first end, so that the first end is pivotally connected to the pressing head through the pivot shaft.

5. The heat dissipation device according to claim 4, wherein: The frame has a guide groove corresponding to the pivot, so that the pivot is suitable for sliding in the guide groove.

6. The heat dissipation device according to claim 1, wherein: The heat dissipation device also includes a fixing component having a press button and a card block connected to the press button, wherein when the press button is not pressed, the card block is suitable for fixing the crimping head, and when the press button is pressed, the press button is suitable for pushing the card block to move, so that the crimping head is separated from the fixing of the card block.

7. The heat dissipation device according to claim 6, wherein: The block has an oblique groove, and the push button has a guide rod extending into the oblique groove, so that when the push button is pressed to move the guide rod in the pressed direction, the guide rod pushes against the oblique groove to drive the block to move.

8. The heat dissipation device according to claim 1, wherein: The heat dissipation device further comprises a buffer member arranged between the frame and the pressing head.

9. The heat dissipation device according to claim 8, wherein: The buffer is a pneumatic rod, a hydraulic rod or a spring.

10. The heat dissipation device according to claim 8, wherein: The buffer component comprises a main body arranged on the frame and a push rod extending from the main body and abutting against the pressing head.

11. The heat dissipation device according to claim 10, wherein: The heat dissipation device further comprises a blocking piece arranged between the push rod and the pressing head.

12. The heat dissipation device according to claim 1, wherein: The heat sink also includes a fin group connected to the compression joint and having a plurality of fins arranged at intervals from each other, and a fan arranged on the side of the fin group.

13. The heat dissipation device according to claim 12, wherein: The top of the fan has a slot, and the operating member also has an anti-opening piece pivotally arranged between each of the pivot rods and having a fixing portion. When the pivot rod is not in the test position, the anti-opening piece is located above the fin group. When the pivot rod is in the test position, the anti-opening piece moves to the top of the fan, allowing the fixing portion to enter the slot to fix the operating member.

14. The heat dissipation device according to claim 13, wherein: The operating member further comprises a baffle plate arranged on the outer side of the top of the fan.

Images