Laser processing equipment

Abstract

The utility model provides laser processing equipment. The laser processing equipment comprises a rack; the laser device comprises a laser emitter and an optical module; the optical module is connected with the laser emitter and is configured to direct the laser beam to the laser emitter; the laser emitter is configured to receive and emit a laser beam; the positioning device comprises a moving module; and the moving module is arranged on the rack, is connected with at least part of the optical module and is configured to drive the optical module to move so as to enable the laser emitter to move to a specified position. The equipment allows the laser emitter to be positioned at different positions through the moving module, the operation range of the equipment is expanded, the problem that in the prior art, the position of the laser generator is fixed is solved, unnecessary contact and scratch with materials are avoided, the mechanical damage risk is reduced, and in addition, through accurate control of the moving module, the laser emitter can be accurately positioned at different positions. The distance between the laser emitter and the material can be optimized, it is ensured that the laser beam is focused within the optimal focal depth range, and the machining precision is improved.

Description

Technical Field

[0001] The present application relates to the field of laser processing, and in particular to a laser processing device. Background Art

[0002] Through Glass Via (TGV) technology is an advanced integration technique used to form vertical interconnects between multi-layer glass substrates. This technology has broad application prospects in optical communications, radio frequency, microwave, micro-electromechanical systems, microfluidic devices, and integrated circuits.

[0003] In the application of TGV technology, the laser generator is a core component responsible for generating a high-energy laser beam to perform laser drilling operations on glass materials. At present, the position of the laser generator in the processing equipment is fixed, and there are some limitations when facing uneven glass material surfaces or glass material accumulation. For example, if the glass material is piled too high and the surface is uneven, the laser generator may contact and scratch it, which will cause unnecessary mechanical damage to the laser generator. In addition, the focal depth of the laser beam is limited. If the distance between the laser generator and the glass material is too close, it may not meet the optimal focal depth range, which will affect the accurate focusing of the laser beam emitted by the laser generator on the surface of the glass material, thereby affecting the processing accuracy.

[0004] Therefore, how to provide a laser processing device with adjustable position and high precision is a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0005] The present application provides a laser processing device, which enables a laser emitter to be moved to a specified position, expands the operating range of the device, and improves the device's ability to perform laser processing at different positions.

[0006] The present application provides a laser processing device, comprising:

[0007] frame;

[0008] A laser device comprising a laser emitter and an optical module; the optical module is connected to the laser emitter and configured to direct a laser beam to the laser emitter; the laser emitter is configured to receive and emit the laser beam;

[0009] The positioning device includes a moving module; the moving module is arranged on the frame, connected to at least part of the optical module, and configured to drive the optical module to move so that the laser emitter moves to a specified position.

[0010] Preferably, at least a portion of the top surface of the frame extends to form a processing structure;

[0011] The movable module includes a fixed column, a lifting assembly arranged on the fixed column, and an extension assembly connected to the lifting assembly; the bottom end of the fixed column is fixed to the processing structure and is configured to fix the movable module; at least part of the optical module is connected to the extension assembly and is configured to drive the optical module to move along the length direction perpendicular to the fixed column; the lifting assembly is configured to drive the optical module to move along the length direction of the fixed column.

[0012] Preferably, the lifting assembly includes at least one slide rail and at least one slider provided on the slide rail;

[0013] The extension component includes a telescopic plate; one side of the telescopic plate is connected to the slider, and the other side is connected to at least part of the optical module.

[0014] Preferably, the positioning device also includes: a rotating structure and an adjusting mechanism connected to the rotating structure; at least part of the rotating structure is embedded in the end of the fixed column away from the processing structure; the adjusting mechanism is arranged inside the fixed column, and is configured so that when the rotating structure rotates to a preset angle, the adjusting mechanism is tightened and abuts against the lifting assembly and the extension assembly, so that the lifting assembly and the extension assembly maintain their relative positions.

[0015] Specifically, the laser device further includes: a laser gain module; the laser gain module is arranged on the frame and is arranged on the bottom surface of the processing structure in a direction away from the laser emitter;

[0016] The laser gain module includes a pump source, a cavity connected to the optical module, and a gain medium placed in the cavity; the pump source is configured to provide energy to the gain medium to excite particles in the gain medium to a high energy level to generate laser light and form a laser beam;

[0017] The cavity has a preset transmission medium, and the laser beam is transmitted to the optical module through the preset transmission medium.

[0018] Specifically, the optical module includes: at least one first lens configured to focus the laser beam; and / or,

[0019] at least one second lens configured to change the direction of the laser beam; and / or,

[0020] a modulator configured to adjust parameters of the laser beam; wherein the parameters include at least intensity, phase, and frequency; and / or,

[0021] a beam shaper configured to change the shape and distribution of the laser beam; and / or,

[0022] A beam splitter is configured to split the laser beam into several parts.

[0023] Specifically, the laser emitter includes: at least one third lens, configured to amplify the laser beam and then emit it to the material to be processed placed on the processing structure.

[0024] Preferably, the laser processing equipment further comprises: an adsorption device; the adsorption device is provided on the processing structure, and a plurality of evenly arranged openings are provided on the surface of the adsorption device, which is configured to apply adsorption force to the material to be processed.

[0025] Preferably, the laser processing equipment further includes: a dust removal device; the dust removal device is arranged on one side of the adsorption device and is configured to adsorb dust attached to the surface of the material to be processed after laser processing.

[0026] Preferably, the laser processing equipment further comprises: a display screen, a control module, and a plurality of control buttons; at least some of the control buttons are provided on the side wall surface of the processing structure, connected to the control module, and configured to change the working state of the laser processing equipment;

[0027] The display screen is arranged on a side of the fixing column away from the optical module, is connected to the control module, and is configured to display the working status of the laser processing equipment.

[0028] According to the specific embodiments provided in this application, the following technical effects are disclosed:

[0029] The technical solution of the present application provides a laser processing device, comprising: a frame; a laser device, comprising a laser emitter and an optical module; the optical module is connected to the laser emitter and configured to direct the laser beam to the laser emitter; the laser emitter is configured to receive and emit the laser beam; a positioning device, comprising a moving module; the moving module is disposed on the frame and connected to at least a portion of the optical module and configured to drive the optical module to move so as to move the laser emitter to a specified position. The device allows the laser emitter to be positioned at different positions through the moving module, thereby expanding the operating range of the device, resolving the limitation of the fixed position of the laser emitter in the prior art, avoiding unnecessary contact and scratches with the material, and reducing the risk of mechanical damage. In addition, through the precise control of the moving module, the distance between the laser emitter and the material can be optimized, ensuring that the laser beam is focused within the optimal focal depth range, thereby improving processing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0031] Figure 1 This is a schematic diagram of a partial structure of a laser device and a positioning device provided in an embodiment of the present application;

[0032] Figure 2 is a schematic diagram of a laser gain module provided in an embodiment of the present application;

[0033] Figure 3 This is one of the overall schematic diagrams of the laser processing equipment provided in the embodiments of the present application;

[0034] Figure 4 This is the second overall schematic diagram of the laser processing equipment provided in the embodiment of the present application;

[0035] Figure 5 This is the third overall schematic diagram of the laser processing equipment provided in the embodiment of the present application.

[0036] Figure numerals: 10, frame; 11, telescopic rod; 20, laser emitter; 30, optical module; 40, laser beam; 50, moving module; 51, fixed column; 52, lifting assembly; 53, extension assembly; 60, processing structure; 70, rotating structure; 80, laser gain module; 90, adsorption device; 91, opening; 100, display screen; 110, control button. DETAILED DESCRIPTION

[0037] Some embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application.

[0038] As mentioned in the background, the laser generator is currently fixed in position within the processing equipment, which presents some limitations when working with uneven glass surfaces or piles of glass. For example, if the glass pile is too high and the surface is uneven, the laser generator may come into contact with it and cause scratches, which could cause unnecessary mechanical damage to the laser generator. Furthermore, the focal depth of the laser beam is limited. If the laser generator and the glass are too close, the optimal focal depth range may be exceeded, affecting the laser beam's ability to accurately focus on the glass surface, thus affecting the processing accuracy.

[0039] To solve the above problems, the core of this application is to provide a laser processing device so that the laser emitter moves to a specified position and maintains an appropriate distance between the laser emitter and the material to be processed.

[0040] Example 1

[0041] Embodiment 1 of the present application provides a laser processing device, referring to Figure 1 as well as Figures 3 to 5, including: a frame 10; a laser device, including a laser emitter 20 and an optical module 30; the optical module 30 is connected to the laser emitter 20 and is configured to direct a laser beam 40 to the laser emitter 20; the laser emitter 20 is configured to receive and emit the laser beam 40; a positioning device, including a moving module 50; the moving module 50 is provided on the frame 10, connected to at least part of the optical module 30, and is configured to drive the optical module 30 to move so that the laser emitter 20 moves to a specified position.

[0042] The laser device and positioning device are both mounted on the frame 10. The coordinated operation of the laser emitter 20, the optical module 30, and the mobile module 50 enables flexible positioning of the laser emitter 20 and precise orientation of the laser beam 40. The mobile module 50 enables the optical module 30 to move, thereby driving the laser emitter 20 to a designated position. This overcomes the limitations of conventional equipment when dealing with uneven or varying heights of processed materials. This improves the accuracy and efficiency of laser processing and enhances its adaptability to complex workpieces. This makes it suitable for high-precision and complex path processing applications, such as the TGV technology used between multi-layer glass substrates, greatly expanding the application range and practicality of laser processing equipment.

[0043] In some embodiments of the present application, when the rack is placed horizontally, the moving module can drive the optical module to move in the horizontal and vertical directions.

[0044] Preferably, reference Figure 2 and Figure 4 , at least part of the top surface of the frame 10 extends to form a processing structure 60; the moving module 50 includes a fixed column 51, a lifting assembly 52 provided on the fixed column 51, and an extension assembly 53 connected to the lifting assembly 52; the bottom end of the fixed column 51 is fixed to the processing structure 60, and is configured to fix the moving module 50; at least part of the optical module 30 is connected to the extension assembly 53, and is configured to drive the optical module 30 to move along the length direction perpendicular to the fixed column 51; the lifting assembly 52 is configured to drive the optical module 30 to move along the length direction of the fixed column 51.

[0045] The processing structure 60 is used to place the material to be processed, such as glass, as well as related materials and equipment used in the laser processing process. The coordinated action of the lifting assembly 52 and the extension assembly 53 enables the precise movement of the optical module 30, thereby allowing the laser emitter 20 to reach the specified position. This improves the adaptability of the equipment to materials to be processed at different heights and positions. Through vertical and horizontal movement, the laser emitter 20 can be quickly and accurately positioned in the processing area, enhancing the flexibility and accuracy of laser processing.

[0046] In some embodiments of the present application, the lifting assembly includes at least one slide rail and at least one slider arranged on the slide rail; the extension assembly includes a telescopic plate; one side of the telescopic plate is connected to the slider, and the other side is connected to at least part of the optical module.

[0047] In some embodiments of the present application, the length direction of the optical module is perpendicular to the length direction of the fixing post.

[0048] A three-dimensional coordinate system is established, with the z-axis determined by the orientation of the fixed column, the y-axis determined by the orientation of the optical module, and the x-axis determined by a direction perpendicular to the optical module. The slider and rail enable the optical module to move up and down along the z-axis, while the telescopic plate enables it to move left and right along the x-axis. This provides a stable and reliable movement mechanism, ensuring that the optical module drives the laser emitter to quickly and accurately move to the designated position for laser processing. The combination of the slider and rail reduces friction during movement and improves precision. The telescopic plate also enables lateral movement of the laser emitter to accommodate processing requirements at varying lateral distances, enhancing the device's adaptability to varying material sizes and shapes.

[0049] The original optical module and the laser emitter are fixedly connected, and the laser emitter cannot move along the y-axis direction. Figure 1 、 Figure 4 and Figure 5 The laser device also includes a telescopic rod 11; the telescopic rod 11 is configured as a hollow structure, a fixed end of which is connected to the optical module 30, and a telescopic end is connected to the laser emitter 20; the hollow structure is configured to allow the connecting line between the optical module 30 and the laser emitter 20 to pass through.

[0050] The telescopic rod allows the laser emitter 20 to be adjusted relative to the optical module 30 along the y-axis. Combined with the use of slide rails, sliders, and telescopic plates, three-dimensional positioning is achieved, allowing the laser emitter 20 to be moved more precisely according to processing requirements. Furthermore, the structure of the telescopic rod 11 ensures a stable connection between the optical module 30 and the laser emitter 20. Its hollow structure simplifies connection requirements, avoids cluttered cable layout, and facilitates subsequent maintenance.

[0051] Preferably, reference Figure 1 as well as Figures 3 to 5The positioning device also includes: a rotating structure 70 and an adjusting mechanism connected to the rotating structure (not shown in the figure); at least a portion of the rotating structure 70 is embedded in the end of the fixed column 51 away from the processing structure 60; the adjusting mechanism is arranged inside the fixed column 51, and is configured so that when the rotating structure 70 rotates to a preset angle, the adjusting mechanism is tightened and abuts against the lifting component 52 and the extension component 53, so that the lifting component 52 and the extension component 53 maintain their relative positions.

[0052] After laser emitter 20 moves to a desired position in three-dimensional space, the angle of rotating structure 70 is adjusted to tighten the adjustment mechanism and lock the lifting assembly 52 and extension assembly 53, keeping them relatively fixed in position to accommodate complex or directional laser processing. The combined use of rotating structure 70 and the adjustment mechanism enables precise positioning of laser emitter 20, reducing potential errors caused by positional fluctuations.

[0053] Example 2

[0054] Example 2 of the present application provides the specific composition of the laser device based on Example 1.

[0055] Specifically, refer to Figures 2 to 5 The laser device also includes: a laser gain module 80; the laser gain module 80 is arranged on the frame 10 and is arranged on the bottom surface of the processing structure 60 in a direction away from the laser emitter 20; the laser gain module 80 includes a pump source, a cavity connected to the optical module 30, and a gain medium placed in the cavity; the pump source is configured to provide energy to the gain medium, so that the particles in the gain medium are excited to a high energy level to generate laser and form a laser beam; wherein a preset transmission medium is provided in the cavity, and the laser beam is transmitted to the optical module 30 through the preset transmission medium.

[0056] In some embodiments of the present application, the preset transmission medium is air, optical fiber or other optical transmission medium.

[0057] The laser gain module 80 also includes a rectangular outer shell. The interior of the outer shell is divided into a first portion and a second portion. The first portion houses the pump source, while the second portion houses the cavity and the gain medium within it. The rectangular structure of the outer shell and the internal compartmentalization make the layout of the pump source and cavity more compact and organized, optimizing space utilization. This structural design also helps reduce external interference with the laser beam generation process, improving the stability and reliability of the entire laser system. The integrated design of the laser gain module 80 allows for more precise coordination between the pump source and the gain medium, thereby increasing the output power and quality of the laser beam and enabling the laser processing equipment to adapt to a wider variety of materials and processing tasks.

[0058] Specifically, the optical module includes: at least one first lens configured to focus the laser beam; and / or, at least one second lens configured to change the direction of the laser beam; and / or, a modulator configured to adjust the parameters of the laser beam; wherein the parameters include at least intensity, phase, and frequency; and / or, a beam shaper configured to change the shape and distribution of the laser beam; and / or, a beam splitter configured to split the laser beam into several parts.

[0059] Among them, the first lens is suitable for application scenarios with high precision requirements such as micromachining or fine drilling; the setting of the second lens provides the ability to process the laser beam at different angles or directions; the modulator adjusts the parameters of the laser beam so that the laser processing equipment can adapt to different material properties and processing requirements; the beam shaper can change the shape and distribution of the laser beam, thereby optimizing the interaction between the laser beam and the material and improving the laser processing efficiency; the beam splitter can divide the laser beam into several parts to adapt to scenarios requiring multi-point processing and parallel processing, thereby improving the processing speed and production efficiency.

[0060] In some embodiments of the present application, the first lens is a convex lens, which is used to reduce the diameter of the laser beam, focus the laser beam on a small point, and increase the energy density of the laser beam to achieve high-precision processing; the second lens is a plane mirror, which is used to guide the laser beam in a larger area and can perform complex point processing.

[0061] Specifically, the laser emitter includes: at least one third lens, configured to amplify the laser beam and then emit it to the material to be processed placed on the processing structure.

[0062] Among them, the third lens can achieve a larger size or deeper penetration processing effect without increasing the power of the laser emitter.

[0063] In some embodiments of the present application, the third lens is a projection lens, which may use a lens with a specific focal length to control the size and shape of the laser beam on the surface of the material.

[0064] Example 3

[0065] Example 3 of the present application provides relevant auxiliary devices for laser processing equipment on the basis of Example 2 to achieve better laser processing effects.

[0066] Preferably, reference Figure 1 as well as Figures 3 to 5 The laser processing equipment further includes: an adsorption device 90; the adsorption device 90 is provided on the processing structure 60, and a plurality of evenly arranged openings 91 are provided on its surface, which are configured to apply adsorption force to the material to be processed.

[0067] The provision of the adsorption device 90 enables the material to remain stable during the laser processing process, reduces the vibration and displacement of the material, simplifies the material clamping process, and improves work efficiency.

[0068] Preferably, reference Figure 1 as well as Figures 3 to 5 The laser processing equipment also includes: a dust removal device (not shown in the figure); the dust removal device is arranged on one side of the adsorption device 90, and is configured to adsorb dust attached to the surface of the material to be processed after laser processing.

[0069] Among them, the dust removal device absorbs the attached dust and then discharges it, which helps to keep the processing environment clean and prevent dust from interfering with the processing or affecting the processing quality.

[0070] Preferably, reference Figures 3 to 5 The laser processing equipment also includes: a display screen 100, a control module (not shown in the figure), and a plurality of control buttons 110; at least some of the control buttons 110 are arranged on the side wall of the processing structure 60, connected to the control module, and configured to change the working state of the laser processing equipment; the display screen 100 is arranged on a side of the fixed column 51 away from the optical module 30, connected to the control module, and configured to display the working state of the laser processing equipment.

[0071] Among them, the setting of the display screen 100 provides the staff with an intuitive operation interface and status feedback. The staff can directly perform control operations through the control button 110, change the working status of the equipment conveniently and quickly, and monitor the processing process through the display screen 100, thereby improving the human-computer interaction experience.

[0072] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0073] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0074] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A laser processing device, characterized in that: The laser processing equipment includes: frame; A laser device comprising a laser emitter and an optical module; the optical module is connected to the laser emitter and configured to direct a laser beam to the laser emitter; the laser emitter is configured to receive and emit the laser beam; The positioning device includes a moving module; the moving module is arranged on the frame, connected to at least part of the optical module, and configured to drive the optical module to move so that the laser emitter moves to a specified position.

2. The laser processing equipment according to claim 1, characterized in that At least a portion of the top surface of the frame extends to form a processing structure; The movable module includes a fixed column, a lifting assembly provided on the fixed column, and an extension assembly connected to the lifting assembly; the bottom end of the fixed column is fixed to the processing structure and is configured to fix the movable module; at least part of the optical module is connected to the extension assembly and is configured to drive the optical module to move along a length direction perpendicular to the fixed column; the lifting assembly is configured to drive the optical module to move along the length direction of the fixed column.

3. The laser processing equipment according to claim 2, characterized in that The lifting assembly includes at least one slide rail and at least one slider provided on the slide rail; The extension assembly includes a telescopic plate; one side of the telescopic plate is connected to the slider, and the other side is connected to at least a portion of the optical module.

4. The laser processing equipment according to claim 2, characterized in that The positioning device also includes: a rotating structure and an adjusting mechanism connected to the rotating structure; at least a portion of the rotating structure is embedded in the end of the fixed column away from the processing structure; the adjusting mechanism is arranged inside the fixed column, and is configured so that when the rotating structure rotates to a preset angle, the adjusting mechanism is tightened and abuts against the lifting component and the extension component, so that the lifting component and the extension component maintain a relative position.

5. The laser processing equipment according to any one of claims 2 to 4, characterized in that: The laser device further comprises: a laser gain module; the laser gain module is arranged on the frame and on the bottom surface of the processing structure in a direction away from the laser emitter; The laser gain module includes a pump source, a cavity connected to the optical module, and a gain medium placed in the cavity; the pump source is configured to provide energy to the gain medium to excite particles in the gain medium to a high energy level to generate laser light and form a laser beam; The cavity has a preset transmission medium, and the laser beam is transmitted to the optical module through the preset transmission medium.

6. The laser processing equipment according to any one of claims 1 to 4, characterized in that: The optical module includes: at least one first lens configured to focus the laser beam; and / or, at least one second lens configured to change the direction of the laser beam; and / or, a modulator configured to adjust parameters of the laser beam; wherein the parameters include at least intensity, phase and frequency; and / or, a beam shaper configured to change the shape and distribution of the laser beam; and / or, A beam splitter is configured to split the laser beam into several parts.

7. The laser processing equipment according to claim 2, characterized in that The laser emitter includes: at least one third lens configured to amplify the laser beam and then emit it to the material to be processed placed on the processing structure.

8. The laser processing equipment according to claim 7, characterized in that The laser processing equipment further includes: an adsorption device; the adsorption device is arranged on the processing structure, and a surface of the adsorption device is provided with a plurality of evenly arranged openings, which is configured to apply adsorption force to the material to be processed.

9. The laser processing equipment according to claim 8, characterized in that The laser processing equipment further includes: a dust removal device; the dust removal device is arranged on one side of the adsorption device and is configured to adsorb dust attached to the surface of the material to be processed after laser processing.

10. The laser processing equipment according to claim 9, characterized in that The laser processing equipment further includes: a display screen, a control module, and a plurality of control buttons; at least some of the control buttons are disposed on a side wall of the processing structure, connected to the control module, and configured to change the working state of the laser processing equipment; The display screen is arranged on a side of the fixing column away from the optical module, is connected to the control module, and is configured to display the working status of the laser processing equipment.

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