Assembly tool for semiconductor equipment

Abstract

The utility model discloses an assembly tool for semiconductor equipment, which relates to the technical field of semiconductor assembly tools, and comprises a first fixed seat, a second fixed seat arranged at the lower end of the first fixed seat, a third fixed seat arranged at the lower end of the second fixed seat, and a third fixed seat arranged at the lower end of the third fixed seat. A fourth fixing seat is arranged at the lower end of the third fixing seat, rotating lug seats are arranged on one side of the first fixing seat, one side of the second fixing seat, one side of the third fixing seat and one side of the fourth fixing seat, embedding grooves are formed in the rotating lug seats, and ball bearings are embedded in the embedding grooves; according to the scheme, the problems that when existing semiconductor wafers are assembled, most of the semiconductor wafers are fixed in a transverse fixing mode, so that the overall needed space is large, manual operation is not convenient, carrying and position adjustment are not easy, flexibility is poor, workers need to take out the semiconductor wafers from the interior of a mounting groove during discharging, and the working efficiency is high are solved. And the problem of inconvenient blanking is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor assembly tooling, in particular to an assembly tooling for semiconductor equipment. Background Art

[0002] Tooling, or process equipment, refers to the general term for various tools used in the manufacturing process. When semiconductor wafers are processed, they are assembled through tooling.

[0003] For example, the Chinese authorized patent with publication number CN217915210U (An assembly tool for semiconductor equipment) includes a cavity and a support body located on the side of the cavity, including: at least three arms for connecting to semiconductor equipment components to facilitate assembly, the arms including a first arm, a second arm, and a third arm, the first arm, the second arm, and the third arm being rotatably connected in sequence to perform a rotational motion, and the first arm, the second arm, and the third arm being plate-like bodies; wherein the first arm is connected to the support body; the first arm, the second arm, and the third arm each include a plurality of holes extending through the plate-like body, and in any one of the plate-like bodies, the area of the holes accounts for at least 55% of the area of the plate-like body. The assembly tool of this utility model can facilitate the removal or installation of semiconductor components.

[0004] However, when assembling existing semiconductor wafers, most of them are fixed by horizontal fixing, which results in a large overall space required, inconvenience for workers to operate, and difficulty in carrying and adjusting the position. The flexibility is poor, and workers also need to take out the materials from the inside of the installation slot, which makes unloading inconvenient. Therefore, it does not meet the existing needs. In this regard, we propose an assembly tool for semiconductor equipment. Utility Model Content

[0005] The purpose of the present utility model is to provide an assembly tool for semiconductor equipment to solve the problem that when assembling existing semiconductor wafers proposed in the above background technology, most of the semiconductor wafers are fixed in a horizontal manner, which results in a large overall space required, inconvenience for workers to operate, and is not easy to carry and adjust the position. The flexibility is poor, and unloading also requires workers to take it out from the inside of the installation slot, which makes unloading inconvenient.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: an assembly tool for semiconductor equipment, comprising: a first fixed seat, a second fixed seat is provided at the lower end of the first fixed seat, a third fixed seat is provided at the lower end of the second fixed seat, a fourth fixed seat is provided at the lower end of the third fixed seat, a rotating ear seat is provided on one side of the first fixed seat, an inlay groove is provided inside the rotating ear seat, a ball bearing is inlaid inside the inlay groove, the rotating ear seat is rotatably connected along the positioning column through the ball bearing, and a lifting assembly is provided inside the first fixed seat, the second fixed seat, the third fixed seat and the fourth fixed seat.

[0007] Preferably, the centers of the first fixing seat, the second fixing seat, the third fixing seat and the fourth fixing seat are each provided with an installation groove running through from top to bottom, the inner wall of the bottom opening of the installation groove is provided with a limiting inner ring, and the inner wall of the limiting inner ring is provided with an internal thread.

[0008] Preferably, the ejection assembly includes an adjustment seat and an upper limit plate, and the upper limit plate is welded and fixed to the adjustment seat. The outer wall of the adjustment seat is provided with an external thread, and the adjustment seat is threadedly connected to the internal thread through the external thread.

[0009] Preferably, a finger groove is provided on the lower surface of the adjustment seat, and the finger groove and the adjustment seat are an integral structure.

[0010] Preferably, an upper cover is provided on the top end of the positioning column, and the upper cover is fixed to the positioning column by threads, and the positioning column is tightly fixed to the ball bearing.

[0011] Preferably, a lower base is provided at the lower end of the positioning column, and the lower base is fixed to the positioning column by threads.

[0012] Preferably, a fixing hole is provided on the upper surface of the lower base, and the lower base is fixed to the ground via external bolts connected to the fixing hole.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] The utility model provides a rotatable first fixing seat, a second fixing seat, a third fixing seat and a fourth fixing seat, and the rotating ear seat is connected by a ball bearing and rotates along the positioning column, so that the directions of the first fixing seat, the second fixing seat, the third fixing seat and the fourth fixing seat can be adjusted, which is convenient for processing the semiconductor wafer from different directions, thereby improving the flexibility and convenience of processing. The first fixing seat, the second fixing seat, the third fixing seat and the fourth fixing seat are opened by rotation, and the vertical structure is convenient for storage, carrying and position adjustment, which solves the problem that when assembling existing semiconductor wafers, most of them are fixed in a horizontal fixing manner to fix multiple semiconductor wafers, which leads to a large overall space requirement, inconvenience for workers to operate, and difficulty in carrying and position adjustment, and poor flexibility.

[0015] By arranging a lifting component in the mounting groove, when unloading, the person puts his fingers into the finger groove, and then rotates the adjustment seat. The adjustment seat is connected to the internal thread through the external thread to achieve overall upward lifting, thereby driving the semiconductor wafer to move out of the mounting groove, making it easier for people to take it out. There is no need for people to reach into the mounting groove to pick up the edge of the semiconductor wafer, which prevents damage to the semiconductor wafer and improves safety and convenience of unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the overall structure of the utility model when viewed from above;

[0018] Figure 3 This is a schematic structural diagram of the first fixing seat of the utility model;

[0019] Figure 4 This is a bottom view of the structure of the top material assembly of the present invention;

[0020] In the figure: 1. First fixed seat; 2. Rotating ear seat; 3. Ball bearing; 4. Positioning column; 5. Upper cover; 6. Mounting slot; 7. Ejector assembly; 8. Lower base; 9. Fixing hole; 10. Limiting inner ring; 11. Internal thread; 12. Inlay groove; 13. Adjustment seat; 14. External thread; 15. Upper limit plate; 16. Finger groove; 17. Second fixed seat; 18. Third fixed seat; 19. Fourth fixed seat. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0022] See also Figure 1-4 , the utility model provides an embodiment: an assembly tool for semiconductor equipment, comprising: a first fixing seat 1, a second fixing seat 17 is provided at the lower end of the first fixing seat 1, a third fixing seat 18 is provided at the lower end of the second fixing seat 17, and a fourth fixing seat 19 is provided at the lower end of the third fixing seat 18, a rotating ear seat 2 is provided on one side of the first fixing seat 1, the second fixing seat 17, the third fixing seat 18 and the fourth fixing seat 19, the rotating ear seat 2 is provided with an inlay groove 12 inside, the inlay groove 12 is inlaid with a ball bearing 3, the rotating ear seat 2 is rotatably connected along the positioning column 4 through the ball bearing 3, the first fixing seat 1, the second fixing seat 17, the third fixing seat 18 and the fourth fixing seat 19 are all provided with a top material component 7, the top of the positioning column 4 is provided with an upper cover 5, and the upper cover 5 is threadedly fixed to the positioning column 4, and the positioning column 4 is tightly fixed to the ball bearing 3.

[0023] By rotating the second fixing seat 17, the third fixing seat 18 and the fourth fixing seat 19, the rotating ear seat 2 is connected by rotating along the positioning column 4 through the ball bearing 3, thereby realizing the direction adjustment of the first fixing seat 1, the second fixing seat 17, the third fixing seat 18 and the fourth fixing seat 19, which is convenient for processing the semiconductor wafer from different directions, improving the flexibility and convenience of processing, and the first fixing seat 1, the second fixing seat 17, the third fixing seat 18 and the fourth fixing seat 19 are opened by rotation, and are a vertical structure, which is convenient for storage, carrying and position adjustment.

[0024] See also Figure 1 、 3 4. The centers of the first fixing seat 1, the second fixing seat 17, the third fixing seat 18 and the fourth fixing seat 19 are all provided with a mounting groove 6 that passes through from top to bottom. The inner wall of the bottom opening of the mounting groove 6 is provided with a limiting inner ring 10. The inner wall of the limiting inner ring 10 is provided with an internal thread 11. The ejection assembly 7 includes an adjusting seat 13 and an upper limit plate 15, and the upper limit plate 15 is welded and fixed to the adjusting seat 13. The outer wall of the adjusting seat 13 is provided with an external thread 14, and the adjusting seat 13 is threadedly connected to the internal thread 11 through the external thread 14. A finger groove 16 is provided on the lower surface of the seat 13, and the finger groove 16 and the adjustment seat 13 are an integrated structure. When unloading, the person puts his finger into the finger groove 16, and then rotates the adjustment seat 13. The adjustment seat 13 is threadedly connected to the internal thread 11 through the external thread 14 to achieve overall upward push, thereby driving the semiconductor wafer to move out of the installation slot 6, which is convenient for people to take. There is no need for people to reach into the installation slot 6 to pick the edge of the semiconductor wafer, which prevents damage to the semiconductor wafer and improves safety and convenience of unloading.

[0025] See also Figure 1 、 2A lower base 8 is provided at the lower end of the positioning column 4, and the lower base 8 is threadedly fixed to the positioning column 4. A fixing hole 9 is provided on the upper surface of the lower base 8, and the lower base 8 is fixed to the ground through an external bolt in the fixing hole 9. The lower base 8 and the positioning column 4 are detachable, which is convenient for disassembly and carrying, thereby improving portability.

[0026] Working principle: When in use, the semiconductor wafer is placed into the mounting groove 6 of the first fixing seat 1, supported by the upper limit plate 15 of the lifting assembly 7, and when multiple semiconductor wafers need to be placed, the second fixing seat 17, the third fixing seat 18 and the fourth fixing seat 19 are rotated, and the rotating ear seat 2 is connected by the ball bearing 3 along the positioning column 4 to realize the direction adjustment of the first fixing seat 1, the second fixing seat 17, the third fixing seat 18 and the fourth fixing seat 19, so as to facilitate the processing of semiconductor wafers from different directions, improve the flexibility and convenience of processing, and through The first fixing seat 1, the second fixing seat 17, the third fixing seat 18 and the fourth fixing seat 19 are opened in a rotating manner, and are a vertical structure, which is convenient for storage, carrying and position adjustment. When unloading, the person puts his fingers into the finger groove 16, and then rotates the adjustment seat 13. The adjustment seat 13 is threadedly connected to the internal thread 11 through the external thread 14 to achieve overall upward push, thereby driving the semiconductor wafer to move out of the installation slot 6, which is convenient for people to take. People do not need to reach into the installation slot 6 to pick the edge of the semiconductor wafer, which prevents damage to the semiconductor wafer and improves safety and unloading convenience.

[0027] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. An assembly tool for semiconductor equipment, comprising a first fixing seat (1), characterized in that: A second fixed seat (17) is provided at the lower end of the first fixed seat (1), a third fixed seat (18) is provided at the lower end of the second fixed seat (17), and a fourth fixed seat (19) is provided at the lower end of the third fixed seat (18). A rotating ear seat (2) is provided on one side of the first fixed seat (1), the second fixed seat (17), the third fixed seat (18) and the fourth fixed seat (19). An inlay groove (12) is provided inside the rotating ear seat (2), and a ball bearing (3) is inlaid inside the inlay groove (12). The rotating ear seat (2) is rotatably connected along the positioning column (4) through the ball bearing (3). A top material assembly (7) is provided inside the first fixed seat (1), the second fixed seat (17), the third fixed seat (18) and the fourth fixed seat (19).

2. The assembly tool for semiconductor equipment according to claim 1, characterized in that: The centers of the first fixing seat (1), the second fixing seat (17), the third fixing seat (18) and the fourth fixing seat (19) are each provided with a mounting groove (6) extending therethrough, and the inner wall of the bottom opening of the mounting groove (6) is provided with a limiting inner ring (10), and the inner wall of the limiting inner ring (10) is provided with an internal thread (11).

3. The assembly tool for semiconductor equipment according to claim 2, characterized in that: The ejector assembly (7) includes an adjustment seat (13) and an upper limit plate (15), and the upper limit plate (15) is welded and fixed to the adjustment seat (13). The outer wall of the adjustment seat (13) is provided with an external thread (14), and the adjustment seat (13) is threadedly connected to the internal thread (11) through the external thread (14).

4. The assembly tool for semiconductor equipment according to claim 3, characterized in that: A finger groove (16) is provided on the lower surface of the adjustment seat (13), and the finger groove (16) and the adjustment seat (13) are an integrated structure.

5. The assembly tool for semiconductor equipment according to claim 1, characterized in that: An upper cover (5) is provided at the top end of the positioning column (4), and the upper cover (5) is threadedly fixed to the positioning column (4), and the positioning column (4) is tightly fixed to the ball bearing (3).

6. The assembly tool for semiconductor equipment according to claim 1, characterized in that: A lower base (8) is provided at the lower end of the positioning column (4), and the lower base (8) is threadedly fixed to the positioning column (4).

7. The assembly tool for semiconductor equipment according to claim 6, characterized in that: A fixing hole (9) is provided on the upper surface of the lower base (8), and the lower base (8) is fixed to the ground via external bolts in the fixing hole (9).

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