Packaging carrier tape of solid mucilage glue for assembling electronic components

Abstract

The utility model discloses a solid adhesive packaging carrier tape for assembling electronic components, which comprises a carrier tape body, a plurality of concave grooves arranged in the carrier tape body, bulges arranged in the grooves, avoiding grooves arranged on two sides of the bulges, and a plurality of positioning holes arranged on one side of the grooves on the carrier tape body. According to the utility model, the projection arranged in the groove facilitates the preliminary erection of the solid viscose, and the arranged avoiding groove facilitates the accommodation of the solid filling glue on the solid viscose, prevents the solid filling glue from being adhered to the inner wall of the avoiding groove, and facilitates the rapid suction of the solid viscose by the suction nozzle for use during use, thereby not affecting the overall production progress of the electronic equipment, and improving the production efficiency of the electronic equipment. And the practical value is very high.

Description

Technical Field

[0001] The utility model belongs to the technical field of carrier tapes, and in particular relates to a packaging carrier tape with solid adhesive for assembling electronic components. Background Art

[0002] During the production process of electronic devices, a solid adhesive is placed between the circuit board and the chip. The solid adhesive can firmly adhere the chip to the circuit board, ensuring the stability of its position. Since there is a small gap between the circuit board and the chip, double-sided tape is usually used to fill the small gap, making the contact between the chip and the circuit board closer, strengthening the mechanical connection between the two, and preventing the chip from loosening due to external forces. In the prior art, the solid filling glue is set at the bottom of the solid adhesive. When the solid adhesive is placed directly in the existing carrier tape (the part of the existing carrier tape where the solid adhesive is placed is a flat groove at the bottom), due to the viscosity of the solid filling glue, the solid adhesive sticks to the carrier tape groove, and the suction nozzle cannot quickly suck it out and use it, thereby affecting the overall production progress of the electronic device. Utility Model Content

[0003] In response to the problems raised in the background technology, the present utility model studies and designs a packaging carrier tape with solid adhesive for assembling electronic components. Its purpose is to provide a packaging carrier tape with solid adhesive for assembling electronic components that can quickly absorb the solid adhesive and does not affect the overall production progress of electronic equipment.

[0004] The technical solution of this utility model:

[0005] A packaging carrier tape with solid adhesive for assembling electronic components comprises a carrier tape body, a plurality of concave grooves arranged in the carrier tape body, a protrusion arranged in the groove, avoidance grooves arranged on both sides of the protrusion, and a plurality of positioning holes arranged on one side of the groove on the carrier tape body.

[0006] Preferably, the protrusion is arranged at a middle position in the groove.

[0007] Preferably, a plurality of concave grooves are equidistantly arranged in the carrier tape body.

[0008] Preferably, the width of the avoidance groove is greater than the width of the solid filling glue on the solid adhesive, so that the solid filling glue will not stick to the side wall of the groove.

[0009] Preferably, the positioning holes are located on the side between adjacent grooves on the carrier body.

[0010] Preferably, after the solid adhesive is placed in the groove, the carrier tape sealing film is attached to the side of the carrier tape body where the groove is provided, so as to seal the groove opening.

[0011] Preferably, the solid filling glue at the bottom of the solid adhesive is placed in the avoidance groove and does not contact the inner side of the avoidance groove.

[0012] Preferably, the width of the groove is 7.25 mm, the depth of the groove is 1.05 mm, the width of the protrusion is 1 mm, the distance between the top of the protrusion and the top of the groove is 0.9 mm, and the width of the avoidance groove is 2 mm.

[0013] Preferably, the diameter of the positioning holes is 1.4 mm to 1.6 mm, and the distance between adjacent positioning holes is 3.9 mm to 4.1 mm.

[0014] Preferably, the thickness of the carrier tape body is 0.3 mm.

[0015] The beneficial effects of the utility model: the utility model has a reasonable structure and novel design. The protrusion arranged in the groove is convenient for initially raising the solid adhesive. The avoidance groove is convenient for accommodating the solid filling glue on the solid adhesive, avoiding the solid filling glue from sticking to the inner wall of the avoidance groove. When in use, the suction nozzle can quickly suck out the solid adhesive and use it, thereby not affecting the overall production progress of the electronic equipment, and has high practical value. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the bottom-up structure of the present invention;

[0018] Figure 3 This is a left-side structural schematic diagram of the present utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the solid adhesive placed in the groove of the utility model.

[0020] Wherein: 1. carrier tape body, 2. groove, 3. protrusion, 4. avoidance groove, 5. positioning hole, 6. solid adhesive, 7. solid filling adhesive, 8. carrier tape sealing film. DETAILED DESCRIPTION

[0021] In order to further illustrate the technical means and effects adopted by the present invention to achieve the predetermined purpose of the utility model, the specific implementation method, structure, characteristics and effects of the present invention are described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0022] like Figures 1 to 3As shown, a packaging carrier tape with solid adhesive for assembling electronic components includes a carrier body 1, a plurality of concave grooves 2 arranged in the carrier body 1, a protrusion 3 arranged in the groove 2, avoidance grooves 4 arranged on both sides of the protrusion 3, and a plurality of positioning holes 5 arranged on one side of the groove 2 on the carrier body 1.

[0023] In this embodiment, Figure 1 、 Figure 3 As shown, the protrusion 3 is arranged in the middle position of the groove 2.

[0024] In this embodiment, Figure 1 、 Figure 2 As shown, a plurality of concave grooves 2 are equidistantly arranged in the carrier body 1 .

[0025] In this embodiment, Figures 1 to 3 As shown, the width of the avoidance groove 4 is greater than the width of the solid filling glue 7 on the solid adhesive 6, so that the solid filling glue 7 will not stick to the side wall of the groove 2.

[0026] In this embodiment, Figure 4 As shown, the two solid filling glues 7 are both centered on the solid adhesive 6 in the width direction, and the width of the solid filling glue 7 is smaller than the width of the solid adhesive 6.

[0027] In this embodiment, Figure 1 As shown, the positioning holes 5 are located on the side between adjacent grooves 2 on the carrier body 1 .

[0028] In this embodiment, Figure 2 、 Figure 3 As shown, after the solid adhesive 6 is placed in the groove 2 , the carrier sealing film 8 is attached to the side of the carrier body 1 where the groove 2 is set, so as to seal the opening of the groove 2 .

[0029] In this embodiment, the solid filling glue 7 at the bottom of the solid adhesive 6 is placed in the avoidance groove 4 and does not contact the inner side surface of the avoidance groove 4 .

[0030] In this embodiment, Figures 1 to 3 As shown, the width of the groove 2 is 7.25 mm, the depth of the groove 2 is 1.05 mm, the width of the protrusion 3 is 1 mm, the distance between the top of the protrusion 3 and the top of the groove 2 is 0.9 mm, and the width of the avoidance groove 4 is 2 mm.

[0031] In this embodiment, Figure 1 As shown, the diameter of the positioning holes 5 is 1.4 mm to 1.6 mm, and the distance between adjacent positioning holes 5 is 3.9 mm to 4.1 mm.

[0032] In this embodiment, Figure 2 、 Figure 3 As shown, the thickness of the carrier tape body 1 is 0.3 mm.

[0033] In this embodiment, Figure 4 As shown, the length of the solid adhesive 6 is 6.9 mm to 7.1 mm, the width of the solid adhesive is 0.95 mm to 1.05 mm, the distance between the two solid filling adhesives 7 is 2 mm, and the distance between the outer end of the solid filling adhesive 7 and the end of the solid adhesive 6 is 1.5 mm.

[0034] Specific usage process: In actual use, the positioning hole 5 of the carrier body 1 is made to coincide with the positioning hole of the suction nozzle, and the middle part of the solid adhesive 6 is placed on the protrusion 3 in the groove 2, so as to facilitate the initial erection of the solid adhesive 6. The solid filling adhesive 7 at the bottom of the solid adhesive 6 is placed in the avoidance groove 4 respectively. At this time, the solid filling adhesive 7 does not contact the inner wall of the avoidance groove 4. After the solid adhesive 6 is placed in the groove 2, the carrier sealing film 8 is attached to the side of the carrier body 1 where the groove 2 is set, and the opening of the groove 2 is sealed. When the solid adhesive 6 is needed in the production process of the electronic equipment, the carrier sealing film 8 on the surface of the groove 2 is uncovered, and the solid adhesive 6 is quickly sucked out by the suction nozzle for use, thereby not affecting the overall production progress of the electronic equipment, and having high practical value.

[0035] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to equivalent embodiments using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A packaging carrier tape with solid adhesive for assembling electronic components, characterized in that: The utility model comprises a carrier body and several concave grooves arranged in the carrier body, a protrusion is arranged in the groove, avoidance grooves are arranged on both sides of the protrusion, and several positioning holes are arranged on one side of the groove on the carrier body.

2. The packaging carrier tape with solid adhesive for assembling electronic components according to claim 1, characterized in that: The protrusion is arranged at a middle position in the groove.

3. The packaging carrier tape with solid adhesive for assembling electronic components according to claim 1, characterized in that: A plurality of concave grooves are equidistantly arranged in the carrier tape body.

4. The packaging carrier tape with solid adhesive for assembling electronic components according to claim 1, characterized in that: The width of the avoidance groove is greater than the width of the solid filling glue on the solid adhesive, so that the solid filling glue will not stick to the side wall of the groove.

5. The packaging carrier tape with solid adhesive for assembling electronic components according to claim 1, characterized in that: The positioning holes are located on the side edges between adjacent grooves on the carrier body.

6. The packaging carrier tape with solid adhesive for assembling electronic components according to claim 1, characterized in that: After the solid adhesive is placed in the groove, the carrier tape sealing film is attached to the side surface of the carrier tape body where the groove is provided, so as to seal the groove opening.

7. The packaging carrier tape with solid adhesive for assembling electronic components according to claim 1, characterized in that: The solid filling glue at the bottom of the solid adhesive is placed in the avoidance groove and does not contact the inner side of the avoidance groove.

8. The packaging carrier tape with solid adhesive for assembling electronic components according to claim 1, characterized in that: The width of the groove is 7.25 mm, the depth of the groove is 1.05 mm, the width of the protrusion is 1 mm, the distance between the top of the protrusion and the top of the groove is 0.9 mm, and the width of the avoidance groove is 2 mm.

9. The packaging carrier tape with solid adhesive for assembling electronic components according to claim 1, characterized in that: The diameter of the positioning holes is 1.4 mm to 1.6 mm, and the distance between adjacent positioning holes is 3.9 mm to 4.1 mm.

10. The packaging carrier tape with solid adhesive for assembling electronic components according to claim 1, characterized in that: The thickness of the carrier tape body is 0.3 mm.

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