Encapsulation module shell and encapsulation module

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and provides a potting module shell and a potting module, and the potting module shell comprises a shell body and a buckle assembly. The shell body is provided with an encapsulation cavity; the buckle assembly comprises a buckle and an enclosure piece, the buckle is arranged on the inner wall of the encapsulation cavity, the enclosure piece is connected to the inner wall of the encapsulation cavity and encloses the buckle in the circumferential direction, a gap is formed between the buckle and the enclosure piece, one end, in the first direction, of the buckle is a clamping end, and the other end, in the second direction, of the buckle is a clamping end; the end, close to the clamping end in the first direction, of the fence piece is a first end, and the first end of the fence piece is in an opening shape. According to the encapsulation module shell, the structure of the buckle is improved, so that the buckle is prevented from being in direct contact with the encapsulation material, the phenomenon of buckle breakage is improved, and the type selection range of the encapsulation material is expanded.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a potting module shell and a potting module. Background Art

[0002] The potting process is an important part of semiconductor manufacturing. Potting is the process of pouring liquid composite potting materials into devices containing electronic components and circuits, and curing them at room temperature or under heating conditions to form a thermosetting polymer insulation material with excellent performance.

[0003] In existing potted semiconductor modules, the potting module housing and the cover plate are matched with each other by means of snaps, and the snaps are directly exposed in the inner cavity of the potting module housing. When the potting material is injected into the inner cavity of the potting module housing, the snaps are in direct contact with the potting material.

[0004] The above-mentioned contact phenomenon will limit the range of movement of the buckle after the potting material solidifies, making the cover removal process difficult and easily causing the buckle to break; and the direct contact between the potting material and the buckle may corrode the buckle material, so the potting material can only be selected if it does not hinder the movement of the buckle or does not react and corrode the buckle, which restricts the choice of potting material.

[0005] To this end, the utility model provides a potting module housing and a potting module to improve the phenomenon of contact between the above-mentioned buckle and the potting material. Utility Model Content

[0006] The purpose of the utility model is to provide a potting module housing and a potting module. The potting module housing improves the structure of the buckle assembly to prevent the buckle from directly contacting the potting material. On the one hand, the movement of the buckle is not restricted by the potting material, which improves the phenomenon of buckle breakage and facilitates the disassembly and assembly of the cover. On the other hand, the buckle will not restrict the selection of the potting material, which expands the selection range of the potting material.

[0007] The utility model provides a potting module housing, comprising: a housing body and a buckle assembly;

[0008] The shell body has a potting cavity;

[0009] The buckle assembly includes a buckle and a surrounding piece, the buckle is arranged on the inner wall of the encapsulation cavity, the surrounding piece is connected to the inner wall of the encapsulation cavity and surrounds the buckle along the circumferential direction, there is a gap between the buckle and the surrounding piece, one end of the buckle along the first direction is a clamping end, the end of the surrounding piece along the first direction close to the clamping end is a first end, and the first end of the surrounding piece is open.

[0010] Optionally, the snap-on end of the buckle extends to the outside of the enclosure through the first end of the enclosure.

[0011] Optionally, the second end of the enclosure along the first direction is closed, and the end of the buckle opposite to the clamping end along the first direction is located inside the enclosure.

[0012] Optionally, the first end of the encapsulation cavity along the first direction is open, and the clamping end of the buckle extends toward the first end of the encapsulation cavity along the first direction.

[0013] Optionally, the snap-on end of the buckle extends out of the first end of the encapsulation cavity.

[0014] Optionally, the clip includes a card seat, a card body and a card protrusion, the card seat is connected to the inner wall of the encapsulation cavity, one end of the card body is connected to the card seat, the other end of the card body extends along the first direction and is connected to the card protrusion, the card protrusion protrudes from one side of the card body perpendicular to the first direction, and one end of the card body connected to the card protrusion serves as the card end.

[0015] Optionally, the enclosure includes an outer enclosure and two side enclosures, one end of the two side enclosures is connected to the inner wall of the encapsulation cavity, and the other end of the two side enclosures is respectively connected to the two ends of the outer enclosure along the second direction, and the second direction is parallel to the inner wall of the encapsulation cavity and perpendicular to the first direction.

[0016] Optionally, a first guide slope or a first transition curved surface is provided on the outer side of the connection between the outer stop and the side enclosure stop.

[0017] Optionally, a second guide slope or a second transition curved surface is provided on the inner side of the connection between the outer stopper and the side enclosure stopper.

[0018] The utility model also provides a potting module, which includes the potting module shell described above.

[0019] With such a configuration, the above-mentioned potting module housing can prevent the buckle from directly contacting the potting material by arranging a blocking piece around the buckle. There is also a gap between the blocking piece and the buckle, so that the movement of the buckle is not restricted by the potting material, thereby increasing the range of movement of the buckle, improving the phenomenon of buckle breakage, and reducing the stress at the buckle, thereby improving the product's ability to resist vibration and impact, and improving the reliability of the product. The increased range of movement of the buckle also facilitates the disassembly and assembly of the cover plate. At the same time, the buckle will not restrict the selection of potting materials, thereby expanding the selection range of potting materials, so that the potting materials are not limited to materials such as silicone gel. In addition, the setting of the opening structure of the blocking piece facilitates the cooperation between the buckle and the cover plate, thereby facilitating the disassembly and assembly of the cover plate, thereby improving the potting efficiency.

[0020] The above-mentioned potting module shell has improved fracture resistance and improved product reliability, which is beneficial to reducing the subsequent maintenance cost of the product and reducing the difficulty of demoulding, thereby reducing production cost and labor cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a structural diagram of a potting module housing according to an embodiment of the present invention;

[0022] Figure 2 The three-dimensional structure diagram of the buckle assembly of one embodiment of the present invention is shown in FIG. Figure 1 ;

[0023] Figure 3 The three-dimensional structure diagram of the buckle assembly of one embodiment of the present invention is shown in FIG. Figure 2 ;

[0024] Figure 4 This is a schematic cross-sectional view of a buckle assembly according to an embodiment of the present invention;

[0025] Figure 5 This is a schematic diagram of the three-dimensional structure of a buckle assembly according to another embodiment of the present invention. Figure 1 ;

[0026] Figure 6 This is a schematic diagram of the three-dimensional structure of a buckle assembly according to another embodiment of the present invention. Figure 2 ;

[0027] Figure 7 This is a schematic structural diagram of the potting module of the present invention.

[0028] Among them, in the accompanying drawings:

[0029] 10-housing body; 101-blocking; 11-potting cavity;

[0030] 20- buckle assembly; 21- buckle; 211- card seat; 212- card body; 213- card protrusion; 2131- guide slope; 22- enclosure; 221- outer block; 222- first side enclosure; 223- second side enclosure; 224- first guide slope; 225- second guide slope;

[0031] 30- heat dissipation base plate;

[0032] 40-cover plate;

[0033] 50-power module;

[0034] 60-potting material;

[0035] a-first direction; b-second direction; c-third direction. DETAILED DESCRIPTION

[0036] The following is a detailed description of the potting module housing and potting module proposed in the present invention, with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the accompanying drawings are highly simplified and not to exact scale, and are intended solely to facilitate and clarify the purpose of illustrating the embodiments of the present invention.

[0037] As used in the present invention, the singular forms "a", "an", and "the" include plural objects, the term "or" is generally used to include the meaning of "and / or", the term "several" is generally used to include the meaning of "at least one", and the terms "at least two" or "a plurality" are generally used to include the meaning of "two or more". In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features. In addition, as used in the present invention, "installed", "connected", "connected", and one element is "set" on another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used relative to the exemplary embodiments as they are shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.

[0038] The potting process is an important part of semiconductor manufacturing. Potting is the process of pouring liquid composite potting materials into devices containing electronic components and circuits, and curing them at room temperature or under heating conditions to form a thermosetting polymer insulation material with excellent performance.

[0039] In existing high-power potted semiconductor modules, the potting module housing and the cover plate are matched with each other by means of snaps, and the snaps are directly exposed in the inner cavity of the potting module housing. When the potting material is injected into the inner cavity of the potting module housing, the snaps are in direct contact with the potting material.

[0040] The above-mentioned contact phenomenon will limit the range of movement of the buckle after the potting material solidifies, making the cover removal process difficult and easily causing the buckle to break; and the direct contact between the potting material and the buckle may corrode the buckle material, so the potting material can only be selected if it does not hinder the movement of the buckle or does not react and corrode the buckle, which restricts the choice of potting material.

[0041] To this end, the utility model provides a potting module housing to improve the phenomenon of contact between the above-mentioned buckles and the potting material.

[0042] The potting module housing includes: a housing body 10 and a snap assembly 20;

[0043] The housing body 10 has a potting cavity 11 .

[0044] Please combine Figure 1 As shown, the housing body 10 has a hollow structure. In this embodiment, the outer contour of the housing body 10 is generally rectangular. The first direction a corresponds to the height of the housing body 10, the second direction b corresponds to the width of the housing body 10, and the third direction c corresponds to the length of the housing body 10. The first direction a, the second direction b, and the third direction c are mutually perpendicular. During normal potting use, the housing body 10 should be positioned so that the first direction a corresponds to the vertical direction.

[0045] Two baffles 101 are arranged in the inner cavity of the shell body 10 along its length direction (third direction c). Each baffle 101 extends along the width direction (second direction b) of the shell body 10. The two baffles 101 divide the inner cavity of the shell body 10 into three potting cavities 11. The three potting cavities 11 are arranged along the length direction (third direction c) of the shell body 10. The side walls of the baffles 101 serve as the inner walls of the potting cavities 11, for example Figure 1 The left side wall of the partition on the left side serves as the right side wall of the left potting cavity, and the right side wall of the partition on the left side serves as the left side wall of the middle potting cavity. Similarly, Figure 1 The right side wall of the partition located on the right side serves as the left side wall of the right potting cavity, and the left side wall of the partition located on the right side serves as the right side wall of the middle potting cavity.

[0046] Please refer to Figure 1 As shown, the inner wall of each potting cavity 11 is provided with a snap assembly 20. Along the third direction c, two sets of snap assemblies 20 are provided on the left side wall of the potting cavity 11 on the left, one set of snap assemblies 20 is provided on each of the left and right side walls of the potting cavity 11 in the middle, and two sets of snap assemblies 20 are provided on the right side wall of the potting cavity 11 on the right. This distribution of snap assemblies 20 creates six snap-in points per cover plate, ensuring uniform coverage of all three potting cavities 11 with a single cover plate, thereby improving potting efficiency.

[0047] In other alternative embodiments, the number of potting cavities 11 included in the housing body 10 and the number and distribution of the snap assemblies 20 can be adaptively adjusted based on actual usage requirements.

[0048] Please refer to Figure 1 As shown, functional structures such as grooves or protrusions are provided on the periphery of the shell body 10 and the block 101. The functional structures provided on the shell body 10 can be adaptively set based on its potting requirements.

[0049] Please refer to Figure 2 and Figure 3 As shown, the buckle assembly 20 includes a buckle 21 and a blocking member 22. The buckle 21 is arranged on the inner wall of the encapsulation cavity 11. The blocking member 22 is connected to the inner wall of the encapsulation cavity 11 and surrounds the buckle 21 along the circumferential direction. There is a gap between the buckle 21 and the blocking member 22. The gap is set to provide the buckle 21 with a certain movable space to facilitate the adaptive deformation of the buckle 21 when it is matched with or removed from the cover. The size of the gap should meet the activity requirements required for the normal use of the buckle 21.

[0050] One end of the buckle 21 along the first direction a is a clamping end ( Figure 2 The upper end of the middle buckle 21 is the clamping end), and the end of the enclosure 22 close to the clamping end along the first direction a is the first end ( Figure 2 The upper end of the middle enclosure member 22 is the first end), and the first end of the enclosure member 22 is open. The setting of the opening structure facilitates the buckle 21 to form an effective match with the cover plate.

[0051] The above-mentioned potting module housing can prevent the buckle 21 from directly contacting the potting material by arranging the enclosure 22 around the buckle 21. There is also a gap between the enclosure 22 and the buckle 21. The movement of the buckle 21 is not restricted by the potting material, which increases the range of movement of the buckle 21, improves the phenomenon of the buckle 21 breaking, and also reduces the stress at the buckle 21, thereby improving the product's ability to resist vibration and impact, and improving the reliability of the product. The increased range of movement of the buckle 21 also facilitates the disassembly and assembly of the cover plate. At the same time, the buckle will not restrict the selection of potting materials, and expands the selection range of potting materials, so that the potting materials are not limited to materials such as silicone gel. In addition, the opening structure of the enclosure 22 facilitates the cooperation between the buckle 21 and the cover plate, thereby facilitating the disassembly and assembly of the cover plate, thereby improving the potting efficiency.

[0052] The above-mentioned potting module shell has improved fracture resistance and improved product reliability, which is beneficial to reducing the subsequent maintenance cost of the product and reducing the difficulty of demoulding, thereby reducing production cost and labor cost.

[0053] Please continue to refer to Figure 2 As shown, in this embodiment, the snap-on end of the buckle 21 extends to the outside of the enclosure 22 through the first end of the enclosure 22. This structure allows the snap-on end to be located outside the enclosure 22 for easy engagement with the cover. In addition, during normal pouring, the liquid level of the pouring material is lower than the first end of the enclosure 22 ( Figure 2 The center is the upper end of the enclosure 22), so the enclosure 22 can still maintain the barrier effect on the pouring material.

[0054] During normal pouring, when the potting module housing is placed, the first direction a corresponds to the vertical direction. Therefore, during normal pouring, the clamping end of the buckle 21 extends vertically upward. At this time, when the material is poured into the potting cavity 11, the liquid level of the poured material should be ensured to be lower than the first end of the enclosure 22 to ensure that the potting material does not pass through the first end of the enclosure 22 ( Figure 2 The opening of the upper end of the middle enclosure member 22 is poured into the interior of the enclosure member 22 and contacts the buckle 21.

[0055] Please continue to refer to Figure 1 and Figure 2 As shown, in this embodiment, the encapsulation cavity 11 passes through the housing body 10 along the first direction a, that is, the first end of the encapsulation cavity 11 along the first direction a ( Figure 1 The upper end of the potting cavity 11 is open, and the second end ( Figure 1 The lower end of the potting cavity 11 is also open. During the potting process, the lower end of the housing body 10 is placed on the heat dissipation baseplate, which seals the lower end of the potting cavity 11 (the second end of the potting cavity 11). The semiconductor module is placed in the potting cavity 11 and the potting material is injected. The upper end of the housing body 10 is then covered with a cover plate, which is engaged with the snap assembly 20 and covers the upper end of the potting cavity 11 (the first end of the potting cavity 11).

[0056] Furthermore, the clamping end of the buckle 21 is moved along the first direction a toward the first end ( Figure 1 The upper end of the potting cavity 11) extends to one side. Please continue to refer to Figure 1 and Figure 2 As shown, the first end of the encapsulation cavity 11 ( Figure 1 The upper end of the potting cavity 11 is used for potting materials and for placing semiconductor modules. It is also used to cooperate with the cover plate. The clamping end of the buckle 21 is connected to the first end of the potting cavity 11 ( Figure 1 The direction of the upper end of the middle potting cavity 11 is kept consistent to facilitate the cooperation between the cover plate and the buckle 21.

[0057] The clamping end of the buckle 21 extends out of the first end of the potting cavity 11. Figure 1 and Figure 2As shown, the clamping end of the buckle 21 is higher than the first end of the potting cavity 11 ( Figure 1 The arrangement of this structure ensures that even when the potting cavity 11 is filled with potting material, the potting material will not contact the clamping end of the buckle 21, which is conducive to completely preventing the clamping end of the buckle 21 from contacting the potting material.

[0058] Please continue to refer to Figure 2 As shown, the upper end of the enclosure 22 (the first end of the enclosure 22) is flush with the upper end of the potting cavity 11 (the first end of the potting cavity 11). When the snap-on end of the clip 21 extends out of the upper end of the enclosure 22 (the first end of the enclosure 22), it means that the snap-on end of the clip 21 also extends out of the upper end of the potting cavity 11 (the first end of the potting cavity 11).

[0059] Please refer to Figure 3 and Figure 4 As shown, in this embodiment, the second end ( Figure 3 The lower end of the middle enclosure 22 is also open, and the end of the buckle 21 opposite to its clamping end ( Figure 3 and Figure 4 The lower end of the middle buckle 21 is located in the enclosure 22. Based on the limitation of the manufacturing process, the second end of the enclosure 22 ( Figure 3 A certain opening is reserved at the lower end of the middle enclosure 22, and the opening should be as small as possible to minimize the flow of the injected potting material from the lower end opening of the enclosure 22 into the enclosure 22. The size of the opening can be determined based on the viscosity of the potting material. When the viscosity of the potting material is greater, its fluidity is smaller, and it is more difficult for it to pass through the lower end opening of the enclosure 22. At this time, the opening can be appropriately increased.

[0060] In this embodiment, the engaging end of the buckle 21 is configured to extend upward along the first direction a to facilitate engagement with the cover. In alternative embodiments, the engaging end of the buckle 21 may extend along the second direction b. For example, the buckle 21 may be configured as a latch-like structure that is movable along the second direction b. The orientation of the engaging end of the buckle 21 may be adaptively adjusted based on the engagement between the engaging structure and the cover.

[0061] In this embodiment, the outer shell of the potting module has three potting cavities 11, and the buckle components 20 are all arranged on the inner wall of the potting cavity 11. It can be adapted to the existing structure of the outer shell body 10 and the existing cover plate structure, so as to minimize the impact on the existing outer shell body 10, the cover plate and the other component structures of the potting module, thereby reducing the improvement cost. In other alternative embodiments, the buckle components 20 can be arranged on the outer wall of the outer shell body 10. Since there are complex functional structures designed on the outside of the outer shell body 10, a systematic redesign of the overall structure of the outer shell body 10 is required at this time. In addition, in other alternative embodiments, the number of potting cavities 11 included in the outer shell body 10 can be adjusted adaptively according to actual usage requirements, and the installation position and distribution structure of the buckle components 20 can be changed adaptively based on the change in the number of potting cavities 11.

[0062] Please refer to Figure 2 and Figure 3 As shown in, the enclosure member 22 includes an outer enclosure 221 and two side enclosures. The two side enclosures are the first side enclosure 222 and the second side enclosure 223 respectively. The outer enclosure 221, the first side enclosure 222 and the second side enclosure 223 are integrally formed, and the enclosure member 22 formed by the three is integrally formed with the outer shell body 10.

[0063] The outer enclosure 221 is arranged parallel to the inner wall of the potting cavity 11. The first side enclosure 222 and the second side enclosure 223 are arranged parallel to each other and perpendicular to the inner wall of the potting cavity 11. The first side enclosure 222 and the second side enclosure 223 are connected to the inner wall of the potting cavity 11. The two ends of the outer enclosure 221 along the second direction b are respectively connected to the first side enclosure 222 and the second side enclosure 223.

[0064] The above-mentioned outer enclosure 221, first side enclosure 222 and second side enclosure 223 form an approximate "U" - shaped structure. The outer enclosure 221, first side enclosure 222 and second side enclosure 223 and the inner wall of the potting cavity 11 enclose an approximate cuboid chamber. A part of the buckle 21 is located in this chamber, and the clamping end of the buckle 21 extends out of this chamber. In addition, the outer enclosure 221, first side enclosure 222 and second side enclosure 223 do not contact the buckle 21, so that there is a certain gap between the outer enclosure 221, first side enclosure 222, second side enclosure 223 and the buckle 21, to ensure the normal movement range of the buckle 21.

[0065] In this embodiment, the outer retaining member 221, the first side panel 222, and the second side panel 223 are all planar plate structures. In alternative embodiments, the shapes of the outer retaining member 221, the first side panel 222, and the second side panel 223 can be flexibly adjusted based on actual usage requirements. For example, at least one of the outer retaining member 221, the first side panel 222, and the second side panel 223 can be configured as a curved surface structure. For example, if the outer retaining member 221 is configured as an arc-shaped plate structure, the outer retaining member 221, the first side panel 222, and the second side panel 223 can form a substantially U-shaped structure. At least one of the outer retaining member 221, the first side panel 222, and the second side panel 223 can also be configured as other known shapes, which will not be further described here.

[0066] In this embodiment, the outer wall 221 is parallel to the inner wall of the potting cavity 11, and the first side enclosure 222 and the second side enclosure 223 are perpendicular to the inner wall of the potting cavity 11. In other alternative embodiments, the outer wall 221 may be arranged at a certain angle to the inner wall of the potting cavity 11, and the angles between the outer wall 221, the first side enclosure 222, the second side enclosure 223, and the potting cavity 11 can be adaptively adjusted based on actual usage requirements.

[0067] Please continue to refer to Figure 2 and Figure 3 As shown, first guide bevels 224 are provided on the outer sides of the connection between the outer retainer 221 and the first side enclosure 222, as well as on the outer sides of the connection between the outer retainer 221 and the second side enclosure 223. This ensures that the outer sides of the connection between the outer retainer 221 and the side enclosures are non-perpendicular. This structural arrangement helps improve the overall mechanical properties of the enclosure 22. Furthermore, when potting material is injected into the potting cavity 11, it contacts the first guide bevels 224, facilitating separation of the potting material from the outer retainer 221 and, in turn, facilitating removal and demolding of the semiconductor module.

[0068] Furthermore, second guide bevels 225 are provided on the inner side of the connection between the outer perimeter stop 221 and the first side enclosure 222, as well as on the inner side of the connection between the outer perimeter stop 221 and the second side enclosure 223. The two first guide bevels 224 and the two second guide bevels 225 are arranged in pairs and in parallel. This ensures that the overall wall thickness of the enclosure 22 remains consistent, ensuring good overall consistency of the enclosure 22. The provision of the second guide bevels 225 also further improves the overall mechanical properties of the enclosure 22.

[0069] In other alternative embodiments, the first guide bevel 224 can be replaced by a first transition curved surface, and the second guide bevel 225 can be replaced by a second transition curved surface. The first transition curved surface and the second transition curved surface can be circular arc cylinders, elliptical arc cylinders, or free cylinders. The provision of the first transition curved surface and the second transition curved surface can also ensure good mechanical properties of the enclosure 22 as a whole, while facilitating the removal and demolding of the semiconductor module.

[0070] Please refer to Figure 4 As shown, the buckle 21 includes a clamping seat 211 , a clamping body 212 and a clamping protrusion 213 .

[0071] The card seat 211 is connected to the inner wall of the potting cavity 11, and the card seat 211 is located in the enclosure 22. The card seat 211 and the second end of the enclosure 22 ( Figure 3 The lower end of the middle enclosure member 22 is flush.

[0072] One end of the card body 212 is connected to the card base 211, and the other end of the card body 212 extends along the first direction a and is connected to the clamping protrusion 213. The clamping protrusion 213 protrudes from one side of the card body 212 perpendicular to the first direction a, wherein the end of the card body 212 connected to the clamping protrusion 213 serves as the clamping end.

[0073] The card body 212 does not contact the enclosure 22 and the inner wall of the potting cavity 11 , so the card body 212 can move perpendicular to the first direction a to facilitate the matching of the buckle 21 and the cover.

[0074] In this embodiment, the engaging protrusion 213 protrudes from the side of the engaging body 212 along the third direction c away from the inner wall of the potting cavity 11. In other alternative embodiments, the engaging protrusion 213 may protrude along the second direction b, as long as it protrudes perpendicular to the first direction a.

[0075] In this embodiment, a guide slope 2131 is provided on the side of the engaging protrusion 213, which is away from the inner wall of the potting cavity 11 along the third direction c. The arrangement of the guide slope 2131 gives the engaging protrusion 213 an overall approximately right-angled trapezoidal structure, with a smaller top and a larger bottom. The guide slope 2131 is used to guide the engaging protrusion 213 into the engaging hole in the cover plate, thereby achieving engagement with the engaging hole. In other alternative embodiments, the actual structure of the engaging protrusion 213 can be adaptively adjusted based on the engaging assembly structure with the cover plate.

[0076] In this embodiment, both sides of the card body 212 along the third direction c are configured as arc structures. The arc shape ensures that the card body 212 has a certain elastic deformation ability along the third direction c, thereby meeting its clamping requirements.

[0077] Please refer to Figure 5 and Figure 6 As shown, another embodiment of the buckle assembly 20 is shown. In this embodiment, the second end ( Figure 5 The lower end of the middle enclosure member 22 is closed, that is, the enclosure member 22 has only the first end ( Figure 5The upper end of the middle enclosure 22 is open. This structure completely blocks potting material from entering the enclosure 22 from below and coming into contact with the buckle 21. On the one hand, the movement of the buckle is not restricted by the potting material, which reduces the possibility of buckle breakage and facilitates the removal and assembly of the cover. On the other hand, the buckle does not restrict the choice of potting material, expanding the range of potting material selection.

[0078] Please continue to refer to Figure 5 and Figure 6 As shown, a portion of the enclosure 22 is integrated into the inner wall of the potting cavity 11, that is, a groove is formed in the potting cavity 11, and the two side walls of the groove serve as the first side enclosure 222 and the second side enclosure 223. The structure of the enclosure 22 can be flexibly adjusted based on the specific structure of the housing body 10.

[0079] Please refer to Figure 7 As shown, this embodiment further provides a potting module, which includes the potting module housing described above.

[0080] In addition, the potting module also includes a heat dissipation base plate 30 and a cover plate 40. The heat dissipation base plate 30 is arranged at the bottom of the shell body 10 to close the lower end of the potting cavity 11. The power module 50 is built into the potting cavity 11 and positioned. The power module 50 includes a chip and a connection layer, a lead and a substrate. The connection layer can be solder, sintered silver or conductive glue, etc. The lead can be aluminum wire, copper wire, gold wire, aluminum tape, copper tape, etc. The substrate can be DBC / AMB or other copper-clad insulating substrate. The potting material 60 is injected into the potting cavity 11. The potting material can be, for example, silicone gel, epoxy resin or other potting materials. The potting material does not contact the buckle 21, so the selection of the potting material is not affected by the buckle 21. The cover plate 40 covers the upper end of the shell body 10 to close the upper end of the encapsulation cavity 11, wherein a snap hole is opened on the cover plate 40, the snap end of the clip 21 passes through the snap hole, and the snap protrusion 213 is pressed on the upper surface of the cover plate 40 to realize the snap fixation of the cover plate 40. Since the clip 21 can undergo a certain elastic deformation, when the external force causes the clip 21 to elastically deform so that its snap protrusion 213 is aligned with the snap hole, the snap end of the clip 21 can be disengaged from the snap hole, and then the cover plate 40 can be removed.

[0081] It should be noted that the above content provides several implementation methods of the buckle assembly 20. The technical features in each implementation method are not strictly independent, and the technical features in each implementation method can also be used interchangeably.

[0082] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0083] The above description is only a description of the preferred embodiment of the present invention and does not limit the scope of the present invention. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A potting module housing, characterized in that: include: Shell body and snap assembly; The shell body has a potting cavity; The buckle assembly includes a buckle and a blocking piece, wherein the buckle is provided on the inner wall of the potting cavity, and the blocking piece is connected to the inner wall of the potting cavity and surrounds the buckle along the circumferential direction, with a gap between the buckle and the blocking piece; One end of the buckle along the first direction is a clamping end, one end of the enclosure member along the first direction close to the clamping end is a first end, and the first end of the enclosure member is open.

2. The potting module housing according to claim 1, wherein: The clamping end of the buckle extends to the outside of the enclosure through the first end of the enclosure.

3. The potting module housing according to claim 2, wherein: The second end of the enclosure along the first direction is closed, and the end of the buckle opposite to the clamping end along the first direction is located inside the enclosure.

4. The potting module housing according to claim 2, wherein: The first end of the encapsulation cavity along the first direction is open, and the clamping end of the buckle extends toward the first end of the encapsulation cavity along the first direction.

5. The potting module housing according to claim 4, wherein: The clamping end of the buckle extends out of the first end of the potting cavity.

6. The potting module housing according to any one of claims 1 to 5, characterized in that: The clip includes a card seat, a card body and a card protrusion, the card seat is connected to the inner wall of the encapsulation cavity, one end of the card body is connected to the card seat, the other end of the card body extends along the first direction and is connected to the card protrusion, the card protrusion protrudes from one side of the card body perpendicular to the first direction, and one end of the card body connected to the card protrusion serves as the card end.

7. The potting module housing according to claim 1, wherein: The enclosure includes an outer enclosure and two side enclosures, one end of the two side enclosures is connected to the inner wall of the encapsulation cavity, and the other ends of the two side enclosures are respectively connected to the two ends of the outer enclosure along the second direction, and the second direction is parallel to the inner wall of the encapsulation cavity and perpendicular to the first direction.

8. The potting module housing according to claim 7, wherein: A first guide slope or a first transition curved surface is provided on the outer side of the connection between the outer stop and the side enclosure stop.

9. The potting module housing according to claim 7, wherein: A second guide slope or a second transition curved surface is provided on the inner side of the connection between the outer stopper and the side enclosure stopper.

10. A potting module, characterized in that: The potting module comprises a potting module housing as described in any one of claims 1 to 9.

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