Silicon wafer cooling device
By designing a silicon wafer cooling device, using guide rails and drive devices to tilt and move the silicon wafer in the material frame, combining liquid replenishment and heating functions, the cooling and filming problems after degumming of the silicon wafer is solved, and the cleanliness and production efficiency of the silicon wafer are improved.
Patent Information
- Application Number
- CN202422337040.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-09-25
AI Technical Summary
In the prior art, the lack of effective cooling and film processing devices after degumming of silicon wafers, resulting in low production efficiency and low cleanliness of silicon wafers.
A silicon wafer cooling device including a cooling tank body, a sheet processing device and a driving device is designed. Through the cooperation of the guide rail and the driving device, the silicon wafer is tilted and moved inclinedly within the material frame for cooling and sheet processing, and combined with the liquid replenishment tube, the overflow tank body and the heating tube to achieve efficient cooling and cleaning.
It realizes efficient cooling and filming after degumming of silicon wafers, improves the cleanliness and production efficiency of silicon wafers, and ensures the cooling effect and the smooth progress of the filming process.
Smart Images
Figure CN223218265U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of silicon wafer production, in particular to a silicon wafer cooling device. Background Art
[0002] During the silicon wafer production process, a crystal ingot is bonded to a material holder, then cut into wafers using a cutting device. The wafers and the material holder are then placed together in a material frame, where they undergo a heating and debonding process along with the frame, allowing the wafers to be removed from the material holder. After debonding, the wafers need to be cooled and sorted, allowing them to converge toward one end of the frame to facilitate subsequent slicing and insertion. This utility model provides a silicon wafer cooling device for cooling and sorting silicon wafers after debonding. Utility Model Content
[0003] In order to solve the above technical problems, the utility model provides a silicon wafer cooling device, which effectively solves the cooling and wafer sorting problems after silicon wafer degumming and overcomes the shortcomings of the existing technology.
[0004] The technical solution adopted by the utility model is: a silicon chip cooling device, comprising:
[0005] Cooling tank with guide rails inside;
[0006] a wafer sorting device, disposed on the guide rail, for placing a material frame loaded with silicon wafers and movably connected to the guide rail;
[0007] The driving device is arranged outside the cooling trough body and connected to one end of the wafer sorting device. It can drive the connection end of the wafer sorting device to move upward, so that the wafer sorting device moves tiltedly along the guide rail, so that the silicon wafers are retracted toward the end of the material frame away from the driving device.
[0008] Furthermore, the film arrangement device includes:
[0009] A sheet sorting bracket, used for placing the material frame, is arranged between the guide rails, and one end of the sheet sorting bracket is connected to the driving device;
[0010] The rollers are arranged on both sides of the sheet-sorting bracket and are rotatably connected to the sheet-sorting bracket. The driving device can drive the sheet-sorting bracket to tilt, so that the rollers roll along the guide rails.
[0011] Furthermore, the guide rail includes a horizontal guide plate and a side guide plate, the side guide plate is arranged on the horizontal guide plate and is opposite to the side of the sheet sorting bracket, the sheet sorting bracket is arranged between the horizontal guide plates, and the roller can roll along the horizontal guide plate.
[0012] Furthermore, first guiding devices are provided on both sides of the sheet sorting bracket relative to the side guide plates, and the first guiding devices can move along the side guide plates.
[0013] Furthermore, a connecting bracket is provided at one end of the sheet sorting bracket close to the driving device, which is rotatably connected to the connecting bracket. The connecting bracket is mounted on the cooling trough body and connected to the driving device, and the driving device can drive the connecting bracket to move up and down.
[0014] Furthermore, a second guide device is provided on a side of the connecting bracket close to the inner wall of the cooling tank body, and the second guide device can move along the inner wall of the cooling tank body.
[0015] Furthermore, the cooling trough body is provided with a guide column on the outside of one side of the driving device, the top of the guide column is connected to the connecting bracket, the guide column is slidably connected to the cooling trough body, and the driving device can drive the guide column to slide up and down.
[0016] Furthermore, a fluid replenishing tube is provided in the cooling tank body, and an overflow tank body is provided on the side of the cooling tank body away from the fluid replenishing tube. The fluid replenishing tube is used to replenish cooling water into the cooling tank body so that the cooling water in the cooling tank body overflows into the overflow tank body.
[0017] Furthermore, a heating pipe is provided inside the cooling tank body for adjusting the temperature of the cooling water.
[0018] Furthermore, the driving device is configured as a driving cylinder, and a shaft of the driving cylinder is sleeved with a collar for adjusting the stroke of the driving shaft.
[0019] The advantages and positive effects of the utility model are as follows: due to the adoption of the above technical solution, the cooling and sorting of silicon wafers after degumming are realized, the cooling and sorting effects are guaranteed, the cleanliness of the silicon wafers is improved, and the production efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 This is a schematic diagram of the overall structure of a silicon wafer cooling device according to an embodiment of the present utility model.
[0021] Figure 2 This is a schematic diagram of the overall structure of a silicon wafer cooling device according to an embodiment of the present utility model.
[0022] Figure 3 This is a schematic structural diagram of a silicon wafer cooling device and a wafer sorting device according to an embodiment of the present invention.
[0023] Figure 4 This is a tilted schematic diagram of a silicon wafer cooling device and a wafer sorting device according to an embodiment of the present invention.
[0024] In the picture:
[0025] 10. Cooling trough 11. Support frame 12 horizontal guide plate
[0026] 13. Side guide plate 14. Guide rod 15. Drain port
[0027] 16. Slag cleaning port 20. Sheet sorting device 21. Sheet sorting bracket
[0028] 22, roller 23, connecting shaft 24, positioning plate
[0029] 25. First guide device 30, driving device 31, guide column
[0030] 32, sleeve 33, collar 40, connecting bracket
[0031] 41. Second guide device 50, fluid infusion tube 60, heating tube
[0032] 70, temperature sensor 80, slag removal drawer 90, overflow tank DETAILED DESCRIPTION
[0033] An embodiment of the present utility model provides a silicon wafer cooling device, which will be described below with reference to the accompanying drawings.
[0034] In the description of the embodiments of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "top", "bottom", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, it should be noted that, unless otherwise clearly stipulated and limited, the terms "setting" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be a communication between the internal parts of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood based on specific circumstances.
[0035] like Figure 1 and Figure 2As shown, an embodiment of the utility model provides a silicon wafer cooling device, comprising a cooling trough body 10, a wafer sorting device 20 and a driving device 30. After degumming, the silicon wafer is placed in a material frame, and the material frame loaded with silicon wafers is placed in the cooling trough body 10. The cooling trough body 10 is filled with cooling water to cool the degummed silicon wafer. A support frame 11 is fixed inside the cooling trough body 10, and relatively arranged guide rails are fixed on the support frame 11. The wafer sorting device 20 is arranged inside the cooling trough body 10, for placing the material frame loaded with silicon wafers, and is arranged on the guide rail, movably connected to the guide rail, and can move along the guide rail. The driving device 30 is fixed to the outside of the cooling trough body 10, and is connected to one end of the wafer sorting device 20. It can drive the connecting end of the wafer sorting device 20 to move upward, so that the wafer sorting device 20 is tilted and moves along the guide rail, so that the silicon wafers are gathered toward the end of the material frame away from the driving device 30.
[0036] Specifically, such as Figure 3 and Figure 4 As shown, the wafer sorting device 20 includes a wafer sorting bracket 21 and rollers 22. The wafer sorting bracket 21 is used to place the material frame. One end of the wafer sorting bracket 21 is connected to a driving device 30. The rollers 22 are arranged on both sides of the wafer sorting bracket 21 and are rotatably connected to the wafer sorting bracket 21. The driving device 30 can drive the wafer sorting bracket 21 to tilt, causing the rollers 22 to roll along the guide rails. In this embodiment, the wafer sorting bracket 21 is a rectangular frame arranged between oppositely arranged guide rails. A connecting shaft 23 is fixed to the wafer sorting bracket 21, and the rollers 22 are rotatably connected to both ends of the connecting shaft 23. The driving device 30 is connected to one end of the wafer sorting bracket 21 and can drive the connecting end of the wafer sorting bracket 21 to move upward, causing the end of the material frame away from the driving device 30 to tilt downward, thereby causing the silicon wafers to converge toward the end of the material frame away from the driving device 30. During the tilting process of the wafer sorting bracket 21, the rollers 22 move along the guide rails.
[0037] Preferably, a positioning plate 24 is fixed to the upper portion of the sheet sorting bracket 21 . The positioning plate 24 is provided along the four sides of the material frame to position the material frame and prevent the material frame from falling off the sheet sorting bracket 21 when the sheet sorting bracket 21 is tilted.
[0038] Preferably, the guide rail includes a horizontal guide plate 12 and a side guide plate 13. The side guide plate 13 is disposed on the horizontal guide plate 12 and is disposed opposite to the side of the sheet sorting bracket 21. The sheet sorting bracket 21 is disposed between the horizontal guide plates 12, and the roller 22 can roll along the horizontal guide plate 12. In this embodiment, the horizontal guide plate 12 is fixed to the support frame 11, and the side guide plate 13 is vertically fixed to the horizontal guide plate 12 and is disposed opposite to the side of the sheet sorting bracket 21 to prevent the sheet sorting bracket 21 from falling off the guide rail.
[0039] Preferably, a first guide device 25 is provided on both sides of the sheet sorting bracket 21 at positions relative to the side guide plates 13, and the first guide device 25 can move along the side guide plates 13. In this embodiment, the first guide device 25 is specifically a universal ball follower, which is provided near the driving device 30. When the driving device 30 drives the connecting end of the sheet sorting bracket 21 to move upward, the first guide device 25 moves along the side guide plates 13, causing the sheet sorting bracket 21 to tilt. Since the first guide device 25 will disengage from the side guide plates 13 after the sheet sorting bracket 21 tilts to a certain angle, a plurality of first guide devices 25 can be provided. The universal ball follower is a prior art, and the specific structure will not be described in detail here.
[0040] Specifically, a connecting bracket 40 is provided at one end of the sheet sorting bracket 21 near the drive device 30, and is rotatably connected to the connecting bracket 40. The connecting bracket 40 is mounted on the cooling trough body 10 and connected to the drive device 30, and the drive device 30 can drive the connecting bracket 40 to move up and down. In this embodiment, the connecting bracket 40 is an inverted L-shaped bracket. The vertical portion of the connecting bracket 40 is rotatably connected to the end of the sheet sorting bracket 21 using a bearing, and the horizontal portion of the connecting bracket 40 is mounted on the top of the cooling trough body 10 and connected to the drive device 30.
[0041] Preferably, a second guide device 41 is provided on a side of the connecting bracket 40 near the inner wall of the cooling trough body 10. The second guide device 41 can move along the inner wall of the cooling trough body 10. In this embodiment, the second guide device 41 is specifically a universal ball follower. To facilitate the movement of the second guide device 41 along the cooling trough body 10, a guide rod 14 is fixed to the inner wall of the cooling trough body 10 relative to the second guide device 41. When the driving device 30 drives the connecting bracket 40 to move up and down, the second guide device 41 can move up and down along the guide rod 14.
[0042] Preferably, Figure 2 As shown, the cooling trough body 10 is provided with a guide column 31 on the outside of one side of the driving device 30. The top of the guide column 31 is connected to the connecting bracket 40. The guide column 31 is slidably connected to the cooling trough body 10, and the driving device 30 can drive the guide column 31 to slide up and down. The specific number of guide columns 31 is not limited. In this embodiment, two vertical guide columns 31 are provided, and a sleeve 32 is fixed on the outside of the cooling trough body 10 relative to the position of the guide column 31. The sleeve 32 is sleeved on the outside of the guide column 31 and is slidably connected to the guide column 31. The top of the guide column 31 is fixedly connected to the horizontal part of the connecting bracket 40. When the driving device 30 drives the connecting bracket 40 to move up and down, it drives the guide column 31 to slide up and down along the sleeve 32.
[0043] Preferably, Figure 2As shown, a refill tube 50 is provided in the cooling tank body 10, and an overflow tank body 90 is provided on the side of the cooling tank body 10 away from the refill tube 50. The refill tube 50 is used to replenish cooling water into the cooling tank body 10, causing the cooling water in the cooling tank body 10 to overflow into the overflow tank body 90. In this embodiment, the refill tube 50 is fixed to the bottom of the cooling tank body 10, and multiple liquid outlet holes are evenly distributed along the refill tube 50. Cooling water is replenished in the cooling tank body 10 through the refill tube 50, causing the cooling water in the cooling tank body 10 to overflow into the overflow tank body 90, removing impurities in the silicon wafers, thereby further cleaning the silicon wafers.
[0044] Preferably, Figure 1 As shown, a heating pipe 60 is provided inside the cooling tank 10 to regulate the temperature of the cooling water. During the actual cooling process, in order to avoid affecting the performance of the silicon wafer, the cooling water needs to be heated to a certain temperature. The heating pipe 60 and a temperature sensor 70 are fixed inside the cooling tank 10 to control the temperature of the cooling water.
[0045] Preferably, Figure 1 As shown, a slag cleaning drawer 80 is provided at the bottom of the cooling trough 10 for filtering slag. The slag cleaning drawer 80 is detachably connected to the cooling trough 10, making it easy to remove and clean. In this embodiment, the bottom of the cooling trough 10 is an inclined surface. A recess is provided at the lower end of the inclined surface for accommodating the slag cleaning drawer 80. The slag cleaning drawer 80 is provided with a filter hole, and a drain port 15 is provided at the bottom of the recess. Cooling water flows through the inclined surface to the slag cleaning drawer 80, where it is filtered and discharged through the drain port 15. At one end of the slag cleaning drawer 80, a slag cleaning port 16 is provided on the side wall of the cooling trough 10. The slag cleaning drawer 80 can be removed from the cooling trough 10 for cleaning. A slag cleaning port cover is mounted on the slag cleaning port 16 via a clamp, making the cover easily removable and facilitating access to the slag cleaning drawer 80.
[0046] Preferably, Figure 2 As shown, the drive device 30 is configured as a drive cylinder, specifically a dual-axis, double-action, stroke-adjustable cylinder. To adjust the stroke of the cylinder drive shaft, multiple collars 33 are mounted on the drive shaft. By increasing or decreasing the number of collars 33, the drive shaft stroke can be adjusted, changing the tilt angle of the wafer unscrambling device 20, thereby facilitating wafer unscrambling. Dual-axis, double-action, stroke-adjustable cylinders are known in the art, and their specific structure is not described here.
[0047] The advantages and positive effects of the utility model are:
[0048] 1. It realizes the cooling and sorting of silicon wafers after degumming, ensures the cooling and sorting effects, and improves production efficiency;
[0049] 2. The first guide device and the second guide device are provided to ensure the normal operation of the film sorting device;
[0050] 3. By setting up a liquid replenishment pipe and an overflow tank, the silicon wafer is cooled and cleaned at the same time, further improving the cleanliness of the silicon wafer;
[0051] 4. By setting up a detachable slag cleaning drawer, the blockage of the drain port is reduced.
[0052] The above embodiments of the present invention are described in detail. However, the above contents are only preferred embodiments of the present invention and should not be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.
Claims
1. A silicon wafer cooling device, characterized in that: include: Cooling tank with guide rails inside; a wafer sorting device, disposed on the guide rail, for placing a material frame loaded with silicon wafers and movably connected to the guide rail; The driving device is arranged outside the cooling trough body and connected to one end of the wafer sorting device. It can drive the connection end of the wafer sorting device to move upward, so that the wafer sorting device moves tiltedly along the guide rail, so that the silicon wafers are retracted toward the end of the material frame away from the driving device.
2. The silicon wafer cooling device according to claim 1, wherein: The film handling device includes: A sheet sorting bracket, used for placing the material frame, is arranged between the guide rails, and one end of the sheet sorting bracket is connected to the driving device; The rollers are arranged on both sides of the sheet-sorting bracket and are rotatably connected to the sheet-sorting bracket. The driving device can drive the sheet-sorting bracket to tilt, so that the rollers roll along the guide rails.
3. The silicon wafer cooling device according to claim 2, characterized in that: The guide rail includes a horizontal guide plate and a side guide plate. The side guide plate is arranged on the horizontal guide plate and is opposite to the side of the sheet sorting bracket. The sheet sorting bracket is arranged between the horizontal guide plates. The roller can roll along the horizontal guide plate.
4. The silicon wafer cooling device according to claim 3, characterized in that: First guiding devices are provided at positions on both sides of the sheet sorting bracket relative to the side guide plates, and the first guiding devices can move along the side guide plates.
5. A silicon wafer cooling device according to any one of claims 2 to 4, characterized in that: The sheet sorting bracket is provided with a connecting bracket at one end close to the driving device, which is rotatably connected to the connecting bracket. The connecting bracket is placed on the cooling trough body and connected to the driving device. The driving device can drive the connecting bracket to move up and down.
6. The silicon wafer cooling device according to claim 5, characterized in that: A second guide device is provided on a side of the connecting bracket close to the inner wall of the cooling tank body, and the second guide device can move along the inner wall of the cooling tank body.
7. The silicon wafer cooling device according to claim 5, characterized in that: A guide column is provided on the outside of one side of the cooling trough body provided with the driving device, the top of the guide column is connected to the connecting bracket, the guide column is slidably connected to the cooling trough body, and the driving device can drive the guide column to slide up and down.
8. A silicon wafer cooling device according to any one of claims 1-4 and 6-7, characterized in that: A fluid replenishing pipe is provided in the cooling tank body, and an overflow tank body is provided on a side of the cooling tank body away from the fluid replenishing pipe. The fluid replenishing pipe is used to replenish cooling water into the cooling tank body so that the cooling water in the cooling tank body overflows into the overflow tank body.
9. The silicon wafer cooling device according to claim 8, characterized in that: A heating pipe is provided inside the cooling tank body for adjusting the temperature of the cooling water.
10. A silicon wafer cooling device according to any one of claims 1-4, 6-7 and 9, characterized in that: The driving device is configured as a driving cylinder, and a shaft of the driving cylinder is sleeved with a collar for adjusting the stroke of the driving shaft.