Efficient heat transfer radiator
By adopting a 3D structure combining VC substrate with copper tube in the exchange chip radiator, the heat conduction of water is carried out by using the vaporization and condensation cycle of water, the problem of insufficient heat dissipation under high power consumption is solved, and a more efficient heat dissipation effect is achieved, the chip temperature is reduced and the risk of high temperature is eliminated.
Patent Information
- Application Number
- CN202422219319.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-10
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-09-10
AI Technical Summary
The heat sinks of existing switching chips are insufficient in heat dissipation under high power consumption conditions, resulting in the chip temperature approaching the limit and there is a risk of heat dissipation.
A high-efficiency heat transfer radiator is designed, using a 3D structure combining VC substrates with copper tubes. The copper tubes are equipped with capillary structures, and aluminum fins form heat dissipation voids, which conduct heat through the vaporization and condensation cycle of water, and take away heat with the system airflow.
It improves heat conduction efficiency, reduces the temperature of the exchange chip, eliminates the risk of high temperature, and significantly improves the heat dissipation effect.
Smart Images
Figure CN223218296U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of switch radiators, and particularly relates to a high-efficiency heat transfer radiator. Background Art
[0002] With the rapid development of informatization, various communication devices have been continuously upgraded, and switch equipment has also been gradually updated. Due to the significant increase in power consumption of switch chips, the layout of motherboard components has become increasingly compact, making heat dissipation increasingly difficult.
[0003] The existing 2U heat sink designed for switching chips has reached the maximum size, such as Figure 1 The radiator uses a VC substrate, heat pipes, and aluminum fins. The VC substrate and heat pipes use a separate heat dissipation structure. Since the power consumption of the switching chip reaches 800W, the radiator performance still cannot meet the requirements. After thermal simulation evaluation, Figure 7 As shown in the figure, the junction temperature of the switch chip reaches 104°C, which is very close to its maximum temperature of 105°C. This poses a risk to the chip's heat dissipation. Therefore, a more efficient heat sink is urgently needed to solve this problem. Utility Model Content
[0004] The purpose of this utility model is to solve the problem of insufficient heat dissipation in the prior art and to propose a high-efficiency heat transfer radiator. This high-efficiency heat transfer radiator can improve heat transfer efficiency and reduce the risk of heat dissipation of the switching chip.
[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:
[0006] A high-efficiency heat transfer radiator is designed, comprising a VC substrate. A protruding chip connection socket is provided in the middle of one side of the VC substrate, and a fixing plate is provided on the other side. The VC substrate is filled with a heat dissipation medium. Multiple vertically arranged copper tubes are evenly distributed on the fixing plate. One end of the copper tube, located on the fixing plate, communicates with the inner cavity of the VC substrate, while the other end is sealed. Capillary structures are provided within the copper tubes, extending into the inner cavity of the VC substrate. A multi-layered aluminum sheet is provided above the fixing plate, and the copper tubes are disposed through the aluminum sheet.
[0007] Furthermore, the copper tube is set on the fixed plate by welding, and forms a VC substrate with a 3D structure with the VC substrate.
[0008] Furthermore, the capillary structure in the copper tube is a capillary tube, and the capillaries are evenly distributed and fixed on the inner wall of the copper tube.
[0009] Furthermore, downward folded edges are provided at both ends of the aluminum flaps as support portions between adjacent aluminum flaps, so that heat dissipation gaps are formed between adjacent aluminum flaps.
[0010] The utility model proposes a high-efficiency heat transfer radiator with the following beneficial effects: the utility model has high heat transfer efficiency and good heat dissipation effect, which can effectively reduce the temperature of high-power chips, ensure chip heat dissipation, and eliminate the risk of high temperature. Specifically, when the radiator is in operation, the heat of the switching chip is transferred to the bottom of the VC substrate through the thermal interface material. The water inside the VC substrate vaporizes after being heated. The vaporized water carries the heat along the VC substrate and the internal passages of the copper tubes to various areas. Because the VC substrate is connected to the interior of all copper tubes, the vaporized water quickly carries the heat to the far end of the VC and the end of the copper tube. When the vaporized water encounters the relatively low temperature of the far end of the VC and the end of the copper tube, it condenses into water. The cold water flows back to the bottom of the VC substrate along the capillary structure of the copper tubes and the VC base. Through the continuous cycle of vaporization and condensation of the water inside the VC base, the heat of the switching chip is efficiently and continuously transferred to the aluminum fins, achieving the purpose of rapid heat transfer. The heat is then removed by the system airflow, thereby ensuring relatively uniform overall temperature and higher heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:
[0012] Figure 1 It is a perspective structural diagram of an existing 2U radiator;
[0013] Figure 2 It is a schematic diagram of the three-dimensional structure of the utility model;
[0014] Figure 3 It is a side view of the utility model;
[0015] Figure 4 It is a schematic diagram of the bottom structure of the utility model;
[0016] Figure 5 It is a schematic diagram of the internal structure of the utility model;
[0017] Figure 6 It is an enlarged schematic diagram of the internal structure of the copper tube in the present invention;
[0018] Figure 7 This is a thermal simulation evaluation diagram of an existing 2U radiator;
[0019] Figure 8 This is a thermal simulation evaluation diagram of the radiator of the utility model;
[0020] The following are marked in the figure: 1. VC substrate; 11. Chip connector; 2. Fixing plate; 3. Copper tube; 31. Capillary; 4. Aluminum flap; 41. Folded edge. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0022] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.
[0023] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "mounted / connected," and "connected" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to the specific circumstances.
[0024] The structural features of the present invention are now described in detail with reference to the accompanying drawings.
[0025] See also Figure 2-Figure 6 A high-efficiency heat transfer heat sink comprises a VC substrate 1. An outwardly protruding chip connector 11 is provided in the middle of one side of the VC substrate 1, and a fixing plate 2 is provided on the other side. During installation, the chip connector 11 is tightly connected to the chip, with a heat-conducting medium interposed between them. The VC substrate 1 is filled with the heat dissipation medium, which is water. Multiple vertically arranged copper tubes 3 are evenly distributed on the fixing plate 2. The copper tubes 3 are welded to the fixing plate 2, forming a 3D structure with the VC substrate 1. One end of the copper tube 3, located on the fixing plate 2, communicates with the inner cavity of the VC substrate 1, while the other end is sealed. Water or water vapor within the VC substrate 1 can enter the copper tube 3. When the water vapor rises into the copper tube 3, its temperature drops and condenses into water, which then flows back into the VC substrate 1.
[0026] In order to increase the condensation area in the copper tube 3 , a capillary structure is provided in the copper tube 3 , which extends into the inner cavity of the VC substrate 1 . Specifically, the capillary structure in the copper tube 3 is a capillary tube 31 , which is evenly distributed and fixed on the inner wall of the copper tube 3 .
[0027] A multi-layer aluminum flap 4 is provided above the fixed plate 2, and the copper tube 3 is arranged through the aluminum flap 4. The two ends of the aluminum flap 4 are provided with downward folded edges 41 as support parts between adjacent aluminum flaps 4, so that a heat dissipation gap is formed between adjacent aluminum flaps 4, and the heat of the multi-layer aluminum flap 4 is taken away by the heat dissipation fan.
[0028] The high-efficiency heat transfer radiator of this utility model has high heat transfer efficiency and good heat dissipation effect. It can effectively reduce the temperature of high-power chips, ensure chip heat dissipation, and eliminate the risk of high temperature. Specifically, when the radiator is in use, the heat of the exchange chip is transferred to the bottom of the VC substrate 1 through the thermal interface material. After being heated, the water inside the VC substrate 1 vaporizes. The vaporized water carries the heat along the internal passages of the VC substrate 1 and the copper tube 3 to various areas. Because the VC substrate 1 is connected to the interior of all copper tubes 3, the vaporized water quickly carries the heat to the far end of the VC substrate 1 and the end of the copper tube 3. When the vaporized water encounters the relatively low temperature of the far end of the VC substrate 1 and the end of the copper tube 3, it condenses into water. The cold water flows back to the bottom of the VC substrate 1 along the capillary structure inside the copper tube 3 and the VC substrate 1. The copper tube 3 then transfers the heat to the aluminum fins 4, which are then carried away by the airflow. Through the continuous cycle of water vaporization and condensation within the VC substrate 1 and copper tubes 3, heat from the switching chip is efficiently and continuously transferred to the aluminum fins 4, rapidly transferring the heat, which is then removed by the system airflow. Because the VC substrate 1 is connected to the interior of all copper tubes 3, the temperature difference between the VC substrate 1 and the copper tubes 3 is minimal, ensuring relatively uniform overall temperature and more efficient heat dissipation.
[0029] See also Figure 8 The thermal simulation results of the high-efficiency heat transfer radiator are as follows: Figure 7 As shown in the figure, the shell temperature of the switch chip dropped to 89.4°C, and the junction temperature of the switch chip also dropped to 97.5°C, which is about 6°C lower than the existing 2U radiator. The shell temperature of the switch chip dropped by 6.3%, effectively reducing the heat dissipation risk.
[0030] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.
Claims
1. A high-efficiency heat transfer radiator, comprising a VC substrate (1), wherein a chip connection seat (11) protruding outward is provided in the middle of one side of the VC substrate (1), and a fixing plate (2) is provided on the other side. The VC substrate (1) is filled with a heat dissipation water medium, and is characterized in that: A plurality of vertically arranged copper tubes (3) are evenly distributed on the fixed plate (2); one end of the copper tube (3) located on the fixed plate (2) is connected to the inner cavity of the VC substrate (1), and the other end is a sealed end; A capillary structure is provided in the copper tube (3), and the capillary structure extends into the inner cavity of the VC substrate (1); A multi-layered aluminum flap (4) is provided above the fixing plate (2), and the copper tube (3) is arranged through the aluminum flap (4).
2. The high efficiency heat transfer radiator according to claim 1, characterized in that: The copper tube (3) is arranged on the fixed plate (2) by welding, and forms a VC substrate with a 3D structure with the VC substrate (1).
3. The high efficiency heat transfer radiator according to claim 1, characterized in that: The capillary structure in the copper tube (3) is a capillary tube (31), and the capillary tubes (31) are evenly distributed and fixed on the inner wall of the copper tube (3).
4. The high efficiency heat transfer radiator according to claim 1, characterized in that: Both ends of the aluminum flaps (4) are provided with downward folding edges (41) as supporting portions between adjacent aluminum flaps (4), so that heat dissipation gaps are formed between adjacent aluminum flaps (4).