Buried resistor multilayer circuit board with blind holes crossed for four times

By using expansion tubes and control screws in the blind holes, the problem of inconvenient sealing of blind holes is solved, and efficient sealing and convenient disassembly of blind holes is achieved. It is suitable for circuit boards with high frequency and high speed data transmission.

CN223219269UActive Publication Date: 2025-08-12Q & D CIRCUITS CO LTD
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Patent Information

Application Number
CN202422523608.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-18
Publication Date
2025-08-12
Estimated Expiration
2034-10-18

AI Technical Summary

Technical Problem

During long-term use of existing blind hole buried multi-layer circuit boards, dust is prone to accumulation in the depths of the blind holes, and the traditional sealing method is not convenient for cleaning and disassembly, resulting in difficulty in sealing and handling.

Method used

The expansion tube structure is adopted, and the tightening and opening of the expansion tube in the blind hole is controlled by controlling the screw, which can facilitate sealing and disassembly of the blind holes, and combine the rubber ring and tension spring to improve sealing and convenience.

Benefits of technology

It improves the efficiency of sealing and disassembly of blind holes, ensures the sealing of blind holes and is easy to repair, and is suitable for high-frequency and high-speed data transmission.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of circuit boards, and discloses a buried resistance multilayer circuit board with blind holes crossed for four times, which comprises a board body assembly and a plugging assembly, the board body assembly comprises multilayer circuit board bodies, a filling layer is bonded between the multilayer circuit board bodies, the multilayer circuit board bodies and the filling layer are provided with blind holes, and the plugging assembly is connected with the board body assembly. The plugging assembly comprises an expansion pipe movably sleeved with the blind hole, a plurality of connecting gaskets are arranged in the expansion pipe, the connecting gaskets are divided into a plurality of expansion cavities, meanwhile, connecting holes are formed in the connecting gaskets, regulation and control screw rods are in threaded connection with the interiors of the connecting holes, the expansion pipe is inserted into the blind hole, and the expansion pipe is inserted into the blind hole by rotating the regulation and control screw rods. When the regulating screw rotates reversely, the expansion pipe expands towards the two ends, at the moment, the side portion of the expansion pipe is separated from the inner wall of the blind hole, the expansion pipe can be taken out, and the blind hole is treated. And the blind hole blocking and dismounting efficiency is effectively improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a buried multi-layer circuit board with four-cross blind vias. Background Art

[0002] A buried via circuit board with cross blind vias is a complex PCB design that combines blind vias, buried vias, and impedance control technologies. A blind via is a hole that connects the surface and internal layers of a PCB but does not completely penetrate the entire board thickness. A cross blind via refers to a hole in the multi-layer structure of a PCB that connects to other layers through a specific layer without connecting to the surface or bottom of the board. A buried via completely penetrates the interior of the PCB but does not appear on the surface of the board. Buried vias are mainly used to make electrical connections between internal layers to save surface space and increase the flexibility of circuit layout. At the same time, impedance control in PCB design is a key technology to ensure that signals remain stable and matched during transmission. By controlling parameters such as PCB line width, layer spacing, and aperture, the desired impedance characteristics can be achieved to meet the requirements of high-frequency signal transmission.

[0003] At present, the existing blind hole buried multi-layer circuit boards are prone to accumulate a lot of dust in the deep of the blind holes during installation and long-term use. The traditional method is to fill the blind holes with resin or special filling materials, and then seal the top with a layer of resin or copper. However, if the blind hole accidentally conducts other layers, it is not convenient to remove the blocked resin, and the blind hole sealing process has certain defects. Utility Model Content

[0004] (1) Technical problems solved

[0005] In response to the shortcomings of the existing technology, the utility model provides a buried multi-layer circuit board with four-cross blind holes, which has the advantages of being able to easily seal and leak the blind holes and facilitate maintenance and processing. It solves the problem that the current use of resin to seal the blind holes makes it inconvenient to subsequently clean and seal the blind holes.

[0006] (2) Technical solution

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a buried multi-layer circuit board with four-cross blind holes, comprising a board assembly and a blocking assembly, wherein the board assembly comprises a multi-layer circuit board body, a filling layer is bonded between the multi-layer circuit board bodies, blind holes are provided on the multi-layer circuit board body and the filling layer, the multi-layer circuit board body is specifically formed by stacking and pressing a plurality of circuit boards, and four-cross blind holes are provided above the multi-layer circuit board body, which combines blind holes, buried holes and impedance control technology. By using blind holes and buried holes, more components and wires can be arranged on the PCB surface, thereby improving space utilization. Through impedance control technology, signal integrity and stability can be ensured, and it is suitable for high-frequency and high-speed data transmission.

[0008] The sealing assembly includes an expansion tube movably sleeved in the blind hole, a plurality of connecting gaskets are provided in the expansion tube, and the connecting gaskets separate a plurality of expansion chambers, and a connecting hole is provided on the connecting gasket, and an adjusting screw is threadedly connected in the connecting hole. The expansion tube is made of rubber material, and when the adjusting screw is rotated counterclockwise, the two ends of the expansion tube are tightened toward the middle, and the side portions are tightly attached to the inner wall of the blind hole to seal the blind hole, and when the adjusting screw is rotated counterclockwise, the expansion tube is opened to the two ends, so that the side portions of the expansion tube are separated from the inner wall of the blind hole, thereby allowing the expansion tube to be removed from the blind hole.

[0009] When using a buried multi-layer circuit board with four-cross blind holes, the multi-layer circuit board bodies are stacked and a filling layer is bonded between adjacent multi-layer circuit board bodies. At the same time, four-cross blind holes and buried holes are opened on the multi-layer circuit board bodies. By installing an expansion tube in the blind hole, the push button is tightly attached to the deep part of the blind hole. At this time, the tension spring is tightened, and the control button is rotated counterclockwise to tighten the two ends of the expansion tube. At this time, the side of the expansion tube is attached to the inner wall of the blind hole.

[0010] As a further improvement of the above solution, a rubber ring is fixed in the expansion cavity.

[0011] Through the above technical solution, the rubber ring achieves the function of secondary fixation of the expansion cavity, improves the overall hardness of the expansion tube, enables it to stably fit on the inner wall of the blind hole, and fully seals the blind hole.

[0012] As a further improvement of the above solution, a sealing ring is fixed to one end of the expansion tube, and the sealing ring fits in the blind hole.

[0013] Through the above technical solution, after the expansion tube is inserted deep into the blind hole, the sealing ring fits against the inner wall deep in the blind hole. When the side of the expansion tube is separated from the inner wall of the blind hole, the expansion tube is pulled so that the sealing ring scrapes the inner wall of the blind hole to prevent dust from remaining in the blind hole.

[0014] As a further improvement of the above solution, a sleeve groove is opened at one end of the expansion tube, a tension spring is fixed in the sleeve groove, and a push button is fixed at one end of the tension spring, and the push button fits in the through hole.

[0015] With the above technical solution, when the side of the expansion tube is separated from the inner wall of the blind hole, the expansion tube is ejected from the blind hole under the push of the tension spring, which facilitates the removal of the expansion tube from the blind hole.

[0016] As a further improvement of the above solution, a regulating button is fixed to one end of the regulating screw, and a connecting hole is opened at one end of the regulating button.

[0017] Through the above technical solution, the regulating screw is rotated by rotating the regulating knob, and at the same time, one end of the regulating knob is flush with the interface of the blind hole. At the same time, the connecting hole is octagonal, and the octagonal rod is inserted into the connecting hole, which facilitates the rotation of the regulating knob.

[0018] As a further improvement of the above solution, through holes are formed through the multi-layer circuit board body and the filling layer.

[0019] Through the above technical solution, screws are inserted into the through holes to fix the entire circuit board in the housing.

[0020] Compared with the prior art, the present invention provides a buried multi-layer circuit board with four-cross blind vias, which has the following beneficial effects:

[0021] 1. The buried multi-layer circuit board with four-cross blind holes has an expansion tube inserted in the blind hole. By rotating the regulating screw, the two ends of the expansion tube are tightened toward the middle, while the middle expands toward the periphery and clings to the inner wall of the blind hole, thereby sealing the blind hole. When the regulating screw is rotated in the opposite direction, the expansion tube is expanded toward both ends. At this time, the side of the expansion tube is separated from the inner wall of the blind hole, so that the expansion tube can be taken out and the blind hole can be processed, effectively improving the efficiency of blind hole blocking and disassembly.

[0022] 2. The buried multi-layer circuit board with four-cross blind holes is equipped with a push button at one end of the expansion tube. When the side of the expansion tube is separated from the blind hole, the tension spring pushes the push button to make the expansion tube pop out of the blind hole, making it easier to disassemble and assemble the expansion tube, further improving its practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the overall external structure of the device of the utility model;

[0024] Figure 2 This is a schematic diagram of the overall cross-sectional structure of the device of the utility model;

[0025] Figure 3 For this utility model Figure 2 Schematic diagram of the structure at A in the middle;

[0026] Figure 4 For this utility model Figure 2 Schematic diagram of the structure at point B in the middle.

[0027] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0028] 1. Board assembly; 101. Multilayer circuit board body; 102. Filling layer; 103. Through hole; 104. Blind hole;

[0029] 2. Sealing assembly; 201. Expansion tube; 202. Connecting gasket; 203. Expansion chamber; 204. Rubber ring; 205. Connecting hole; 206. Adjusting screw; 207. Sealing ring; 208. Socket groove; 209. Tension spring; 210. Push button; 211. Adjusting button; 212. Connecting hole. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] Example 1

[0032] See also Figure 1-4 As shown, the buried multi-layer circuit board with four-cross blind holes proposed in this embodiment includes a board assembly 1 and a blocking assembly 2. The board assembly 1 includes a multi-layer circuit board body 101, and a filling layer 102 is bonded between the multi-layer circuit board body 101. Blind holes 104 are provided on the multi-layer circuit board body 101 and the filling layer 102. The multi-layer circuit board body 101 is specifically formed by stacking and pressing a plurality of circuit boards, and four-cross blind holes 104 are provided above the multi-layer circuit board body 101. It combines blind holes, buried holes and impedance control technology. By using blind holes and buried holes, more components and wires can be arranged on the PCB surface, thereby improving space utilization. Through impedance control technology, signal integrity and stability can be ensured, and it is suitable for high-frequency and high-speed data transmission.

[0033] The plugging assembly 2 includes an expansion tube 201 that is movably sleeved in the blind hole 104. A plurality of connecting gaskets 202 are provided in the expansion tube 201, and the connecting gaskets 202 separate a plurality of expansion chambers 203. At the same time, a connecting hole 205 is opened on the connecting gasket 202, and an adjusting screw 206 is threadedly connected to the connecting hole 205. The expansion tube 201 is made of rubber material. When the adjusting screw 206 is rotated counterclockwise, the two ends of the expansion tube 201 are tightened toward the middle. At this time, the side is tightly attached to the inner wall of the blind hole 104, sealing the blind hole 104. When the adjusting screw 206 is rotated counterclockwise, the expansion tube 201 is opened to both ends, so that the side of the expansion tube 201 is separated from the inner wall of the blind hole 104, thereby removing the expansion tube 201 from the blind hole 104.

[0034] The working principle of the buried multi-layer circuit board with four intersecting blind vias proposed in this embodiment is as follows: the multi-layer circuit board bodies 101 are stacked, and a filling layer 102 is bonded between adjacent multi-layer circuit board bodies 101. At the same time, four intersecting blind vias 104 and buried vias are opened on the multi-layer circuit board bodies 101. By installing the expansion tube 201 in the blind hole 104, the push button 210 is tightly attached to the deep part of the blind hole 104. At this time, the tension spring 209 is tightened, and the control button 211 is rotated counterclockwise to tighten the two ends of the expansion tube 201. At this time, the side of the expansion tube 201 is attached to the inner wall of the blind hole 104.

[0035] Example 2

[0036] See also Figure 1-4 As shown, the buried multi-layer circuit board with four cross blind holes proposed in this embodiment, on the basis of embodiment one, also includes: a rubber ring 204 is fixed in the expansion cavity 203, a sealing ring 207 is fixed at one end of the expansion tube 201, the sealing ring 207 fits in the blind hole 104, a sleeve groove 208 is opened at one end of the expansion tube 201, a tension spring 209 is fixed in the sleeve groove 208, a push button 210 is fixed at one end of the tension spring 209, the push button 210 fits in the through hole 103, a regulating button 211 is fixed at one end of the regulating screw 206, a connecting hole 212 is opened at one end of the regulating button 211, and a through hole 103 is passed through the multi-layer circuit board body 101 and the filling layer 102.

[0037] In this solution, the rubber ring 204 achieves the function of secondary fixing the expansion cavity 203, improving the overall hardness of the expansion tube 201, so that it can stably fit on the inner wall of the blind hole 104, fully sealing the blind hole 104. After the expansion tube 201 is inserted deep into the blind hole 104, the sealing ring 207 fits on the inner wall of the blind hole 104 deep. When the side of the expansion tube 201 is separated from the inner wall of the blind hole 104, the expansion tube 201 is pulled so that the sealing ring 207 scrapes the inner wall of the blind hole 104 to prevent dust from remaining in the blind hole 104. When the side of 01 is separated from the inner wall of the blind hole 104, the expansion tube 201 is pushed by the tension spring 209 to pop out of the blind hole 104, which facilitates the removal of the expansion tube 201 from the blind hole 104. By rotating the regulating knob 211, the regulating screw 206 is rotated. At the same time, one end of the regulating knob 211 is flush with the interface of the blind hole 104. At the same time, the connecting hole 212 is octagonal in shape. The octagonal rod is inserted into the connecting hole 212, which facilitates the rotation of the regulating knob 211. A screw is inserted into the through hole 103 to fix the circuit board as a whole in the shell.

[0038] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A buried multi-layer circuit board with four-cross blind vias, comprising a board assembly and a blocking assembly, characterized in that: The board assembly includes a multi-layer circuit board body, a filling layer is bonded between the multi-layer circuit board bodies, and blind holes are opened in the multi-layer circuit board body and the filling layer; The plugging assembly includes an expansion tube movably sleeved in a blind hole, a plurality of connecting gaskets are arranged in the expansion tube, and the connecting gaskets separate a plurality of expansion cavities, and a connecting hole is opened on the connecting gasket, and a regulating screw is threadedly connected in the connecting hole.

2. The buried blocking multi-layer circuit board with four-cross blind vias according to claim 1, characterized in that: A rubber ring is fixed in the expansion cavity.

3. The buried blocking multi-layer circuit board with four-cross blind vias according to claim 1, characterized in that: A sealing ring is fixed at one end of the expansion tube, and the sealing ring fits in the blind hole.

4. The buried blocking multi-layer circuit board with four-cross blind vias according to claim 3, characterized in that: A sleeve groove is provided at one end of the expansion tube, a tension spring is fixed in the sleeve groove, a push button is fixed at one end of the tension spring, and the push button fits in the through hole.

5. The buried blocking multi-layer circuit board with four-cross blind vias according to claim 1, characterized in that: A regulating button is fixed at one end of the regulating screw, and a connecting hole is opened at one end of the regulating button.

6. The buried blocking multi-layer circuit board with four-cross blind vias according to claim 1, characterized in that: The multi-layer circuit board body and the filling layer are penetrated by through holes.