Cooling fin and backlight module

Abstract

The cooling fin comprises a first edge, a second edge, a third edge and a fourth edge which are sequentially connected end to end, and the first edge comprises a first sub-edge connected with the second edge, a second sub-edge connected with the fourth edge and a third straight sub-edge connected between the first sub-edge and the second sub-edge. And the first orthographic projection length of the first side on the third straight sub-side is greater than the second orthographic projection length of the third side on the third straight sub-side. According to the radiating fin provided by the embodiment of the invention, the material cost can be effectively saved under the condition that the radiating effect is ensured.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a heat sink, a temperature evaluation method and apparatus for a backlight module including the heat sink, a computing device, a computer-readable storage medium, and a computer program product. Background Art

[0002] In recent years, with the improvement of the brightness specifications of display devices such as mobile phones, LCD display devices such as LCD mobile phones need to increase the number of LEDs and LED current used in the backlight module. However, the increase in the number of LEDs and current will cause the temperature of the backlight module (especially at the LED position) to increase, thereby affecting the consumer's experience and the service life of the mobile phone. On the other hand, due to the requirements and limitations of brightness specifications, the number of LEDs and (backlight) current, which are the main factors affecting the temperature of the backlight module, are often fixed and cannot be adjusted. Therefore, adding heat dissipation materials to the backlight module (for example, attaching them on the back) and the selection of the type of heat dissipation materials and the design of the shape and size become the key to reducing the module temperature. Utility Model Content

[0003] In view of this, the present application provides a heat sink, a temperature assessment method and apparatus for a backlight module including a heat sink, a computing device, a computer-readable storage medium, and a computer program product, in the hope of alleviating or overcoming some or all of the above-mentioned defects and other possible defects.

[0004] According to a first aspect of the present application, a heat sink is provided, characterized in that it includes: a first side, a second side, a third side and a fourth side connected end to end in sequence, wherein the first side includes a first sub-side connected to the second side, a second sub-side connected to the fourth side, and a third straight sub-side connected between the first sub-side and the second sub-side, and the length of a first orthographic projection of the first side on the third straight sub-side is greater than the length of a second orthographic projection of the third side on the third straight sub-side.

[0005] In the heat sink according to some embodiments of the present application, at least one of the first sub-side and the second sub-side is an arc-shaped side.

[0006] In the heat sink according to some embodiments of the present application, the third straight sub-edge is arranged along the first direction, and at least one of the first angle between the second edge and the second direction and the second angle between the fourth edge and the second direction is in a preset angle range, wherein the first direction is perpendicular to the second direction.

[0007] In the heat sink according to some embodiments of the present application, the third side is parallel to the third straight sub-side and the first included angle is equal to the second included angle.

[0008] In the heat sink according to some embodiments of the present application, the distance between the third side and the third straight sub-side is within a first preset distance interval.

[0009] In some embodiments of the present application, the heat sink further includes at least one avoidance opening, and the minimum distance from a point on the edge of each avoidance opening to the third straight sub-side is within a second preset distance interval.

[0010] In the heat sink according to some embodiments of the present application, each of the at least one avoidance opening includes: a first edge, a second edge, a third edge and a fourth edge connected end to end in sequence, wherein the first edge and the third edge are parallel to each other and arranged along the first direction, wherein for each avoidance opening, the superimposed positive projection length of the first edge, the second edge, the third edge and the fourth edge on the first edge is less than the distance between the first edge and the third edge.

[0011] In the heat sink according to some embodiments of the present application, the at least one avoidance opening includes at least one rectangular avoidance opening.

[0012] In the heat sink according to some embodiments of the present application, at least one avoidance opening includes at least one isosceles trapezoidal avoidance opening and / or at least one right-angled trapezoidal avoidance opening, wherein in the at least one isosceles trapezoidal or right-angled trapezoidal avoidance opening, the first edge is closer to the first side of the heat sink relative to the third edge, and the length of the third edge is greater than the length of the first edge.

[0013] In the heat sink according to some embodiments of the present application, at least one avoidance opening includes a first avoidance opening and a second avoidance opening arranged side by side and adjacent to each other along a first direction, wherein the shortest distance in the first direction between the fourth edge of the first avoidance opening close to the second avoidance opening and the third edge of the second avoidance opening close to the first avoidance opening is greater than the maximum value of the first distance between the first edge and the second edge of the first avoidance opening, the second distance between the first edge and the second edge of the second avoidance opening, the first superimposed orthographic projection length of the first edge, the second edge, the third edge and the fourth edge of the first avoidance opening on the first edge, and the second superimposed orthographic projection length of the first edge, the second edge, the third edge and the fourth edge of the second avoidance opening on the first edge.

[0014] According to the second aspect of the present application, a backlight module is provided, comprising: a backlight source body; and a heat sink according to some embodiments of the present application, which is attached to the back of the backlight source body, wherein the first side of the heat sink is adjacent to the bottom edge of the back of the backlight source body and consistent with its outer contour.

[0015] In the backlight module according to some embodiments of the present application, the distance between the first side of the heat sink and the bottom edge of the back surface of the backlight source body is within a third preset distance interval.

[0016] According to a third aspect of the present application, a temperature evaluation method for a backlight module according to some embodiments of the present application is provided, comprising: obtaining a sample data set through experimental detection, wherein each sample data includes a temperature influencing factor sample and a corresponding temperature label of the backlight module, the temperature influencing factor sample includes a backlight source number sample value, a backlight source current sample value, and a heat sink length sample value of the backlight module, wherein the heat sink length refers to the length of the heat sink in the second direction; obtaining a temperature evaluation model for the backlight module based on the sample data set using at least one of an interpolation method and a fitting method; obtaining a set of temperature influencing factors to be processed, which includes the number of backlight sources, the backlight source current value, and the heat sink length; and evaluating the temperature of the backlight module corresponding to the set of temperature influencing factors to be processed using the temperature evaluation model.

[0017] According to a fourth aspect of the present application, a temperature evaluation device for a backlight module according to some embodiments of the present application is provided, comprising: a sample acquisition module configured to acquire a sample data set through experimental detection, wherein each sample data includes a temperature influencing factor sample and a corresponding temperature label of the backlight module, and the temperature influencing factor sample includes a backlight source number sample value, a backlight source current sample value, and a heat sink length sample value of the backlight module, wherein the heat sink length refers to the length of the heat sink in the second direction; a model acquisition module configured to obtain a temperature evaluation model for the backlight module based on the sample data set using at least one of an interpolation method and a fitting method; a factor acquisition module configured to acquire a set of temperature influencing factors to be processed, which includes the number of backlight sources, the backlight source current value, and the heat sink length; and a temperature evaluation module configured to evaluate the temperature of the backlight module corresponding to the set of temperature influencing factors to be processed using the temperature evaluation model.

[0018] According to a fifth aspect of the present application, a computing device is provided, comprising: a memory and a processor, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the processor is prompted to execute a method according to some embodiments of the present application.

[0019] According to a sixth aspect of the present application, a computer-readable storage medium is provided, on which computer-readable instructions are stored. When the computer-readable instructions are executed, the methods according to some embodiments of the present application are implemented.

[0020] According to a seventh aspect of the present application, a computer program product is provided, comprising a computer program, which implements the steps of the method according to some embodiments of the present application when executed by a processor.

[0021] In the heat sink according to some embodiments of the present application, a closed quadrilateral heat sink is obtained by connecting four sides end to end, wherein the first side includes three sub-sides to adapt to various different external contours (such as rounded corners) of the bottom of the backlight module (for arranging the backlight source), thereby achieving a close fit near the heat source of the backlight module (i.e., the backlight source) and improving the heat dissipation effect; on the other hand, in the quadrilateral heat sink according to the present application, the orthographic projection length of the third side arranged opposite to the first side on the third straight sub-side is smaller than the orthographic projection length of the first side adjacent to the bottom of the backlight source, that is, the heat sink is designed to be a trapezoidal shape that is narrow at the top and wide at the bottom. In this way, compared with the conventional rectangular heat sink, the corner parts away from the first side (i.e., away from the heat source at the bottom of the backlight module) (the backlight module area covered by it is away from the heat source, and the corresponding heat dissipation effect is not obvious) are cut off to effectively save the material cost of the heat sink while ensuring the heat dissipation effect.

[0022] These and other advantages of the application will be apparent from and elucidated with reference to the embodiments described hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Embodiments of the present application will now be described in more detail and with reference to the accompanying drawings, in which:

[0024] Figure 1 Schematically showing a partial front view and a rear view of a backlight module according to the related art;

[0025] Figure 2 Schematically shows a measured thermal imaging image of a backlight module according to related art;

[0026] Figure 3 Schematically showing the structure of a heat sink according to some embodiments of the present application;

[0027] Figure 4 Schematically illustrating a heat sink cutting process according to some embodiments of the present application;

[0028] Figure 5A Schematically showing a front view of the back of a backlight module according to some embodiments of the present application;

[0029] Figure 5B Schematically shows Figure 5A A partial detail diagram of a backlight module according to some embodiments of the present application is shown;

[0030] Figure 6 Schematically illustrating the structure of a heat sink according to some embodiments of the present application;

[0031] Figure 7 Schematically illustrating the structure of a heat sink according to some embodiments of the present application;

[0032] Figure 8 Schematically illustrating a heat dissipation path of a backlight module including a heat sink according to some embodiments of the present application;

[0033] Figure 9 Schematically illustrating the structure of a heat sink according to some embodiments of the present application;

[0034] Figure 10 A flow chart schematically illustrates a method for evaluating the temperature of a backlight module according to some embodiments of the present application;

[0035] Figure 11 The value ranges and combinations of various temperature influencing factors in the temperature evaluation method for a backlight module according to some embodiments of the present application are schematically illustrated in the form of three-dimensional coordinates;

[0036] Figure 12 An exemplary structural block diagram illustrating a temperature evaluation method for a backlight module according to some embodiments of the present application is shown;

[0037] Figure 13 An example block diagram of a computing device according to some embodiments of the present application is schematically shown. DETAILED DESCRIPTION

[0038] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the drawings represent like or similar parts, and thus repetitive description thereof will be omitted.

[0039] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner.In the following description, many specific details are provided so as to provide a full understanding of the embodiments of the present application. However, it will be appreciated by those skilled in the art that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps etc. can be adopted. In other cases, known methods, devices, implementations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0040] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically separate entities. That is, these functional entities may be implemented in software, in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.

[0041] It should be understood that although the first, second and other terms can be used to describe various devices, features or parts in this article, these devices, features or parts should not be limited by these terms. These terms are only used to distinguish one (or one group of) devices, features or parts from another (or another group of) devices, features or parts. It should also be understood that, in the absence of other limitations, the "multiple" mentioned in this disclosure can refer to two or more. It should also be understood that the "connection", "coupling" or similar words mentioned in this disclosure can relate to the scheme of direct connection, direct coupling, and can also relate to the scheme of indirect connection, indirect coupling realized via one or more intermediate devices, members, etc. In certain embodiments, "connection" and "coupling", "engagement" or similar words can refer to fixed connection, and can also refer to detachable connection. For example, in the description about an element or device being connected to another element or device, it can refer to that an element or device is fixedly connected to another element or device, and can also refer to that an element or device is detachably connected to another element or device. In this article, detachably connected means: component A and component B are detachably connected, which means that the two components are connected together by a detachable and / or removable connection method such as bonding, snapping, riveting, threaded connection, over-fitting, etc., and the connection between component A and component B can be removed without destroying and / or damaging the component A and component B by methods such as heating, pulling, pressing, impacting, vibrating, etc., so as to facilitate replacement and recycling of components.

[0042] Figure 1 The partial front view and rear view of a backlight module according to the related art are schematically shown.

[0043] like Figure 1 As shown in the front view (a) of the backlight module, a plurality of backlight sources 110 (such as light emitting diodes LED 1, LED 2, ..., LED 15, LED 16) are provided at the bottom of the backlight module 100, which are the main heat sources of the backlight module. Figure 1 As shown in the back view (b) of the backlight module, a heat sink 120 is attached to the back of the backlight module 100 along the bottom and side frames. The heat sink 120 is roughly rectangular (wherein the connection between the bottom edge and the two side edges is rounded, which is consistent with the outer contour of the bottom frame of the backlight module 100), the width W is roughly equal to the overall width of the backlight module 100, and the height H is much smaller than the overall height of the backlight module (that is, the heat sink is only pasted in the area adjacent to the bottom heat source (LED backlight source) (that is, the temperature is higher area) to save material costs).

[0044] Figure 2 The figure shows the measured thermal imaging diagram of the backlight module according to the related art. Figure 2As shown, in the area near the bottom of the backlight module 100, heat transfer and temperature levels radiate outward from the backlight source 110 (i.e., the LED heat source), that is, the temperature is highest at the location of the backlight source 110 (i.e., the bottom) in the entire backlight module 100, and the temperature gradually decreases as the distance from the backlight source 110 increases. Therefore, as shown in Figure 1, the corner positions or areas of the back of the backlight module 100 covered by the rectangular heat sink 120, such as those far away from the backlight source 110 or the LED heat source 110, Figure 1 The temperature of the area covered by the shadow parts 121 and 122 of the heat sink 120 in the back view (b) is not high. Figure 1 The heat dissipation effect produced by the shaded parts 121 and 122 in the figure is poor and has little impact on the module temperature. Therefore, the corner parts 121 and 122 of the conventional rectangular heat sink 120 away from the heat source can be cut to form a new trapezoidal heat sink, thereby reducing material costs while ensuring the heat dissipation effect.

[0045] Figure 3 The structure of the heat sink according to some embodiments of the present application is schematically shown. Figure 3 As shown, the heat sink 300 according to the present application may include: a first side 310, a second side 320, a third side 330, and a fourth side 340 connected end to end in sequence, wherein the first side 210 includes a first sub-side 311 connected to the second side, a second sub-side 312 connected to the fourth side 340, and a third straight sub-side 313 connected between the first sub-side 311 and the second sub-side 312, and the first orthographic projection length L1 of the first side 310 on the third straight sub-side 313 is greater than the second orthographic projection length L2 of the third side 330 on the third straight sub-side 313. It should be noted that the heat sink 300 can be attached or adhered to the back of a backlight body for an LCD display device, wherein the first side 310 is adjacent to the bottom edge of the backlight body.

[0046] Because the material of the heat sink attached to the back of the backlight module or display module is a significant factor affecting the module's temperature, it is important to carefully select a heat sink material with improved heat dissipation. Field testing of various heat sink materials has shown that graphite sheets have a relatively high thermal conductivity. Therefore, the heat sink according to the present application can be made of or include graphite sheets.

[0047] In the heat sink according to some embodiments of the present application, a closed quadrilateral heat sink is obtained by connecting four sides end to end, wherein the first side includes three sub-sides to adapt to various different external contours (such as rounded corners) of the bottom of the backlight module (for arranging the backlight source), thereby achieving a close fit near the heat source of the backlight module (i.e., the backlight source) and improving the heat dissipation effect; on the other hand, in the quadrilateral heat sink according to the present application, the projection length L2 of the third side arranged opposite to the first side on the third straight sub-side is smaller than the projection length L1 of the first side adjacent to the bottom of the backlight source, that is, the heat sink is designed to be a trapezoidal shape that is narrow at the top and wide at the bottom. In this way, compared with the conventional rectangular heat sink, the corner parts away from the first side (i.e., away from the heat source at the bottom of the backlight module) (the backlight module area covered by it is away from the heat source, so the temperature is not too high, and the corresponding heat dissipation effect is not obvious) are cut off to effectively save the material cost of the heat sink while ensuring the heat dissipation effect.

[0048] Figure 3 1 and 2 are different. Optionally, the first direction is a horizontal direction, the second direction is a vertical direction, and the two are perpendicular to each other. Figure 3 As shown, in some embodiments, the third straight sub-side 313 can be parallel to the first direction, and at least one of the first angle θ1 between the second side 320 and the second direction and the second angle θ2 between the fourth side 340 and the second direction is within a preset angle range. By limiting the angle between the side (second and fourth sides) and the vertical direction (second direction), the length difference between the orthographic projections of the upper base (third side) and the lower base (first side) of the heat sink can be appropriately limited, thereby limiting the cutting range of the upper corners of the heat sink relative to the rectangular sheet, so as to balance the heat dissipation effect and material cost, that is, to maximize material cost savings without substantially affecting the heat dissipation effect. On the one hand, the degrees of θ1 and θ2 cannot be too large, otherwise the heat dissipation effect will be affected; on the other hand, they cannot be too small, otherwise the cost savings will be insignificant. Therefore, the angles θ1 and θ2 between the side of the trapezoidal heat sink according to the present application and the vertical direction should be limited to a reasonable range, that is, within a preset angle range. The preset angle range can be determined through experimental testing.

[0049] Table 1—Example data of heat sink morphology and corresponding heat dissipation effect according to some embodiments of the present application

[0050]

[0051] As shown in Table 1, Item represents the morphological data of the heat sink 300, where X represents the width of the heat sink 300 (the length of the heat sink in the first direction, i.e., the length L1 of the orthographic projection of the first side 310 on the third straight sub-side 313), Y represents the height of the heat sink 300 (the length of the heat sink 300 in the second direction, such as the length of the superimposed orthographic projection of each side of the heat sink in the second direction), and θ represents the angle between the two side edges 320 and 340 of the heat sink 300 and the vertical direction (i.e., θ1 = θ2 = θ). As shown in Table 1, here, for different values of θ, three temperature measurements were performed on the backlight module with the corresponding morphological heat sink 300 attached, thereby obtaining three sets of measured temperature data #1, #2, and #3 for each different θ, as well as the average data AVG of these three sets of data, wherein the unit (Unit) of the temperature data is ℃ (Celsius). As shown in Table 1, in the morphological data for heat sink 300, X = 68 mm, Y = 50 mm, and θ is 0°, 5°, 7.5°, 10°, 12.5°, 15°, 20°, and 30°, for a total of 8 degrees. Each data set (#1, #2, #3, and AVG) in Table 1 includes two temperature data points: "front" and "back," representing the measured temperatures of the front and back of the backlight module, respectively.

[0052] From the specific temperature data of each group of the backlight module shown in Table 1 (especially the AVG (average temperature) group data), it can be seen that after multiple experimental tests, when the angles θ1 and θ2 between the side and the vertical direction of the (rounded) trapezoidal heat sink 300 of the present application are within the range of 0-10 degrees (for example, 0 degrees, 5 degrees, 7.5 degrees, 10 degrees), the temperature change of the backlight module attached to the heat sink 300 is not significant, and when the degree of θ exceeds 10 degrees (12.5 degrees, 15 degrees, 20 degrees and 30 degrees), the temperature of the front and back of the corresponding backlight module increases significantly (for example, compared with the heat sink below 10 degrees, the temperature of the front and back of the backlight module is about 0.4-0.8 degrees higher). Therefore, based on the above measured data, the preset angle interval corresponding to at least one of the first angle θ1 between the second side 320 and the second direction and the second angle θ2 between the fourth side 340 and the second direction can be set to (0 0 ,10 0 ], or alternatively, it can also be set to (1 0 ,10 0 ] or (2 0 ,10 0 ] or (5 0 ,10 0 ] etc. The preset angle range set in this way can not only ensure that the heat dissipation effect and characteristics of the heat sink for the backlight module are not affected, but also significantly save the material cost of the heat sink.

[0053] In the first side 310 of the heat sink 300 according to some embodiments of the present application, at least one of the first sub-side 311 connected between the second side 320 and the third straight sub-side 313 and the second sub-side 312 connected between the fourth side 340 and the third straight sub-side 313 may be an arcuate side. Figure 3 As shown, the first sub-edge 311 and the second sub-edge 312 are both curved edges. In the heat sink according to the present application, the curved edges (i.e., the first sub-edge 311 and the second sub-edge 310) at the junction of the first edge 310 (i.e., the bottom edge adjacent to the bottom of the backlight module) and the side edges (i.e., the second edge 320 and the fourth edge 340) can be designed to adapt to the rounded contour features of the bottom frame of the display module or backlight module of a display device such as a mobile phone. This makes it easy to achieve a close fit between the bottom corners of the heat sink and the area where the heat source (i.e., backlight source) of the backlight module is located, significantly improving the heat dissipation effect.

[0054] In the heat sink 300 according to some embodiments of the present application, Figure 3 As shown, the third side 330 may be parallel to the third straight sub-side 313 and the first angle θ1 is equal to the second angle θ2. Figure 3 As shown, when the third side 330 is a straight side parallel to the first direction (i.e., parallel to the third straight sub-side 313), the shape of the heat sink 300 is a relatively regular (rounded) trapezoidal shape. Furthermore, the first angle θ1 being equal to the second angle θ2 means that the two side edges 320 and 340 have the same inclination, and the shape of the heat sink 300 is a more regular (rounded) isosceles trapezoid. Here, according to the normal posture of the backlight module in which the heat sink is located and its corresponding real-life device such as a mobile phone, the first direction can be a horizontal direction (for example, the bottom side direction of the mobile phone), and the second direction can be a vertical direction (for example, the side direction of the mobile phone). The standard or regular (isosceles) trapezoidal shape of the heat sink 300 is convenient for assembly line production or cutting.

[0055] Figure 4 The cutting process of the heat sink according to some embodiments of the present application is schematically shown. Figure 4 As shown, the cutting process of the heat sink 300 can be achieved by alternating layout. Practice has shown that such alternating layout and cutting process can reduce material costs by about 6%.

[0056] In the heat sink 300 according to some embodiments of the present application, the distance between the mutually parallel third side 330 and the third straight sub-side 313 may be within a first preset distance interval. Figure 3 As shown, when the third side 330 is parallel to the third straight sub-side 313, the distance between the two is exactly equal to the height H of the heat sink 300 (the length of the heat sink in the second direction, that is, the height of the trapezoidal heat sink 300). Figure 3As shown, the height H of the heat sink is H1+H2, where H1 is the length of the orthographic projection of the side edges of the heat sink (i.e., the second edge 320 and the fourth edge 340) in the second direction, and H2 is the length of the orthographic projection of the first sub-edge 311 and the second sub-edge 312 in the second direction. In order to save the material cost of the heat sink as much as possible (i.e., to achieve a balance between the heat dissipation effect and the material cost) while ensuring that the heat dissipation effect of the backlight module targeted by the heat sink is not significantly affected, the first preset distance interval of the heat sink height H (i.e., the distance between the third edge 330 and the third straight sub-edge 313) can be determined through repeated experimental tests. Wherein H2 is a rounded projection adapted to the backlight module, and therefore can be determined by the outer contour of the backlight module; and H1 can be determined through experimental testing, for example, within the range of 5.0-8.5 mm. On the other hand, the width W of the heat sink 300 can be limited by the width of the backlight module.

[0057] Figure 5A Schematically shows a front view of the back of the backlight module according to some embodiments of the present application. Figure 5A As shown, the backlight module 500 includes a backlight source body 510 and a heat sink 520 attached to the back of the backlight source body 510. Figure 5A As shown, the backlight body 510 includes a plurality of backlight sources 511 (e.g., LEDs) arranged linearly at the bottom of the backlight body, and the heat sink 520 is surrounded by first to fourth sides 521, 522, 523, and 524 connected end to end, wherein the first side 521 is adjacent to the bottom edge of the backlight body 510 and is consistent with its outer contour. The first arc-shaped sub-side 521a and the second sub-side 521b located at the corner of the first side 521 are consistent with the bottom rounded corner contour of the backlight body 510, and the third straight sub-side 521c is adjacent to the bottom edge of the backlight body 510. The heat sink 520 in the backlight module 500 is attached to the bottom back of the backlight body 510 to ensure that it is close to the bottom backlight source (e.g., LED heat source) 511, thereby facilitating heat conduction and improving the heat dissipation effect.

[0058] like Figure 5A As shown, the height H (length in the second direction) of the heat sink 520 is obtained by the following formula (1):

[0059] H=H1+H2 (1)

[0060] Wherein H1 represents the superimposed orthographic projection length of the side edges (i.e., the second edge 522 and the fourth edge 524) of the heat sink 520 in the second direction, and H2 represents the orthographic projection length of the (arc-shaped) first sub-edge 521a and / or the second sub-edge 521b of the bottom edge (i.e., the first edge 521) in the second direction.

[0061] Generally, since the curved first sub-edge 311 and second sub-edge are adapted to the rounded corner profile of the backlight module, H2 can be determined by the backlight module profile (especially the profile of the bottom rounded corner); while H1 can be determined through experimental testing. For example, through actual temperature measurement, H1 can be within the range of 5.0-8.5 mm.

[0062] Figure 5B Shown Figure 5A The detailed view of the corner of the backlight module is shown in FIG. Figure 5B As shown, in Figure 5A In the illustrated corner 530 of the backlight module 500, the second curved sub-edge 521b of the heat sink 520 substantially matches the contour of the rounded (curved) edge 512 of the backlight body 510. To meet the requirements of the attachment process and margin requirements, a certain gap d can be set between the first edge 521 and the bottom edge of the backlight body 520. The gap d between the bottom edge 521 of the heat sink and the bottom edge 512 of the backlight module can be designed to prevent errors caused by assembly errors. The gap d can be within (e.g., a third) predetermined distance range, for example, with a minimum of 0.5 mm and a maximum of 1 mm.

[0063] In some embodiments, the width W of the heat sink 520 may be defined by the width W0 of the backlight module 500 or the backlight source body 510. Figure 5A and 5B As shown, the width W (length in the first direction) of the heat sink 520 can be obtained by the following formula (2):

[0064] W=W0-2*d (2)

[0065] W0 represents the width of the backlight body 510 or the backlight module 500 , and d represents the gap between the bottom edge of the heat sink (ie, the first side 521 ) and the bottom edge of the backlight body 510 .

[0066] Figure 6 and Figure 7 The structures of the heat sinks according to some embodiments of the present application are schematically shown respectively.

[0067] In some application scenarios of backlight modules or display modules for display devices, one or more specific positions or small areas need to be pre-set in the area on the back of the module for pasting the heat sink for setting or pasting other components. Therefore, the corresponding heat sink needs to be hollowed out for such positions, that is, avoidance openings are set at the corresponding positions of the heat sink to avoid occupying specific positions.

[0068] like Figure 6 and Figure 7As shown, according to some embodiments of the present application, the heat sink 600, 700 surrounded by the first side (lower bottom edge) 610, 710, the second side (left side) 620, 720, the third side (upper bottom edge) 630, 730 and the fourth side (right side) 640, 740 may include at least one avoidance opening, such as a first avoidance opening 650, 750 and a second avoidance opening 660, 760; the first side 610, 710 includes a first sub-edge 611, 711, a second sub-edge 612, 712 and a third straight sub-edge 613, 713; the minimum distance a from a point on the edge of each avoidance opening 650, 750, 660, 760 to the third straight sub-edge 613, 713 is in a second preset distance interval.

[0069] like Figure 6 and Figure 7 As shown, for the heat sinks 600 and 700 that include a hollow design (i.e., a avoidance opening 650, 660, 750, 760 for avoiding the position on the back of the backlight module for pasting other components), the hollow position should be as far away as possible from the bottom backlight source (i.e., the heat source) of the backlight module to avoid the heat sink opening close to the heat source from adversely affecting heat transfer and dissipation. The setting of the specific position can be obtained through experimental detection. For example, the second preset distance interval to which the distance a from the lowest point on the edge of the avoidance opening 650, 660, 750, 760 to the bottom edge (i.e., the third straight sub-edge 613, 713) can be obtained through experimental detection. Referring to Table 2, the second preset distance interval of a can be set to 5-15mm, i.e., a minimum of 5mm, a maximum of 15mm, and typically 10mm, because experiments show that at 5mm, the temperature increase decreases, and the temperature tends to be stable at 10mm.

[0070] In some embodiments, the shape and size of the avoidance openings 650, 660, 750, 760 of the heat sink 600, 700 can be determined according to the specific application scenario of the backlight module (for example, the size and shape of the components provided). Figure 6 As shown, each of the clearance openings in the heat sink 600, such as the second clearance opening 660, may include: a first edge 661, a second edge 662, a third edge 663, and a fourth edge 664, which are connected end to end, wherein the first edge 661 and the third edge 663 are parallel to the first direction. In other words, the first clearance opening 650 and the second clearance opening 660 may be rectangular, trapezoidal, or parallelogram. Alternatively, the clearance openings of the heat sink 600 may also be circular, or other polygonal shapes.

[0071] like Figure 6 As shown, the at least one avoidance opening 650 includes at least one rectangular avoidance opening 650, and the second edge 662 and the fourth edge 664 of each rectangular avoidance opening 660 are parallel to the second direction. Figure 6As shown, the width (ie, the length along the first direction) of each rectangular avoidance opening 650, 660 is x, and the height (ie, the length along the second direction) is y, wherein x>y, that is, the horizontal length of the rectangular opening is greater than the vertical length.

[0072] like Figure 7 As shown, each of the avoidance openings in the heat sink 700, such as the second avoidance opening 760, may include: a first edge 761, a second edge 762, a third edge 763, and a fourth edge 764 connected end to end in sequence, wherein the first edge 761 and the third edge 763 are parallel to the first direction, wherein for each avoidance opening (such as the second avoidance opening 760), the superimposed orthographic projection length of the first edge 761, the second edge 762, the third edge 763, and the fourth edge 764 on the first edge 761 is less than the distance between the first edge 761 and the third edge 763. Here, the "superimposed orthographic projection length" refers to the length of the superimposed orthographic projections of the edges of the avoidance opening on the first edge (bottom edge) (wherein the overlapping parts of different projections are not counted repeatedly), which is used to characterize the overall width of the avoidance opening, that is, the length in the first direction; and the "distance between the first edge and the third edge" represents the height of the avoidance opening, that is, the length in the second direction. The degree of difference between the overall horizontal width and the overall vertical height of the avoidance opening can be determined according to the specific application scenario. For example, according to actual measurements, the superimposed orthographic projection length (i.e., the overall width) can be less than half of the distance between the first edge and the third edge (i.e., the overall height) (for example, the width is 7 and the height is 15).

[0073] According to the heat dissipation principle in the backlight module, since the backlight source (i.e., heat source) in the backlight module is located at the bottom, its main heat conduction path is from bottom to top (i.e., along the second direction). In this way, the lateral width (the first direction perpendicular to the second direction) of the avoidance opening of the heat sink becomes the main obstacle to blocking the heat conduction path. Based on the above principle, the shape of the avoidance opening of the heat sink should be designed so that its lateral width is as small as possible (in order to maintain the opening area, the longitudinal height can be appropriately extended) so that the corresponding backlight module heat conduction path is smoother and the heat dissipation effect is improved. For the specific principle, please refer to Figure 8 .

[0074] like Figure 7 As shown, at least one avoidance opening 750, 760 includes at least one rectangular avoidance opening 750, 760, and the second edge 762 and the fourth edge 764 of each rectangular avoidance opening 760 are parallel to the second direction. Generally, avoidance openings of regular shape (such as rectangle) are relatively easy to manufacture. Figure 7As shown, for the rectangular clearance openings 750 and 760, the superposition orthographic projection length of each edge (i.e., the overall width of the opening) is exactly the width of the rectangle (i.e., the length along the first direction) as x, and the distance between the first edge and the third edge (i.e., the overall height of the opening) is exactly the height of the rectangle (i.e., the length along the second direction) as y, where x < y, that is, the horizontal length (i.e., width) of the rectangular opening is less than the vertical length (i.e., height). Thus, relative to Figure 6 the lateral placement of the clearance openings 650 and 660 of the heat sink 600, Figure 7 the vertically placed clearance openings 750 and 760 shown are more conducive to the heat conduction and evacuation of the heat source, and thus have a better heat dissipation effect. Specific heat dissipation effect data can be seen in Table 2.

[0075] As Figure 6 shown, in the heat sink 600 according to some embodiments of the present application, it includes a first clearance opening 650 and a second clearance opening 660 arranged side by side along the first direction. The shortest distance in the first direction between the fourth edge 654 of the first clearance opening 650 close to the second clearance opening 660 and the second edge 662 of the second clearance opening 660 close to the first clearance opening 650 is greater than the first distance between the first edge 651 and the third edge 652 of the first clearance opening 650, the second distance between the first edge 661 and the third edge 663 of the second clearance opening 660, the first superposition orthographic projection length of the first edge 651, the second edge 652, the third edge 653, and the fourth edge 654 of the first clearance opening 650 on the first edge 651, and the second superposition orthographic projection length of the first edge 661, the second edge 662, the third edge 663, and the fourth edge 664 of the second clearance opening 660 on the first edge 661. Figure 7 The adjacent clearance openings 750 and 760 in the heat sink 700 of Figure 6 can have the same properties as the clearance openings 650 and 660 of the heat sink 600 of Figure 6 , which will not be elaborated here. Based on the heat conduction principle of the backlight module heat sink, the distance between two adjacent clearance openings in the heat sink should be set as large as possible to facilitate the smooth passage of heat. For example, it can be set to be greater than the overall horizontal width and the overall vertical height of the two clearance openings. In this way, the adjacent clearance opening spacing is relatively wide, which is conducive to heat conduction; otherwise, if the adjacent opening spacing is too small and the two openings are close to being connected, it may block heat conduction and is not conducive to heat dissipation.

[0076] Table 2 - Example data of the heat sink form and corresponding heat dissipation effect according to some embodiments of the present application

[0077]

[0078] As shown in Table 2, Item represents the morphological data related to the avoidance openings 650, 660, 750, and 760 of the heat sinks 600 and 700, wherein X represents the width of the avoidance opening (the length in the first direction, such as the horizontal width of the rectangular opening), Y represents the height of the avoidance opening (the length in the second direction, such as the vertical height of the rectangular opening), a represents the minimum distance from a point on the edge of the avoidance opening to the bottom edge of the heat sink (i.e., the third straight sub-side), and b represents the shortest distance between two adjacent avoidance openings in the heat sink in the first direction. As shown in Table 2, for each set of avoidance opening data (i.e., different combinations of X, Y, a, and b values (unit: mm)), five temperature measurements were performed on the backlight module with the corresponding morphological heat sink attached, thereby obtaining five sets of measured temperature data #1, #2, #3, #4, and #5 and the average data AVG of these five sets of data for each set of heat sink avoidance opening morphological data, wherein the unit (Unit) of the temperature data is ℃ (degrees Celsius). As shown in Table 2, in the heat sink's avoidance opening data, (X, Y) takes the values of (0, 0), (15, 7), and (7, 15), respectively; while a only takes one value, 20; and b takes three values, 5, 10, and 15. Each set of temperature data (#1, #2, #3, and AVG) in Table 2 includes two temperature data points, "front" and "back," representing the measured temperatures of the front and back of the backlight module, respectively. From the specific temperature data for each set of backlight modules shown in Table 2 (especially the AVG (average temperature) data point), it can be seen that after multiple experimental tests, the first row of data shows that when X=Y=0 (i.e., the heat sink has no avoidance opening), the backlight module temperature is lower than that of other rows. This means that the hollow design has a certain impact on the heat dissipation effect. Therefore, the hollow design of the heat sink should be minimized unless absolutely necessary. Secondly, it can be seen from the data in rows 2-4 that when X=15 and Y=7 (i.e., the horizontal width is greater than the vertical height), as the value of b changes from 5 to 10, the module temperature decreases by about 0.2-0.5 degrees overall, indicating that the farther the avoidance opening is from the bottom edge, the better the heat dissipation effect; however, when b changes from 10 to 15, the module temperature does not change significantly (some decrease and some increase), so after the distance from the avoidance opening to the bottom edge of the heat sink (the third straight sub-side) reaches a certain extent (for example, 10mm-15mm), it has almost no effect on the heat dissipation effect. Again, by comparing the data in rows 2-4 with the data in row 5, it can be seen that, compared with the horizontally placed avoidance opening (for example, X=15, Y=7), when the horizontal width X of the avoidance opening is smaller than the vertical height Y (i.e., X=7, Y=15), the temperature of the backlight module is reduced overall, especially the front temperature is significantly reduced, which indicates that the shape of the avoidance opening has a greater influence on the heat dissipation effect, wherein the width of the avoidance opening in the first direction (horizontal) parallel to the bottom edge of the backlight module (i.e., the position where the LED backlight source is installed) should be smaller than the height in the second direction in order to improve the heat dissipation effect.

[0079] Figure 8 The heat dissipation path of a backlight module including a heat sink according to some embodiments of the present application is schematically shown.

[0080] like Figure 8 As shown in the figure (a) on the left, the backlight module 800a includes a backlight source body 810 and a heat sink 820 attached to the back of the backlight source body along the bottom, wherein the heat sink 820 includes two avoidance openings 821 and 822 whose lateral width is greater than the longitudinal height. Based on the heat dissipation characteristics of the heat sink (such as a graphite sheet) and the heat conduction efficiency in the horizontal and vertical directions, and the backlight source (i.e., the heat source) in the backlight module is located at the bottom, the main heat conduction path of the heat is from bottom to top (i.e., along the second direction), so the lateral (first direction perpendicular to the second direction) width of the avoidance opening of the heat sink becomes the main obstacle to blocking the heat conduction path. Therefore, as Figure 8 As shown in Figure (a), the rectangular avoidance openings 821 and 822 whose horizontal width is greater than the vertical height (i.e., the length in the first direction is greater than the length in the second direction) become obstacles in the heat conduction path of the heat sink 820 in the backlight module 800a, blocking the heat dissipation path in a larger range. Therefore, the larger the first direction (horizontal) size (i.e., the horizontal width), the smaller the heat dissipation path and the worse the heat dissipation effect.

[0081] like Figure 8 As shown in the figure (b) on the right, the backlight module 800b includes a backlight source body 830 and a heat sink 840 attached to the back of the backlight source body along the bottom, wherein the heat sink 840 includes two avoidance openings 841 and 842 whose horizontal width is smaller than the vertical height. Figure 8 As shown in Figure (b), based on the heat dissipation characteristics of the heat sink (such as graphite sheet) and the heat conduction efficiency in the horizontal and vertical directions, Figure 8 Compared with the heat sink 820 shown in (a), the rectangular avoidance openings 841 and 842 whose horizontal width is smaller than the vertical height (i.e., the length in the first direction is smaller than the length in the second direction) significantly lessen the obstruction of the heat conduction from the bottom to the top of the heat sink 840 in the backlight module 800a, and are more conducive to the smooth flow of heat transfer path. Therefore, the smaller the first direction (horizontal) dimension (i.e., the horizontal width), the less obstruction the heat dissipation path and the better the heat dissipation effect. Therefore, based on Figure 9 The heat conduction principle of the heat sink shown in the figure can optimize the design of the hollowing direction (i.e., the avoidance opening) while ensuring that the hollowing area remains unchanged. For example, the avoidance opening can be designed as Figure 7 The longitudinally placed (length in the first direction is less than length in the second direction) rectangular holes shown in the figure reduce the blockage of the heat conduction path (longitudinal propagation path from bottom to top), thereby improving the heat conduction capacity and heat dissipation effect.

[0082] Figure 9The structure of a heat sink according to some embodiments of the present application is schematically shown.

[0083] In some embodiments, as Figure 9 As shown in (a) and (b), the backlight modules 900a and 900b according to the present application respectively include backlight source bodies 910a, 910b and heat sinks 920a, 920b, and the heat sinks 920a and 920b may respectively include at least one isosceles trapezoidal avoidance opening 921 and / or at least one right-angled trapezoidal avoidance opening 922, wherein in the isosceles trapezoidal avoidance opening 921 or the right-angled trapezoidal avoidance opening 922, the first edge (lower edge) is closer to the first side (i.e., the lower bottom edge) of the heat sink 900a, 900b relative to the third edge (upper edge), and the length of the third edge is greater than the length of the first edge. In the hollowing design (i.e., avoidance opening) of the trapezoidal heat sink, the opening shape can be designed as follows Figure 9 The isosceles trapezoid and / or right-angled trapezoid shown in (a) and (b), and the upper base (third edge) of the trapezoid is larger than the lower base (third edge) (i.e., a trapezoid with a larger upper portion and a smaller lower portion, also called an inverted trapezoid). In this way, since the lower base of the inverted trapezoidal opening in the heat sink is smaller near the bottom of the backlight source body (i.e., the heat source), the obstruction of (more) heat conduction at the bottom can be reduced, which is more conducive to heat conduction and improves the heat dissipation effect; and although the upper base is larger, it is farther away from the bottom heat source, so less heat needs to be conducted or evacuated, and therefore has less impact on the heat dissipation effect. In the case of the same area and the same height (length), the inverted trapezoid may have less heat blocking than the rectangular or normal trapezoidal (i.e., small at the top and large at the bottom) avoidance opening. On the other hand, the avoidance opening of the isosceles trapezoid or right-angled trapezoid is easy to make due to its relatively regular shape.

[0084] In some embodiments, as Figure 9 As shown in (c), the backlight module 900c according to the present application includes a backlight source body 910c and a heat sink 920c, and the heat sink 920c may include at least one parallelogram-shaped avoidance opening 923. In some embodiments, as Figure 9 As shown in (d), the backlight module 900d according to the present application includes a backlight source body 910d and a heat sink 920d, and the heat sink 920d may include at least one isosceles trapezoidal avoidance opening 923, wherein the length of the third edge is less than the length of the first edge. Figure 9 Compared with the isosceles trapezoidal avoidance opening 923 shown in (d), Figure 9 The isosceles trapezoidal avoidance opening 923 shown in (a) is larger at the top and smaller at the bottom. Since the lower bottom edge of this inverted trapezoidal opening in the heat sink is smaller near the bottom of the backlight source body (i.e., the heat source), it may increase the blockage of (more) heat conduction at the bottom, which is not conducive to heat conduction and improves the heat dissipation effect.

[0085] exist Figure 9 In (a)-(d), in various shapes (parallelogram avoidance opening 923, isosceles trapezoid avoidance openings 921, 924, right-angled trapezoid avoidance opening 922), the overall width (i.e., the length of the superimposed orthographic projection of each edge of the opening on the lower base) x is less than the overall height (i.e., the distance between the upper base and the lower base) y, that is, the superimposed orthographic projection length of the first edge (lower base), second edge (left side), third edge (upper base) and fourth edge (right side) of each avoidance opening on the first edge is less than the distance between the first edge and the third edge. Therefore, such a heat sink shape with a transverse (first direction) width less than a longitudinal (second direction) height significantly reduces the blockage of the heat conduction path of the heat sink (a path mainly propagating longitudinally from bottom to top), and significantly improves the heat conduction capacity and heat dissipation effect.

[0086] exist Figure 9 In (a)-(d), the shortest distance b between two adjacent avoidance openings, that is, the shortest distance b in the first direction between the right edge of the left opening and the left edge of the right opening, is greater than the overall lateral width x and overall longitudinal height y of each of the two avoidance openings. In other words, the distance between two adjacent avoidance openings in the heat sink should be set as large as possible to facilitate the smooth passage of heat. For example, it can be set to be greater than the overall lateral width and overall longitudinal height of the two avoidance openings. In this way, the spacing between adjacent avoidance openings is wider, which is conducive to heat conduction.

[0087] Figure 10 The flowchart schematically illustrates a temperature evaluation method for a backlight module according to some embodiments of the present application.

[0088] In the related art, the display module or backlight module project that protects the heat sink lacks temperature assessment before the project is established, which causes individual products to have poor display due to excessively high temperature during the trial production stage. Based on the above problems, there is an urgent need for a solution to effectively evaluate the module temperature to ensure smooth mass production of the product. Therefore, the present application provides a method for evaluating the temperature of the backlight module, by obtaining experimental data that characterizes the quantitative relationship between the main factors affecting the temperature (such as the size of the backlight current, the number of LEDs, the shape and size of the heat sink, etc.) and the module temperature, that is, by testing the module temperature change data caused by different currents & different numbers of LEDs and different sizes of heat sinks (such as graphite sheets), to effectively evaluate the temperature of the new module project product (that is, the module temperature corresponding to the new backlight current, number of LEDs, shape and size of the heat sink, etc.).

[0089] like Figure 10 As shown, in some embodiments, a temperature assessment method for a backlight module according to some embodiments of the present application may include the following steps:

[0090] S1010, obtaining a sample data set through test detection, wherein each sample data includes a temperature influence factor sample and a corresponding temperature label of the backlight module, the temperature influence factor sample includes a backlight quantity sample value, a backlight current sample value, and a heat sink length sample value of the backlight module, wherein the heat sink length refers to the length of the heat sink in the second direction;

[0091] S1020, obtaining a temperature assessment model for the backlight module based on the sample data set using at least one of an interpolation method and a fitting method;

[0092] S1030, obtaining a set of temperature influencing factors to be processed, which includes the number of backlight sources, the backlight current value, and the heat sink length;

[0093] S1040: Using the temperature evaluation model, evaluate the temperature of the backlight module corresponding to the set of temperature influencing factors to be processed.

[0094] As described in S1010, it is first necessary to obtain a sample data set, namely, a sample of temperature influencing factors used to calculate the temperature evaluation model or function of the backlight module, as well as the corresponding measured temperature labels of the backlight module. Through experimental testing, the main factors affecting the temperature of the backlight module (i.e., temperature influencing factors) can include three aspects: LED current, number of LEDs, and size of the heat sink (or graphite sheet) (e.g., vertical height).

[0095] Figure 11 The value ranges and combinations of various temperature influencing factors in the temperature evaluation method for the backlight module according to some embodiments of the present application are schematically shown in the form of three-dimensional coordinates. Figure 11 As shown, in some embodiments, the current product backlight module LED current range is 20-24mA, the number of LEDs is usually 16ea, 18ea or 20ea, and the longitudinal height or length of the graphite sheet is 0-50mm. Subsequently, the specific measurement conditions are implemented in three dimensions: the module temperature increases from the current dimension 20→24mA, the module temperature increases from the LED number dimension 16→20ea, and the module temperature decreases from the graphite sheet dimension 0→50mm. The temperature influencing factors shown in Figure 5 can be combined in different ways to form multiple (for example, 90) groups for inputting sample data, such as (20mA, 16ea, 0mm)...(24mA, 20ea, 50mm), etc., and then the temperature data (i.e., temperature label) corresponding to each group of sample data can be obtained through actual measurement for each group of sample data, thereby obtaining a sample data set (i.e., 90 groups of sample data, each group of sample data includes three influencing factor input data and corresponding measured temperature data).

[0096] As shown in S1020, after obtaining the sample data set, multiple groups (i.e., 90 groups) of input samples in the sample data set plus measured temperature labels can be used to calculate the temperature evaluation model or function of the backlight module corresponding to these data sets through numerical methods such as interpolation and / or fitting methods, as a fixed model for directly obtaining the corresponding backlight module temperature based on the input LED number, heat sink length, and LED current value.

[0097] In this way, after obtaining the temperature evaluation model, as described in S1030 and S1040, the temperature of the backlight module corresponding to the set of temperature influence factors to be processed can be calculated or evaluated by obtaining the set of temperature influence factors to be processed (including the number of backlight sources, the backlight current value, and the heat sink length) and inputting them into the temperature evaluation model.

[0098] In some embodiments, since in the actual product design process, the LED current is a non-integer value, that is, it may be 20.5mA, and the graphite sheet length is a non-integer value, that is, it may be 36mm, so the LED current and the graphite sheet length need to be set finely. For example, the LED current is set as the minimum unit of 0.1mA and the graphite sheet length is set as the minimum unit to meet the actual product design requirements, and the number of LEDs can be 16ea, 18ea or 20ea.

[0099] According to the temperature evaluation method for the backlight module in some embodiments of the present application, the module temperature can be accurately evaluated in the early project evaluation stage, avoiding the temperature evaluation errors or large errors caused by the related technology only referring to the design of existing projects or predicting based on experience. In this way, the temperature evaluation method according to the present application can be used to accurately evaluate the temperature of the backlight module in the trial production before the module project is established, and then the values of various influencing factors (such as LED current, number of LEDs or heat sink length) can be appropriately adjusted according to the evaluated (for example, possibly too high) temperature (to make it normal), avoiding the occurrence of poor display of individual products due to too high temperature in the trial production stage, and uneven display caused by material wrinkles caused by too high temperature during the product reliability test.

[0100] Figure 12 FIG. 1 is an exemplary structural block diagram of a temperature evaluation device 1200 for a backlight module according to some embodiments of the present application. Figure 12 As shown, the temperature evaluation device 1200 for a backlight module may include a sample acquisition module 1210 , a model acquisition module 1220 , a factor acquisition module 1230 and a temperature evaluation module 1240 .

[0101] The sample acquisition module 1210 can be configured to acquire a sample data set through experimental detection, wherein each sample data includes a temperature influence factor sample and a corresponding temperature label of the backlight module, and the temperature influence factor sample includes a backlight source quantity sample value, a backlight source current sample value, and a heat sink length sample value of the backlight module, wherein the heat sink length refers to the length of the heat sink in the second direction.

[0102] The model acquisition module 1220 may be configured to obtain a temperature evaluation model for the backlight module based on the sample data set by using at least one of an interpolation method and a fitting method.

[0103] The factor acquisition module 1230 may be configured to acquire a set of temperature influencing factors to be processed, which includes the number of backlight sources, the backlight current value, and the heat sink length.

[0104] The temperature evaluation module 1240 may be configured to use the temperature evaluation model to evaluate the temperature of the backlight module corresponding to the set of temperature influencing factors to be processed.

[0105] It should be noted that the various modules described above can be implemented in software or hardware or a combination of both. Multiple different modules can be implemented in the same software or hardware structure, or one module can be implemented by multiple different software or hardware structures.

[0106] Figure 13 Schematically illustrates an example block diagram of a computing device 1300 according to some embodiments of the present application. The computing device 1300 may represent a device for implementing the various means or modules described herein and / or performing the various methods described herein. The computing device 1300 may be, for example, a server, a desktop computer, a laptop computer, a tablet, a smart phone, a smart watch, a wearable device, or any other suitable computing device or computing system, which may include various levels of devices ranging from full-resource devices with a large amount of storage and processing resources to low-resource devices with limited storage and / or processing resources. In some embodiments, the above description of the computing device 1300 may be a computer system or a computing system. Figure 12 The temperature evaluation device 1200 for a backlight module can be implemented in one or more computing devices 1300 .

[0107] like Figure 13As shown, the example computing device 1300 includes a processing system 1301, one or more computer-readable media 1302, and one or more I / O interfaces 1303 that are communicatively coupled to each other. Although not shown, the computing device 1300 may also include a system bus or other data and command transmission system that couples the various components to each other. The system bus may include any one or a combination of different bus structures, such as a memory bus or memory controller, a peripheral bus, a universal serial bus, and / or a processor or local bus utilizing any of a variety of bus architectures. Alternatively, other components such as control and data lines may also be included.

[0108] Processing system 1301 represents functionality that performs one or more operations using hardware. Thus, processing system 1301 is illustrated as including hardware elements 1304 that may be configured as processors, functional blocks, and the like. This may include implementation in hardware as application-specific integrated circuits or other logic devices formed using one or more semiconductors. Hardware elements 1304 are not limited by the materials from which they are formed or the processing mechanisms employed therein. For example, a processor may be comprised of (a plurality of) semiconductors and / or transistors (e.g., electronic integrated circuits (ICs)). In such a context, processor-executable instructions may be electronically executable instructions.

[0109] Computer-readable media 1302 is illustrated as including memory / storage 1205. Memory / storage 1305 represents a memory / storage associated with one or more computer-readable media. Memory / storage 1205 may include volatile media (such as random access memory (RAM)) and / or non-volatile media (such as read-only memory (ROM), flash memory, optical disks, magnetic disks, etc.). Memory / storage 1305 may include fixed media (e.g., RAM, ROM, fixed hard drive, etc.) and removable media (e.g., flash memory, removable hard drive, optical disks, etc.). Exemplarily, memory / storage 1305 may be used to store the various data mentioned in the above embodiments, etc. Computer-readable media 1302 may be configured in various other ways as further described below.

[0110] One or more I / O (input / output) interfaces 1303 represent functionality that allows a user to enter commands and information into the computing device 1300 and also allows information to be displayed to the user and / or sent to other components or devices using various input / output devices. Examples of input devices include a keyboard, a cursor control device (e.g., a mouse), a microphone (e.g., for voice input), a scanner, touch functionality (e.g., a capacitive or other sensor configured to detect physical touch), a camera (e.g., that can use visible or invisible wavelengths (such as infrared frequencies) to detect motion that does not involve touch as gestures), a network card, a receiver, and the like. Examples of output devices include a display device, a speaker, a printer, a tactile response device, a network card, a transmitter, and the like.

[0111] The computing device 1300 also includes a temperature assessment strategy 1306. The temperature assessment strategy 1306 can be stored as a computer program instruction in the memory / storage device 1305, or can be hardware or firmware. The temperature assessment strategy 1306 can be implemented together with the processing system 1301 and the like to implement the temperature assessment strategy 1306. Figure 12 The entire functions of the various modules of the temperature evaluation device 1200 for the backlight module are described.

[0112] Various techniques may be described herein in the general context of software, hardware, elements, or program modules. Generally, these modules include routines, programs, objects, elements, components, data structures, etc. that perform specific tasks or implement specific abstract data types. As used herein, the terms "module," "function," etc. generally refer to software, firmware, hardware, or a combination thereof. A feature of the techniques described herein is that they are platform-independent, meaning that these techniques can be implemented on a variety of computing platforms with a variety of processors.

[0113] An implementation of the described modules and techniques may be stored on or transmitted across some form of computer-readable media. Computer-readable media may include various media accessible by computing device 1300. By way of example and not limitation, computer-readable media may include "computer-readable storage media" and "computer-readable signal media."

[0114] As opposed to a mere signal transmission, carrier wave, or signal itself, "computer-readable storage medium" refers to a medium and / or device, and / or tangible storage device, capable of persistently storing information. Thus, computer-readable storage media refers to non-signal-bearing media. Computer-readable storage media include hardware such as volatile and non-volatile, removable and non-removable media and / or storage devices implemented in a method or technology suitable for storing information (such as computer-readable instructions, data structures, program modules, logic elements / circuits, or other data). Examples of computer-readable storage media may include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical storage devices, hard disks, cassettes, magnetic tape, magnetic disk storage devices or other magnetic storage devices, or other storage devices, tangible media, or articles of manufacture suitable for storing desired information and accessible by a computer.

[0115] "Computer-readable signal media" refers to signal-bearing media configured to transmit instructions to the hardware of computing device 1300, such as via a network. Signal media typically embodies computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave, data signal, or other transport mechanism. Signal media also includes any information transmission media. By way of example, and not limitation, signal media include wired media such as a wired network or direct connection, and wireless media such as acoustic, RF, infrared, and other wireless media.

[0116] As previously described, hardware elements 1304 and computer-readable media 1302 represent instructions, modules, programmable device logic, and / or fixed device logic implemented in hardware form, which in some embodiments can be used to implement at least some aspects of the technology described herein. Hardware elements can include integrated circuits or systems on a chip, application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and other implementations in silicon or other hardware devices. In this context, hardware elements can be used as processing equipment for executing program tasks defined by the instructions, modules, and / or logic embodied by the hardware elements, as well as hardware devices for storing instructions for execution, such as the computer-readable storage media previously described.

[0117] The aforementioned combinations may also be used to implement the various techniques and modules described herein. Thus, software, hardware, or program modules and other program modules may be implemented as one or more instructions and / or logic on some form of computer-readable storage medium and / or embodied by one or more hardware elements 1304. The computing device 1300 may be configured to implement specific instructions and / or functions corresponding to the software and / or hardware modules. Thus, for example, by using a computer-readable storage medium and / or hardware elements 1304 of a processing system, a module may be implemented as a module executable by the computing device 1300 as software, at least in part, in hardware. Instructions and / or functions may be executed / operable by, for example, one or more computing devices 1300 and / or processing systems 1301 to implement the techniques, modules, and examples described herein.

[0118] The techniques described herein may be supported by these various configurations of computing device 1300 and are not limited to the specific examples of the techniques described herein.

[0119] In particular, according to embodiments of the present application, the processes described above with reference to the flowcharts may be implemented as computer programs. For example, embodiments of the present application provide a computer program product comprising a computer program carried on a computer-readable medium, the computer program including program code for executing at least one step of the method embodiments of the present application.

[0120] In some embodiments of the present application, one or more computer-readable storage media are provided, on which computer-readable instructions are stored. When the computer-readable instructions are executed, the temperature assessment method for the backlight module according to some embodiments of the present application is implemented. The various steps of the temperature assessment method for the backlight module according to some embodiments of the present application can be converted into computer-readable instructions through programming and stored in a computer-readable storage medium. When such a computer-readable storage medium is read or accessed by a computing device or computer, the computer-readable instructions therein are executed by a processor on the computing device or computer to implement the method according to some embodiments of the present application.

[0121] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0122] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code comprising one or more executable instructions for implementing the steps of a custom logical function or process, and the scope of the preferred embodiments of the present application includes alternative implementations in which functions may be performed in a sequence other than as shown or discussed (including in a substantially simultaneous manner or in reverse order depending on the functions involved), which should be understood by those skilled in the art to which the embodiments of the present application pertain.

[0123] The logic and / or steps represented in the flowcharts or otherwise described herein, for example, can be considered as an ordered list of executable instructions for implementing the logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (e.g., a computer-based system, a system including a processor, or other system that can fetch and execute instructions from an instruction execution system, apparatus, or device). For purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by, or in conjunction with, an instruction execution system, apparatus, or device.

[0124] It should be understood that the various parts of the present application can be implemented by hardware, software, firmware or a combination thereof. In the above embodiment, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, it can be implemented by any one of the following technologies well known in the art or a combination thereof: a discrete logic circuit having a logic gate circuit for implementing a logical function on a data signal, an application-specific integrated circuit having a suitable combinational logic gate circuit, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0125] Those skilled in the art will appreciate that all or part of the steps of the method of the above embodiment may be accomplished through hardware associated with program instructions, and the program may be stored in a computer-readable storage medium, which, when executed, includes executing one or a combination of the steps of the method embodiment.

[0126] In addition, the functional units in the various embodiments of the present application may be integrated into a processing module, or each unit may exist physically separately, or two or more units may be integrated into a module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

Claims

1. A heat sink, characterized in that: include: The first side, the second side, the third side and the fourth side are connected end to end. The first side includes a first sub-side connected to the second side, a second sub-side connected to the fourth side, and a third straight sub-side connected between the first sub-side and the second sub-side, and a first orthographic projection length of the first side on the third straight sub-side is greater than a second orthographic projection length of the third side on the third straight sub-side.

2. The heat sink according to claim 1, wherein: At least one of the first sub-edge and the second sub-edge is an arc-shaped edge.

3. The heat sink according to claim 1 or 2, characterized in that: The third straight sub-edge is arranged along the first direction, and at least one of a first angle between the second edge and the second direction and a second angle between the fourth edge and the second direction is in a preset angle range, wherein the first direction is perpendicular to the second direction.

4. The heat sink according to claim 3, wherein: The third side is parallel to the third straight sub-side and the first included angle is equal to the second included angle.

5. The heat sink according to claim 4, wherein: The distance between the third side and the third direct sub-side is within a first preset distance interval.

6. The heat sink according to claim 1, wherein: The heat sink further includes at least one avoidance opening, and the minimum distance from a point on the edge of each avoidance opening to the third straight sub-side is within a second preset distance interval.

7. The heat sink according to claim 6, wherein: Each of the at least one avoidance opening comprises: a first edge, a second edge, a third edge, and a fourth edge connected end to end in sequence, wherein the first edge and the third edge are parallel to each other and arranged along the first direction, For each of the avoidance openings, a superimposed orthographic projection length of the first edge, the second edge, the third edge, and the fourth edge on the first edge is smaller than a distance between the first edge and the third edge.

8. The heat sink according to claim 7, wherein: The at least one avoidance opening includes at least one rectangular avoidance opening.

9. The heat sink according to claim 7, wherein: The at least one avoidance opening includes at least one isosceles trapezoidal avoidance opening and / or at least one right-angled trapezoidal avoidance opening. In the at least one isosceles trapezoidal or right-angled trapezoidal avoidance opening, the first edge is closer to the first side of the heat sink than the third edge, and the length of the third edge is greater than that of the first edge.

10. The heat sink according to claim 7, wherein: The at least one avoidance opening includes a first avoidance opening and a second avoidance opening arranged side by side and adjacent to each other along the first direction, wherein the shortest distance in the first direction between the fourth edge of the first avoidance opening close to the second avoidance opening and the third edge of the second avoidance opening close to the first avoidance opening is greater than the maximum value of the first distance between the first edge and the second edge of the first avoidance opening, the second distance between the first edge and the second edge of the second avoidance opening, the first superimposed orthographic projection length of the first edge, the second edge, the third edge and the fourth edge of the first avoidance opening on the first edge, and the second superimposed orthographic projection length of the first edge, the second edge, the third edge and the fourth edge of the second avoidance opening on the first edge.

11. A backlight module, characterized in that: include: Backlight source body; as well as The heat sink according to any one of claims 1 to 10 is attached to the back surface of the backlight source body, wherein the first side of the heat sink is adjacent to the bottom edge of the back surface of the backlight source body and is consistent with its outer contour.

12. The backlight module according to claim 11, wherein: The distance between the first side of the heat sink and the bottom edge of the back surface of the backlight source body is within a third preset distance interval.

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