Mini RGB packaging structure and lamp bead

Abstract

The utility model provides a Mini RGB packaging structure and a lamp bead, relates to the semiconductor technology field, the Mini RGB packaging structure comprises a substrate, at least three light emitting chips and at least two light scattering plates, the at least three light emitting chips and the at least two light scattering plates are arranged on the front surface of the substrate, the light scattering plates are arranged along the length direction of the light emitting chips, two opposite sides of the light scattering plates along the width direction of the light emitting chips are respectively provided with a light scattering surface, and the light scattering surfaces are arranged on the light scattering plates. A coating layer is arranged on the light scattering face, the light scattering plate comprises two first light scattering plates, one first light scattering plate is arranged between every two adjacent light-emitting chips, the first light scattering plates and the light-emitting chips are arranged at the same height, and the cross section of each first light scattering plate is in a rectangular shape. According to the LED lamp bead, the light scattering plate is additionally arranged on the substrate, and the light scattering surfaces are arranged on the two sides of the light scattering plate, so that the light emitting angle of the light emitting chip can be enlarged, the purpose of improving the brightness of the lamp bead is achieved, the bonding property between the epoxy glue layer and the substrate can be improved, and the air tightness and the cold and hot impact performance of the lamp bead product are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a Mini RGB packaging structure and a lamp bead. Background Art

[0002] With the popularization of the display application market, the market has increasingly higher requirements for the performance parameters of lamp beads.

[0003] Existing Mini RGB chip packaging products are manufactured using a single molding process. The epoxy adhesive used for molding is a mixture of transparent epoxy resin, diffusion powder, and blackening agent. During use, the epoxy resin and blackening agent first emit light, giving the LEDs an inky color. The diffusion powder then diffuses the light to ensure the chip's luminous effect. However, due to the limited brightness and angle of the light-emitting chip, further improving the product's overall brightness typically requires replacing the chip with a higher-brightness chip or selecting epoxy adhesive with a lower blackening agent ratio during molding. The former increases production costs, while the latter can easily create gaps between the epoxy adhesive and the substrate over long-term use, allowing moisture to seep in, seriously impacting product performance. Utility Model Content

[0004] Based on this, the purpose of the utility model is to provide a Mini RGB packaging structure and lamp beads, aiming to solve the technical problem that Mini RGB chip packaging products in the existing technology can only improve the overall brightness of the product by replacing high-brightness light-emitting chips or selecting epoxy glue with a smaller proportion of black agent during molding. The former increases the production cost, and the latter is prone to gaps between the epoxy glue and the substrate over long-term use, which allows water vapor to penetrate, seriously affecting the performance of the product.

[0005] On one hand, the utility model provides a Mini RGB packaging structure, comprising a substrate, at least three light-emitting chips arranged on the front of the substrate, and at least two diffuser plates, wherein the diffuser plates are arranged along the length direction of the light-emitting chips, and diffuser surfaces are respectively provided on two opposite sides of the diffuser plates along the width direction of the light-emitting chips, and a coating layer is provided on the diffuser surfaces;

[0006] The diffuser includes two first diffusers, one of which is provided between two adjacent light-emitting chips. The first diffuser is arranged at the same height as the light-emitting chip, and the cross section of the first diffuser is rectangular.

[0007] Compared to existing technologies, the Mini RGB package structure and lamp beads of this utility model offer the following advantages: by adding a diffuser plate to the substrate, with diffuser surfaces on both sides, the diffuser surfaces on the plate reflect the light emitted by the light-emitting chip after it emits light, thereby widening the light-emitting angle of the light-emitting chip and achieving the purpose of increasing the brightness of the lamp beads. Furthermore, the diffuser plate increases the bonding area between the epoxy adhesive layer and the substrate during the molding process, improving the bonding between the epoxy adhesive layer and the substrate. This effectively prevents external moisture from penetrating into the package structure during long-term use, thereby improving the airtightness and thermal shock resistance of the lamp bead product, and enhancing the reliability of the lamp bead product.

[0008] In addition, the Mini RGB packaging structure of the present invention may also have the following additional technical features:

[0009] Furthermore, the coating layer is a silver layer.

[0010] Furthermore, the diffuser includes four second diffusers, which are arranged in parallel at equal intervals on the front of the substrate, and a light-emitting chip is provided between two adjacent second diffusers. The height of the second diffuser is greater than the height of the light-emitting chip, and the diffuser surface on the second diffuser is an inwardly concave arc surface.

[0011] Furthermore, the light-emitting chip includes a red light-emitting chip, a green light-emitting chip and a blue light-emitting chip, and the red light-emitting chip, the green light-emitting chip and the blue light-emitting chip are arranged side by side at equal intervals on the front surface of the substrate.

[0012] Furthermore, an epoxy adhesive layer is provided on the front surface of the substrate, and the epoxy adhesive layer covers the surface of the light-emitting chip and the diffuser plate, and the top of the epoxy adhesive layer is a planar structure.

[0013] Furthermore, at least two back soldering pads are provided on the back side of the substrate, and a back ink layer is provided between the two back soldering pads, and one side of the back ink layer is connected to the back side of the substrate.

[0014] Furthermore, the substrate is made of resin.

[0015] The utility model also provides a lamp bead, which includes the above-mentioned Mini RGB packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 2 is a cross-sectional view of the Mini RGB package structure in the first embodiment of the present invention;

[0017] Figure 2 This is a top view of the lamp bead in the first embodiment of the present utility model;

[0018] Figure 3 2 is a cross-sectional view of the Mini RGB package structure in the second embodiment of the present invention;

[0019] Figure 4 This is a top view of the lamp bead in the second embodiment of the present invention.

[0020] Among them, the above drawings include the following figure marks: 10-substrate; 20-light-emitting chip; 31-first diffuser; 32-second diffuser; 33-diffuser surface; 40-epoxy adhesive layer; 50-back solder pad; 60-back ink layer.

[0021] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0022] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. The drawings illustrate several embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0023] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are intended only to describe specific embodiments and are not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] To solve the technical problem that the Mini RGB Chip packaging products in the existing technology can only improve the overall brightness of the product by replacing high-brightness light-emitting chips or selecting epoxy glue with a smaller proportion of black agent during molding, the former increases the production cost, and the latter is prone to the phenomenon of water vapor seeping into the gap between the epoxy glue and the substrate after long-term use, which seriously affects the performance of the product. The Mini RGB packaging structure of the present invention is provided with a diffuser plate on the substrate, and diffuser surfaces are provided on both sides of the diffuser plate. After the light-emitting chip emits light, the diffuser surface on the diffuser plate can reflect the light emitted by the light-emitting chip, thereby expanding the light-emitting angle of the light-emitting chip and achieving the purpose of improving the brightness of the lamp bead. In addition, the provision of the diffuser plate can also increase the bonding area between the epoxy glue layer and the substrate during the lamp bead molding process, increase the bonding between the epoxy glue layer and the substrate, and effectively isolate external water vapor from penetrating into the interior of the packaging structure during long-term use, thereby improving the airtightness and thermal shock resistance of the lamp bead product, and improving the reliability of the lamp bead product.

[0026] To facilitate understanding of the present invention, several embodiments of the present invention are provided below. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0027] Example 1

[0028] See also Figures 1 to 2 , showing the Mini RGB package structure and lamp beads in the first embodiment of the present invention. The Mini RGB package structure in this embodiment includes a substrate 10, at least three light-emitting chips 20 disposed on the front of the substrate 10, and at least two diffusers. The diffusers are arranged along the length of the light-emitting chips 20. The diffusers are provided with diffuser surfaces 33 on opposite sides of the diffuser along the width of the light-emitting chips 20, and the diffuser surfaces 33 are provided with a coating layer.

[0029] In this embodiment, three light emitting chips 20 are provided on the substrate 10. Specifically, Figure 1 As shown, the three light-emitting chips 20 on the front of the substrate 10 in the figure are a red light-emitting chip, a green light-emitting chip and a blue light-emitting chip from left to right, and the red light-emitting chip, the green light-emitting chip and the blue light-emitting chip are arranged side by side on the front of the substrate 10 at equal intervals.

[0030] Furthermore, the diffuser plate includes two first diffusers 31, one of which is positioned between two adjacent light-emitting chips 20. In other words, in this embodiment, one first diffuser plate 31 is positioned between the red and green light-emitting chips, and another first diffuser plate 31 is positioned between the green and blue light-emitting chips. The first diffusers 31 are positioned along the length of the light-emitting chips 20, and their overall length is greater than the overall length of the light-emitting chips 20. The first diffusers 31 are positioned at the same height as the light-emitting chips 20. The cross-section of the first diffuser plate 31 is rectangular, and the diffusion surfaces 33 on opposite sides of the first diffuser plate 31 along the width of the light-emitting chips 20 are spaced at the same distance from the adjacent light-emitting chips 20.

[0031] Furthermore, in this embodiment, the coating layer on the light-scattering surface 33 is a silver layer. During actual use, the light emitted by the light-emitting chip is reflected by the silver layer, which not only expands the light-emitting angle of the light-emitting chip and reduces light loss, but also effectively avoids the phenomenon of light crosstalk between adjacent light-emitting chips, thereby improving the light brightness of the light-emitting chip.

[0032] Furthermore, an epoxy adhesive layer 40 is provided on the front of the substrate 10. The epoxy adhesive layer 40 covers the surface of the light-emitting chip 20 and the first diffuser 31. The top of the epoxy adhesive layer 40 is a flat structure. It should be noted that the provision of two first diffusers 31 on the front of the substrate 10 can increase the bonding area between the epoxy adhesive layer 40 and the substrate 10 during the molding process. During long-term use, it can effectively prevent external moisture from penetrating into the structure, thereby improving the airtightness and thermal shock resistance of the lamp bead product, thereby significantly enhancing the performance of the lamp bead product.

[0033] Furthermore, in this embodiment, at least two back solder pads 50 are provided on the back surface of the substrate 10 , and a back ink layer 60 is provided between the two back solder pads 50 . One side of the back ink layer 60 is connected to the back surface of the substrate 10 .

[0034] Furthermore, in this embodiment, the substrate 10 is made of resin. The resin material can make the substrate 10 more flexible, thereby better preventing the light emitting chip 20 from burning due to a current short circuit, thereby increasing the service life of the lamp bead.

[0035] This embodiment also provides a lamp bead, which includes the Mini RGB packaging structure in the above example.

[0036] Example 2

[0037] Please refer to Figures 3 and 4, shown is the Mini RGB package structure and lamp beads in the second embodiment of the present invention. The difference between the Mini RGB package structure and lamp beads in this embodiment and the Mini RGB package structure and lamp beads in the first embodiment is that the diffuser includes four second diffusers 32, which are arranged in parallel at equal intervals on the front surface of the substrate 10, and a light-emitting chip is provided between two adjacent second diffusers 32. Specifically, in this embodiment, Figure 3 As shown, the three light-emitting chips on the front of the substrate 10 are, from left to right, a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip. The red, green, and blue light-emitting chips are arranged at equal intervals on the front of the substrate 10. A second diffuser 32 is provided on both sides of the width of the green light-emitting chip, on the side of the red light-emitting chip facing away from the green light-emitting chip, and on the side of the blue light-emitting chip facing away from the green light-emitting chip. The scattering surface 33 on each diffuser is aligned with the spacing between adjacent light-emitting chips. Furthermore, the height of the second diffuser 32 is greater than the height of the light-emitting chips, and the scattering surface 33 on the second diffuser 32 is an inwardly concave arc.

[0038] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0039] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A Mini RGB packaging structure, characterized in that: The device comprises a substrate, at least three light-emitting chips arranged on the front surface of the substrate, and at least two light-scattering plates, wherein the light-scattering plates are arranged along the length direction of the light-emitting chips, and light-scattering surfaces are respectively provided on two opposite sides of the light-scattering plates along the width direction of the light-emitting chips, and the light-scattering surfaces are provided with a coating layer; The diffuser includes two first diffusers, one of which is provided between two adjacent light-emitting chips. The first diffuser is arranged at the same height as the light-emitting chip, and the cross section of the first diffuser is rectangular.

2. The Mini RGB packaging structure according to claim 1, characterized in that: The coating layer is a silver layer.

3. The Mini RGB packaging structure according to claim 1, wherein: The diffuser includes four second diffusers, which are arranged side by side at equal intervals on the front of the substrate, and a light-emitting chip is provided between two adjacent second diffusers. The height of the second diffuser is greater than the height of the light-emitting chip, and the diffuser surface on the second diffuser is an inwardly concave arc surface.

4. The Mini RGB packaging structure according to claim 1, wherein: The light-emitting chips include a red light-emitting chip, a green light-emitting chip and a blue light-emitting chip, and the red light-emitting chip, the green light-emitting chip and the blue light-emitting chip are arranged side by side with equal intervals on the front surface of the substrate.

5. The Mini RGB packaging structure according to claim 1, wherein: An epoxy adhesive layer is further provided on the front of the substrate, and the epoxy adhesive layer covers the surfaces of the light-emitting chip and the diffuser plate, and the top of the epoxy adhesive layer is a planar structure.

6. The Mini RGB packaging structure according to claim 1, characterized in that: At least two back soldering pads are provided on the back side of the substrate, and a back ink layer is provided between the two back soldering pads. One side of the back ink layer is connected to the back side of the substrate.

7. The Mini RGB packaging structure according to claim 1, characterized in that: The substrate is made of resin.

8. A lamp bead, characterized in that: Comprising the Mini RGB packaging structure according to any one of claims 1 to 7.

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