Display panel packaged by driving chip and flexible circuit board

Abstract

The utility model discloses a display panel packaged by a driving chip and a flexible circuit board, comprising a substrate comprising a first surface and a second surface which are oppositely arranged, and the first surface is provided with a display area and a connection area; the first circuit layer covers the first surface; a light-emitting layer and a packaging layer are arranged on the first circuit layer above the display area, and a polaroid, an optical adhesive layer and a protective layer are sequentially arranged above the packaging layer; the second circuit layer is arranged on the second surface, and the second circuit layer is electrically connected with the driving chip and the flexible circuit board; and the conduction circuit is arranged in the connection area or at the edge of the connection area, the upper end of the conduction circuit is electrically connected with the first circuit layer, and the lower end of the conduction circuit is electrically connected with the second circuit layer. Lines on the front face of the substrate are led to the back face of the substrate through metal via holes or a side face line wiring mode to be connected with the driving chip and the flexible circuit board, and the problem that the width of a lower frame of the display panel is increased due to bending of the flexible circuit board is solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of OLED display, and relates to a display panel packaged by a driving chip and a flexible circuit board. Background Art

[0002] In today's display technology landscape, end-users are increasingly demanding of display products, particularly regarding bezel width. With the continuous advancement of technology, OLED hard-display products have made significant progress in meeting these customer demands. Currently, the top and left and right bezels can be made relatively narrow, providing users with a more immersive visual experience.

[0003] However, controlling the width of the bottom bezel of OLED rigid screen products presents challenges. Existing driver chips and flexible circuit boards are packaged on the front of the substrate. After being bonded, the flexible circuit board needs to be bent to the back of the product. This bending protrudes a certain distance from the substrate. This structural characteristic makes it difficult to further reduce the width of the bottom bezel of display products. In the pursuit of extremely narrow bezels, the increase in bottom bezel width has become a key factor restricting the overall design of OLED rigid screen products.

[0004] Therefore, it is necessary to improve the existing technology to overcome the defects in the existing technology. Utility Model Content

[0005] The purpose of the utility model is to provide a display panel packaged with a driver chip and a flexible circuit board, so as to reduce the width of the lower frame of the display product.

[0006] The purpose of this utility model is achieved through the following technical solutions:

[0007] A display panel packaged with a driver chip and a flexible circuit board, comprising:

[0008] The substrate comprises a first surface and a second surface arranged opposite to each other, wherein the first surface has a display area and a connection area;

[0009] a first circuit layer, covering the first surface; a light-emitting layer and an encapsulation layer are provided on the first circuit layer above the display area, and a polarizer, an optical adhesive layer and a protective layer are sequentially provided above the encapsulation layer;

[0010] a second circuit layer, disposed on the second surface, the second circuit layer being electrically connected to the driver chip and the flexible circuit board respectively;

[0011] The conducting circuit is arranged in the connecting area or at the edge of the connecting area, with its upper end electrically connected to the first circuit layer and its lower end electrically connected to the second circuit layer.

[0012] As a further improvement of an embodiment of the present invention, a through hole is provided on the substrate where the connecting area is located, and the conducting circuit is provided in the through hole.

[0013] As a further improvement of an embodiment of the present invention, the conducting circuit is provided on the side wall of the substrate where the connecting area is located, and one end of the second circuit layer is electrically connected to the lower end of the conducting circuit.

[0014] As a further improvement of an embodiment of the present invention, the substrate is thin film transistor glass.

[0015] As a further improvement of an embodiment of the present invention, the flexible circuit board is located on a side of the driving chip away from the connection area.

[0016] As a further improvement of an embodiment of the present invention, the orthographic projection of the second circuit layer on the substrate is located in the connecting area.

[0017] The above technical solution has the following beneficial effects: the circuits on the front of the substrate are led to the back of the substrate through metal vias or side line wiring to achieve connection with the driver chip and the flexible circuit board, thereby solving the problem of increased width of the lower frame of the display panel caused by bending of the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are merely exemplary, and those skilled in the art can, without inventive effort, derive other implementation drawings based on the provided drawings.

[0019] The structures, proportions, sizes, etc. illustrated in this specification are intended solely to complement the contents disclosed herein and to facilitate understanding and reading by persons familiar with the art. They are not intended to limit the conditions under which the present invention may be implemented and therefore have no substantive technical significance. Any structural modifications, changes in proportions, or adjustments in size, without affecting the efficacy and objectives of the present invention, shall remain within the scope of the technical contents disclosed herein.

[0020] Figure 1 This is a structural diagram provided for Example 1 of the present utility model.

[0021] Figure 2 This is a structural diagram provided for Example 2 of the present utility model.

[0022] In the figure: 1-substrate; 2-first circuit layer; 3-light-emitting layer; 4-packaging layer; 5-polarizer; 6-optical adhesive layer; 7-protective layer; 8-second circuit layer; 9-driver chip; 10-flexible circuit board; 11-conduction circuit. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0025] In the present invention, unless otherwise specified, directional words such as "up, down, top, bottom" are usually used with reference to the directions shown in the drawings, or with reference to the components themselves in the vertical, perpendicular or gravity direction; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above directional words are not used to limit the present invention. Example 1

[0026] See also Figure 1 As shown, a display panel using a driver chip and a flexible circuit board package includes a substrate 1 having a first surface (front) and a second surface (back) opposite to each other. The first surface has a display area A and a connection area B. The display area A is the core area for image display, while the connection area B plays an important role in connecting different components.

[0027] The first surface is covered with a first circuit layer 2. A light-emitting layer 3 and an encapsulation layer 4 are sequentially arranged on the first circuit layer 2 above the display area A. The light-emitting layer 3 is responsible for generating light and is an essential component for image display. The encapsulation layer 4 protects the light-emitting layer, preventing damage from external factors. A polarizer 5, an optical adhesive layer 6, and a protective layer 7 are sequentially arranged above the encapsulation layer 4. The polarizer adjusts the polarization direction of light, improving the contrast and color saturation of the image. The optical adhesive layer acts as a bonding and fixing layer, ensuring a tight bond between the layers. The protective layer further protects the display panel from external physical damage.

[0028] A second circuit layer 8 is provided on the second surface of substrate 1. Second circuit layer 8 is electrically connected to a driver chip 9 and a flexible circuit board 10. The driver chip controls the display panel, while the flexible circuit board facilitates signal transmission. Furthermore, a conductive circuit 11 is provided within connection area B. The upper end of conductive circuit 11 is electrically connected to the first circuit layer 2, and the lower end is electrically connected to the second circuit layer 8. This ensures electrical continuity between the circuit layers on the first and second surfaces, ensuring the proper functioning of the entire display panel. This design makes the display panel more compact in structure and more stable and reliable in function.

[0029] Specifically, the substrate 1 is made of thin film transistor glass (TFT glass). TFT glass has excellent performance and characteristics, laying a solid foundation for the stable operation of the display panel.

[0030] This thin-film transistor glass exhibits high transparency, allowing light to pass through unimpeded, ensuring clear and bright images in the display area. Its excellent flatness provides an ideal platform for laying out the various structural layers, allowing the first circuit layer 2, the light-emitting layer 3, and other components to be evenly distributed on it. TFT glass also possesses excellent heat resistance and chemical stability, maintaining its structural integrity and performance stability in a variety of environmental conditions. It can withstand the heat generated during display panel operation without deformation or performance degradation. Furthermore, its resistance to chemical substances enables it to function long-term in complex operating environments, providing a strong guarantee for the reliable operation of the display panel.

[0031] Furthermore, through-holes are provided on substrate 1 where the display panel's connection area B is located. These through-holes are formed using laser drilling, ensuring precision and quality. The through-holes exhibit a vertical structure, connecting different surfaces of substrate 1.

[0032] The conductive circuit 11 is arranged in this through-hole, tightly connecting the first circuit layer 2 on the front of the substrate 1 with the second circuit layer 8 on the back of the substrate. In this way, electrical conduction between different circuit layers is achieved, allowing current and signals to be smoothly transmitted throughout the display panel. The through-hole formed by laser drilling is not only highly precise but also stable, ensuring that the conductive circuit 11 will not become loose or have poor contact during long-term use. At the same time, the vertical structure design also makes the display panel more compact, saves space, and helps reduce the width of the lower frame of the display panel.

[0033] The flexible circuit board 10 is specifically positioned within the display panel. It is located on the side of the driver chip 9 away from the connection area B. The flexible circuit board, with its unique flexibility, greatly facilitates signal transmission within the display panel. It works in conjunction with the driver chip to ensure the proper functioning of the display panel. This layout design fully considers signal transmission path optimization and space efficiency. Positioned away from the connection area B, the flexible circuit board can perform its functions without interfering with other critical areas, effectively ensuring the stable operation of the display panel.

[0034] In the display panel, the orthographic projection of the second circuit layer 8 on the substrate 1 is located within the connection area B. This design is of great significance. Connection area B is a key area connecting the different parts of the display panel. This positioning of the second circuit layer enables it to better electrically connect with the conductive traces 11 and the first circuit layer 2. This layout also helps optimize the overall structure of the display panel, improve space utilization, and ensure more efficient and stable coordination between various components, providing strong support for the display panel's excellent performance. Example 2

[0035] See also Figure 2 As shown, a display panel using a driver chip and a flexible circuit board package has a structure substantially the same as that of Example 1, including:

[0036] The substrate 1 has a first surface (front surface) and a second surface (back surface) opposite to each other, and a display area A and a connection area B are provided on the first surface.

[0037] The first circuit layer 2 is covered and arranged on the first surface; a light-emitting layer 3 and an encapsulation layer 4 are arranged on the first circuit layer 2 above the display area A, and a polarizer 5, an optical adhesive layer 6 and a protective layer 7 are arranged in sequence above the encapsulation layer 4.

[0038] The second circuit layer 8 is disposed on the second surface, and the second circuit layer 8 is electrically connected to the driving chip 9 and the flexible circuit board 10 respectively.

[0039] The difference lies in the placement of the conductive line 11. In this embodiment, the conductive line 11 is arranged at the edge of the connecting area B, with its upper end electrically connected to the first circuit layer 2 and its lower end electrically connected to the second circuit layer 8.

[0040] Specifically, in the display panel, a conductive line 11 is provided on the side wall of the substrate A where the connection area B is located. This design has unique functions and advantages. The conductive line 11 is distributed along the side wall of the substrate A, providing a channel for circuit connection inside the display panel. One end of the second circuit layer 8 is electrically connected to the lower end of the conductive line 11. Through this connection method, electrical conduction between different areas of the substrate is achieved. Such a layout enables current and signals to be transmitted smoothly in the display panel, ensuring that each component can work normally. At the same time, the conductive line 11 on the side wall does not take up too much substrate surface space, which is conducive to reducing the width of the lower frame of the display panel.

[0041] Obviously, the embodiments described above are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0042] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, tasks, devices, components and / or combinations thereof.

[0043] It should be noted that the terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0044] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A display panel packaged with a driver chip and a flexible circuit board, characterized in that: include: The substrate comprises a first surface and a second surface arranged opposite to each other, wherein the first surface has a display area and a connection area; a first circuit layer, covering the first surface; a light-emitting layer and an encapsulation layer are provided on the first circuit layer above the display area, and a polarizer, an optical adhesive layer and a protective layer are sequentially provided above the encapsulation layer; a second circuit layer, disposed on the second surface, the second circuit layer being electrically connected to the driver chip and the flexible circuit board respectively; The conducting circuit is arranged in the connecting area or at the edge of the connecting area, with its upper end electrically connected to the first circuit layer and its lower end electrically connected to the second circuit layer.

2. The display panel according to claim 1, wherein: A through hole is provided on the substrate where the connecting area is located, and the conducting line is provided in the through hole.

3. The display panel according to claim 1, wherein: The conducting circuit is arranged on the side wall of the substrate where the connecting area is located, and one end of the second circuit layer is electrically connected to the lower end of the conducting circuit.

4. The display panel according to claim 1, wherein: The substrate is thin film transistor glass.

5. The display panel according to claim 1, wherein: The flexible circuit board is located on a side of the driving chip away from the connecting area.

6. The display panel according to claim 1, wherein: The orthographic projection of the second circuit layer on the substrate is located in the connecting area.

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