Heat sink assembly, quantum measurement and control circuit and quantum computer

Abstract

The utility model discloses a heat sink assembly, a quantum measurement and control circuit and a quantum computer. The heat sink assembly comprises a heat sink seat and a heat-conducting fin, the heat sink seat comprises a first clamping seat and a second clamping seat which are detachably connected, and an accommodating hole is formed when the first clamping seat and the second clamping seat are clamped; the accommodating hole is used for accommodating a line group comprising a plurality of flexible strip lines, a heat-conducting sheet is attached between any two flexible strip lines in the line group, and the heat-conducting sheet exceeds the extension section of the accommodating hole and is in contact with the wall surface of the clamping part of the first clamping seat and the second clamping seat; and the heat sink seat is arranged on the cold disc. According to the invention, the plurality of flexible strip lines are clamped in the accommodating hole of the heat sink seat, the heat-conducting sheet is pasted between any two adjacent flexible strip lines, and the part, exceeding the accommodating hole, of the heat-conducting sheet is in contact with the clamping part of the first clamping seat and the second clamping seat, so that the heat of the plurality of flexible strip lines is efficiently conducted to the heat sink seat; as the heat sink seat is mounted on the cooling disc, heat is conducted to the cooling disc, and the effect of efficiently dissipating heat of the plurality of flexible strip lines is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of quantum computers, in particular to a heat sink component, a quantum measurement and control circuit and a quantum computer. Background Art

[0002] Quantum computing is a new computing model that uses the laws of quantum mechanics to control basic information units for calculations. While the basic information unit of classical computing is the classical bit, the basic information unit of quantum computing is the qubit. A classical bit can only exist in one state, either 0 or 1, but based on the quantum mechanical principle of superposition, a qubit can exist in a superposition of multiple possible states. As a result, quantum computing far outperforms classical computing in terms of computational efficiency.

[0003] In superconducting quantum computers, quantum chips must operate at extremely low temperatures, such as around 10 millikelvin (mK). This low temperature is typically maintained by a dilution refrigerator, where the quantum chip is mounted at the lowest temperature. To control and measure the quantum chip at this bottom layer, a circuit carrying quantum measurement and control signals must enter the dilution refrigerator, passing through the refrigerator's various cold plates and connecting to the quantum chip at the lowest temperature.

[0004] With the rapid growth in the number of qubits, the required measurement and control signal transmission lines (also known as quantum measurement and control lines) have also increased, but the space inside the dilution refrigerator is usually limited. Currently, the signal transmission lines in the measurement and control signal transmission lines are usually coaxial cables. However, coaxial cables have the following disadvantages: their size will be difficult to achieve a smaller design on a large scale in the long term. With the development of flexible stripline, due to its small size and high integration, more and more designs use flexible stripline to replace coaxial cables. When using flexible stripline, it generates heat during operation. How to ensure that the heat of the flexible stripline during operation is highly efficient and transferred to the cold plate is very important.

[0005] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or any form of implication that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0006] The purpose of the utility model is to provide a heat sink component, a quantum measurement and control circuit and a quantum computer that can efficiently conduct heat to a cold plate.

[0007] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0008] A first aspect of the present invention provides a heat sink assembly, comprising a heat sink seat and a heat conducting sheet;

[0009] The heat sink seat includes a first clamp seat and a second clamp seat that are detachably connected, and the first clamp seat and the second clamp seat form a receiving hole when they are clamped together; the receiving hole is used to accommodate a wire group including a plurality of flexible strip lines, and the thermal conductive sheet is attached between any two adjacent flexible strip lines in the wire group, and the extension section of the thermal conductive sheet beyond the receiving hole is in contact with the wall surface of the clamping point of the first clamp seat and the second clamp seat; the heat sink seat is installed on the cold plate.

[0010] In the heat sink assembly as described above, further, the thermal conductive sheet is adhered to the surface of the flexible strip line by thermal conductive adhesive.

[0011] The heat sink assembly as described above, further, the extension section of the heat conducting sheet beyond the accommodating hole is in complete contact with the wall surface of the clamping portion between the first clamping seat and the second clamping seat;

[0012] And / or, the heat conducting sheet is completely laid on the portion of the flexible strip line located in the accommodating hole.

[0013] As described above, the heat sink assembly further extends the thermal conductive sheet along the width direction of the flexible strip line toward the outside of the accommodating hole to form the extension section, and the extension section is clamped by the first clamp seat and the second clamp seat to achieve contact between the extension section and the wall surface of the clamping point of the first clamp seat and the second clamp seat.

[0014] As described above, the heat sink assembly further comprises: a heat conducting column is provided on the first clamping seat; a first positioning hole matching the heat conducting column is provided on the second clamping seat; and a second positioning hole matching the heat conducting column is provided on the heat conducting sheet.

[0015] In the heat sink assembly as described above, further, the thermal conductive sheet is a copper foil, the thickness of the copper foil is 0.02-0.05 mm, and the surface roughness of the copper foil is 0.5 μm-1.0 μm.

[0016] The heat sink assembly as described above, further, the first clamping seat is made of oxygen-free copper;

[0017] And / or, the second clamping seat is made of oxygen-free copper;

[0018] And / or, the heat-conducting column is made of oxygen-free copper.

[0019] As described above, the heat sink assembly further comprises a plurality of first grooves arranged at intervals on the first clamping seat, a plurality of second grooves arranged at intervals on the second clamping seat, and the first clamping seat and the second clamping seat are clamped together so that the plurality of first grooves and the plurality of second grooves form a plurality of accommodating holes; a wire group is provided in each accommodating hole.

[0020] A second aspect of the present invention provides a quantum measurement and control circuit, comprising a flexible stripline and the above-mentioned heat sink assembly;

[0021] One end of the flexible strip line is electrically connected to a signal source or a measuring device, and the other end is electrically connected to a quantum chip.

[0022] A third aspect of the present invention provides a quantum computer comprising at least one of the above-mentioned quantum measurement and control circuits.

[0023] The beneficial effects of the present invention are:

[0024] In the heat sink assembly of the present application, a plurality of flexible strip lines are clamped in the accommodating hole of the heat sink seat. Since a thermal conductive sheet is attached between any two adjacent flexible strip lines and the portion of the thermal conductive sheet extending beyond the accommodating hole is in contact with the clamping portion of the first clamp seat and the second clamp seat, the heat of the plurality of flexible strip lines is efficiently conducted to the heat sink seat. Since the heat sink seat is installed on a cold plate, the heat is conducted to the cold plate, thereby achieving the effect of efficiently dissipating heat from the plurality of flexible strip lines.

[0025] The quantum measurement and control circuit and quantum computer provided by the present invention both include the above-mentioned heat sink assembly, and therefore have the same beneficial effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A top view of the heat sink assembly provided in an embodiment of the present invention Figure 1 ;

[0027] Figure 2 The main view of the heat sink assembly provided by the embodiment of the utility model Figure 1 ;

[0028] Figure 3 A top view of the heat sink assembly provided in an embodiment of the present invention Figure 2 ;

[0029] Figure 4 Left view of the heat sink assembly provided by the embodiment of the utility model Figure 1 ;

[0030] In the accompanying drawings, 10, first clamping seat; 11, first groove; 12, heat-conducting column; 20, second clamping seat; 21, second groove; 22, first positioning hole; 30, heat-conducting plate; 40, flexible strip line; 50, first screw; 60, second screw. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application. The embodiments described below with reference to the drawings are exemplary and are only used to explain this application, and cannot be interpreted as limiting this application.

[0032] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0034] Figure 1 A top view of the heat sink assembly provided in an embodiment of the present invention Figure 1 ; Figure 2 The main view of the heat sink assembly provided by the embodiment of the utility model Figure 1 ;like Figure 1 and Figure 2 As shown, an embodiment of the present application discloses a heat sink assembly, including a heat sink seat and a thermal conductive sheet 30; the heat sink seat includes a first clamp seat 10 and a second clamp seat 20 that are detachably connected, and the first clamp seat 10 and the second clamp seat 20 form a receiving hole when they are clamped together; the receiving hole is used to accommodate a wire group including a plurality of flexible strip lines 40, and the thermal conductive sheet 30 is attached between any two adjacent flexible strip lines 40 in the wire group, and the extension section of the thermal conductive sheet 30 beyond the receiving hole is in contact with the wall surface of the clamping point of the first clamp seat 10 and the second clamp seat 20; the heat sink seat is installed on a cold plate.

[0035] In the heat sink assembly of the present application, a plurality of flexible strip lines 40 are clamped in the accommodating hole of the heat sink seat. Since a thermal conductive sheet 30 is attached between any two adjacent flexible strip lines 40 and the portion of the thermal conductive sheet 30 extending beyond the accommodating hole is in contact with the clamping portion of the first clamp seat 10 and the second clamp seat 20, the heat of the plurality of flexible strip lines 40 is efficiently conducted to the heat sink seat. Since the heat sink seat is installed on the cold plate, the heat is conducted to the cold plate, thereby achieving the effect of efficiently dissipating heat for the plurality of flexible strip lines 40.

[0036] In this embodiment, the number of flexible ribbon lines 40 in a line group is not specifically limited, but is no less than two. For example, a line group may include two, three, four, or another number of flexible ribbon lines 40. In this embodiment, the number of thermally conductive sheets 30 required in each line group is related to the number of flexible ribbon lines 40. For example, when a line group includes two flexible ribbon lines 40, one thermally conductive sheet 30 is required; when a line group includes three flexible ribbon lines 40, two thermally conductive sheets 30 are required.

[0037] In order to further improve the heat dissipation effect, in some implementations of this embodiment, the heat conducting sheet 30 is adhered to the surface of the flexible strip line 40 by using a heat conducting adhesive.

[0038] By adhering the heat conducting sheet 30 to the surface of the flexible strip line 40 through the heat conducting adhesive, heat can be effectively conducted, so that the heat of the flexible strip line 40 is more effectively transferred to the heat conducting sheet 30 , thereby improving the heat dissipation effect of the flexible strip line 40 .

[0039] In order to further improve the heat dissipation effect, in some implementations of this embodiment, the extension section of the heat conductive sheet 30 extending beyond the accommodating hole is in complete contact with the wall surface of the clamping portion of the first clamping seat 10 and the second clamping seat 20; since the extension section is in complete contact with the wall surface of the clamping portion, the contact area is increased, thereby improving the heat dissipation effect.

[0040] In order to further improve the heat dissipation effect, in some implementations of this embodiment, the heat conducting sheet 30 is completely laid on the portion of the flexible strip line 40 located in the receiving hole.

[0041] In order to further improve the heat dissipation effect, in some implementations of this embodiment, the thermal conductive sheet 30 extends toward the outside of the accommodating hole along the width direction of the flexible strip line 40 to form the extension section, and the extension section is clamped by the first clamp seat 10 and the second clamp seat 20 to achieve contact between the extension section and the wall surface of the clamping point of the first clamp seat 10 and the second clamp seat 20; this arrangement enables the first clamp seat 10 and the second clamp seat 20 to fully contact the thermal conductive sheet 30, thereby improving the heat dissipation effect.

[0042] Figure 3A top view of the heat sink assembly provided in an embodiment of the present invention Figure 2 ;like Figure 3 As shown, in Figure 1 On the basis of the above, the first clamping seat 10 is provided with a heat-conducting column 12, the second clamping seat 20 is provided with a first positioning hole 22 matching the heat-conducting column 12, and the heat-conducting sheet 30 is provided with a second positioning hole matching the heat-conducting column 12; by providing the heat-conducting column 12, the first positioning hole 22, and the second positioning hole, positioning can be easily achieved, thereby making it easier to achieve that the heat-conducting sheet 30 is completely laid on the portion of the flexible strip line 40 located in the accommodating hole. In addition, the heat-conducting column 12 is in contact with the first positioning hole 22 and the second positioning hole, thereby further improving the heat dissipation effect.

[0043] In this embodiment, the material of the heat conducting sheet 30 is not specifically limited, and it can be a heat conducting material. In order to further improve the heat dissipation effect, the heat conducting sheet 30 is copper foil, the thickness of the copper foil is 0.02-0.05 mm, and the surface roughness of the copper foil is 0.5 μm-1.0 μm.

[0044] Since copper foil has good thermal conductivity, the use of copper foil improves the thermal conductivity. By setting the thickness to 0.02-0.05mm, the copper foil ensures thermal conductivity while also having good toughness, making it easier for the extension section to be clamped by the first clamping seat 10 and the second clamping seat 20 to achieve contact between the extension section and the wall surface of the clamping location of the first clamping seat 10 and the second clamping seat 20. The copper foil surface of this embodiment has a certain degree of roughness, which can increase the contact area between the copper foil and the surface of the flexible strip line 40, thereby improving the thermal conductivity efficiency. When the roughness of the copper foil is less than 0.5μm, it may not be enough to increase the contact area, affecting the thermal conductivity performance. When the roughness of the copper foil is higher than 1.0μm, it may cause uneven filling of the thermal conductive adhesive, thereby affecting the thermal conductivity efficiency. Therefore, 0.5μm-1.0μm is selected.

[0045] In this embodiment, the material of the first clamping base 10 is not specifically limited, and any heat-conductive material is sufficient. In order to further improve the heat dissipation effect, the material of the first clamping base 10 is oxygen-free copper.

[0046] In this embodiment, the material of the second clamping base 20 is not specifically limited, and any heat-conductive material is sufficient. To further improve the heat dissipation effect, the material of the second clamping base 20 is oxygen-free copper.

[0047] In this embodiment, the material of the heat-conducting column 12 is not specifically limited, and any heat-conducting material is sufficient. In order to further improve the heat dissipation effect, the material of the heat-conducting column 12 is oxygen-free copper.

[0048] As the number of quantum bits integrated on a quantum chip increases, the number of flexible strip lines 40 required also increases. Although a heat sink assembly can be added to ensure the heat dissipation of more flexible strip lines 40, the free space in the refrigerator is limited. Therefore, it is very necessary to be able to integrate more flexible strip lines 40 in one heat sink assembly. In some implementations of this embodiment, the first clamping seat 10 is provided with a plurality of first grooves 11 arranged at intervals, and the second clamping seat 20 is provided with a plurality of second grooves 21 arranged at intervals. The first clamping seat 10 and the second clamping seat 20 are clamped together so that the plurality of first grooves 11 and the plurality of second grooves 21 form a plurality of accommodating holes; each accommodating hole is provided with a wire group. By providing a plurality of first grooves 11 and second grooves 21, this embodiment enables the heat sink assembly to integrate more flexible strip lines 40 to meet the requirements of high quantum bit circuits.

[0049] For example, Figure 1 As shown, when the first clamping seat 10 in the heat sink assembly is provided with two first grooves 11, and the second clamping seat 20 is provided with two second grooves 21, two receiving holes are formed, each receiving hole is clamped with a wire group, and each wire group contains four flexible strip lines 40. At this time, two flexible strip lines 40 can be pasted on one thermal conductive sheet 30 (these two flexible strip lines 40 belong to different wire groups and are located in different receiving holes), and a total of three thermal conductive sheets 30 are required. The heat sink assembly can be used to integrate eight flexible strip lines 40.

[0050] In this embodiment, the shapes of the first clamping seat 10 and the second clamping seat 20 are not specifically limited. For example, the first clamping seat 10 and the second clamping seat 20 have the same structure and are symmetrically arranged about the line group when clamped. Specifically, the first clamping seat 10 includes a first horizontal plate and a first vertical plate arranged perpendicular to the first horizontal plate, and a first groove 11 is set on the first vertical plate. The second clamping seat 20 includes a second horizontal plate and a second vertical plate arranged perpendicular to the second horizontal plate, and a second groove 21 is set on the second vertical plate. The first clamping seat 10 and the second clamping seat 20 are clamped so that the first groove 11 and the second groove 21 form a receiving hole.

[0051] In this embodiment, the method of installing the heat sink on the cold plate is not specifically limited. For example, Figure 1 As shown: the heat sink is fixed to the cold plate by a first screw 50. In order to further improve the heat dissipation effect, a copper gasket is provided between the first screw 50 and the cold plate.

[0052] In this embodiment, the connection method between the first clamping base 10 and the second clamping base 20 is not specifically limited. For example, Figure 4 Left view of the heat sink assembly provided by the embodiment of the utility model Figure 1 ,like Figure 4As shown, the first clamping seat 10 and the second clamping seat 20 are detachably connected by a second screw 60 .

[0053] Based on the same application concept, this application also proposes a quantum measurement and control circuit comprising a flexible stripline and the aforementioned heat sink assembly. One end of the flexible stripline is electrically connected to a signal source or measurement device, and the other end is electrically connected to a quantum chip. The quantum measurement and control circuit of this embodiment includes the aforementioned heat sink assembly and thus has the same beneficial effects as the aforementioned heat sink assembly, which will not be further described here.

[0054] Based on the same application concept, the present application also proposes a quantum computer comprising at least one of the aforementioned quantum measurement and control circuits. Therefore, it has the same beneficial effects as the aforementioned quantum measurement and control circuits and will not be further elaborated here.

[0055] Throughout this specification, references to terms such as "some embodiments" or "examples" indicate that the specific features, structures, materials, or characteristics described in conjunction with such embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments. Furthermore, those skilled in the art may combine and reconcile the different embodiments or examples described in this specification.

[0056] The above description is merely a preferred embodiment of the present invention and does not limit the present invention in any way. Any person skilled in the art who, without departing from the scope of the present invention, makes any equivalent substitution, modification, or other variation to the technical solution and technical content disclosed herein shall be deemed to fall within the scope of the present invention and remain within the scope of protection of the present invention.

Claims

1. A heat sink assembly, characterized in that: Including heat sink and thermal pad; The heat sink seat includes a first clamp seat and a second clamp seat that are detachably connected, and the first clamp seat and the second clamp seat form a receiving hole when they are clamped together; the receiving hole is used to accommodate a wire group including a plurality of flexible strip lines, and the thermal conductive sheet is attached between any two adjacent flexible strip lines in the wire group, and the extension section of the thermal conductive sheet beyond the receiving hole is in contact with the wall surface of the clamping point of the first clamp seat and the second clamp seat; the heat sink seat is installed on the cold plate.

2. The heat sink assembly according to claim 1, wherein: The heat conducting sheet is adhered to the surface of the flexible strip line through heat conducting adhesive.

3. The heat sink assembly according to claim 1, wherein: The extension section of the heat conducting sheet extending beyond the accommodating hole is in complete contact with the wall surface of the clamping portion between the first clamping seat and the second clamping seat; And / or, the heat conducting sheet is completely laid on the portion of the flexible strip line located in the accommodating hole.

4. The heat sink assembly according to claim 1, wherein: The heat conducting sheet extends toward the outside of the accommodating hole along the width direction of the flexible strip line to form the extension section, and the extension section is clamped by the first clamp seat and the second clamp seat to achieve contact between the extension section and the wall surface of the clamping point of the first clamp seat and the second clamp seat.

5. The heat sink assembly according to claim 1, wherein: The first clamping seat is provided with a heat-conducting column, the second clamping seat is provided with a first positioning hole matching the heat-conducting column, and the heat-conducting sheet is provided with a second positioning hole matching the heat-conducting column.

6. The heat sink assembly according to claim 1, characterized in that The heat conducting sheet is a copper foil, the thickness of the copper foil is 0.02-0.05 mm, and the surface roughness of the copper foil is 0.5 μm-1.0 μm.

7. The heat sink assembly according to claim 5, characterized in that The first clamping seat is made of oxygen-free copper; And / or, the second clamping seat is made of oxygen-free copper; And / or, the heat-conducting column is made of oxygen-free copper.

8. The heat sink assembly according to claim 1, wherein: The first clamping seat is provided with a plurality of first grooves arranged at intervals, and the second clamping seat is provided with a plurality of second grooves arranged at intervals. The first clamping seat and the second clamping seat are clamped together so that the plurality of first grooves and the plurality of second grooves form a plurality of accommodating holes; a wire group is provided in each accommodating hole.

9. A quantum measurement and control circuit, characterized in that: comprising a flexible strip line and a heat sink assembly according to any one of claims 1 to 8; One end of the flexible strip line is electrically connected to a signal source or a measuring device, and the other end is electrically connected to a quantum chip.

10. A quantum computer comprising at least one quantum measurement and control circuit according to claim 9.

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