Lead prefabricated solder mold

Abstract

The utility model relates to a lead wire prefabrication solder mold, which comprises a pin, a support plate perpendicular to the axis of the pin is arranged on the pin, and the diameter of the support plate is larger than that of the pin; the shell comprises an upper mold shell, a middle mold shell and a lower mold shell; the upper mold shell is used for embedding and fixing the supporting plate and the pins above the supporting plate; the middle mold shell is used for embedding and fixing the pins below the supporting plate; and the lower mold shell is used for embedding and fixing the bottoms of the pins. Compared with the prior art, the connecting and fastening relation between the pins and the shell is reinforced, and meanwhile, the follow-up welding flux piece assembling and follow-up brazing are effectively avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit processing, in particular to a lead prefabricated solder mold. Background Art

[0002] In the manufacture of ceramic integrated circuit housings, the leads for soldering ceramic are typically nail-head pins. A pin hole is pre-dug in the lower mold. When in use, the lower mold is placed on the bottom mold, the pins are loaded into the mold, and solder is placed on the pin ends before brazing the ceramic. However, since the nail-head pins fit into the mold only through the pin hole, they lack connectivity. Summary of the Invention

[0003] The purpose of the utility model is to provide a lead prefabricated solder mold in order to overcome the defects of the existing pin and mold having poor connectivity.

[0004] The purpose of the utility model can be achieved through the following technical solutions:

[0005] The technical solution of the utility model is to provide a lead prefabricated solder mold, comprising:

[0006] A pin, wherein the pin is provided with a support plate perpendicular to the axis thereof, and the diameter of the support plate is larger than the diameter of the pin;

[0007] A shell for embedding and fixing several of the pins, the shell includes an upper mold shell for embedding and fixing the support plate and the pins above it, a middle mold shell for embedding and fixing the pins below the support plate, and a lower mold shell for embedding and fixing the bottom of the pins.

[0008] In some specific embodiments, the lower mold shell is provided with an empty slot or a first pin positioning hole matching the diameter of the pin.

[0009] In some specific embodiments, the middle mold shell is provided with a second pin positioning hole that matches the diameter of the pin and passes through the middle mold shell.

[0010] In some specific embodiments, the second pin locating hole is coaxial with the first pin locating hole.

[0011] In some specific embodiments, the depth of the first pin positioning hole or the empty groove and the second pin positioning hole is the same as the distance from the support plate to the bottom of the pin.

[0012] In some specific embodiments, the diameter of the second pin positioning hole is smaller than the diameter of the support plate.

[0013] In some specific embodiments, the upper mold shell is provided with a limiting hole matching the diameter of the support plate, and a third pin positioning hole connected to the limiting hole and matching the diameter of the pin.

[0014] In some specific embodiments, the third pin locating hole and the limiting hole are coaxial with the first pin locating hole and the second pin locating hole.

[0015] In some specific implementations, the diameter of the third pin locating hole is not smaller than the diameters of the first pin locating hole and the second pin locating hole.

[0016] In some specific embodiments, mutually penetrating positioning holes and matching positioning pins are provided at the four top corners of the upper mold shell, the middle mold shell, and the lower mold shell.

[0017] Compared with the prior art, the present invention strengthens the connection and fastening relationship between the pins and the shell, and also effectively avoids the subsequent transfer of solder sheets and subsequent brazing, greatly improving production efficiency and reducing the generation of waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the cross-sectional structure of the utility model.

[0019] Figure 2 This is a structural diagram of a pin of the utility model.

[0020] Figure 3 This is a schematic diagram of the cross-sectional structure of a lower mold of the utility model.

[0021] Figure 4 for Figure 3 Schematic diagram of the top view of the lower mold.

[0022] Figure 5 It is a schematic diagram of the cross-sectional structure of the middle mold of the utility model.

[0023] Figure 6 It is a schematic diagram of the top view of the middle mold of the utility model.

[0024] Figure 7 It is a schematic diagram of the cross-sectional structure of the upper mold of the utility model.

[0025] Figure 8 This is a schematic diagram of the top structure of the upper mold of the utility model.

[0026] Figure 9 This is a schematic diagram of the cross-sectional structure of another lower mold of the present invention.

[0027] Figure 10 for Figure 9 Schematic diagram of the cross-sectional structure of the lower mold.

[0028] The following are marked in the figure:

[0029] 1 is the lower mold, 101 is the first pin positioning hole, 102 is the empty slot, 2 is the middle mold, 201 is the second pin positioning hole, 3 is the upper mold, 301 is the third pin positioning hole, 302 is the limit hole, 4 is the pin, 401 is the support plate, 5 is the positioning pin, 6 is the positioning hole, and 7 is the solder sheet. DETAILED DESCRIPTION

[0030] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0031] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not require further definition or explanation in subsequent drawings.

[0032] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0033] In the following embodiments, unless otherwise specified, functional components or structures are conventional components or structures used in the art to achieve corresponding functions.

[0034] Example 1:

[0035] like Figure 1-8 The figure shows a prefabricated solder mold for special-shaped leads, comprising: pins 4, a housing for embedding and securing a plurality of the pins 4, a support plate 401 perpendicular to the pins 4's axis, and a diameter greater than that of the pins 4. The housing comprises an upper mold shell 3 for embedding and securing the support plate 401 and the pins 4 above it, a middle mold shell 2 for embedding and securing the pins 4 below the support plate 401, and a lower mold shell 1 for embedding and securing the bottoms of the pins 4.

[0036] In the present technical solution, the support plate 401 on the pin 4 is used to increase the support or connection relationship of the side wall of the pin 4 in the shell, further limiting the pin 4 in the shell. The shell is divided into three parts: the upper mold shell 3, the middle mold shell 2, and the lower mold shell 1. The middle mold shell 2 and the lower mold shell 1 are used to limit the part below the upper support plate 401 of the pin 4, so that the support plate 401 of the pin 4 can be supported by the top surface of the middle mold shell 2. The upper mold shell 3 is then used to limit the upper support plate 401 and the part above the pin 4. After the pin 4 is assembled in the shell, on the one hand, the support plate 401 will be further limited in all directions, making the pin 4 in the shell more stable. On the other hand, since only the top surface of the pin 4 is exposed, when the solder sheet 7 is assembled, transported, and brazed at the end of the pin 4, the position of the solder sheet 7 is relatively fixed, which can effectively prevent it from spilling into the shell gap and the support plate 401, resulting in secondary assembly or undetected brazing and becoming waste, affecting the operation efficiency and the qualified rate of the finished product.

[0037] The lower mold shell 1 is provided with a slot 102 that can accommodate all of the pins 4. The middle mold shell 2 is provided with a second pin locating hole 201 that matches the diameter of the pins 4 and penetrates the middle mold shell 2. The depth of the slot 102 and the second pin locating hole 201 is the same as the distance from the support plate 401 to the bottom of the pins 4. Because the diameter of the second pin locating hole 201 is smaller than the diameter of the support plate 401, the support plate 401 on the pins 4 abuts the top surface of the middle mold shell 2. The upper mold shell 3 is provided with a limiting hole 302 that matches the diameter of the support plate 401, and a third pin positioning hole 301 that is connected to the limiting hole 302 and matches the diameter of the pin 4. The third pin positioning hole 301 and the limiting hole 302 are coaxial with the second pin positioning hole 201 to further stabilize the positional relationship between the pin 4 and the shell, and also avoid the situation where the support plate 401 is still exposed after the pin 4 is assembled, thereby affecting the assembly, transportation, and soldering of the solder sheet 6. The aperture of the third pin positioning hole 301 is not less than the aperture of the second pin positioning hole 201. For example, when the pin 4 is a nail head pin, the top diameter of the pin 4 is larger than its bottom diameter, so the aperture of the third pin positioning hole 301 is larger than the aperture of the second pin positioning hole 201; when the pin 4 is cylindrical, the aperture of the third pin positioning hole 301 is the same as the aperture of the second pin positioning hole 201. The four corners of the upper mold shell 3, the middle mold shell 2 and the lower mold shell 1 are provided with mutually penetrating positioning holes 6 and matching positioning pins 5, which ensure the close relationship between the shells through mechanical reinforcement.

[0038] Based on the above technical solution, when the present invention is in use, the middle mold shell 2 can be placed on the lower mold shell 1 first, and then the pins 4 can be installed into the corresponding pin positioning holes of the middle mold shell 2 and the lower mold shell 1 by using a fixture. At this time, the support plate 401 of the pin 4 and the part above it are exposed outside the middle mold shell 2, and then the upper mold shell 3 is placed on the middle mold shell 2, and the limiting hole 302 on the upper mold shell 3 is aligned with the support plate 401, and the third pin positioning hole 301 is aligned with the pin 4. At this time, the positioning pin 5 is inserted into the positioning holes 6 at the four top corners of the upper mold shell 3, the middle mold shell 2, and the lower mold shell 1 to fix the shell, and then the solder sheet 7 is moved to the top surface of the pin 4 by using a fixture for subsequent brazing.

[0039] Example 2:

[0040] Compared with Example 1, most of them are the same, the only difference is that Figure 9 、 10 As shown, the lower mold shell 1 is provided with a first pin positioning hole 101 that matches the diameter of the pin 4 to further determine the positional relationship between each pin 4 and the shell.

[0041] In this embodiment, a special-shaped lead prefabricated solder mold includes: pins 4, a shell for embedding and fixing a number of the pins 4, the pins 4 are provided with a support plate 401 perpendicular to their axis, and the diameter of the support plate 401 is larger than the diameter of the pins 4. The shell includes an upper mold shell 3 for embedding and fixing the support plate 401 and the pins 4 above it, a middle mold shell 2 for embedding and fixing the pins 4 below the support plate 401, and a lower mold shell 1 for embedding and fixing the bottom of the pins 4. The lower mold shell 1 is provided with a first pin positioning hole 101 that matches the diameter of the pins 4 to further determine the positional relationship between each pin 4 and the shell. The middle mold shell 2 is provided with a second pin positioning hole 201 that matches the diameter of the pins 4 and passes through the middle mold shell 2. The second pin positioning hole 201 is coaxial with the first pin positioning hole 301 to further stabilize the positional relationship between the pins 4 and the shell. The depth of the first pin positioning hole 101 and the second pin positioning hole 201 is the same as the distance from the support plate 401 to the bottom of the pin 4, and since the apertures of the first pin positioning hole 101 and the second pin positioning hole 201 are smaller than the diameter of the support plate 401, the support plate 401 on the pin 4 abuts against the top surface of the middle mold shell 2.

[0042] The upper mold shell 3 is provided with a limiting hole 302 that matches the diameter of the support plate 401, and a third pin positioning hole 301 that is connected to the limiting hole 302 and matches the diameter of the pin 4. The third pin positioning hole 301 and the limiting hole 302 are coaxial with the first pin positioning hole 101 and the second pin positioning hole 201 to further stabilize the positional relationship between the pin 4 and the shell, and also prevent the support plate 401 from being exposed after the pin 4 is assembled, thereby affecting the assembly, transportation, and soldering of the solder sheet 6. The aperture of the third pin positioning hole 301 is not smaller than the aperture of the first pin positioning hole 101 and the second pin positioning hole 201. For example, when pin 4 is a nailhead pin, the top diameter of pin 4 is larger than its bottom diameter, so the diameter of third pin locating hole 301 is larger than the diameters of first pin locating hole 101 and second pin locating hole 201. When pin 4 is cylindrical, the diameter of third pin locating hole 301 is the same as the diameters of first pin locating hole 101 and second pin locating hole 201. The four corners of the upper mold 3, middle mold 2, and lower mold 1 are provided with interconnected locating holes 6 and matching locating pins 5, ensuring a tight fit between the shells through mechanical reinforcement.

[0043] Based on the above technical solution, when the present invention is in use, the middle mold shell 2 can be placed on the lower mold shell 1 first, and the second pin positioning hole 201 on the middle mold shell 2 and the first pin positioning hole 101 on the lower mold shell 1 can be aligned. Then, the pin 4 can be installed into the corresponding pin positioning holes of the middle mold shell 2 and the lower mold shell 1 by using a fixture. At this time, the support plate 401 of the pin 4 and the part above it are exposed outside the middle mold shell 2. Then, the upper mold shell 3 is placed on the middle mold shell 2, and the limiting hole 302 on the upper mold shell 3 is aligned with the support plate 401, and the third pin positioning hole 301 is aligned with the pin 4. At this time, the positioning pin 5 is inserted into the positioning holes 6 at the four top corners of the upper mold shell 3, the middle mold shell 2, and the lower mold shell 1 to fix the shell. Then, the solder sheet 7 is moved to the top surface of the pin 4 by using a fixture for subsequent brazing.

[0044] The above description of the embodiments is intended to facilitate understanding and use of the utility model by those skilled in the art. Those skilled in the art will readily be able to make various modifications to these embodiments and apply the general principles described herein to other embodiments without requiring inventive effort. Therefore, the utility model is not limited to the above-described embodiments. Improvements and modifications made by those skilled in the art based on the disclosure of this utility model without departing from the scope of this utility model should be within the scope of protection of this utility model.

Claims

1. A lead prefabricated solder mold, characterized in that: include: A pin (4), wherein the pin (4) is provided with a support plate (401) perpendicular to the axis thereof, and the diameter of the support plate (401) is larger than the diameter of the pin (4); A shell for embedding and fixing a plurality of the pins (4), the shell comprising an upper mold shell (3) for embedding and fixing the support plate (401) and the pins (4) above it, a middle mold shell (2) for embedding and fixing the pins (4) below the support plate (401), and a lower mold shell (1) for embedding and fixing the bottom of the pins (4).

2. The lead prefabricated solder mold according to claim 1, characterized in that: The lower mold shell (1) is provided with an empty slot (102) or a first pin positioning hole (101) matching the diameter of the pin (4).

3. The lead prefabricated solder mold according to claim 2, characterized in that: The middle mold shell (2) is provided with a second pin positioning hole (201) that matches the diameter of the pin (4) and passes through the middle mold shell (2).

4. The lead prefabricated solder mold according to claim 3, characterized in that: The second pin positioning hole (201) is coaxial with the first pin positioning hole (101).

5. The lead prefabricated solder mold according to claim 4, characterized in that: The depth of the first pin locating hole (101) or the empty slot (102) and the second pin locating hole (201) is the same as the distance from the support plate (401) to the bottom of the pin (4).

6. The lead preform solder mold according to claim 3, characterized in that: The diameter of the second pin positioning hole (201) is smaller than the diameter of the support plate (401).

7. The lead preform solder mold according to claim 4, characterized in that: The upper mold shell (3) is provided with a limiting hole (302) whose diameter matches the support plate (401), and a third pin positioning hole (301) which is in communication with the limiting hole (302) and matches the diameter of the pin (4).

8. The lead preform solder mold according to claim 7, characterized in that: The third pin positioning hole (301) and the limiting hole (302) are coaxial with the first pin positioning hole (101) and the second pin positioning hole (201).

9. The lead preform solder mold according to claim 7, characterized in that: The diameter of the third pin positioning hole (301) is not smaller than the diameters of the first pin positioning hole (101) and the second pin positioning hole (201).

10. The lead preform solder mold according to claim 1, characterized in that: Positioning holes (6) that penetrate each other and positioning pins (5) that match the holes are provided at the four corners of the upper mold shell (3), the middle mold shell (2), and the lower mold shell (1).

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