Laser welding adsorption table device

Abstract

The utility model relates to a laser welding adsorption table device which comprises a moving module, a welding adsorption table device body and a laser head, the welding adsorption table device body is installed on the moving module, and the laser head is arranged above the welding adsorption table device body. The welding adsorption table device sequentially comprises a lower bottom plate, an upper bottom plate, a rotating module, an adsorption table and an adjusting device from bottom to top. The adjusting device comprises a base plate, a lower sliding plate and an upper sliding plate. According to the utility model, the whole chip is adsorbed in an inverted manner, the substrate is adsorbed and fixed below the chip, and the whole surface is directly welded after the upper and lower positions are aligned, so that the efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field related to laser processing in the semiconductor industry, and in particular to a laser welding adsorption table device. Background Art

[0002] After extensive searching, we discovered the existing Chinese patent publication number CN216503023U, which discloses a warped piece adsorption laser processing platform, comprising an XY processing platform, a processing adsorption platform, a galvanometer, and a vision system. The processing adsorption platform comprises a suction cup base, on which an adsorption plate is mounted, and an intermediate lifting assembly is mounted within the central groove of the suction cup base. The intermediate lifting assembly comprises a lifting base, and the drive end at the top of the lead screw motor is connected to the upper adsorption support plate, which is equipped with several anti-static suction cups. This utility model uses a sealing ring to form a closed space with the bottom of the product. Even if the product is warped and deformed, this closed space can be formed, allowing the product to be adsorbed and fixed. This utility model can improve processing efficiency and ensure product appearance.

[0003] In summary, the problems existing in the prior art are:

[0004] The conventional method is to solder large chips individually, which is inefficient. In addition, as the size of LED chips becomes smaller and smaller, the difficulty of soldering individual chips also increases.

[0005] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a laser welding adsorption table device to make it more valuable for industrial use. Utility Model Content

[0006] In order to solve any of the above technical problems, the purpose of the present invention is to provide a laser welding adsorption table device.

[0007] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0008] The laser welding adsorption platform device includes a mobile module, a welding adsorption platform device and a laser head. The welding adsorption platform device is installed on the mobile module, and the laser head is arranged above the welding adsorption platform device.

[0009] The welding adsorption table device includes a lower base plate, an upper base plate, a rotating module, an adsorption table and an adjustment device from bottom to top, and the adjustment device includes a base plate, a lower slide plate and an upper slide plate;

[0010] The lower base plate is installed on the mobile module. Several fixed columns installed on the lower base plate pass through the upper base plate and are then connected to the upper base plate. The upper base plate is installed with a rotating module, and the rotating module is installed with an adsorption platform.

[0011] A first slide groove distributed along the front-to-back direction is provided on the base plate, the lower slide plate is placed in the first slide groove and can move along the front-to-back direction in the first slide groove, a second slide groove distributed along the left-to-right direction is provided on the lower slide plate, the upper slide plate is placed in the second slide groove and can move along the left-to-right direction in the second slide groove, a rotating flange is installed in the center hole of the upper slide plate, and the bottom of the rotating flange passes through the center hole of the lower slide plate and is connected to the upper adsorption plate below.

[0012] As a further improvement of the present invention, a gap is provided between the lower base plate and the upper base plate, and a gap adjusting piece is installed in the gap.

[0013] As a further improvement of the present invention, the top screw holes around the base plate are mounted on the fixing columns below through top screws.

[0014] As a further improvement of the present invention, a plurality of lower slide plate pressing blocks are installed on the base plates on the left and right sides of the first slide groove, and the lower slide plate pressing blocks are located above the lower slide plate.

[0015] As a further improvement of the present invention, a lower slide moving bolt is installed in the first slide groove on the front or rear side of the lower slide, one side of the lower slide moving bolt is fixed in the first slide groove, and the other side of the lower slide moving bolt is screwed into the threaded hole of the lower slide.

[0016] As a further improvement of the present invention, a plurality of upper slide plate pressing blocks are installed on the lower slide plates on both sides of the front and rear of the second slide groove, and the upper slide plate pressing blocks are located above the upper slide plate.

[0017] As a further improvement of the present invention, an upper slide moving bolt is installed in the second slide groove on the left or right side of the upper slide, one side of the upper slide moving bolt is fixed in the second slide groove, and the other side of the upper slide moving bolt is screwed into the threaded hole of the upper slide.

[0018] As a further improvement of the present invention, the vacuum joint installed on the rotating flange is connected to the upper adsorption plate below, and the chip board is adsorbed on the bottom of the upper adsorption plate.

[0019] As a further improvement of the present invention, the rotating flange is installed in the center hole of the lower slide plate through a pressing ring.

[0020] By means of the above solution, the present invention has at least the following advantages:

[0021] The utility model adsorbs the whole chip upside down, adsorbs and fixes the substrate at the bottom, and directly welds the whole surface after the upper and lower positions are properly aligned, which is highly efficient.

[0022] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and to implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is a structural diagram of a laser welding adsorption table device of the utility model;

[0025] Figure 2 yes Figure 1 Schematic diagram of the internal structure of the welding adsorption table device;

[0026] Figure 3 yes Figure 2 Schematic diagram of the structure of the middle regulating device;

[0027] Figure 4 yes Figure 3 Schematic diagram of the internal structure.

[0028] The meanings of the reference numerals in the figures are as follows.

[0029] Mobile module 1, welding adsorption table device 2, laser head 3, lower base plate 21, upper base plate 22, rotating module 23, adsorption table 24, fixed column 25, adjusting device 26, base plate 2601, lower slide plate 2602, lower slide plate pressure block 2603, lower slide plate moving bolt 2604, upper slide plate 2605, upper slide plate pressure block 2606, upper slide plate moving bolt 2607, rotating flange 2608, vacuum joint 2609, pressure ring 2610, upper adsorption plate 2611, chip board 2612. DETAILED DESCRIPTION

[0030] The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0031] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the utility model for which protection is sought, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention.

[0032] like Figures 1 to 4 As shown, a laser welding adsorption platform device includes a moving module 1, a welding adsorption platform device 2 and a laser head 3. The welding adsorption platform device 2 is installed on the moving module 1, and the laser head 3 is arranged above the welding adsorption platform device 2.

[0033] The movable module 1 is an X-axis and Y-axis module or a multi-axis module.

[0034] The welding adsorption platform device 2 includes a lower base plate 21, an upper base plate 22, a rotating module 23, an adsorption platform 24 and an adjustment device 26 from bottom to top. The adjustment device 26 includes a base plate 2601, a lower slide plate 2602 and an upper slide plate 2605.

[0035] The lower base plate 21 is mounted on the movable module 1. Several fixed columns 25 installed on the lower base plate 21 pass through the upper base plate 22 and then connect to the upper base plate 2601. A gap is provided between the lower and upper base plates 21, and a gap adjustment plate is installed in the gap. The rotating module 23 is mounted on the upper base plate 22, and the suction platform 24 is mounted on the rotating module 23. The jackscrew holes around the base plate 2601 are fixed to the fixed columns 25 below via jackscrews.

[0036] A first slide groove distributed along the front-to-back direction is provided on the base plate 2601, the lower slide plate 2602 is placed in the first slide groove and can be moved along the front-to-back direction in the first slide groove, a second slide groove distributed along the left-to-right direction is provided on the lower slide plate 2602, the upper slide plate 2605 is placed in the second slide groove and can be moved along the left-to-right direction in the second slide groove, a rotating flange 2608 is installed in the center hole of the upper slide plate 2605, and the bottom of the rotating flange 2608 passes through the center hole of the lower slide plate 2602 and is connected to the upper adsorption plate 2611 below.

[0037] The vacuum joint 2609 installed on the rotating flange 2608 is connected to the upper adsorption plate 2611 below, and the chip board 2612 is adsorbed on the bottom of the upper adsorption plate 2611. The rotating flange 2608 is installed in the center hole of the lower slide plate 2602 through the pressing ring 2610.

[0038] Several lower slide plate pressure blocks 2603 are mounted on the base plates 2601 on the left and right sides of the first chute. The lower slide plate pressure blocks 2603 are located above the lower slide plate 2602. Lower slide plate moving bolts 2604 are mounted in the first chute on the front or rear side of the lower slide plate 2602. One side of the lower slide plate moving bolt 2604 is fixed in the first chute, and the other side is screwed into a threaded hole in the lower slide plate 2602.

[0039] Several upper slide block presses 2606 are mounted on the lower slide 2602 on both sides of the second chute. The upper slide block presses 2606 are located above the upper slide 2605. An upper slide moving bolt 2607 is mounted in the second chute on the left or right side of the upper slide 2605. One side of the upper slide moving bolt 2607 is fixed in the second chute, and the other side is screwed into a threaded hole in the upper slide 2605.

[0040] The positional relationship and connection relationship between the components of the present invention are as follows:

[0041] The welding adsorption platform device 2 is mounted on the moving module 1 via the lower base plate 21 and moves along with the platform. The laser head 3 is mounted and fixed above the welding adsorption platform device 2.

[0042] The components of the welding adsorption platform 2 are positioned as follows: four fixing posts 25 are fixed to the four corners of the lower base 21. The four corner holes of the upper base 22 pass through the four fixing posts 25 and are then fixed to the lower base 21. The upper base 22 does not contact the four fixing posts 25. The rotating module 23 is fixed to the upper base 22, and the adsorption platform 24 is fixed to the rotating module 23. The adjustment device 26 is fixed to the four fixing posts 25 through the holes in the four corners of the base plate 2601.

[0043] The parts of the adjusting device 26 are positioned as follows: the lower slide 2602 is placed in the groove of the base plate 2601. Four lower slide pressure blocks 2603 are fixed to the base plate 2601, pressing the lower slide 2602 so that it can only move along the groove of the base plate 2601. One end of the lower slide moving bolt 2604 is fixed to the base plate 2601, and the other end is screwed into the threaded hole of the lower slide 2602. The upper slide 2605 is placed in the groove of the lower slide 2602. Four upper slide pressure blocks 2606 are fixed to the lower slide 2602, pressing the upper slide 2605 so that it can only reciprocate along the groove of the lower slide 2602. One end of the upper slide moving bolt 2607 is fixed to the lower slide 2602, and the other end is screwed into the threaded hole of the upper slide 2605. The rotating flange 2608 passes through the center hole of the upper slide 2605, and the back side is screwed into the thread of the rotating flange 2608 with a pressure ring 2610 and tightened to the step of the rotating flange 2608, so that the rotating flange 2608 can also rotate in the center hole of the upper slide 2605; the upper adsorption plate 2611 is fixed on the lower surface of the rotating flange 2608.

[0044] The working principle and working process of this utility model:

[0045] First, use a micrometer to check the flatness of the adsorption platform 24. Based on the results, add a gap between the lower base plate 21 and the upper base plate 22 to adjust the flatness of the adsorption platform 24. Place the chip board 2612 on the lower surface of the upper adsorption plate 2611, align it with the adsorption groove, and turn on the vacuum connector 2609 to secure the chip board 2612 by suction. Then, visually check the flatness of the chip board 2612. Based on the inspection results, adjust the overall posture of the adjustment device 26 using the screw holes at the four corners of the base plate 2601. This also adjusts the flatness of the chip board 2612 to ensure that the chip board 2612 is parallel to the adsorption platform 24. Then place the welding substrate on the adsorption table 24 for adsorption and fixation, rotate the rotating module 23 to level the welding substrate, adjust the XY direction of the chip board 2612 by adjusting the lower slide moving bolts 2604 and the upper slide moving bolts 2607, and adjust the angle of the chip board 2612 by rotating the rotating flange 2608, and finally align each chip on the chip board 2612 with the soldering point on the welding substrate, and then move the rotating module 23 upward to press the welding substrate and the chip board 2612 together, and then start laser welding. After the processing is completed, the rotating module 23 descends, and the chip board 2612 is supported by hand and the vacuum of the vacuum joint 2609 is disconnected, the empty chip board 2612 is taken out, and the vacuum of the adsorption table 24 is turned off to take out the substrate that is finally welded intact.

[0046] The utility model adsorbs the whole chip upside down, adsorbs and fixes the substrate at the bottom, and directly welds the whole surface after the upper and lower positions are properly aligned, which is highly efficient.

[0047] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0048] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0049] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A laser welding adsorption platform device, comprising a movable module (1), a welding adsorption platform device (2) and a laser head (3), wherein the welding adsorption platform device (2) is mounted on the movable module (1), and a laser head (3) is arranged above the welding adsorption platform device (2); characterized in that: The welding adsorption platform device (2) comprises, from bottom to top, a lower base plate (21), an upper base plate (22), a rotating module (23), an adsorption platform (24) and an adjustment device (26); the adjustment device (26) comprises a base plate (2601), a lower slide plate (2602) and an upper slide plate (2605); The lower base plate (21) is mounted on the movable module (1); a plurality of fixed columns (25) mounted on the lower base plate (21) pass through the upper base plate (22) and are then connected to the upper base plate (2601); a rotating module (23) is mounted on the upper base plate (22); and an adsorption platform (24) is mounted on the rotating module (23); A first slide groove distributed along the front-to-back direction is provided on the base plate (2601), the lower slide plate (2602) is placed in the first slide groove and can be moved in the front-to-back direction in the first slide groove, a second slide groove distributed along the left-to-right direction is provided on the lower slide plate (2602), the upper slide plate (2605) is placed in the second slide groove and can be moved in the left-to-right direction in the second slide groove, a rotating flange (2608) is installed in the center hole of the upper slide plate (2605), and the bottom of the rotating flange (2608) passes through the center hole of the lower slide plate (2602) and is connected to the upper adsorption plate (2611) below.

2. The laser welding adsorption stage device according to claim 1, characterized in that: A gap is provided between the lower base plate (21) and the upper base plate (22), and a gap adjusting piece is installed in the gap.

3. The laser welding adsorption stage device according to claim 1, characterized in that: The top screw holes around the base plate (2601) are mounted on the fixing columns (25) below through top screws.

4. The laser welding adsorption stage device according to claim 1, characterized in that: A plurality of lower slide plate pressing blocks (2603) are installed on the base plates (2601) on the left and right sides of the first slide groove, and the lower slide plate pressing blocks (2603) are located above the lower slide plate (2602).

5. The laser welding adsorption stage device according to claim 1, characterized in that: A lower slide moving bolt (2604) is installed in the first sliding groove on the front side or rear side of the lower slide (2602), one side of the lower slide moving bolt (2604) is fixed in the first sliding groove, and the other side of the lower slide moving bolt (2604) is screwed into the threaded hole of the lower slide (2602).

6. The laser welding adsorption stage device according to claim 1, characterized in that: A plurality of upper slide pressing blocks (2606) are installed on the lower slides (2602) at both the front and rear sides of the second slide groove, and the upper slide pressing blocks (2606) are located above the upper slide (2605).

7. The laser welding adsorption stage device according to claim 1, characterized in that: An upper slide moving bolt (2607) is installed in the second sliding groove on the left or right side of the upper slide (2605), one side of the upper slide moving bolt (2607) is fixed in the second sliding groove, and the other side of the upper slide moving bolt (2607) is screwed into the threaded hole of the upper slide (2605).

8. The laser welding adsorption stage device according to claim 1, characterized in that: The vacuum joint (2609) installed on the rotating flange (2608) is connected to the upper adsorption plate (2611) below, and the chip board (2612) is adsorbed on the bottom of the upper adsorption plate (2611).

9. The laser welding adsorption stage device according to claim 1, characterized in that: The rotating flange (2608) is installed in the center hole of the lower slide plate (2602) through the pressure ring (2610).

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