Injection mold capable of preventing chip from being damaged

Abstract

The utility model provides an injection mold capable of preventing a chip from being damaged. The injection mold comprises an upper mold assembly and a lower mold assembly arranged below the upper mold assembly, the upper die assembly internally comprises an upper removing block installed in an upper die plate, and upper ejector pins are installed in the upper removing block and the upper die plate. A column casing corresponding to the upper removing block is arranged in the lower die assembly, a column casing iron block is arranged in the circumferential direction of the column casing, and lower ejector pins are arranged in the column casing iron block and the lower die plate; the multiple upper ejector pins located in the upper die assembly and the multiple lower ejector pins located in the lower die assembly are coaxially arranged. According to the utility model, the upper ejector pin and the lower ejector pin which are arranged in the injection mold are utilized for the part of a product with a film sticking phenomenon in the injection mold, the film sticking phenomenon when the substrate is separated from the injection mold is avoided, the structure of the upper support column and the lower support column is combined, the problem of chip damage is solved, the flatness of the substrate can be effectively improved, and the production efficiency is improved. The product production quality is stabilized.

Description

Technical Field

[0001] The utility model relates to the field of injection molds, in particular to the technical field of chip manufacturing molds, and specifically to an injection mold for preventing chip damage. Background Art

[0002] During the early stages of mass production of the new CP 16G DDR5 product, chip breakage frequently occurred. Analysis revealed that when separating the material from the injection mold of the MUF equipment, insufficient wax was applied to the mold surface, making it difficult to demold the substrate. The substrate became sticky when being removed from the mold, making it difficult to demold and separate the material, leading to chip breakage.

[0003] As production volumes continued to increase, defects continued to occur, making it impossible to maintain stable production. Immediate action was urgently needed to address this issue. The defects revealed a concentrated problem, concentrating on the same row of the substrate. The chip breakage occurred primarily on both sides of the ejector pins in the MUF equipment during injection molding. Furthermore, the mold cleaning process typically took six hours before the defects occurred. During separation from the mold, the high viscosity of the injection molding material prevented the material from falling off easily, leading to chip breakage. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide an injection mold that prevents chip damage, so as to solve the difficulties of the prior art.

[0005] To achieve the above-mentioned and other related purposes, the present invention provides an injection mold for preventing chip breakage, comprising an upper mold assembly and a lower mold assembly disposed below the upper mold assembly;

[0006] The upper mold assembly includes an upper rejection block 4 installed in the upper mold plate 2, and upper ejector pins 7 are installed in both the upper rejection block 4 and the upper mold plate 2;

[0007] The lower die assembly is provided with a column 211 corresponding to the upper reject block 4, and a column iron block 24 is installed circumferentially of the column 211. A lower ejector pin 27 is provided in both the column iron block 24 and the lower die plate 22.

[0008] The plurality of upper ejector pins 7 located in the upper mold assembly and the plurality of lower ejector pins 27 located in the lower mold assembly are coaxially arranged.

[0009] According to a preferred embodiment, the upper ejector pin 7 and the lower ejector pin 27 are located on the same side of the product.

[0010] According to a preferred embodiment, nine upper ejector pins 7 and nine lower ejector pins 27 are arranged at equal intervals in each column.

[0011] According to the preferred solution, the upper mold assembly is provided with an upper driving plate 6, an upper top plate 5, an upper mold base 1 and an upper mold plate 2 in sequence along the direction close to the lower mold assembly;

[0012] The upper template 2 is provided with an upper reject block 4 and a door cutout 3 located around the upper reject block 4;

[0013] The upper ejector pin 7 is installed on the upper ejector plate 5, and the bottom thereof passes through the upper die base 1 and the upper die plate 2 in sequence.

[0014] According to a preferred embodiment, an upper push pin 11 is further mounted on the end of the upper driving plate 6 away from the lower die assembly.

[0015] According to the preferred embodiment, an upper support 9 passing through the upper driving plate 6 and the upper top plate 5 is installed on the top of the upper die base 1;

[0016] A lower support column 29 passing through the lower top plate 25 and the lower driving plate 26 is provided at the bottom of the lower die base 21 .

[0017] According to the preferred embodiment, the lower mold assembly is provided with a lower driving plate 26, a lower top plate 25, a lower mold base 21, a lower partition plate 23 and a lower mold plate 22 in sequence along the direction close to the upper mold assembly;

[0018] The column 211 is provided through the lower driving plate 26, the lower top plate 25, the lower die base 21, the lower partition plate 23 and the lower die plate 22. A piston 212 for pushing the plastic packaging material is installed in the column 211.

[0019] The lower ejector pin 27 is installed on the lower ejector plate 25 , and the top thereof passes through the lower die base 21 , the lower partition plate 23 and the lower die plate 22 in sequence.

[0020] According to the preferred solution, the thickness of the lower partition 23 is changed according to product requirements.

[0021] According to the preferred embodiment, an upper return pin 8 and a lower return pin 28 are coaxially mounted in the upper mold assembly and the lower mold assembly respectively;

[0022] The upper return pin 8 is installed on the upper top plate 5, and the bottom passes through the upper mold base 1 and the upper mold plate 2;

[0023] The lower return pin 28 is installed on the lower top plate 25, and the top passes through the lower die base 21, the lower partition plate 23 and the lower die plate 22;

[0024] When the upper mold assembly and the lower mold assembly are closed, the upper return pin 8 and the lower return pin 28 are set against each other;

[0025] The upper return pin 8 is sleeved with a butterfly spring 12 , and the butterfly spring 12 is arranged between the upper die base 1 and the upper top plate 5 .

[0026] According to the preferred embodiment, an upper stop pin 10 is installed on the end of the upper driving plate 6 away from the lower mold assembly;

[0027] Correspondingly, a lower stopping pin 210 is mounted on one end of the lower driving plate 26 away from the upper die assembly.

[0028] According to a preferred embodiment, the upper stop pin 10 and the lower stop pin 210 are coaxially arranged.

[0029] The utility model aims at the part where the product in the injection mold has a sticking phenomenon, and utilizes the upper ejector and the lower ejector installed in the injection mold to avoid the sticking phenomenon when the substrate is separated from the injection mold. Combined with the structure of the upper support and the lower support, the problem of chip damage is solved, and the flatness of the substrate is effectively improved, thereby stabilizing the product production quality.

[0030] The following will describe in more detail the best embodiments of the present invention in conjunction with the accompanying drawings so that the features and advantages of the present invention can be easily understood. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 Shown is a schematic structural diagram of the upper mold assembly in the present invention;

[0032] Figure 2 Shown is a schematic structural diagram of the lower mold assembly in the present invention;

[0033] Description of labels

[0034] 1. Upper die base; 2. Upper die plate; 3. Door cutout; 4. Upper knockout block; 5. Upper ejector plate; 6. Upper drive plate; 7. Upper ejector pin; 8. Upper return pin; 9. Upper support post; 10. Upper stop ejector pin; 11. Upper push ejector pin; 12. Belleville spring;

[0035] 21. Lower die base; 22. Lower die plate; 23. Lower partition plate; 24. Column iron block; 25. Lower top plate; 26. Lower drive plate;

[0036] 27. Lower ejector pin; 28. Lower return pin; 29. Lower support pin; 210. Lower stop ejector pin; 211. Cylinder; 212. Piston. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the technical solution of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the specific embodiments of the present invention. The same figure marks in the drawings represent the same parts. It should be noted that the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Compared to the embodiments shown in the drawings, feasible embodiments within the scope of protection of the present invention may have fewer components, other components not shown in the drawings, different components, differently arranged components, or differently connected components, etc. In addition, two or more components in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.

[0039] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by persons of ordinary skill in the field to which the present invention belongs. The words "first", "second" and similar terms used in the specification and claims of the present utility model patent application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "a" or "an" do not necessarily indicate a quantity limitation. Words such as "include" or "comprising" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0040] The utility model proposes an injection mold for preventing chip damage, which is used in the chip manufacturing process. The utility model does not limit the type of chip, but the structure of the injection mold for preventing chip damage is particularly suitable for the production of CP 16G DDR5.

[0041] In general, the chip damage prevention injection mold proposed by the present invention mainly includes an upper mold component and a lower mold component arranged below the upper mold component. Figure 1 , which shows the arrangement relationship between the upper mold assembly and the lower mold assembly.

[0042] In order to facilitate chip demolding in the injection mold, the problem reflected in the background technology is concentrated on the same row of the substrate, and the chip breakage defective position is mainly on both sides of the separation ejector pins of the MUF equipment injection, and the injection mold cleaning time is six hours before the defect occurs. When the material is separated from the mold, the viscosity of the injection molding material is high and the material is not easy to fall off, resulting in chip breakage. For this reason, in the technical solution provided in this embodiment, the upper ejector pin and the lower ejector pin installed in the injection mold are used for the part where the product in the injection mold has a sticking phenomenon, so as to avoid the sticking phenomenon when the substrate is separated from the injection mold. Combined with the structure of the upper and lower pillars, the problem of chip breakage is solved, and the flatness of the substrate is effectively improved to stabilize the product production quality.

[0043] As mentioned above, during the injection molding production process of the substrate, it was found that the defective problems were concentrated on the same side of the substrate and on the side where the mold was separated. For this reason, an upper ejector pin 7 was installed at the corresponding position in the upper mold assembly, and a lower ejector pin 27 was installed at the corresponding position in the lower mold assembly. Since the multiple upper ejector pins 7 in the upper mold assembly and the multiple lower ejector pins 27 in the lower mold assembly are coaxially arranged, and the upper ejector pins 7 and the lower ejector pins 27 are located on the same side of the product, there are 9 upper ejector pins 7 and lower ejector pins 27 in each column at equal intervals, which can effectively make the material stripping simultaneously in the axial direction of the same side of the substrate, and resist the problem of viscosity of the injection molding material, so that the demolding process becomes smooth.

[0044] Specifically, such as Figure 1 As shown, the upper mold assembly is provided with an upper driving plate 6, an upper top plate 5, an upper mold base 1 and an upper mold plate 2 in sequence along the direction approaching the lower mold assembly, wherein the upper driving plate 6 and the upper top plate 5 are connected to each other, and the upper mold base 1 and the upper mold plate 2 are connected to each other. During operation, an upper rejection block 4 and a door cutout 3 located around the upper rejection block 4 are installed in the upper mold plate 2 corresponding to injection molding, and an upper ejector pin 7 for smooth demoulding is installed on the upper top plate 5, wherein the bottoms of two rows of upper ejector pins 7 pass through the upper mold base 1 and the upper mold plate 2 in sequence, and the bottom of the upper ejector pin 7 on the other side passes through the upper rejection block 4.

[0045] Similarly, if Figure 2As shown, the lower mold assembly is provided with a lower driving plate 26, a lower top plate 25, a lower mold base 21, a lower partition plate 23 and a lower mold plate 22 in sequence along the direction close to the upper mold assembly, wherein the lower driving plate 26 and the lower top plate 25 are connected to each other, and the lower mold base 21, the lower partition plate 23 and the lower mold plate 22 are connected to each other, corresponding to the injection molding and the upper rejection block 4 in the upper mold assembly, a column 211 is provided in the lower driving plate 26, the lower top plate 25, the lower mold base 21, the lower partition plate 23 and the lower mold plate 22, and a piston 212 is installed in the column 211, and the piston 212 is used for pushing during the EMC molding material process; in addition, corresponding to the door cutout 3 in the upper mold assembly, a column iron block 24 for sealing is installed in the circumference of the column 211, and the column iron block 24 is used to form a gap between the column 211 and the lower mold assembly.

[0046] It should be specifically explained that a lower ejector 27 for demolding is also provided in the lower mold assembly, wherein the lower ejector 27 is installed on the lower ejector plate 25, two rows of which are coaxially arranged with the two rows in the upper mold assembly, and the top passes through the lower mold base 21, the lower partition plate 23 and the lower template 22 in sequence, and the other row is coaxially arranged with the upper ejector 7 passing through the upper rejection block 4 in the upper mold assembly, and the top of the lower ejector 27 in this row passes through the column iron block 24.

[0047] On this basis, it is preferred that the thickness of the lower partition 23 is adjusted and replaced according to product requirements to ensure quality management of product production.

[0048] Combined with attachment Figure 1 and 2 As shown, the top of the upper mold base 1 is equipped with an upper support 9 passing through the upper drive plate 6 and the upper top plate 5, and the bottom of the lower mold base 21 is equipped with a lower support 29 passing through the lower top plate 25 and the lower drive plate 26. The upper support 9 and the lower support 29 can support the product substrate after the injection mold is completed, which helps the product substrate to be separated from the injection cavity.

[0049] Considering the ejector pin used for mold return, an upper return pin 8 and a lower return pin 28 are coaxially mounted in the upper mold assembly and the lower mold assembly, respectively. The upper return pin 8 is mounted on the upper ejector plate 5, with its bottom passing through the upper mold base 1 and the upper mold plate 2. The lower return pin 28 is mounted on the lower ejector plate 25, with its top passing through the lower mold base 21, the lower partition plate 23, and the lower mold plate 22. When the upper and lower mold assemblies are closed, the upper return pin 8 and the lower return pin 28 abut against each other to form a limit position, thereby protecting the product from molding.

[0050] In addition, a butterfly spring 12 is installed on the upper return pin 8. The butterfly spring 12 is arranged between the upper mold base 1 and the upper top plate 5. The butterfly spring can play a certain buffering and stabilizing role in the movement of the mold, with the purpose of preventing material leakage during the EMC injection molding process.

[0051] Furthermore, when the upper and lower molds are pressed together, in order to prevent the molds from being over-pressed and to play a role in pressing and limiting the position, an upper stop pin 10 is installed on the end of the upper driving plate 6 away from the lower mold assembly, and a lower stop pin 210 is correspondingly installed on the end of the lower driving plate 26 away from the upper mold assembly. The upper stop pin 10 and the lower stop pin 210 are coaxially arranged and press against each other during pressing; in addition, during returning, an upper push pin 11 is also installed on the end of the upper driving plate 6 away from the lower mold assembly to play a driving action when the mold returns in the upper mold.

[0052] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed in the present invention are intended to be covered by the claims of the present invention.

Claims

1. An injection mold for preventing chip damage, characterized in that: It includes an upper mold assembly and a lower mold assembly arranged below the upper mold assembly; The upper mold assembly includes an upper rejection block (4) installed in the upper mold plate (2), and upper ejector pins (7) are installed in both the upper rejection block (4) and the upper mold plate (2); A column barrel (211) is provided in the lower die assembly corresponding to the upper reject block (4), a column barrel iron block (24) is installed in the circumference of the column barrel (211), and a lower ejector pin (27) is provided in both the column barrel iron block (24) and the lower die plate (22); The plurality of upper ejector pins (7) located in the upper mold assembly and the plurality of lower ejector pins (27) located in the lower mold assembly are coaxially arranged.

2. The chip-breakage-proof injection mold according to claim 1, characterized in that: The upper ejector pin (7) and the lower ejector pin (27) are arranged on the same side of the product.

3. The chip-breakage-proof injection mold according to claim 2, characterized in that: The upper die assembly is provided with an upper driving plate (6), an upper top plate (5), an upper die seat (1) and an upper die plate (2) in sequence along a direction close to the lower die assembly; An upper rejection block (4) and door cutouts (3) located around the upper rejection block (4) are installed in the upper template (2); the upper ejector pin (7) is installed on the upper top plate (5), and its bottom passes through the upper mold base (1) and the upper template (2) in sequence.

4. The chip-breakage-proof injection mold according to claim 3, characterized in that: An upper support (9) passing through the upper drive plate (6) and the upper top plate (5) is installed on the top of the upper die seat (1); The bottom of the lower die base (21) is provided with a lower support column (29) passing through the lower top plate (25) and the lower driving plate (26).

5. The chip-breakage-proof injection mold according to claim 4, characterized in that: The lower die assembly is provided with a lower driving plate (26), a lower top plate (25), a lower die base (21), a lower partition plate (23) and a lower die plate (22) in sequence along a direction close to the upper die assembly; The column cylinder (211) is arranged through the lower driving plate (26), the lower top plate (25), the lower mold base (21), the lower partition plate (23) and the lower mold plate (22), and a piston (212) for pushing the plastic packaging material is installed in the column cylinder (211); The lower ejector pin (27) is installed on the lower top plate (25), and the top thereof passes through the lower die base (21), the lower partition plate (23) and the lower die plate (22) in sequence.

6. The chip-breakage-proof injection mold according to claim 5, characterized in that: An upper return pin (8) and a lower return pin (28) are coaxially mounted in the upper die assembly and the lower die assembly, respectively; The upper return pin (8) is mounted on the upper top plate (5), and its bottom passes through the upper die base (1) and the upper die plate (2); The lower return pin (28) is installed on the lower top plate (25), and the top passes through the lower mold base (21), the lower partition plate (23) and the lower mold plate (22); When the upper mold assembly and the lower mold assembly are closed, the upper return pin (8) and the lower return pin (28) are positioned against each other; A butterfly spring (12) is sleeved and mounted on the upper return pin (8), and the butterfly spring (12) is arranged between the upper die seat (1) and the upper top plate (5).

7. The chip-breakage-proof injection mold according to claim 6, characterized in that: An upper stop pin (10) is mounted on one end of the upper drive plate (6) away from the lower die assembly; Correspondingly, a lower stop ejector pin (210) is installed on one end of the lower driving plate (26) away from the upper die assembly.

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