Semi-automatic film tearing device for wafer

Abstract

The utility model discloses a semi-automatic film tearing device for a wafer, which comprises a device shell, a linear sliding table and a compressed air regulating valve are respectively arranged on the horizontal plane at one end of the device shell, and a vacuum chuck connected with the compressed air regulating valve is arranged on the linear sliding table. A vacuum degree display instrument, a vacuum starting button, a touch screen, an emergency stop button and a film tearing starting button are arranged on the inclined surface of one end of the device shell; the device is provided with a device shell, a mounting frame, a supporting frame, a servo motor, a driving synchronous belt wheel, a transmission belt, a driven synchronous belt wheel, a waste adhesive tape storage roller, a damping force transmission wheel, a damping force transmission synchronous belt, an adhesive tape positioning roller, a waste adhesive tape discharging roller shaft, a lifting air cylinder, an adhesive tape pressing roller, a static ion removing fan and a protective cover. And the function of simple operation is achieved, so that the operation convenience is improved, and the problem of time and labor waste caused by tedious operation is solved.

Description

Technical Field

[0001] The utility model belongs to the wafer technology direction, and specifically relates to a wafer semi-automatic film tearing device. Background Art

[0002] The wafer is the carrier used to produce integrated circuits, mostly referring to single-crystal silicon wafers. The wafer needs to be torn off during processing. With the continuous advancement of technology, manual tearing of the film is gradually eliminated, and more advanced tearing devices are used to replace manual tearing of the film.

[0003] The existing film tearing device has a low degree of automation, which still requires a lot of manual work, resulting in high labor consumption and reduced film tearing efficiency. This phenomenon has become a problem that needs to be solved urgently by people in this field. Utility Model Content

[0004] The purpose of the present invention is to provide a semi-automatic wafer film tearing device in view of the existing technology, so as to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a semi-automatic wafer film tearing device, comprising a device shell, a linear slide and a compressed air regulating valve are respectively provided on the horizontal surface of one end of the device shell, a vacuum suction cup connected to the compressed air regulating valve is installed on the linear slide, and a vacuum display instrument, a vacuum start button, a touch screen, an emergency stop button and a film tearing start button are respectively provided on the inclined surface of one end of the device shell.

[0006] A groove is provided at the other end of the device shell, and a mounting bracket and a support bracket are respectively provided on both sides of the inner wall of the groove. A servo motor is installed on the inner wall of the mounting bracket, and a driving synchronous pulley is installed on the output shaft of the servo motor. A transmission belt is installed on the outer wall of the driving synchronous pulley, and a driven synchronous pulley is installed on the top of the transmission belt. The driven synchronous pulley is connected to a waste tape storage roller through an axis.

[0007] Two damping force transmission wheels are respectively installed on the outer walls of the mounting frame, and the outer walls of the two damping force transmission wheels are provided with damping force transmission synchronous belts. One of the damping force transmission wheels is connected to the tape positioning roller through an axis, and the other damping force transmission wheel is connected to the waste tape roller through an axis.

[0008] A lifting cylinder is installed on the inner wall of the support frame, and a tape pressing roller is installed on the movable end of the lifting cylinder.

[0009] Furthermore, a protective cover is provided above the groove of the device housing, and the protective cover is connected to the device housing by bolts, which facilitates protection work.

[0010] Furthermore, a warning light is provided on the top of the protective cover to facilitate warning work.

[0011] Furthermore, display windows are provided on the top and one side of the protective cover, and the windows are distributed in a transparent structure, which facilitates observation of the work progress.

[0012] Furthermore, a static-eliminating ion blower is provided in the groove of the device housing, and the static-eliminating ion blower is located inside the protective cover, which facilitates the static-eliminating work.

[0013] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0014] (1) By providing a device housing, a mounting frame, a support frame, a servo motor, an active synchronous pulley, a transmission belt, a driven synchronous pulley, a waste tape storage roller, a damping force transmission wheel, a damping force transmission synchronous belt, a tape positioning roller, a waste tape discharge roller, a lifting cylinder, a tape pressing roller, an anti-static ion fan and a protective cover, a simple operation function is achieved, thereby improving the convenience of operation, solving the time-consuming and labor-intensive problems caused by complicated operations, and effectively saving labor and improving the film tearing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a left side cross-sectional schematic diagram of the utility model;

[0018] Figure 3 It is a right side cross-sectional schematic diagram of the present utility model;

[0019] Figure 4 It is a back sectional schematic diagram of the present utility model.

[0020] In the figure: 1. Device housing; 2. Mounting frame; 3. Support frame; 4. Servo motor; 5. Active synchronous pulley; 6. Transmission belt; 7. Driven synchronous pulley; 8. Waste tape storage roller; 9. Damping force transmission wheel; 10. Damping force transmission synchronous belt; 11. Tape positioning roller; 12. Waste tape discharge roller; 13. Lifting cylinder; 14. Tape pressing roller; 15. Anti-static ion fan; 16. Protective cover. DETAILED DESCRIPTION

[0021] The following is a non-limiting detailed description of the technical solution of the present invention in conjunction with preferred embodiments and their accompanying drawings. Obviously, the described embodiments are only a portion of the embodiments of the present invention, and not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.

[0022] See also Figure 1-4 The utility model provides a technical solution: a semi-automatic wafer film tearing device, including a device shell 1, a linear slide and a compressed air regulating valve are respectively provided on the horizontal surface of one end of the device shell 1, a vacuum suction cup connected to the compressed air regulating valve is installed on the linear slide, and a vacuum display instrument, a vacuum start button, a touch screen, an emergency stop button and a film tearing start button are respectively provided on the inclined surface of one end of the device shell 1.

[0023] A groove is provided at the other end of the device housing 1, and a mounting frame 2 and a support frame 3 are respectively provided on both sides of the inner wall of the groove. A servo motor 4 is installed on the inner wall of the mounting frame 2, and a driving synchronous pulley 5 is installed on the output shaft of the servo motor 4. A transmission belt 6 is installed on the outer wall of the driving synchronous pulley 5, and a driven synchronous pulley 7 is installed on the top of the transmission belt 6. The driven synchronous pulley 7 is connected to a waste tape storage roller 8 through an axis.

[0024] Two damping force transmission wheels 9 are respectively installed on the outer wall of the mounting frame 2, and the outer walls of the two damping force transmission wheels 9 are provided with a damping force transmission synchronous belt 10. One damping force transmission wheel 9 is connected to the tape positioning roller 11 through an axis, and the other damping force transmission wheel 9 is connected to the waste tape roller 12 through an axis.

[0025] A lifting cylinder 13 is installed on the inner wall of the support frame 3, and a tape pressing roller 14 is installed on the movable end of the lifting cylinder 13.

[0026] Furthermore, a protective cover 16 is provided above the groove of the device housing 1 , and the protective cover 16 is connected to the device housing 1 by bolts, which facilitates the protection work.

[0027] Furthermore, a warning light is provided on the top of the protective cover 16 to facilitate warning work.

[0028] Furthermore, display windows are provided on the top and one side of the protective cover 16, and the windows are distributed in a transparent structure, which facilitates observation of the work progress.

[0029] Furthermore, a static-eliminating ion blower 15 is provided in the groove of the device housing 1 and is located inside the protective cover 16 , facilitating static-eliminating work.

[0030] When in use, first, manually place the wafer with film on the vacuum suction cup, then press the vacuum start button, and after reaching the set vacuum degree, press the film tearing start button. At this time, the tape roller 14 is in the rising state, and then the linear slide drives the vacuum suction cup to move backward a specified distance, and makes the tape roller 14 drop, so that the tape roller 14 is pressed on the vacuum suction cup platform. At this time, the linear slide continues to drive the vacuum suction cup to move backward to the rearmost position. At this time, the tape roller 14 has completely exceeded the vacuum suction cup, and the waste tape has been bonded to the platform and the wafer with film, and then the tape roller 14 rises and leaves the platform. The linear slide drives the vacuum suction cup to move forward. During the movement, the waste tape will automatically tear off the film on the wafer. In this process, the waste tape storage roller 8 is driven by the servo motor 4 through the active synchronous pulley 5, the transmission belt 6 and the driven synchronous pulley 7 (the servo motor 4 sets the appropriate torque and rotation speed). When the vacuum suction cup reaches the front end, the wafer film is peeled off. During this process, the waste tape storage roller 8 continues to rotate until the tape is tightened. When the film peeling is completed, the vacuum of the vacuum suction cup is released to complete the disassembly of the wafer, thereby completing a series of film peeling operations. The overall work operation is simple, which effectively improves the convenience of operation.

[0031] In the description of the present invention, it should be understood that the terms "up", "down", "front", "back", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the present invention.

[0032] Finally, it should be pointed out that the above embodiments are intended only to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art will appreciate that modifications may be made to the technical solutions described in the above embodiments, or that some of the technical features may be replaced with equivalents. Such modifications or replacements do not deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A semi-automatic wafer film tearing device, comprising a device housing (1), characterized in that: A linear slide and a compressed air regulating valve are respectively provided on a horizontal surface at one end of the device housing (1); a vacuum suction cup connected to the compressed air regulating valve is installed on the linear slide; a vacuum degree display instrument, a vacuum start button, a touch screen, an emergency stop button and a film tearing start button are respectively provided on an inclined surface at one end of the device housing (1); The other end of the device housing (1) is provided with a groove, and a mounting frame (2) and a support frame (3) are respectively provided on both sides of the inner wall of the groove, and a servo motor (4) is installed on the inner wall of the mounting frame (2), and an active synchronous pulley (5) is installed on the output shaft of the servo motor (4), and a transmission belt (6) is installed on the outer wall of the active synchronous pulley (5), and a driven synchronous pulley (7) is installed on the top of the transmission belt (6), and the driven synchronous pulley (7) is connected to a waste tape storage roller (8) through a shaft; Two damping force transmission wheels (9) are respectively installed on the outer wall of the mounting frame (2), and the outer walls of the two damping force transmission wheels (9) are provided with damping force transmission synchronous belts (10), one of the damping force transmission wheels (9) is connected to a tape positioning roller (11) via a shaft, and the other damping force transmission wheel (9) is connected to a waste tape discharge roller (12) via a shaft; A lifting cylinder (13) is installed on the inner wall of the support frame (3), and a tape pressing roller (14) is installed on the movable end of the lifting cylinder (13).

2. The semi-automatic wafer film tearing device according to claim 1, characterized in that: A protective cover (16) is provided above the groove of the device housing (1), and the protective cover (16) is connected to the device housing (1) via bolts.

3. The semi-automatic wafer film tearing device according to claim 2, characterized in that: A warning light is provided on the top of the protective cover (16).

4. The semi-automatic wafer film tearing device according to claim 3, characterized in that: Display windows are provided on the top and one side of the protective cover (16), and the windows are distributed in a transparent structure.

5. The semi-automatic wafer film tearing device according to claim 1, characterized in that: A static-eliminating ion blower (15) is provided in the groove of the device housing (1), and the static-eliminating ion blower (15) is located inside the protective cover (16).

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