Clip type semiconductor material sheet blanking mechanism

Abstract

The utility model belongs to the technical field of semiconductor production, and discloses a clip type semiconductor material sheet blanking mechanism, which comprises a material bin positioning assembly, a material bin clamping assembly and a transferring assembly, and is characterized in that the material bin positioning assembly is provided with a tidying station for storing and positioning a no-load material bin; the stock bin clamping assembly is used for clamping a no-load stock bin; and the transferring assembly is used for driving the stock bin clamping assembly to transfer the no-load stock bin from the tidying station to the material receiving position so as to receive the semiconductor material sheets discharged by the front-end equipment. According to the cartridge clip type semiconductor material piece discharging mechanism, the no-load material bin is tidily positioned through the material bin positioning assembly, then the material bin clamping assembly is driven by the transferring assembly to move the no-load material bin to the material collecting position so as to collect the material pieces discharged by front-end equipment, ordered discharging of the semiconductor material pieces is achieved, the overall structure is compact, the occupied space is small, maintenance is convenient, and the efficiency is high. And the blanking efficiency of the semiconductor material sheets is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to a clip-type semiconductor sheet unloading mechanism. Background Art

[0002] Existing semiconductor wafers are mostly loaded in clip-type hoppers with different external dimensions. When unloading semiconductor wafers, most of them are completed manually or by a single functional mechanism. Therefore, the efficiency is low and the versatility is poor, which makes it difficult to meet the high-speed production needs of the semiconductor industry. Utility Model Content

[0003] In order to solve the above problems, the purpose of the present invention is to provide an economical, efficient and widely applicable clip-type semiconductor tablet unloading mechanism.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A clip-type semiconductor tablet unloading mechanism, comprising:

[0006] The silo positioning assembly is provided with regular stations for storing and positioning empty silos;

[0007] Bin clamping assembly, used to clamp the empty bin;

[0008] The transfer assembly is used to drive the hopper clamping assembly to transfer the empty hopper from the regular workstation to the receiving position to collect the semiconductor sheets discharged by the front-end equipment.

[0009] As an optional solution, the silo positioning assembly includes a base platform for placing the empty silo, the regularization workstation is set on the base platform, the upper surface of the base platform is in sliding contact with the bottom of the empty silo, and the base platform is provided with baffles for limiting the two ends of the empty silo, a front stop block for limiting the front side of the empty silo, and a return plate for applying pressure to the back side of the empty silo.

[0010] As an optional solution, a first guide rail and a first driving member are provided on the lower surface of the reference table, a first mounting seat is slidingly provided on the first guide rail, a driving plate is provided on the first mounting seat that passes through the reference table and is connected to the correction plate, and the output end of the first driving member is fixedly connected to the first mounting seat.

[0011] As an optional solution, the first driving member is a cylinder or a linear module.

[0012] As an optional solution, the silo positioning assembly is installed on the base plate, the transfer assembly is installed on the base plate and is located on one side of the silo positioning assembly, the transfer assembly includes a second guide rail and a second driving member arranged on the base plate, a second mounting seat is slidingly arranged on the second guide rail, the second mounting seat is driven by the second driving member to move horizontally back and forth relative to the regular workstation, a vertical plate is provided on the second mounting seat, a third guide rail and a third driving member are provided on the vertical plate, a third mounting seat is slidingly arranged on the third guide rail, and the third mounting seat is driven by the third driving member to move up and down relative to the regular workstation.

[0013] As an optional solution, the second driving member includes a first screw rod arranged parallel to the second guide rail, a first motor for driving the first screw rod to rotate is provided on the base plate, and a first nut cooperating with the first screw rod is provided on the second mounting seat.

[0014] As an optional solution, the third driving member includes a second screw rod arranged parallel to the third guide rail, a second motor for driving the second screw rod to rotate is provided on the vertical plate, and a second nut cooperating with the second screw rod is provided on the third mounting seat.

[0015] As an optional solution, the silo clamping assembly includes a lower support plate and an upper pressure plate located above the lower support plate, the lower support plate is mounted on a third mounting seat, the lower support plate is used to extend into the regular work station and support the bottom of the empty silo, the upper pressure plate is slidably set on the third guide rail through a fourth mounting seat, and the third mounting seat is provided with a fourth driving member for driving the upper pressure plate close to or away from the lower support plate, and the upper pressure plate is used to cooperate with the lower support plate to clamp the empty silo.

[0016] As an optional solution, a guide column connected to the upper pressure plate is provided on the fourth mounting seat, and a spring is sleeved on the guide column. The spring is used to provide buffering when the upper pressure plate contacts the empty silo.

[0017] As an optional solution, the fourth driving member includes a third screw rod arranged parallel to the third guide rail, a third motor for driving the third screw rod to rotate is provided on the third mounting seat, and a third nut cooperating with the third screw rod is provided on the fourth mounting seat.

[0018] The beneficial effects of the present invention are as follows: the clip-type semiconductor material sheet unloading mechanism regularly positions the empty material sheet through the material sheet positioning component, and then drives the material sheet clamping component to move the empty material sheet to the receiving position through the transfer component to receive the semiconductor material sheets discharged by the front-end equipment, thereby realizing orderly unloading of semiconductor sheets. The material sheet positioning component and the material sheet clamping component can be adaptively clamped according to different material sheet sizes, have good versatility, and the transfer component moves accurately, meeting the semiconductor sheet receiving requirements. The overall structure is compact, occupies little space, is easy to maintain, and effectively improves the semiconductor sheet unloading efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a structural diagram of a clip-type semiconductor tablet unloading mechanism provided by an embodiment of the present utility model;

[0020] Figure 2 This is a side view of a clip-type semiconductor tablet unloading mechanism provided by an embodiment of the present utility model;

[0021] Figure 3 This is a schematic diagram of the structure of the silo positioning assembly involved in the embodiment of the utility model Figure 1 ;

[0022] Figure 4 This is a schematic diagram of the structure of the silo positioning assembly involved in the embodiment of the utility model Figure 2 ;

[0023] Figure 5 This is a schematic diagram of the structure of the transfer assembly and the silo clamping assembly involved in the embodiment of the utility model Figure 1 ;

[0024] Figure 6 This is a schematic diagram of the structure of the transfer assembly and the silo clamping assembly involved in the embodiment of the utility model Figure 2 .

[0025] In the attached figure:

[0026] 1. Bin positioning assembly; 11. Regularization station; 12. Reference platform; 13. Baffle; 14. Front stopper; 15. Return plate; 16. First guide rail; 17. First mounting seat; 18. Drive plate; 19. Cylinder;

[0027] 2. Transfer assembly; 21. Second guide rail; 22. Second mounting base; 23. Vertical plate; 24. Third guide rail; 25. Third mounting base; 26. First screw rod; 27. First motor; 28. Second screw rod; 29. Second motor;

[0028] 3. Bin clamping assembly; 31. Lower support plate; 32. Upper pressure plate; 33. Fourth mounting base; 34. Guide column; 35. Spring; 36. Third screw rod; 37. Third motor;

[0029] 4. Substrate. DETAILED DESCRIPTION

[0030] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0031] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0032] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0033] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on the positions or locations shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0034] See also Figures 1 to 6 As shown, this preferred embodiment provides a clip-type semiconductor tablet unloading mechanism, including a hopper positioning component 1, a hopper clamping component 3 and a transfer component 2, wherein:

[0035] The silo positioning assembly 1 is provided with a regular station 11 for storing and positioning an empty silo;

[0036] The silo clamping assembly 3 is used to clamp the empty silo;

[0037] The transfer assembly 2 is used to drive the hopper clamping assembly 3 to transfer the empty hopper from the tidying station 11 to the receiving position to receive the semiconductor wafers discharged by the front-end equipment.

[0038] Therefore, the empty silo is regularly positioned by the silo positioning component 1, and then the empty silo is moved to the receiving position by driving the silo clamping component 3 through the transfer component 2 to receive the semiconductor sheets discharged by the front-end equipment, thereby realizing orderly unloading of semiconductor sheets. The silo positioning component 1 and the silo clamping component 3 can be adaptively clamped according to different empty silo sizes, and have good versatility. The transfer component 2 moves accurately, meeting the semiconductor sheet receiving requirements. The overall structure is compact, occupies little space, is easy to maintain, and effectively improves the semiconductor sheet unloading efficiency.

[0039] Specifically, see Figure 3 and Figure 4 The silo positioning assembly 1 herein includes a base 12 for placing an empty silo. The aligning station 11 is disposed on the base 12. The upper surface of the base 12 is in sliding contact with the bottom of the empty silo. The base 12 is provided with baffles 13 for limiting the ends of the empty silo, a front block 14 for limiting the front side of the empty silo, and a return plate 15 for applying pressure to the back side of the empty silo. When the empty silo is placed on the aligning station 11, when the ends of the empty silo are in contact with the baffles 13 and the return plate 15 pushes the empty silo against the front block 14, the position of the empty silo on the base 12 is unified, allowing the subsequent silo clamping assembly 3 to accurately grasp the empty silo.

[0040] Furthermore, a first guide rail 16 and a first driver are provided on the lower surface of the base plate 12. A first mounting seat 17 is slidably mounted on the first guide rail 16. A driving plate 18 is mounted on the first mounting seat 17, passing through the base plate 12 and connected to the alignment plate 15. The output end of the first driver is fixedly connected to the first mounting seat 17. Preferably, the first driver is a cylinder 19 or a linear module, which drives the alignment plate 15 to cooperate with the front baffle 13 to achieve the clamping function. In this embodiment, the first driver is exemplified by the cylinder 19.

[0041] Specifically, the silo positioning assembly 1 is mounted on the base plate 4, and the transfer assembly 2 is mounted on the base plate 4 and is located on one side of the silo positioning assembly 1. Figure 5 and Figure 6 The transfer assembly 2 here includes a second guide rail 21 and a second driving member arranged on the base plate 4. A second mounting seat 22 is slidably arranged on the second guide rail 21, and the second mounting seat 22 is driven by the second driving member to move horizontally back and forth relative to the tidying station 11. A vertical plate 23 is arranged on the second mounting seat 22, and a third guide rail 24 and a third driving member are arranged on the vertical plate 23. A third mounting seat 25 is slidably arranged on the third guide rail 24, and the third mounting seat 25 is driven by the third driving member to move up and down relative to the tidying station 11.

[0042] Furthermore, the second driving member includes a first screw rod 26 arranged parallel to the second guide rail 21, a first motor 27 for driving the first screw rod 26 to rotate is provided on the base plate 4, and a first nut cooperating with the first screw rod 26 is provided on the second mounting seat 22. The first screw rod 26 is driven to rotate by the first motor 27, so that the second mounting seat 22 is moved along the second guide rail 21, that is, the translation function of the silo clamping assembly 3 relative to the regular workstation 11 is realized.

[0043] Furthermore, the third driving member includes a second screw rod 28 arranged parallel to the third guide rail 24, and a second motor 29 for driving the second screw rod 28 to rotate is provided on the vertical plate 23. A second nut cooperating with the second screw rod 28 is provided on the third mounting seat 25. The second screw rod 28 is driven to rotate by the second motor 29, so that the third mounting seat 25 is moved along the third guide rail 24, that is, the lifting function of the silo clamping assembly 3 relative to the regular workstation 11 is realized.

[0044] Specifically, see Figure 5 and Figure 6 The silo clamping assembly 3 here includes a lower support plate 31 and an upper pressure plate 32 located above the lower support plate 31. The lower support plate 31 is installed on the third mounting seat 25. The lower support plate 31 is used to extend into the regularization station 11 and support the bottom of the empty silo. It should be noted that in order to facilitate the lower support plate 31 to extend into the regularization station 11 for taking over, an avoidance opening for the lower support plate 31 to be inserted is opened on the reference platform 12; the upper pressure plate 32 is slidably set on the third guide rail 24 through the fourth mounting seat 33, and the third mounting seat 25 is provided with a fourth driving member for driving the upper pressure plate 32 close to or away from the lower support plate 31. The upper pressure plate 32 is used to cooperate with the lower support plate 31 to clamp the empty silo.

[0045] In particular, a guide column 34 connected to the upper pressure plate 32 is provided on the fourth mounting seat 33, and a spring 35 is sleeved on the guide column 34. The spring 35 is used to provide buffering when the upper pressure plate 32 contacts the empty bin to avoid damage or even deformation of the empty bin during clamping.

[0046] Furthermore, the fourth driving member includes a third screw rod 36 arranged parallel to the third guide rail 24, and the third mounting seat 25 is provided with a third motor 37 for driving the third screw rod 36 to rotate, and the fourth mounting seat 33 is provided with a third nut cooperating with the third screw rod 36. The third motor 37 drives the third screw rod 36 to rotate, so that the fourth mounting seat 33 is moved along the third guide rail 24, that is, the lifting function of the upper pressure plate 32 relative to the lower support plate 31 is realized, thereby meeting the clamping requirements of the empty silo.

[0047] Usage: 1) Place the empty bin on the aligning station 11, and the bin positioning assembly 1 adjusts the empty bin to the target position. 2) The transfer assembly 2 drives the bin clamping assembly 3 to move toward the aligning station 11 and clamp the empty bin. 3) The transfer assembly 2 drives the bin clamping assembly 3 to lift and move the empty bin to the receiving position, where it collects semiconductor wafers discharged from the front-end equipment and unloads them one by one into the clip-type hopper. Tests have shown that the empty bin can hold a maximum of 30 wafers, with the fastest single wafer collection time of 6 seconds.

[0048] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. Clip-type semiconductor sheet unloading mechanism, characterized in that: include: A silo positioning assembly (1), wherein the silo positioning assembly (1) is provided with a regular station (11) for storing and positioning an empty silo; A silo clamping assembly (3) for clamping the empty silo; The transfer assembly (2) is used to drive the hopper clamping assembly (3) to transfer the empty hopper from the tidying station (11) to the receiving position to receive the semiconductor chips discharged by the front-end equipment.

2. The clip-type semiconductor tablet unloading mechanism according to claim 1, characterized in that: The silo positioning assembly (1) includes a base platform (12) for placing the empty silo, the regularization station (11) is arranged on the base platform (12), the upper surface of the base platform (12) is in sliding contact with the bottom of the empty silo, and the base platform (12) is provided with baffles (13) for limiting the two ends of the empty silo, a front block (14) for limiting the front side of the empty silo, and a return plate (15) for applying pressure to the back side of the empty silo.

3. The clip-type semiconductor tablet unloading mechanism according to claim 2, characterized in that: A first guide rail (16) and a first driving member are provided on the lower surface of the reference platform (12); a first mounting seat (17) is slidably provided on the first guide rail (16); a driving plate (18) passing through the reference platform (12) and connected to the correction plate (15) is provided on the first mounting seat (17); and an output end of the first driving member is fixedly connected to the first mounting seat (17).

4. The clip-type semiconductor tablet unloading mechanism according to claim 3, characterized in that: The first driving member is a cylinder (19) or a linear module.

5. The clip-type semiconductor tablet unloading mechanism according to claim 1, characterized in that: The silo positioning assembly (1) is mounted on a base plate (4), the transfer assembly (2) is mounted on the base plate (4) and is located on one side of the silo positioning assembly (1), the transfer assembly (2) comprises a second guide rail (21) and a second driving member arranged on the base plate (4), a second mounting seat (22) is slidably arranged on the second guide rail (21), the second mounting seat (22) is driven by the second driving member to make horizontal reciprocating movements relative to the regularization station (11), a vertical plate (23) is arranged on the second mounting seat (22), a third guide rail (24) and a third driving member are arranged on the vertical plate (23), a third mounting seat (25) is slidably arranged on the third guide rail (24), and the third mounting seat (25) is driven by the third driving member to make lifting movements relative to the regularization station (11).

6. The clip-type semiconductor tablet unloading mechanism according to claim 5, characterized in that: The second driving member includes a first screw rod (26) arranged parallel to the second guide rail (21), a first motor (27) for driving the first screw rod (26) to rotate is provided on the base plate (4), and a first nut cooperating with the first screw rod (26) is provided on the second mounting seat (22).

7. The clip-type semiconductor tablet unloading mechanism according to claim 5, characterized in that: The third driving member includes a second screw rod (28) arranged parallel to the third guide rail (24), a second motor (29) for driving the second screw rod (28) to rotate is provided on the vertical plate (23), and a second nut cooperating with the second screw rod (28) is provided on the third mounting seat (25).

8. The clip-type semiconductor tablet unloading mechanism according to claim 5, characterized in that: The silo clamping assembly (3) includes a lower support plate (31) and an upper pressure plate (32) located above the lower support plate (31), the lower support plate (31) is mounted on the third mounting seat (25), the lower support plate (31) is used to extend into the regularization station (11) and support the bottom of the empty silo, the upper pressure plate (32) is slidably arranged on the third guide rail (24) through the fourth mounting seat (33), and the third mounting seat (25) is provided with a fourth driving member for driving the upper pressure plate (32) to approach or move away from the lower support plate (31), and the upper pressure plate (32) is used to cooperate with the lower support plate (31) to clamp the empty silo.

9. The clip-type semiconductor tablet unloading mechanism according to claim 8, characterized in that: The fourth mounting seat (33) is provided with a guide column (34) connected to the upper pressing plate (32), and the guide column (34) is sleeved with a spring (35). The spring (35) is used for buffering when the upper pressing plate (32) contacts the empty silo.

10. The clip-type semiconductor tablet unloading mechanism according to claim 8, characterized in that: The fourth driving member includes a third screw rod (36) arranged parallel to the third guide rail (24), a third motor (37) for driving the third screw rod (36) to rotate is provided on the third mounting seat (25), and a third nut cooperating with the third screw rod (36) is provided on the fourth mounting seat (33).

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