Automatic IGBT (Insulated Gate Bipolar Translator) chip feeding device

Abstract

The utility model discloses an IGBT chip automatic feeding device, which comprises a material pipe feeding turnover disc, an automatic feeding mechanism and a vibration feeding mechanism, and is characterized in that the material pipe feeding turnover disc comprises a bottom plate, a feeding pipe placing groove, a discharging pipe placing groove, an overturning pressing assembly, an automatic locking assembly and a turnover protection insertion plate; the material pipe feeding turnover disc is arranged on the automatic feeding mechanism through a bottom plate, a plurality of grooves for clamping a row of IGBT plastic uptake pipes are formed in an upper material pipe containing groove and a lower material pipe containing groove respectively, and the overturning pressing assembly and the automatic locking assembly are movably buckled to press the IGBT plastic uptake pipes. The turnover protection insertion plate is detachably arranged at the end of the discharging pipe containing groove and used for preventing the IGBT chip in the plastic uptake pipe from sliding out. The automatic feeding mechanism drives the material pipe feeding turnover disc to move so that the IGBT plastic uptake pipes on the material pipe feeding turnover disc can be aligned with the input end of the vibration feeding mechanism one by one for feeding. The automatic feeding device is accurate and rapid in material pipe fixing, high in operation efficiency, accurate in automatic feeding of IGBT chips, and smooth and reliable in operation.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic special equipment, in particular to an automatic feeding device for IGBT chips. Background Art

[0002] IGBTs (Insulated Gate Bipolar Transistors) are widely used semiconductor devices in home appliances, industrial, automotive, and military applications. Before mounting IGBT chips in pinned packages on circuit boards, their pins typically need to be trimmed and shaped to ensure accurate assembly.

[0003] Since pin-type packaged IGBTs are usually packaged in blister tubes, the IGBTs in the blister tubes need to be removed and automatically fed to the trimming and shaping processing position during trimming and shaping to facilitate large-scale automatic processing. When automatically feeding and transporting IGBTs in the existing technology, it is necessary to first remove the baffle at the front end of the blister tube, and then place a row of blister tubes with IGBT chips inside on a turnover tray (material tray). When the turnover tray is transported, the IGBT chips in the blister tubes are easy to slip out, causing material jamming and damage to the product during transportation. In addition, the turnover tray in the existing technology requires screws and pressure plates to fix the blister tubes. Fixing and changing the blister tubes is relatively troublesome, and production efficiency is low, which requires further improvement. Utility Model Content

[0004] In order to solve the above problems, the purpose of the utility model is to provide an automatic loading device for IGBT chips, in which the blister tubes in the loading turntable are fixed accurately and quickly, and the operation efficiency is high. The IGBT chips in the blister tubes will not slip out during the switching process after loading, and the products will not be lost. The IGBT chips are automatically loaded accurately, and the operation is smooth and reliable.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] An automatic feeding device for IGBT chips comprises a feed tube feeding turntable, an automatic feeding mechanism and a vibration feeding mechanism, wherein the feed tube feeding turntable comprises a bottom plate, a feed tube placement groove, a discharge tube placement groove, a flipping and pressing assembly, an automatic locking assembly and a turnover protection insert plate, wherein the feed tube feeding turntable is placed on the automatic feeding mechanism through the bottom plate, the feed tube placement groove and the discharge tube placement groove are respectively arranged at both ends of the bottom plate, and a plurality of grooves for clamping a row of IGBT blister tubes are respectively provided in the feed tube placement groove and the discharge tube placement groove, and one end of the flipping and pressing assembly is hinged to the feed tube placement groove and the discharge tube placement groove respectively. The end of the placement slot, the other end of the flip and clamping assembly is movably fastened with the automatic locking assembly to press the IGBT blister tube into the loading tube placement slot and the discharge tube placement slot, and the turnover protection plug plate is detachably placed at the end of the discharge tube placement slot to prevent the IGBT chip in the blister tube from sliding out during transportation; the automatic feeding mechanism is used to drive the tube loading turnover disk to move so that a row of IGBT blister tubes on it are aligned one by one with the input end of the vibration feeding mechanism for feeding, and the turnover protection plug plate is pulled out during feeding to allow the IGBT chips in the blister tube to slide out sequentially to the conveying slot of the automatic feeding mechanism.

[0007] Furthermore, the automatic feeding mechanism includes a mounting base, a feeding drive mechanism, a mobile mounting platform, a limit baffle and a material tube inspection mechanism. The feeding drive mechanism is arranged on the mounting base, and the mobile mounting platform is arranged on the feeding drive mechanism. The mobile mounting platform is provided with an inclined fixed chassis, and the bottom plate of the material tube loading turntable is positioned on the fixed chassis. The limit baffle is mounted on the side of the mounting base to support the lower end face of the IGBT blister tube. The material tube inspection mechanism is provided with a sensor for detecting whether the IGBT blister tube in the material tube loading turntable is placed in place.

[0008] Furthermore, the fixed chassis is provided with positioning pins for positioning the base plate.

[0009] Furthermore, the mobile installation platform is provided with an adjustment plate for adjusting the tilt angle of the fixed chassis.

[0010] Furthermore, the limiting baffle is provided with a discharge guide block for correcting the sliding-out posture of the IGBT chip.

[0011] Furthermore, the vibration feeding mechanism includes a vibration power component and an IGBT chip conveying trough, and the input end of the IGBT chip conveying trough is docked with the discharge guide block to change the IGBT chip from upright to lying flat.

[0012] Furthermore, a blowing nozzle is provided at the discharge guide block, and the blowing nozzle is aimed at the discharge port in the discharge guide block to blow the IGBT chip stuck at the discharge port back into the blister tube so that it can be guided back to the right position and slide down under the action of gravity.

[0013] Furthermore, a detection sensor for detecting whether the conveying posture of the IGBT chip is correct is provided at a position on the limit baffle corresponding to the discharge guide block.

[0014] Furthermore, an unlocking button for operating the automatic locking component is provided in the material tube feeding turntable.

[0015] The utility model has the following beneficial effects:

[0016] 1. The material tube loading turntable of the utility model is arranged on the automatic feeding mechanism. The automatic feeding mechanism drives the blister tubes in the material tube loading turntable to align with the input end of the vibration feeding mechanism one by one for feeding. The blister tubes in the loading turntable are fixed accurately and quickly, and the operation efficiency is high. After loading, the turnover protection plug-in plate is used to block the lower end of the blister tube during the switching process, so that the IGBT chip in the blister tube will not slip out and the product will not be lost. When loading, the turnover protection plug-in plate is pulled out to facilitate automatic and accurate loading of the IGBT chip, and the operation is smooth and reliable.

[0017] 2. The automatic feeding mechanism and the vibration feeding mechanism of the utility model realize automatic continuous feeding. The automatic feeding mechanism is provided with a feeding drive mechanism capable of precise stepping. The movable mounting platform on the feeding drive mechanism can adjust the inclination angle to facilitate the installation of the loading turntable, ensuring that the IGBT chip can accurately slide into the vibration feeding mechanism.

[0018] 3. A limit baffle and a discharge guide block for guiding the IGBT chip to slide out are arranged between the vibration feeding mechanism and the material tube loading turntable of the utility model, and an air blowing nozzle is arranged at the discharge guide block. The air blowing nozzle is used to blow the IGBT chip stuck at the discharge port back into the blister tube so that it can be guided to slide down again under the action of gravity, thereby avoiding material jamming and affecting the feeding. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a three-dimensional schematic diagram of the automatic IGBT chip loading device of the utility model;

[0020] Figure 2 This is a side view schematic diagram of the automatic IGBT chip loading device of the utility model;

[0021] Figure 3 It is a three-dimensional schematic diagram of the material tube feeding turntable of the utility model.

[0022] Description of reference numerals:

[0023] 1. Material tube loading turntable; 11. Bottom plate; 12. Loading tube placement slot; 13. Discharging tube placement slot; 14. Flip and clamping assembly; 15. Automatic locking assembly; 16. Turnover protection plug plate; 17. Unlock button; 2. Automatic feeding mechanism; 21. Mounting base; 22. Feeding drive mechanism; 23. Mobile mounting platform; 24. Limit baffle; 25. Material tube inspection mechanism; 26. Fixed chassis; 27. Adjustment plate; 28. Discharge guide block; 29. Detection sensor; 3. Vibration feeding mechanism; 31. Vibration power component; 32. IGBT chip conveying trough; 4. Air blowing nozzle. DETAILED DESCRIPTION

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0025] See also Figure 1-3As shown, an automatic feeding device for IGBT chips includes a feed tube feeding turntable 1, an automatic feeding mechanism 2 and a vibration feeding mechanism 3. The feed tube feeding turntable 1 includes a bottom plate 11, a feed tube placement groove 12, a discharge tube placement groove 13, a flipping and pressing assembly 14, an automatic locking assembly 15 and a turnover protection insert plate 16. The feed tube feeding turntable 1 is placed on the automatic feeding mechanism 2 through the bottom plate 11. The feed tube placement groove 12 and the discharge tube placement groove 13 are respectively arranged at both ends of the bottom plate 11. The feed tube placement groove 12 and the discharge tube placement groove 13 are respectively provided with a plurality of grooves for clamping a row of IGBT blister tubes. One end of the flipping and pressing assembly 14 is hinged to the end of the feed tube placement groove 12 and the discharge tube placement groove 13, and the other end of the flipping and pressing assembly 14 is There is a locking buckle that is movably fastened with the automatic locking component 15 to press the IGBT blister tube into the feeding tube placement groove 12 and the discharge tube placement groove 13. The flip pressing component 14 is also provided with a carrying handle for easy turnover and movement. The feeding tube feeding turnover plate 1 is provided with an unlocking button 17 for operating the automatic locking component 15; the turnover protection plug plate 16 is detachably placed at the end of the discharge tube placement groove 13 to prevent the IGBT chip in the blister tube from slipping out during transportation; the automatic feeding mechanism 2 is used to drive the feeding tube feeding turnover plate 1 to move so that a row of IGBT blister tubes on it are aligned one by one with the input end of the vibration feeding mechanism 3 for feeding. When feeding, the turnover protection plug plate 16 is pulled out to allow the IGBT chips in the blister tube to slide out sequentially to the conveying groove of the automatic feeding mechanism 2. The automatic feeding mechanism 2 includes a mounting base 21, a feeding drive mechanism 22, a mobile mounting platform 23, a limit baffle 24 and a material tube inspection mechanism 25. The feeding drive mechanism 22 is arranged on the mounting base 21, and the feeding drive mechanism 22 is provided with a servo or stepping motor, a transmission mechanism and a motion platform. The mobile mounting platform 23 is arranged on the feeding drive mechanism 22, and the mobile mounting platform 23 is provided with an inclined fixed chassis 26. The bottom plate 11 of the material tube loading turnover plate 1 is positioned and placed on the fixed chassis 26, and the fixed chassis 26 is provided with a positioning pin for positioning the bottom plate 11; the limit baffle 24 is mounted on the side of the mounting base 21 to resist the lower end face of the IGBT blister tube to prevent the IGBT chip therein from falling out, and the material tube inspection mechanism 25 is provided with a sensor for detecting whether the IGBT blister tube in the material tube loading turnover plate 1 is placed in place. The vibration feeding mechanism 3 includes a vibration power component 31 and an IGBT chip conveying trough 32. The input end of the IGBT chip conveying trough 32 is connected to the discharge guide block 28 to change the IGBT chip from being upright to being lying flat.

[0026] Based on the previous embodiment, the movable mounting platform 23 is provided with an adjustment plate 27 for adjusting the tilt angle of the fixed chassis 26. The limit baffle 24 is provided with a discharge guide block 28 for guiding the IGBT chip to slide out correctly (the limit baffle 24 in this position has a corresponding IGBT chip discharge opening).

[0027] Based on the previous embodiment, the discharge guide block 28 is provided with an air blowing nozzle 4. The air blowing nozzle 4 is aligned with the discharge opening of the discharge guide block 28 and is used to blow IGBT chips stuck at the discharge opening back into the blister tube, causing them to slide back into the correct position under the action of gravity. A detection sensor 29 is provided on the limit stopper 24 at a position corresponding to the discharge guide block 28 to detect whether the IGBT chip is being conveyed in the correct posture.

[0028] The working principle of this utility model is:

[0029] During use, first insert the turnover protection plug plate 16 into the end of the discharge tube placement groove 13, and place the blister tubes with the baffles removed into the multiple grooves in the upper tube placement groove 12 and the lower tube placement groove 13 in sequence. After placement, press down the flip pressing assembly 14 and fasten it with the locking buckle and the automatic locking assembly 15 to press the IGBT blister tube into the upper tube placement groove 12 and the discharge tube placement groove 13. After installing a tube loading turnover plate 1, place it on the automatic feeding mechanism 2. After placement, pull out the turnover protection plug plate 16, use the limit baffle 24 to support the lower end surface of the IGBT blister tube to prevent the IGBT chip from slipping during the loading process, and then the feeding drive mechanism 22 in the automatic feeding mechanism 2 drives the tube loading turnover plate 1 to move through the mobile mounting platform 23, so that the row of IGBT blister tubes on it are aligned one by one with the input end of the vibration feeding mechanism 3 for feeding. If the material is stuck at the discharge guide block 28, the air nozzle 4 is aimed at the discharge port in the discharge guide block 28 to blow the IGBT chip stuck at the discharge port back into the blister tube so that it can be guided and slide down again under the action of gravity.

[0030] The above description is only a specific embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformation made using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, is also included in the patent protection scope of the present invention.

Claims

1. An automatic feeding device for IGBT chips, comprising a feeding tube turntable (1), an automatic feeding mechanism (2) and a vibration feeding mechanism (3), characterized in that: The material tube loading turntable (1) comprises a bottom plate (11), a loading tube placement groove (12), a discharge tube placement groove (13), a flipping and pressing assembly (14), an automatic locking assembly (15) and a turnover protection plug plate (16). The material tube loading turntable (1) is placed on the automatic feeding mechanism (2) through the bottom plate (11). The loading tube placement groove (12) and the discharge tube placement groove (13) are respectively arranged at both ends of the bottom plate (11). The loading tube placement groove (12) and the discharge tube placement groove (13) are respectively provided with a plurality of grooves for clamping a row of IGBT blister tubes. One end of the flipping and pressing assembly (14) is hinged to the ends of the loading tube placement groove (12) and the discharge tube placement groove (13). The other end of the flip pressing assembly (14) is movably fastened with the automatic locking assembly (15) to press the IGBT blister tube into the feeding tube placement groove (12) and the discharge tube placement groove (13); the turnover protection plug plate (16) is detachably placed at the end of the discharge tube placement groove (13) to prevent the IGBT chip in the blister tube from sliding out during transportation; the automatic feeding mechanism (2) is used to drive the tube feeding turnover disk (1) to move so that a row of IGBT blister tubes on it are aligned one by one with the input end of the vibration feeding mechanism (3) for feeding; when feeding, the turnover protection plug plate (16) is pulled out to make the IGBT chips in the blister tube slide out sequentially to the conveying groove of the automatic feeding mechanism (2).

2. The automatic IGBT chip loading device according to claim 1, characterized in that: The automatic feeding mechanism (2) includes a mounting base (21), a feeding drive mechanism (22), a mobile mounting platform (23), a limit baffle (24) and a material tube inspection mechanism (25), wherein the feeding drive mechanism (22) is arranged on the mounting base (21), the mobile mounting platform (23) is arranged on the feeding drive mechanism (22), and the mobile mounting platform (23) is provided with a tilted fixed chassis (26), the bottom plate (11) of the material tube loading turntable (1) is positioned and placed on the fixed chassis (26), the limit baffle (24) is mounted on the side of the mounting base (21) to support the lower end surface of the IGBT blister tube, and the material tube inspection mechanism (25) is provided with a sensor for detecting whether the IGBT blister tube in the material tube loading turntable (1) is placed in place.

3. The automatic IGBT chip loading device according to claim 2, characterized in that: Positioning pins for positioning the bottom plate (11) are provided on the fixed chassis (26).

4. The automatic IGBT chip loading device according to claim 2, characterized in that: An adjustment plate (27) for adjusting the tilt angle of the fixed chassis (26) is provided on the mobile installation platform (23).

5. The automatic IGBT chip loading device according to claim 2, characterized in that: The limiting baffle (24) is provided with a discharge guide block (28) for correcting the sliding-out posture of the IGBT chip.

6. The automatic IGBT chip loading device according to claim 5, characterized in that: The vibration feeding mechanism (3) comprises a vibration power component (31) and an IGBT chip conveying trough (32), wherein the input end of the IGBT chip conveying trough (32) is docked with the discharge guide block (28), so as to change the IGBT chip from being upright to being lying flat.

7. The automatic IGBT chip loading device according to claim 6, characterized in that: The discharge guide block (28) is provided with a blowing nozzle (4), and the blowing nozzle (4) is aligned with the discharge port in the discharge guide block (28) and is used to blow the IGBT chip stuck at the discharge port back into the blister tube so that it is guided back to the right position and slides down under the action of gravity.

8. The automatic IGBT chip loading device according to claim 6, characterized in that: A detection sensor (29) for detecting whether the conveying posture of the IGBT chip is correct is provided at a position on the limit baffle (24) corresponding to the discharge guide block (28).

9. The automatic IGBT chip loading device according to claim 1, characterized in that: The material tube loading turntable (1) is provided with an unlocking button (17) for operating the automatic locking component (15).

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