Copper plating device for PCB manufacturing

Abstract

The utility model discloses a copper plating device for manufacturing a PCB (Printed Circuit Board), which comprises copper plating equipment, the copper plating equipment comprises a tank body and a support frame, the tank body is arranged above the support frame, and the tank body comprises a pickling tank, an electroplating tank, a cleaning tank and a plurality of top covers, a plurality of traditional independent procedures such as acid pickling, electroplating and cleaning are integrated into one device, and high integration and optimization of the production process are achieved. Traditionally, the working procedures are generally required to be respectively carried out in different equipment, the operation is complicated, and the material transfer and dispatching cost between the equipment is high. According to the device, the pickling tank, the electroplating tank and the cleaning tank are designed in the same tank body, so that the interruption and waiting time on a production line is effectively reduced, the production efficiency is greatly improved, meanwhile, batch products can be treated, the production efficiency is greatly improved, the production cost is reduced, and product damage caused by collision can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board processing, in particular to a copper plating device used for PCB board manufacturing. Background Art

[0002] In the modern electronics manufacturing industry, with the rapid development of PCB technology, the market demand for high-quality, efficient PCB production equipment continues to increase. Traditional PCB manufacturing processes typically involve multiple independent processing steps, including pickling, electroplating, and cleaning. These steps are not only complex to operate, but also suffer from inefficient connections between equipment and material flow, leading to extended production cycles and increased costs. To address these issues, the industry urgently needs a new production line design that can integrate and optimize process steps and improve production efficiency.

[0003] After searching, it was found that a Chinese patent document disclosed a vertical continuous copper plating device for PCB boards [Application No.: 201921341133.X, Publication No.: CN210444592U], which includes a copper plating box, a conveyor belt is provided on the front side of the copper plating box, a through slot is provided on the upper end face of the copper plating box, a copper plating material taking device is installed above the through slot, an electroplating liquid is provided in the copper plating box, and an anode plate is installed on the rear end face of the copper plating box. Although this drilling device has a simple structure and can achieve the purpose of copper plating, it can only meet the needs of copper plating and cannot perform pickling and cleaning processes, and can no longer meet the processing requirements of current products. Utility Model Content

[0004] In view of the problems existing in the prior art, the present invention aims to provide a copper plating device for PCB board manufacturing.

[0005] A copper plating device for PCB board manufacturing includes a copper plating device, which is characterized in that: the copper plating device includes a tank body and a support frame, and the tank body is installed above the support frame;

[0006] The tank body includes a pickling tank, an electroplating tank, a cleaning tank and several top covers. A pickling tank is provided on one side of the electroplating tank, and a cleaning tank is provided on the other side of the electroplating tank. Tops of the pickling tank, electroplating tank and cleaning tank are all provided with top covers.

[0007] Electroplating equipment is arranged on the side of the electroplating tank.

[0008] Preferably, a plurality of racks are provided inside the pickling tank and the electroplating tank.

[0009] Through the above technical solution, space utilization can be improved, and the stability of the workpiece during processing can be ensured to avoid damage caused by collision. At the same time, the placement rack adopts a cross-shaped structure with good mechanical strength to prevent deformation caused by the weight of the workpiece or liquid flow.

[0010] Preferably, a liquid injection port is provided on the side of the pickling tank, and a liquid discharge port is provided at the bottom of the pickling tank.

[0011] With this technical solution, the injection port is located on the side of the pickling tank, making it easily accessible to operators when adding liquid without interference from other equipment or structures. This design allows workers to quickly and conveniently inject a predetermined amount of acid solution into the pickling tank, ensuring even distribution of the solution, thereby improving the pickling effect. The drain port is located at the bottom of the pickling tank to quickly discharge the treated acid solution and impurities.

[0012] Preferably, a liquid injector is provided on the side of the electroplating tank, the liquid injector is located on the top of the electroplating equipment, and a spherical gate valve is provided at the bottom of the electroplating tank.

[0013] Through the above technical solution, the liquid injector can realize real-time replenishment of the liquid in the electroplating tank, ensure the stable concentration of the electroplating solution, and further improve the quality of the coating. The spherical gate valve has a certain storage function, which can collect impurities and remove them together when draining to avoid blockage.

[0014] Preferably, a second liquid injection port is provided on one side of the cleaning tank, and a second liquid discharge port is provided on the other side of the cleaning tank.

[0015] The above technical solution ensures uniform flow and effective distribution of the cleaning liquid within the tank. When the operator injects the cleaning liquid through the second injection port, the cleaning liquid can flow quickly within the tank, fully contacting the workpiece to be cleaned, enhancing the cleaning effect. This coaxial design not only optimizes the liquid flow path, but also reduces eddy currents and stagnation of the liquid within the tank, thereby improving cleaning efficiency.

[0016] Preferably, the bottoms of the pickling tank and the electroplating tank are both funnel-shaped.

[0017] The main advantage of the funnel-shaped bottom design, as described above, is that it effectively directs liquid toward the drain port, accelerating the drainage process. This increases the rate at which the acid solution drains from the pickling tank, reducing the potential for secondary contamination of the workpiece surface caused by liquid stagnation. This design also allows for more complete chemical reactions within the tank, ensuring that each workpiece receives uniform and thorough treatment during the pickling process.

[0018] In electroplating tanks, the funnel-shaped bottom also plays a crucial role. This shape guides the plating liquid quickly toward the drain, preventing sediment from accumulating at the bottom and thus maintaining the cleanliness and activity of the plating solution. This design not only improves the fluidity of the plating solution but also reduces unevenness during the plating process, ensuring uniformity and adhesion of the coating.

[0019] Preferably, ribs are provided on the outside of the trough body.

[0020] Through the above technical solution, the overall rigidity and deformation resistance of the trough body can be increased. These ribs are evenly distributed along the circumference of the trough body and can effectively resist the pressure and twisting force that may be generated in the trough body during liquid filling and operation.

[0021] Compared with the prior art, the utility model has the following advantages:

[0022] 1. This copper plating system for PCB manufacturing achieves highly integrated and optimized production processes by integrating multiple, traditionally independent processes—such as pickling, electroplating, and cleaning—into a single device. Traditionally, these processes typically require separate equipment, resulting in complex operations and high material transfer and scheduling costs between devices. However, by integrating the pickling, electroplating, and cleaning tanks within the same system, this system effectively reduces production line interruptions and waiting times, significantly improving production efficiency.

[0023] 2. The copper plating device for PCB board manufacturing can process batches of products at the same time through the design of the placement rack, which greatly improves production efficiency, reduces production costs, and avoids product damage caused by bumps. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0025] Figure 2 It is a three-dimensional schematic diagram of some components of the utility model;

[0026] Figure 3 This is a three-dimensional schematic diagram of the tank body of the utility model;

[0027] Figure 4 It is a rear view schematic diagram of the tank body of the utility model.

[0028] In the figure: 1. Tank body; 2. Support frame; 101. Pickling tank; 102. Electroplating tank; 103. Cleaning tank; 104. Placement rack; 201. Top cover; 301. Liquid filling port 1; 302. Liquid discharge port 1; 303. Liquid injector; 304. Ball gate valve; 305. Liquid filling port 2; 306. Liquid discharge port 2. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] See also Figures 1 to 4The present invention provides a technical solution: a copper plating device for PCB board manufacturing, which is characterized by:

[0031] A copper plating device for PCB board manufacturing includes copper plating equipment, characterized in that: the copper plating equipment includes a tank body 1 and a support frame 2, the tank body 1 is installed above the support frame 2; the tank body 1 includes a pickling tank 101, an electroplating tank 102, a cleaning tank 103 and several top covers 201, the pickling tank 101 is provided on one side of the electroplating tank 102, and the cleaning tank 103 is provided on the other side of the electroplating tank 102, and the tops of the pickling tank 101, the electroplating tank 102 and the cleaning tank 103 are all provided with top covers 201; and the electroplating equipment 105 is provided on the side of the electroplating tank 102.

[0032] Specifically, a number of placement racks 106 are provided inside the pickling tank 101 and the electroplating tank 102 to avoid damage caused by collision. The placement racks 106 adopt a cross-shaped structure with good mechanical strength to prevent deformation caused by the weight of the workpiece or liquid flow, while improving space utilization. This design can effectively improve the stability of the workpiece and ensure that the copper plating process will not cause uneven plating due to swinging.

[0033] Specifically, the pickling tank 101 is provided with a liquid injection port 301 on the side, and a liquid discharge port 302 at the bottom. The liquid injection port 301 is set on the side of the pickling tank 101, which is convenient for operators to access when adding liquid, without interference from other equipment or structures. This design allows workers to quickly and conveniently inject a predetermined amount of acid solution into the pickling tank 101, ensuring that the solution is evenly distributed, thereby improving the pickling effect. The liquid discharge port 302 is located at the bottom of the pickling tank 101, which can quickly discharge the treated acid solution and impurities. The combined design of the liquid injection port 301 and the liquid discharge port 302 not only improves the convenience and safety of the operation of the pickling tank 101, but also significantly improves the efficiency and consistency of the pickling process.

[0034] Specifically, an injector 303 is provided on the side of the electroplating tank 102, and the injector 303 is located at the top of the electroplating equipment 105. A spherical gate valve 304 is provided at the bottom of the electroplating tank 102. The injector 303 can realize real-time replenishment of the liquid in the electroplating tank 102, ensure the stability of the concentration of the electroplating solution 305, and further improve the quality of the coating. The spherical gate valve 304 has a special shape and flow channel structure, so that impurities can be effectively collected and discharged together with the electroplating solution 305, avoiding the risk of accumulation in the tank and equipment failure.

[0035] Specifically, a second liquid injection port 306 is provided on one side of the cleaning tank 103, and a second liquid discharge port 307 is provided on the other side of the cleaning tank 103, ensuring uniform flow and effective distribution of the cleaning liquid 308 within the tank. When the operator injects the cleaning liquid 308 through the second liquid injection port 306, the cleaning liquid 308 can flow quickly within the tank, fully contacting the workpiece to be cleaned, and enhancing the cleaning effect. This coaxial design not only optimizes the flow path of the liquid, but also reduces eddy currents and stagnation of the liquid within the tank, thereby improving cleaning efficiency. The opposite-side structural design of the second liquid injection port 306 and the second liquid discharge port 307 ensures that during high-flow operation, the tank body 1 will not cause additional stress concentration due to liquid flow.

[0036] Specifically, the bottoms of both the pickling tank 101 and the electroplating tank 102 are funnel-shaped. The main advantage of the funnel-shaped bottom design is that it effectively guides liquid toward drain port 1 302 and drain port 2 307, thereby accelerating the drainage process. In the pickling tank 101, the acid solution is discharged faster, reducing the potential for secondary contamination of the workpiece surface caused by liquid stagnation. This design also allows for more complete chemical reactions within the tank, ensuring that each workpiece receives uniform and thorough treatment during the pickling process.

[0037] The funnel-shaped bottom of electroplating tank 102 also plays an important role. Guided by this shape, electroplating solution 305 flows quickly toward drain port 302, preventing sediment from accumulating at the bottom of the tank and thus maintaining the cleanliness and activity of electroplating solution 305. This design not only improves the fluidity of electroplating solution 305 but also reduces unevenness during the electroplating process, ensuring uniformity and adhesion of the coating.

[0038] The funnel-shaped bottom design also simplifies cleaning and maintenance. Due to the unique shape of the bottom, residual liquid and sediment in the tank can be easily drained, reducing the complexity of equipment maintenance. During daily inspections, operators can also more easily observe the liquid condition in the tank, ensuring that the equipment is always in optimal working condition.

[0039] Specifically, ribs 109 are provided on the outside of the trough body 1 to increase the overall rigidity and deformation resistance of the trough body 1. These ribs 109 are evenly distributed along the circumference of the trough body 1 and can effectively resist the pressure and twisting force that may be generated in the trough body 1 during liquid filling and operation. The setting of the ribs 109 can also prevent people from directly contacting the trough body 1, thereby indirectly ensuring the safety of the operator.

[0040] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0042] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A copper plating device for PCB board manufacturing, including copper plating equipment, characterized by: The copper plating equipment comprises a tank body (1) and a support frame (2), wherein the tank body (1) is installed above the support frame (2); The tank body (1) comprises a pickling tank (101), an electroplating tank (102), a cleaning tank (103) and a plurality of top covers (201); the pickling tank (101) is provided on one side of the electroplating tank (102); the cleaning tank (103) is provided on the other side of the electroplating tank (102); and the tops of the pickling tank (101), the electroplating tank (102) and the cleaning tank (103) are all provided with top covers (201); The electroplating tank (102) is provided with an electroplating device (105) on its side.

2. The copper plating device for PCB manufacturing according to claim 1, wherein: A plurality of placement racks (104) are provided inside the pickling tank (101) and the electroplating tank (102).

3. The copper plating device for PCB manufacturing according to claim 1, wherein: The side of the pickling tank (101) is provided with a liquid injection port (301), and the bottom of the pickling tank (101) is provided with a liquid discharge port (302).

4. The copper plating device for PCB manufacturing according to claim 1, wherein: A liquid injector (303) is provided on the side of the electroplating tank (102), and the liquid injector (303) is located on the top of the electroplating equipment (105). A spherical gate valve (304) is provided at the bottom of the electroplating tank (102).

5. The copper plating device for PCB manufacturing according to claim 1, wherein: A second liquid injection port (305) is provided on one side of the cleaning tank (103), and a second liquid discharge port (306) is provided on the other side of the cleaning tank (103).

6. The copper plating device for PCB manufacturing according to claim 1, characterized in that: The bottoms of the pickling tank (101) and the electroplating tank (102) are both funnel-shaped.

7. The copper plating device for PCB manufacturing according to claim 1, characterized in that: The outer side of the trough body (1) is provided with ribs.

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