Ultrathin microwave circuit board electroplating mechanism

Abstract

The utility model relates to the technical field of circuit board manufacturing, and provides an ultrathin microwave circuit board electroplating mechanism which comprises a connecting plate, electroplating baths are symmetrically and fixedly connected to the two sides of the connecting plate, lifting assemblies are symmetrically arranged on the outer walls of the two sides of the two electroplating baths, and an adjusting assembly is arranged between every two adjacent lifting assemblies. According to the electroplating mechanism, the clamping assemblies are arranged, so that a circuit board can be clamped and fixed, the clamping frames on the two sides can be alternately lifted and adjusted through the arrangement of the adjusting assembly and the lifting assembly, the number of the clamping frames is multiple, and the clamping assemblies are arranged on the two sides of the clamping frames. The circuit boards can be conveniently placed into the electroplating bath in batches, and when the circuit board on one side is electroplated, a worker can disassemble and assemble the circuit board on the other side, so that the working efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board manufacturing, in particular to an ultra-thin microwave circuit board electroplating mechanism. Background Art

[0002] PCB electroplating is a manufacturing process that involves depositing a layer of metal onto the surface of a circuit board to improve its conductivity, solderability, and protective properties. Common metals used for PCB electroplating include copper, nickel, and tin. The PCB electroplating process includes cleaning, pretreatment, plating, and post-processing. PCB electroplating improves the reliability and stability of the board and is an essential step in PCB manufacturing.

[0003] For example, the Chinese utility model patent authorization announcement number CN219752480U discloses a circuit board electroplating cylinder, which includes an electroplating cylinder, a cleaning component, and an auxiliary component. A movable horizontal plate is provided on the top of the electroplating cylinder, the cleaning component is provided on the electroplating cylinder, and the auxiliary component is provided inside the electroplating cylinder for stirring and mixing the electroplating solution. Through the coordinated use of a connecting rod, a filter plate, a slider, an L-shaped fixed plate, a slide rod, and a push block, the filter plate can be driven up and down by the lifting of the movable horizontal plate, so that impurities contained in the electroplating solution can be filtered above the filter plate to prevent the impurities from falling into the interior of the electroplating cylinder and affecting the electroplating operation of the electroplating solution on subsequent circuit boards. At the same time, the filter plate is moved to the bottom of the push block, and the movement of the push block can push and remove impurities on the surface of the filter plate. The linkage of the filter plate makes the device structure simple and easy to operate.

[0004] The circuit boards in the above patents need to be manually disassembled after electroplating is completed before they can be reloaded. This operation is more troublesome and is not conducive to the electroplating efficiency of the circuit boards. Utility Model Content

[0005] In order to solve the problems existing in the background technology, the utility model provides an ultra-thin microwave circuit board electroplating mechanism, which solves the problem in the prior art that after the electroplating is completed, the entire circuit board needs to be manually disassembled before it can be reloaded, which is a more cumbersome operation and is not conducive to the electroplating efficiency of the circuit board.

[0006] In response to the problems in the prior art, the utility model provides an ultra-thin microwave circuit board electroplating mechanism, including a connecting plate, both sides of which are symmetrically and fixedly connected to electroplating tanks, both outer walls of the two electroplating tanks are symmetrically provided with lifting components, an adjustment component is provided between two adjacent lifting components, and a clamping component is provided above the two electroplating tanks.

[0007] Specifically, the lifting assembly includes a mounting plate symmetrically fixedly connected to the outer wall of the electroplating tank, the side wall of the mounting plate is rotatably connected to a first connecting cylinder, the circumferential outer wall of the first connecting cylinder is fixedly connected to a first connecting rod, one end of the first connecting rod is hinged to a second connecting cylinder, the second connecting cylinder is hinged to a second connecting rod, and one end of the second connecting rod is fixedly connected to a third connecting cylinder.

[0008] Specifically, the adjustment assembly includes a support plate symmetrically fixedly connected to the middle part of the upper surface of the connecting plate, a horizontal plate fixedly connected between the two support plates, a double-headed motor fixedly connected to the upper surface of the horizontal plate, the output shafts at both ends of the double-headed motor pass through the support plates on both sides and are fixedly connected to cranks, one end of the two cranks are fixedly connected to sliders, the two sliders are slidably connected to slide grooves, and the two slide grooves are respectively fixedly connected to the side walls of two adjacent first connecting rods.

[0009] Specifically, the clamping assembly includes a clamping frame fixedly connected between the two third connecting tubes, and multiple groups of clamping plates are fixed between the inner walls on both sides of the clamping frame. A clamping groove is provided on the lower surface of the clamping plate, and the two side walls of the clamping groove are respectively fixedly connected with a rubber pad and a movable plate. The outer wall of the clamping plate close to the movable plate is symmetrically provided with a threaded rod, and the threaded rod passes through the clamping plate and is rotatably connected to the movable plate.

[0010] Specifically, the threaded rod is threadedly connected to the clamping plate.

[0011] Specifically, support legs are fixedly connected to the four corners of the bottom of the two electroplating tanks.

[0012] Beneficial effects of the utility model:

[0013] The electroplating mechanism can clamp and fix the circuit board through the setting of the clamping component, and can alternately lift and lower the clamping frames on both sides through the setting of the adjustment component and the lifting component. There are multiple groups of clamping frames, which is convenient for placing circuit boards into the electroplating tank in batches. When the circuit board on one side is being electroplated, the staff can disassemble and install the circuit board on the other side, which greatly improves work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the overall structure of the utility model from another side perspective;

[0017] Figure 3 This is a schematic diagram of the structure of the adjustment component in the present utility model;

[0018] Figure 4 This is a schematic diagram of the structure of the clamping assembly in the present utility model.

[0019] In the figure: 1. Connecting plate; 2. Electroplating tank; 3. Lifting assembly; 301. Mounting plate; 302. First connecting cylinder; 303. First connecting rod; 304. Second connecting cylinder; 305. Second connecting rod; 306. Third connecting cylinder; 4. Adjusting assembly; 401. Support plate; 402. Horizontal plate; 403. Double-headed motor; 404. Crank; 405. Slider; 406. Slide groove; 5. Clamping assembly; 501. Clamping frame; 502. Clamping plate; 503. Clamping groove; 504. Rubber pad; 505. Movable plate; 506. Threaded rod; 6. Support leg. DETAILED DESCRIPTION

[0020] In order to make the technical methods, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0021] like Figure 1-4The electroplating mechanism of an ultra-thin microwave circuit board is shown, comprising a connecting plate 1, both sides of the connecting plate 1 are symmetrically fixedly connected to the electroplating tank 2, the outer walls of the two electroplating tanks 2 are symmetrically provided with lifting components 3, an adjustment component 4 is provided between two adjacent lifting components 3, and a clamping component 5 is provided above the two electroplating tanks 2. The lifting component 3 comprises a mounting plate 301 symmetrically fixedly connected to the outer wall of the electroplating tank 2, the side wall of the mounting plate 301 is rotatably connected to the first connecting cylinder 302, the circumferential outer wall of the first connecting cylinder 302 is fixedly connected to the first connecting rod 303, and one end of the first connecting rod 303 is hinged to the second connecting rod 303. The second connecting cylinder 304 is hinged with a second connecting rod 305, and one end of the second connecting rod 305 is fixedly connected to the third connecting cylinder 306. The adjusting assembly 4 includes a support plate 401 symmetrically fixedly connected to the middle of the upper surface of the connecting plate 1, and a cross plate 402 is fixedly connected between the two support plates 401. The upper surface of the cross plate 402 is fixedly connected to a double-headed motor 403. The output shafts at both ends of the double-headed motor 403 pass through the support plates 401 on both sides and are fixedly connected to the crank 404. One end of the two cranks 404 is fixedly connected to a slider 405, and the two sliders 405 are slidably connected to a slide groove. 406, the two slide grooves 406 are respectively fixedly connected to the side walls of two adjacent first connecting rods 303, the clamping assembly 5 includes a clamping frame 501 fixedly connected between the two third connecting cylinders 306, and multiple groups of clamping plates 502 are fixed between the inner walls on both sides of the clamping frame 501. The lower surface of the clamping plate 502 is provided with a clamping groove 503, and the two side walls of the clamping groove 503 are respectively fixedly connected with a rubber pad 504 and a movable plate 505. The outer wall of the clamping plate 502 on one side close to the movable plate 505 is symmetrically provided with a threaded rod 506, and the threaded rod 506 passes through the clamping plate 502 and is rotatably connected to the movable plate 505 By setting the clamping component 5, the circuit board can be clamped and fixed. By setting the adjustment component 4 and the lifting component 3, the clamping frames 501 on both sides can be alternately lifted and lowered, and the number of clamping frames 501 is multiple groups, which is convenient for placing circuit boards into the plating tank 1 in batches, and when the circuit board on one side is being electroplated, the staff can disassemble and install the circuit board on the other side, which greatly improves work efficiency. The threaded rod 506 is threadedly connected to the clamping plate 502, thereby facilitating the rotation of the threaded rod 506. The four corners of the bottom of the two plating tanks 2 are fixedly connected to the support legs 6, which facilitates the support of the plating tank 2.

[0022] (1) When electroplating a circuit board, the circuit board is first placed in the clamping groove 503, and then the threaded rod 506 is rotated. The threaded rod 506 pushes the movable plate 505 to move toward the side of the rubber pad 504. The circuit board is clamped by the mutual cooperation between the movable plate 505 and the rubber pad 504. The rubber plate is flexible and can play a buffering role in the process of clamping the circuit board, which can effectively protect the circuit board. In addition, there are multiple groups of clamping plates 502, which can be used to perform circuit plating on circuit boards in batches, greatly improving production efficiency.

[0023] (2) After the circuit boards are installed, the double-headed motor 403 is started. The output shaft of the double-headed motor 403 drives the cranks 404 on both sides to rotate. The cranks 404 drive the sliders 405 to slide inside the slide grooves 406. The slide grooves 406 drive the first connecting rod 303 to move. The first connecting rod 303 drives the second connecting cylinders 304, the second connecting rods 305 and the third connecting cylinder 306 on both sides of the two electroplating tanks 2 to alternately rise and fall. The third connecting cylinder 306 drives the two clamping frames 501 to alternately rise and fall, so as to facilitate the batch placement of circuit boards into the electroplating tank 2. When the circuit boards on one side are being electroplated, the staff can disassemble and install the circuit boards on the other side, which greatly improves work efficiency.

[0024] How it works

[0025] When electroplating a circuit board, first place the circuit board in the clamping groove 503, then rotate the threaded rod 506, and the threaded rod 506 pushes the movable plate 505 to move toward the side of the rubber pad 504. The circuit board is clamped by the mutual cooperation between the movable plate 505 and the rubber pad 504. The rubber plate is flexible and can play a buffering role in the process of clamping the circuit board, which can effectively protect the circuit board. In addition, there are multiple groups of clamping plates 502, which can be used to perform circuit plating on circuit boards in batches, greatly improving production efficiency. After the circuit board is installed, the double-headed motor 403 is started, and the double-headed motor 40 The output shaft drives the cranks 404 on both sides to rotate, and the cranks 404 drive the slider 405 to slide inside the slide groove 406. The slide groove 406 drives the first connecting rod 303 to move. The first connecting rod 303 drives the second connecting cylinders 304, the second connecting rods 305 and the third connecting cylinder 306 on both sides of the two electroplating tanks 2 to alternately rise and fall. The third connecting cylinder 306 drives the two clamping frames 501 to alternately rise and fall, thereby facilitating the placement of circuit boards into the electroplating tank 2 in batches. When the circuit boards on one side are being electroplated, the staff can disassemble and install the circuit boards on the other side, which greatly improves work efficiency.

Claims

1. An ultra-thin microwave circuit board electroplating mechanism, characterized in that: include: Connecting plate (1); An electroplating tank (2), wherein both sides of the connecting plate (1) are symmetrically and fixedly connected to the electroplating tank (2); A lifting assembly (3), wherein the outer walls of both sides of the two electroplating tanks (2) are symmetrically provided with a lifting assembly (3); An adjusting component (4), wherein an adjusting component (4) is provided between two adjacent lifting components (3); A clamping assembly (5) is provided above each of the two electroplating tanks (2).

2. The ultra-thin microwave circuit board electroplating mechanism according to claim 1, characterized in that: The lifting assembly (3) includes a mounting plate (301) symmetrically fixedly connected to the outer wall of the electroplating tank (2); the side wall of the mounting plate (301) is rotatably connected to a first connecting cylinder (302); the circumferential outer wall of the first connecting cylinder (302) is fixedly connected to a first connecting rod (303); one end of the first connecting rod (303) is hinged to a second connecting cylinder (304); the second connecting cylinder (304) is hinged to a second connecting rod (305); and one end of the second connecting rod (305) is fixedly connected to a third connecting cylinder (306).

3. The ultra-thin microwave circuit board electroplating mechanism according to claim 1, characterized in that: The adjustment assembly (4) comprises a support plate (401) symmetrically fixedly connected to the middle of the upper surface of the connecting plate (1); a transverse plate (402) is fixedly connected between the two support plates (401); a double-headed motor (403) is fixedly connected to the upper surface of the transverse plate (402); the output shafts at both ends of the double-headed motor (403) pass through the support plates (401) on both sides and are fixedly connected to cranks (404); one end of each of the two cranks (404) is fixedly connected to a slider (405); each of the two sliders (405) is slidably connected to a slide groove (406); and the two slide grooves (406) are respectively fixedly connected to the side walls of two adjacent first connecting rods (303).

4. The ultra-thin microwave circuit board electroplating mechanism according to claim 2, characterized in that: The clamping assembly (5) includes a clamping frame (501) fixedly connected between the two third connecting cylinders (306), and multiple groups of clamping plates (502) are fixed between the inner walls on both sides of the clamping frame (501). A clamping groove (503) is provided on the lower surface of the clamping plate (502), and the two side walls of the clamping groove (503) are respectively fixedly connected with a rubber pad (504) and a movable plate (505). The outer wall of the clamping plate (502) on one side close to the movable plate (505) is symmetrically provided with a threaded rod (506), and the threaded rod (506) passes through the clamping plate (502) and is rotatably connected to the movable plate (505).

5. The ultra-thin microwave circuit board electroplating mechanism according to claim 4, characterized in that: The threaded rod (506) is threadedly connected to the clamping plate (502).

6. The ultra-thin microwave circuit board electroplating mechanism according to claim 2, characterized in that: Support legs (6) are fixedly connected to the four corners of the bottom of the two electroplating tanks (2).

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