High-efficiency heat dissipation device for high-temperature lamp

Abstract

The utility model discloses an efficient heat dissipation device for a high-temperature lamp. The efficient heat dissipation device comprises an aluminum frame, heat dissipation fins, a heat dissipation fan connecting frame, a heat dissipation fan and a heat dissipation fan power box. The radiating fins are located on the back of the aluminum frame and are integrally formed with the aluminum frame body in a stretching mode. The two ends of the fan connecting frame are fastened above the two ends of the back of the aluminum frame by a certain height through screws; the cooling fan and the cooling fan power box are fixed to the fan connecting frame through screws, and the rotating speed can be automatically adjusted. Compared with an existing LED lamp which is usually simple in structure, passive heat dissipation of heat dissipation fins or heat dissipation fins is mainly adopted in a heat dissipation mode, the application range is greatly limited, an active heat dissipation device is added to improve the situation, the LED lamp can better adapt to more working conditions, and long-time high-strength operation of the LED lamp is guaranteed.

Description

Technical Field

[0001] The utility model relates to a high-efficiency heat dissipation device for a high-temperature lamp, belonging to the technical field of lighting equipment. Background Art

[0002] LED chips are extremely sensitive to temperature. Rising temperatures reduce light radiation, shifting the peak wavelength, causing changes in the LED's color temperature and color rendering index, accelerating the aging of the phosphor and components, and reducing the lifespan of the LED chip. Therefore, the design of the heat dissipation structure is particularly important for high-power LED lamps or high-temperature lamps operating in high ambient temperatures. The quality of the heat dissipation design will significantly impact the final LED lamp's luminous efficacy, spectrum, lifespan, and other parameters. Existing LED lamps often have simple structures and primarily rely on passive heat dissipation through heat sinks or fins, which greatly limits their applicability. To improve this situation, the addition of active heat dissipation devices to better adapt to a wider range of operating conditions is particularly important. Utility Model Content

[0003] In view of the problems existing in the above-mentioned prior art, the utility model provides a high-efficiency heat dissipation device for a high-temperature lamp, thereby solving the above-mentioned technical problems.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a high-efficiency heat dissipation device for a high-temperature lamp, comprising an aluminum frame, a heat sink, a heat dissipation fan connecting frame, a heat dissipation fan, and a heat dissipation fan power supply box; the heat sink is located on the back of the aluminum frame and is stretched and formed integrally with the aluminum frame body; the two ends of the fan connecting frame are fastened by screws at a certain height above the two ends of the back of the aluminum frame; the heat dissipation fan and the heat dissipation fan power supply box are fixed to the fan connecting frame by screws, and the speed can be automatically adjusted.

[0005] Furthermore, the cooling fan connecting frame is placed 25 mm above the aluminum frame.

[0006] A thermal sensor is installed on the heat sink; the resistance of the thermal sensor varies between 100Ω and 10kΩ. Before the heat sink temperature reaches 60°C, the resistance increases from 100Ω to 1kΩ, which is a nonlinear change; when the heat sink temperature is between 60°C and 80°C, its resistance changes linearly between 1kΩ and 10kΩ, and the signal is transmitted to the DSP microprocessor chip. The DSP processes the signal and sends a corresponding PWM pulse signal to control the speed of the cooling fan.

[0007] Furthermore, the cooling fan power supply box is fixed to the cooling fan connecting frame by screws and is used to supply power to the cooling fan.

[0008] Furthermore, the speed of the cooling fan is controlled by a PWM signal to reduce fan noise and save electricity.

[0009] Furthermore, the heat sink and the aluminum frame are obtained by using an aluminum stretching machine.

[0010] Furthermore, the aluminum frame is made of 6063 high-quality aluminum alloy.

[0011] The beneficial effect of the present invention is that the present invention is simple in structure and mainly uses passive heat dissipation of heat sinks or heat dissipation fins for existing LED lamps, which greatly limits the scope of application. In order to improve this situation, an active heat dissipation device is added to make it better adaptable to more working conditions and ensure long-term high-intensity operation of the LED lamp. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural diagram of the present utility model.

[0013] In the figure: 1. heat sink, 2. cooling fan connecting frame, 3. cooling fan, 4. cooling fan power box. DETAILED DESCRIPTION

[0014] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. However, it should be understood that the specific embodiments described herein are only used to illustrate the present invention and are not intended to limit the scope of the present invention.

[0015] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present invention pertains. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0016] like Figure 1 As shown, a high-efficiency heat dissipation device for a high-temperature lamp includes an aluminum frame, a heat sink 1, a heat dissipation fan connecting frame 2, a heat dissipation fan 3, and a heat dissipation fan power box 4;

[0017] The heat sink 1 is located on the back of the aluminum frame and is processed together with the main body of the aluminum frame by an aluminum stretching machine; the two ends of the fan connecting frame 2 are fastened by screws at a certain height above the two ends of the back of the aluminum frame; the cooling fan 3 and the cooling fan power box 4 are fixed to the fan connecting frame by screws, and the speed can be automatically adjusted.

[0018] Reference Figure 1 In this embodiment, the aluminum frame is preferably made of 6063 high-quality aluminum alloy, which has stable mechanical properties, strong heat resistance and high heat dissipation coefficient.

[0019] Reference Figure 1In this embodiment, the cooling fan connecting frame 2 is preferably placed 25 mm above the aluminum frame. This height is determined by the fan temperature test results, where the fan cooling effect is best.

[0020] Reference Figure 1 In this embodiment, the speed of the cooling fan 3 is preferably controlled by a PWM signal, which can timely reduce fan noise and save electricity.

[0021] Reference Figure 1 In this embodiment, a thermistor is preferably installed on the heat sink 1. As the heat sink temperature changes, its resistance changes between 100Ω and 10kΩ. Before the heat sink temperature is 60°C, the resistance increases from 100Ω to 1kΩ, which is a nonlinear change; when the heat sink temperature is between 60°C and 80°C, its resistance changes linearly between 1kΩ and 10kΩ, and transmits the signal to the DSP microprocessor chip. The DSP processes the signal and sends a corresponding PWM pulse signal to control the speed of the cooling fan.

[0022] Reference Figure 1 In this embodiment, the cooling fan power supply box 4 is preferably fixed on the cooling fan connecting frame 2 to supply power to the cooling fan 3.

[0023] The utility model is for existing LED lamps, which often have a simple structure and mainly adopt passive heat dissipation of heat sinks or heat fins, which greatly limits the scope of application. In order to improve this situation, an active heat dissipation device is added to make it better adaptable to more working conditions and ensure long-term high-intensity operation of the LED lamp.

[0024] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements or improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-efficiency heat dissipation device for a high-temperature lamp, characterized in that: The invention comprises an aluminum frame, a heat sink (1), a heat dissipation fan connecting frame (2), a heat dissipation fan (3), and a heat dissipation fan power supply box (4); the heat dissipation fin (1) is located on the back of the aluminum frame and is formed integrally with the main body of the aluminum frame by stretching; the two ends of the fan connecting frame (2) are fastened by screws to a certain height above the two ends of the back of the aluminum frame; the heat dissipation fan (3) and the heat dissipation fan power supply box (4) are fixed to the fan connecting frame by screws, and can realize automatic adjustment of the rotation speed.

2. The high-efficiency heat dissipation device for a high-temperature lamp according to claim 1, characterized in that: The cooling fan connecting frame (2) is placed 25 mm above the aluminum frame.

3. The high-efficiency heat dissipation device for a high-temperature lamp according to claim 1, characterized in that: A thermal sensor is installed on the heat sink (1); the resistance of the thermal sensor varies in the range of 100Ω-10kΩ, and before the heat sink temperature reaches 60°C, the resistance increases from 100Ω to 1kΩ, which is a nonlinear change; when the heat sink temperature is between 60°C and 80°C, the resistance changes linearly between 1kΩ and 10kΩ, and transmits the signal to the DSP microprocessor chip, which processes and sends a corresponding PWM pulse signal to control the speed of the cooling fan.

4. The high-efficiency heat dissipation device for a high-temperature lamp according to claim 1, characterized in that: The cooling fan power supply box (4) is fixed to the cooling fan connecting frame (2) by screws and is used to supply power to the cooling fan (3).

5. The high-efficiency heat dissipation device for a high-temperature lamp according to claim 1, characterized in that: The speed of the cooling fan (3) is controlled by a PWM signal, which is used to reduce fan noise and save electricity.

6. The high-efficiency heat dissipation device for a high-temperature lamp according to claim 1, characterized in that: The heat sink (1) and the aluminum frame are obtained by processing using an aluminum stretching machine.

7. The high-efficiency heat dissipation device for a high-temperature lamp according to claim 1, characterized in that: The aluminum frame is made of 6063 high-quality aluminum alloy.

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