Solder paste thickness detection equipment
Through the combination of the L-shaped slide frame, elastic telescopic assembly and limiting mechanism, the cumbersome adjustment problem of solder paste thickness detection equipment in the prior art for circuit boards of different thicknesses is solved, and fast and accurate solder paste thickness measurement is achieved.
Patent Information
- Application Number
- CN202422587833.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2025-08-15
- Estimated Expiration
- 2034-10-24
AI Technical Summary
When facing circuit boards of different thicknesses, existing solder paste thickness detection equipment requires cumbersome laser head height adjustment and circuit board thickness detection, resulting in low measurement efficiency and insufficient accuracy.
The L-shaped slide frame and multiple elastic telescopic components are used to cooperate with the limiting mechanism to realize automatic positioning and keeping parallel states of PCB circuit boards of different thicknesses. Combined with the threaded rod system driven by the servo motor, the adjustment process is simplified.
Fast and accurate solder paste thickness measurement of PCB circuit boards of different thicknesses is achieved, without additional adjustments to laser detectors and circuit boards, improving measurement efficiency and accuracy.
Smart Images

Figure CN223228963U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of solder paste thickness detection, in particular to solder paste thickness detection equipment. Background Art
[0002] With the development of surface mount technology, the components assembled in circuit boards are getting smaller and smaller, the component assembly density is getting higher and higher, and the solder joints are getting smaller and smaller. In the process of circuit board production, solder paste printing is usually required. However, it is an indisputable fact that the solder paste printing process will produce many defects. Another well-known fact is that the amount of solder paste is an important indicator for judging the quality and reliability of solder joints. The solder paste thickness tester can effectively detect potential defects in the printing process.
[0003] A Chinese patent with announcement number CN210051297U discloses a solder paste thickness detection device, including a frame, a workbench fixedly connected to the bottom of the frame, a shell fixedly connected to the back of the inner wall of the frame, and a motor fixedly connected to the left side of the bottom of the inner wall of the shell through a support plate, one end of the motor output shaft fixedly connected to a first bevel gear, and a threaded rod rotatably connected between the top and bottom of the inner wall of the shell.
[0004] The above-mentioned disclosed patent still has the following technical defects: in order to detect the thickness of solder paste on circuit boards of different thicknesses, the laser head needs to be height-adjusted, and the adjustment process is relatively cumbersome, and the thickness of the circuit board needs to be detected in advance. Utility Model Content
[0005] The utility model aims to solve the problems existing in the background technology and propose a solder paste thickness detection device.
[0006] The technical solution of the utility model is a solder paste thickness detection device, comprising:
[0007] A base, on which an L-shaped sliding frame is slidably mounted, and a power assembly a for driving the L-shaped sliding frame to move is mounted on the base;
[0008] A mounting slider and a laser detector mounted on the mounting slider, wherein the mounting slider is slidably mounted on an L-shaped sliding frame, and a power assembly b for driving the mounting slider is mounted on the L-shaped sliding frame; the driving direction of the power assembly b is perpendicular to the driving direction of the power assembly a;
[0009] A plurality of elastic telescopic components, wherein the plurality of elastic telescopic components are vertically arranged on the base;
[0010] Multiple limiting mechanisms, the limiting assembly includes a mounting shaft and a telescopic limiting piece, the mounting shaft is vertically arranged on the base, and the telescopic limiting piece is rotatably mounted on the mounting shaft.
[0011] Preferably, a plurality of infrared emitters are installed on the mounting slide, and the plurality of infrared emitters are evenly distributed on the periphery of the laser detector.
[0012] Preferably, the power assembly a includes a servo motor a and a threaded rod a, the servo motor a is mounted on the base, the threaded rod a is connected to the output shaft of the servo motor a, and the bottom end of the L-shaped sliding frame is threadedly connected to the threaded rod a.
[0013] Preferably, the power assembly b includes a servo motor b and a threaded rod b, the servo motor b is mounted on the upper end of the L-shaped sliding frame, the threaded rod b is connected to the output shaft of the servo motor b, and the mounting slider is threadedly connected to the threaded rod b.
[0014] Preferably, the elastic telescopic component includes a cylinder, a movable rod, a spring, a limit block and a rubber ball. The cylinder is arranged on the base, the end of the movable rod is movably arranged on the inner side of the cylinder and connected to the limit block, the spring is arranged on the inner side of the cylinder, and the rubber ball is arranged at the top of the movable rod.
[0015] Preferably, the telescopic limiting member includes a sleeve and a limiting rod, the sleeve is rotatably connected to the mounting shaft, and the end of the limiting rod is slidably arranged on the inner side of the sleeve.
[0016] Compared with the existing technology, the present invention has the following beneficial technical effects: the present invention can realize the positioning work of PCB circuit boards of different thicknesses, so that the distance between PCB circuit boards of different thicknesses and the laser detector is always consistent, and can ensure that the PCB circuit boards are always in a parallel state, without the need to adjust the laser detector and the PCB circuit board, making the measurement work fast and accurate. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a structural diagram of the present utility model.
[0018] Figure 2 This is a schematic diagram of the structure of the PCB circuit board after unloading in the utility model.
[0019] Figure 3 It is a cross-sectional structural diagram of the elastic telescopic member in the present utility model.
[0020] Figure numerals: 1. base; 2. L-shaped sliding frame; 3. controller; 41. cylinder; 42. movable rod; 5. mounting shaft; 6. servo motor a; 7. threaded rod a; 8. servo motor b; 9. threaded rod b; 10. mounting slider; 11. laser detector; 12. infrared transmitter; 131. sleeve; 132. limit rod; 14. spring; 15. limit block; 16. rubber ball. DETAILED DESCRIPTION
[0021] Example 1
[0022] like Figure 1-Figure 3 As shown, a solder paste thickness detection device proposed in this embodiment includes a base 1, an L-shaped sliding frame 2, a laser detector 11, multiple elastic telescopic components and multiple limiting mechanisms.
[0023] A controller 3 is installed on the L-shaped sliding frame 2 for controlling the operation of the servo motor a6 and the servo motor b8. The L-shaped sliding frame 2 is slidably installed on the base 1, and a power component a for driving the L-shaped sliding frame 2 to move is installed on the base 1. The power component a includes a servo motor a6 and a threaded rod a7. The servo motor a6 is installed on the base 1, and the threaded rod a7 is connected to the output shaft of the servo motor a6. The bottom end of the L-shaped sliding frame 2 is threadedly connected to the threaded rod a7; the mounting slider 10 is slidably installed on the L-shaped sliding frame 2, and the laser detector 11 is installed on the mounting slider 10. A power component b for driving the mounting slider 10 to move is installed on the L-shaped sliding frame 2; the driving direction of the power component b is perpendicular to the driving direction of the power component a. The power component b includes a servo motor b8 and a threaded rod b9. The servo motor b8 is installed at the upper end of the L-shaped sliding frame 2, and the threaded rod b9 is connected to the output shaft of the servo motor b8. The mounting slider 10 is threadedly connected to the threaded rod b9.
[0024] Multiple elastic telescopic components are vertically arranged on the base 1, and the elastic telescopic components include a cylinder 41, a movable rod 42, a spring 14, a limit block 15 and a rubber ball 16. The cylinder 41 is arranged on the base 1, and the end of the movable rod 42 is movably arranged on the inner side of the cylinder 41 and connected to the limit block 15. The spring 14 is arranged on the inner side of the cylinder 41, and the rubber ball 16 is arranged at the top of the movable rod 42.
[0025] The limiting assembly includes a mounting shaft 5 and a telescopic limiting member. The telescopic limiting member includes a sleeve 131 and a limiting rod 132. The sleeve 131 is rotatably connected to the mounting shaft 5. The end of the limiting rod 132 is slidably arranged on the inner side of the sleeve 131. The limiting rod 132 is movable, so that the equipment can facilitate the limiting work of PCB circuit boards of different sizes. The mounting shaft 5 is vertically arranged on the base 1, and the telescopic limiting member is rotatably installed on the mounting shaft 5.
[0026] In this embodiment, when working, the PCB circuit board is placed on multiple elastic telescopic parts, and then the PCB circuit board is pressed to move downward until the PCB circuit board moves to the position below the limit rod 132, and then the multiple telescopic limit parts are rotated. The multiple limit rods 132 set can limit the edge of the PCB circuit board, and then the thickness of the solder paste on the PCB circuit board can be detected by the laser detector 11; in summary, the utility model can realize the positioning work of PCB circuit boards of different thicknesses, so that the distance between PCB circuit boards of different thicknesses and the laser detector 11 is always consistent, and it can ensure that the PCB circuit board is always in a parallel state, without the need to adjust the laser detector 11 and the PCB circuit board, so that the measurement work is fast and accurate.
[0027] Example 2
[0028] like Figure 1 As shown, a solder paste thickness detection device proposed in this embodiment, compared with Example 1, in this embodiment, multiple infrared emitters 12 are installed on the mounting slider 10, and the multiple infrared emitters 12 are evenly distributed on the periphery of the laser detector 11. The infrared emitters 12 emit infrared light beams and irradiate them onto the PCB circuit board, thereby making it easier for the operator to determine the position to be detected on the PCB circuit board.
[0029] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto. Various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.
Claims
1. A solder paste thickness detection device, characterized in that: include: A base (1), an L-shaped sliding frame (2) is slidably mounted on the base (1), and a power component a for driving the L-shaped sliding frame (2) to move is mounted on the base (1); A mounting slide (10) and a laser detector (11) mounted on the mounting slide (10), wherein the mounting slide (10) is slidably mounted on an L-shaped sliding frame (2), and a power component b for driving the mounting slide (10) to move is mounted on the L-shaped sliding frame (2); the driving direction of the power component b is perpendicular to the driving direction of the power component a; A plurality of elastic telescopic components, wherein the plurality of elastic telescopic components are vertically arranged on the base (1); A plurality of limiting mechanisms are provided, wherein the limiting assembly comprises a mounting shaft (5) and a telescopic limiting member, wherein the mounting shaft (5) is vertically arranged on the base (1), and the telescopic limiting member is rotatably mounted on the mounting shaft (5).
2. The solder paste thickness detection device according to claim 1, characterized in that: A plurality of infrared emitters (12) are installed on the installation slide block (10), and the plurality of infrared emitters (12) are evenly distributed on the periphery of the laser detector (11).
3. The solder paste thickness detection device according to claim 1, characterized in that: The power assembly a comprises a servo motor a (6) and a threaded rod a (7), wherein the servo motor a (6) is mounted on the base (1), the threaded rod a (7) is connected to the output shaft of the servo motor a (6), and the bottom end of the L-shaped sliding frame (2) is threadedly connected to the threaded rod a (7).
4. The solder paste thickness detection device according to claim 1, characterized in that: The power assembly b comprises a servo motor b (8) and a threaded rod b (9), wherein the servo motor b (8) is mounted on the upper end of the L-shaped sliding frame (2), the threaded rod b (9) is connected to the output shaft of the servo motor b (8), and the mounting slide block (10) is threadedly connected to the threaded rod b (9).
5. The solder paste thickness detection device according to claim 1, characterized in that: The elastic telescopic component comprises a cylinder (41), a movable rod (42), a spring (14), a limit block (15) and a rubber ball (16). The cylinder (41) is arranged on the base (1). The end of the movable rod (42) is movably arranged inside the cylinder (41) and connected to the limit block (15). The spring (14) is arranged inside the cylinder (41). The rubber ball (16) is arranged at the top end of the movable rod (42).
6. The solder paste thickness detection device according to claim 1, characterized in that: The telescopic limiting member comprises a sleeve (131) and a limiting rod (132); the sleeve (131) is rotatably connected to the mounting shaft (5); and the end of the limiting rod (132) is slidably arranged on the inner side of the sleeve (131).
Citation Information
Patent Citations
Solder paste thickness detection device
CN210051297U