Chip adsorption device

Abstract

The utility model relates to a chip adsorption device which comprises a testing device, an adsorption device, a moving device and a pressing plate, and the pressing plate is located above the testing device. The testing device comprises a circuit board and at least one pressing type unlocking testing seat. The moving device is used for moving the pressing plate; the pressing plate is used for unlocking the pressing type unlocking test seat; the pressing plate further comprises at least one through hole, one end of the through hole is connected with the adsorption device, and the other end of the through hole corresponds to the pressing type unlocking test seat. And the adsorption device is used for adsorbing the chip in the pressing type unlocking test seat. According to the utility model, the pressing plate is controlled by the moving device to press or release the press-type unlocking test seat so as to unlock or lock the test chip in the press-type unlocking test seat, and the test chip is adsorbed to be taken out or put in through the adsorption device, so that a traditional manual pressing mode is replaced, the test chip is not easily influenced by human factors, the working efficiency is improved, and the test cost is reduced. And the requirements of large-scale production and automatic production can be met.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, and more particularly to a device for adsorbing chips. Background Art

[0002] In modern electronics manufacturing, chip testing is a crucial step in ensuring chip quality and performance. Traditional testing methods typically require efficient, precise, and stable fixtures to ensure good contact between the chip and the test equipment during testing.

[0003] Currently, test sockets rely on manual pressure to load and unload test chips for testing. This design offers convenience and flexibility in lab environments or small-batch production, making it suitable for R&D and initial verification.

[0004] However, as chip production gradually increases, the limitations of existing push-to-test sockets in mass production are becoming increasingly apparent. First, the manual push-to-test operation is inefficient in mass production and susceptible to human factors, resulting in low consistency and repeatability, making it difficult to meet the requirements of efficient, automated production. Utility Model Content

[0005] The technical problem to be solved by the present invention is that the production efficiency of the manual pressing test socket method in the prior art is low and it is difficult to meet the needs of automated production. In view of the above-mentioned defects of the prior art, a device for adsorbing chips is provided.

[0006] The technical solution adopted by the utility model to solve its technical problems is:

[0007] A device for adsorbing chips is constructed, comprising a testing device, an adsorption device, a moving device and a pressing plate; the pressing plate is located above the testing device and is connected to the moving device; the testing device comprises a circuit board and at least one push-to-unlock test socket, and the push-to-unlock test socket is arranged on the circuit board; the moving device is used to move the pressing plate; the pressing plate is used to unlock the push-to-unlock test socket; the pressing plate also includes at least one through hole, one end of the through hole is connected to the adsorption device, and the other end corresponds to the push-to-unlock test socket; the adsorption device is used to adsorb the chip in the push-to-unlock test socket.

[0008] Furthermore, the push-to-unlock test seat includes a base, a fixed part, a movable part and a test area, the base is fixed to the circuit board, the movable part is movably arranged on the base and is located below the pressing plate; the test area is arranged below the fixed part and corresponds to the adsorption device; the fixed part and the movable part are linked and are used to fix or unlock the test area.

[0009] Furthermore, the pressing plate further includes at least one pressure sensor, which is disposed on the pressing plate and faces the circuit board.

[0010] Furthermore, the pressing plate further includes a placement hole corresponding to the pressure sensor, and the pressure sensor is disposed in the placement hole.

[0011] Furthermore, each of the pressure sensors includes a conductive column, the placement hole includes multiple conductive layers and insulating layers, and the insulating layers are respectively arranged between every two of the conductive layers; the conductive column moves in the placement hole and is connected to at least one layer of the conductive layer.

[0012] Furthermore, the adsorption device includes a vacuum pump, which is arranged corresponding to the through hole and faces the test area.

[0013] Furthermore, the moving device includes a support frame and at least one transmission member, the support frame is fixed on one side of the circuit board; one end of the transmission member is connected to the pressing plate, and the other end is fixed in the support frame.

[0014] Furthermore, the support frame is provided with a slide rail, and the pressing plate includes a slider, and the slider is arranged in the slide rail.

[0015] Furthermore, the fixed part includes a fixing bar, which is symmetrically arranged on both sides of the test area to lock or unlock the test area; the fixed part is provided with a slide groove, and the movable part is provided with a sliding rod corresponding to the slide groove, and the sliding rod is movably arranged in the slide groove.

[0016] Furthermore, an adsorption structure is provided at one end of the through hole corresponding to the test area.

[0017] The beneficial effects of the present invention are: the pressing plate is controlled by a mobile device to press or release the press-type unlocking test seat to unlock or lock the test chip in the press-type unlocking test seat, and the test chip is sucked out or put in by the adsorption device, replacing the traditional manual pressing method, which is not easily affected by human factors, can greatly improve work efficiency, and can meet the needs of large-scale production and automated production. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0019] Figure 1This is an overall structural diagram of a device for adsorbing a chip in one embodiment of the present invention;

[0020] Figure 2 This is a three-dimensional structural diagram from another angle of a device for adsorbing a chip in one embodiment of the present invention;

[0021] Figure 3 This is a three-dimensional schematic diagram of a device for adsorbing a chip in one embodiment of the present invention from another angle;

[0022] Figure 4 This is a front view schematic diagram of a device for adsorbing chips according to the present invention;

[0023] Figure 5 Schematic diagram of the contact between the conductive pillar and the conductive layer in one embodiment of the present invention;

[0024] Figure 6 This is a three-dimensional schematic diagram of a fixing portion in one embodiment of the present utility model;

[0025] Figure 7 This is a three-dimensional schematic diagram of the movable part in one embodiment of the utility model;

[0026] Figure 8 It is a three-dimensional schematic diagram of another embodiment of the utility model.

[0027] Explanation of reference numerals: test device 1, adsorption device 2, moving device 3, pressing plate 4, circuit board 101, push-to-unlock test socket 102, base 201, fixing part 202, movable part 203, test area 204, through hole 401, pressure sensor 402, placement hole 403, conductive column 404, conductive layer 405, insulating layer 406, vacuum pump 205, support frame 301, transmission part 302, slide rail 303, slider 407, fixing bar 206, slide groove 207, sliding rod 208, adsorption structure 408. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will be described clearly and completely in conjunction with the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] The terms "first," "second," "third," "fourth," and so forth (if any) in the specification and claims of this application and in the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" and "having," and any variations thereof, are intended to cover non-exclusive inclusions, e.g., a process, method, system, product, or apparatus comprising a series of steps or elements is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not explicitly listed or inherent to such process, method, product, or apparatus.

[0030] This application is described in detail with reference to schematic diagrams. For ease of illustration, when describing the embodiments of this application, cross-sectional views of device structures may be partially enlarged and not to scale. Furthermore, these schematic diagrams are merely illustrative and should not limit the scope of this application. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.

[0031] Currently, the test socket is pressed manually, but this method is inefficient in large-scale production and is easily affected by human factors, resulting in low consistency and repeatability, and is difficult to meet the needs of efficient and automated production.

[0032] Please refer to Figure 1 In one embodiment of the present application, a device for adsorbing chips is proposed, including a testing device 1, an adsorption device 2, a moving device 3 and a pressing plate 4; the pressing plate 4 is located above the testing device 1, and the pressing plate 4 is connected to the moving device 3; the testing device 1 includes a circuit board 101 and at least one push-to-unlock test socket 102, and the push-to-unlock test socket 102 is arranged on the circuit board 101; the moving device 3 is used to move the pressing plate 4; the pressing plate 4 is used to unlock the push-to-unlock test socket 102; the pressing plate 4 also includes at least one through hole 401, one end of the through hole 401 is connected to the adsorption device 2, and the other end corresponds to the push-to-unlock test socket 102; the adsorption device 2 is used to adsorb the chip in the push-to-unlock test socket 102. By controlling the pressing plate 4 to press or release the press-type unlocking test socket 102 through the mobile device 3, the chip in the press-type unlocking test socket 102 can be unlocked or locked, and the test chip can be adsorbed, taken out or put in through the adsorption device 2, replacing the traditional manual pressing method. It is not easily affected by human factors, can greatly improve work efficiency, and can meet the needs of large-scale production and automated production.

[0033] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below with reference to the accompanying drawings.

[0034] like Figure 1-Figure 3 As shown, specifically, the test device 1 is located below the pressing plate 4, the adsorption device 2 is located above the pressing plate 4, and the push-to-unlock test seat 102 faces the adsorption device 2. At this time, the test device 1 and the adsorption device 2 are relatively arranged on both sides of the pressing plate 4, so that the adsorption device 2 can adsorb the test chip placed in the push-to-unlock test seat 102; the pressing plate 4 is fixedly connected to the moving device 3.

[0035] The pressing plate 4 is made of high-strength metal material and can withstand multiple pressing cycles. The pressing plate 4 is fixedly mounted on the mobile device 3 and placed horizontally. The mobile device 3 drives the pressing plate 4 to move toward the push-to-unlock test socket 102 and presses the push-to-unlock test socket 102. At this time, the push-to-unlock test socket 102 is unlocked. When the mobile device 3 drives the pressing plate 4 to move away from the push-to-unlock test socket 102, the pressing plate 4 releases the pressure applied to the push-to-unlock test socket 102. At this time, the push-to-unlock test socket 102 is reset and the chip inside the push-to-unlock test socket 102 is locked.

[0036] The pressing plate 4 is provided with several through holes 401 corresponding to the adsorption device 2 and the push-to-unlock test socket 102, so that the adsorption device 2 can adsorb the test chip in the push-to-unlock test socket 102. More specifically, the pressing plate 4 is located between the push-to-unlock test socket 102 and the adsorption device 2. When the pressing plate 4 moves toward the push-to-unlock test socket 102, the pressing plate 4 squeezes the push-to-unlock test socket 102 and releases the fixation of the test chip. At this time, one end of the through hole 401 is connected to the push-to-unlock test socket 102, and the other end is connected to the adsorption device 2. The adsorption device 2 provides suction and adsorbs the test chip in the push-to-unlock test socket 102. Furthermore, the number and distribution of the through holes 401 on the pressing plate 4 can be set according to different chip sizes and arrangements to ensure that chips of different specifications can be adsorbed. The interface between the through hole 401 and the adsorption device 2 adopts a sealed design, such as a sealing ring, to prevent gas leakage during the adsorption process.

[0037] In one specific embodiment, the mobile device 3 fixes the pressing plate 4 by clamping; in another specific embodiment, the pressing plate 4 is fixed to the mobile device 3 by snapping; and the pressing plate 4 can be vertically displaced under the drive of the mobile device 3 to press or release the test device 1.

[0038] In another embodiment, the adsorption device 2 adsorbs an untested test chip and then moves it above the push-to-unlock test socket 102. The mobile device 3 is then driven toward the push-to-unlock test socket 102. Driven by the mobile device 3, the pressing plate 4 presses the push-to-unlock test socket 102. At this point, the lock of the push-to-unlock test socket 102 is released, and the test chip can be placed into the push-to-unlock test socket 102 for testing. After placement, the pressing plate 4 moves away from the push-to-unlock test socket 102, and the push-to-unlock test socket 102 is reset, and the test chip is secured again.

[0039] In one embodiment, the push-to-unlock test socket 102 includes a base 201, a fixed portion 202, a movable portion 203 and a test area 204. The base 201 is fixed to the circuit board 101, and the movable portion 203 is movably arranged on the base 201 and is located below the pressing plate 4; the test area 204 is arranged below the fixed portion 202 and corresponds to the adsorption device 2; the fixed portion 202 and the movable portion 203 are arranged in linkage and are used to fix or unlock the test area 204.

[0040] like Figure 2 As shown, the push-to-unlock test socket 102 includes a base 201, a fixed portion 202, a movable portion 203, and a test area 204. The base 201 is fixedly mounted above the circuit board 101, and the movable portion 203 is movably mounted above the base 201. More specifically, the bottom of the movable portion 203 is provided with a protrusion, and the base 201 is provided with a placement groove corresponding to the protrusion. Springs are respectively provided at the four corners of the bottom of the movable portion 203. When the movable portion 203 is pressed, the springs are compressed and deformed, causing the protrusions to move within the placement grooves. At this time, the fixed portions 202 on both sides of the test area 204 are displaced by the movable portion 203 and leave the test area 204. At this time, the fixed portions 202 are unlocked from the test area 204, and the test chip can be attracted and removed by the suction device 2 above. When the pressure on the movable portion 203 is released, the springs reset, the protrusions move along the placement grooves, and the fixed portion 202 resets to be located within the test area 204, locking the test area 204 again.

[0041] In one embodiment, the pressing plate 4 further includes at least one pressure sensor 402 . The pressure sensor 402 is disposed on the pressing plate 4 and faces the circuit board 101 .

[0042] Specifically, the moving device 3 drives the pressing plate 4 to move toward the push-to-unlock test socket 102 , and continues to squeeze after the fixing portion 202 is unlocked, which easily causes overpressure. However, the accuracy of using an image sensor to determine whether there is overpressure is low.

[0043] like Figure 3As shown, the present application sets at least one pressure sensor 402 on the pressing plate 4. The pressure sensor 402 can be a contact sensor or a non-contact sensor, wherein the non-contact sensor includes an infrared sensor, a laser sensor and a distance sensor.

[0044] When the pressing plate 4 is pressed down, the pressure sensor 402 will first contact the circuit board 101 under the push-to-unlock test socket 102. When the pressure sensor 402 is pressed down to a preset threshold, that is, the pressure value, the pressure sensor 402 stops pressing down to prevent overpressure.

[0045] In another specific embodiment, the pressing plate 4 is provided with four pressure sensors 402, which are respectively arranged at the four corners. When the pressing plate 4 moves to contact the circuit board 101 and continues to press until the pressure sensor 402 presses down to a preset pressure value, it stops pressing down.

[0046] In another specific embodiment, the pressure sensor 402 is a distance sensor. During the movement of the pressing plate 4 toward the push-to-unlock test seat 102, the distance between the pressing plate 4 and the push-to-unlock test seat 102 is sensed until the pressing plate 4 is at the set maximum moving distance, at which time the downward pressure is stopped to prevent overpressure.

[0047] In one embodiment, the pressing plate 4 further includes a placement hole 403 corresponding to the pressure sensor 402 , and the pressure sensor 402 is disposed in the placement hole 403 .

[0048] Specifically, such as Figure 3 As shown, the pressure plate 4 is provided with placement holes 403 with pressure sensors 402 placed therein. When the mobile device 3 is located on the side of the pressure plate 4, the pressure sensors 402 pass through the placement holes 403 and move within the placement holes 403. Figure 8 As shown, when the moving device 3 is located on the upper surface of the pressing plate 4 and covers the placement hole 403, the pressure sensor 402 is located on the lower surface of the pressing plate 4 and does not pass through the placement hole 403. The pressure sensor 402 moves in the placement hole 403 and senses the pressure value.

[0049] In one embodiment, the pressure sensor 402 includes a conductive column 404, and the placement hole 403 includes multiple conductive layers 405 and an insulating layer 406, and the insulating layer 406 is respectively arranged between every two conductive layers 405; the conductive column 404 moves in the placement hole 403 and is connected to at least one layer of the conductive layer 405.

[0050] like Figure 5As shown, the pressure sensor 402 is a contact sensor, and the conductive layer 405 is made of a conductive material and can be electrically connected to the conductive column 404. Multiple conductive layers 405 are stacked on the inner wall of the placement hole 403, and an insulating layer 406 is located between every two layers of the conductive layer 405. The insulating layer 406 is made of an insulating material and is used to separate the conductive layers 405. The pressure sensor 402 is electrically connected to a processor. When the pressing plate 4 is not in contact with the circuit board 101, the conductive column 404 is in an initial position; when the conductive column 404 moves in the placement hole 403, it will contact and conduct with the conductive layer 405. At this time, the processor can obtain the potential change of the conductive layer 405, and then determine the position of the conductive column 404, thereby obtaining the depth of the conductive column 404 in the placement hole 403, and calculate the pressure value exerted on the pressure sensor 402. In a specific embodiment, the conductive layer 405 has four layers, and an insulating layer 406 is provided between each of the four conductive layers 405. After being squeezed, the conductive column 404 moves to the third conductive layer 405. At this time, the conductive column 404 is connected to the conductive layer 405 and generates an electrical signal. After receiving the electrical signal, the processor determines that the conductive column 404 is located in the third layer and outputs the pressure value corresponding to the third conductive layer 405.

[0051] In another embodiment, each conductive layer 405 is pre-set to a different pressure value. When the pressing plate 4 approaches the circuit board 101, the pressure sensor 402 contacts the circuit board 101, which in turn compresses the conductive pillar 404. This contact and conduction between the conductive pillar 404 and the conductive layer 405 can be determined as the corresponding pressure value of the contacted conductive layer 405. When the preset critical pressure value is reached, the pressing plate 4 stops pressing downward to prevent overpressure and damage to the push-to-release test socket 102.

[0052] More specifically, pressure sensor 402 utilizes a highly sensitive sensor. After pressing plate 4 moves downward and contacts circuit board 101, it monitors changes in pressure between the two plates in real time. When the pressure reaches a set threshold, the control system stops movement device 3, halting the downward pressure on pressing plate 4 and preventing overpressure. The mounting position of pressure sensor 402 is carefully calculated and placed to ensure effective sensing of the pressure distribution on pressing plate 4.

[0053] In one embodiment, the adsorption device 2 includes a vacuum pump 205 . The vacuum pump 205 is disposed corresponding to the through hole 401 and faces the testing area 204 .

[0054] like Figure 3As shown, specifically, the vacuum pump 205 is arranged corresponding to the through hole 401, and the vacuum pump 205 can provide sufficient suction in a short time. The parameters of the vacuum pump 205 can be adjusted to meet the needs of large-scale production, so that the adsorption speed and stability are better. The piping system in the adsorption device 2 is made of high-pressure resistant materials to ensure long-term use. Furthermore, by adjusting the position and size of the through hole 401 on the pressing plate 4 and the adsorption force of the vacuum pump 205, it can be flexibly applied to chips of various specifications and has a wide range of applicability. For special chip types, the corresponding pressing plate 4 and adsorption device 2 can also be customized, which has high flexibility and applicability.

[0055] In one embodiment, the mobile device 3 includes a support frame 301 and at least one transmission member 302 . The support frame 301 is fixed to one side of the circuit board 101 . One end of the transmission member 302 is connected to the pressing plate 4 , and the other end is fixed in the support frame 301 .

[0056] like Figure 3 and Figure 4 As shown, specifically, the moving device 3 includes a support frame 301, which is arranged on one side of the circuit board 101 to provide support. The moving device 3 includes a transmission member 302. In one specific embodiment, the transmission member 302 is driven by a cylinder, and one end of the cylinder is fixed to the bottom of the support frame 301, while the other end is fixed to the pressing plate 4. The cylinder drives the pressing plate 4 to move in the direction of the press-type unlocking test socket 102 and squeezes the movable part 203. The movable part 203 and the fixed part 202 are linked to unlock the test area 204. In another specific embodiment, the transmission member 302 includes a first transmission member 302 and a second transmission member 302. The first transmission member 302 is a gear, and the second transmission member 302 is a rack. The rack is arranged in the support frame 301, and the gear is arranged on the top of the pressing plate 4. The gear is driven to move so that the pressing plate 4 is displaced in the vertical direction.

[0057] In another embodiment, the moving device 3 is a robot arm, and clamps the pressing plate 4, and can rotate at multiple angles, so that the moving path and speed of the pressing plate 4 can be more accurately controlled; after rotating, the moving device 3 absorbs the untested chip and rotates to above the push-to-unlock test seat 102, and then moves toward the push-to-unlock test seat 102, and squeezes the push-to-unlock test seat 102 to unlock the fixing part 202 and place the test chip in the test area 204.

[0058] In one embodiment, the support frame 301 is provided with a slide rail 303 , and the pressing plate 4 includes a slider 407 . The slider 407 is disposed in the slide rail 303 .

[0059] like Figure 4As shown, specifically, the support frame 301 is provided with a high-precision slide rail 303, and the pressing plate 4 can be displaced vertically along the slide rail 303. When the transmission member 302 is a cylinder drive, one end is fixed to the bottom of the support frame 301, and the other end is fixed to the slider 407, so that the slider 407 can move within the slide rail 303; when the slider 407 moves along the slide rail 303 toward the push-to-unlock test socket 102, it will gradually squeeze the push-to-unlock test socket 102, causing the movable portion 203 to move the fixed portion 202, and finally releasing the fixed portion 202 from the test area 204; when the slider 407 moves along the slide rail 303 away from the push-to-unlock test socket 102, the test area 204 is released.

[0060] In one embodiment, the fixed portion 202 includes fixed bars 206 symmetrically disposed on both sides of the test area 204 to lock or unlock the test area 204. The fixed portion 202 is provided with a slide groove 207, and the movable portion 203 is provided with a sliding rod 208 corresponding to the slide groove 207, and the sliding rod 208 is movably disposed in the slide groove 207.

[0061] like Figure 6 and Figure 7 As shown, specifically, the fixed portion 202 is provided with a fixing bar 206, which is symmetrically arranged on both sides of the movable portion 203 to apply pressure to the test chip in the test area 204, so that the test chip is fixed in the test area 204; the fixed portion 202 is provided with a slide groove 207, and the movable portion 203 is provided with a sliding rod 208 corresponding to the slide groove 207, the sliding rod 208 is cylindrical and movably arranged in the slide groove 207; when the movable portion 203 is squeezed by the pressing plate 4, the movable portion 203 squeezes the spring above the base 201, and at the same time, the sliding rod 208 moves along the slide groove 207, at this time, the fixed portion 202 moves in the direction away from the test area 204; when the applied pressure is released, the spring resets, driving the movable portion 203 to reset, and the sliding rod 208 moves in the slide groove 207 toward the test area 204, and the fixed bar 206 is located in the test area 204 again and fixes the test chip.

[0062] In one embodiment, an adsorption structure 408 is disposed at one end of the through hole 401 facing the testing area 204 .

[0063] like Figure 3 As shown, specifically, the adsorption structure 408 is a suction nozzle, which is arranged in the through hole 401 and faces the test area 204. When the test chip in the test area 204 needs to be taken out, the suction nozzle can provide suction and adsorb the test chip in the test area 204; when adsorbing a chip with a larger volume or a heavier weight, the suction nozzle can assist the vacuum pump 205 to increase the suction force on the test chip to ensure that the chip can be adsorbed.

[0064] The various embodiments in this specification are described in a progressive manner. Similar parts between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences between the other embodiments. In particular, the method embodiments are described briefly because they are generally similar to the structural embodiments. For relevant parts, refer to the description of the structural embodiments.

[0065] The above is a specific implementation of the present application. It should be understood that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A device for adsorbing a chip, characterized in that: It includes a testing device, an adsorption device, a moving device and a pressing plate; The pressing plate is located above the testing device, and the pressing plate is connected to the moving device; The testing device includes a circuit board and at least one push-to-unlock test socket, wherein the push-to-unlock test socket is provided on the circuit board; The moving device is used to move the pressing plate; the pressing plate is used to unlock the push-to-unlock test socket; The pressing plate further comprises at least one through hole, one end of which is connected to the adsorption device, and the other end of which corresponds to the push-to-unlock test socket; The adsorption device is used to adsorb the chip in the push-to-unlock test socket.

2. The device for adsorbing a chip according to claim 1, characterized in that: The pressing plate further includes at least one pressure sensor, which is arranged on the pressing plate and faces the circuit board.

3. The device for adsorbing a chip according to claim 2, characterized in that: The pressing plate further includes a placement hole corresponding to the pressure sensor, and the pressure sensor is arranged in the placement hole.

4. The device for adsorbing chips according to claim 3, characterized in that: The pressure sensor includes a conductive column, and the placement hole includes multiple conductive layers and insulating layers, wherein the insulating layers are respectively arranged between every two conductive layers; the conductive column moves in the placement hole and is in electrical communication with at least one conductive layer.

5. The device for adsorbing chips according to claim 1, characterized in that: The push-to-unlock test socket includes a base, a fixed part, a movable part and a test area. The base is fixed to the circuit board, and the movable part is movably arranged on the base and is located below the pressing plate; the test area is arranged below the fixed part and corresponds to the adsorption device; the fixed part and the movable part are linked and are used to fix or unlock the test area.

6. The device for adsorbing a chip according to claim 5, characterized in that: The adsorption device includes a vacuum pump, which is arranged corresponding to the through hole and faces the test area.

7. The device for adsorbing a chip according to claim 1, characterized in that: The moving device includes a support frame and at least one transmission member. The support frame is fixed on one side of the circuit board. One end of the transmission member is connected to the pressing plate, and the other end is fixed in the support frame.

8. The device for adsorbing chips according to claim 7, characterized in that: The support frame is provided with a slide rail, and the pressing plate includes a slider, and the slider is arranged in the slide rail.

9. The device for adsorbing a chip according to claim 5, characterized in that: The fixing portion includes fixing bars, which are symmetrically arranged on both sides of the test area to lock or unlock the test area; The fixed portion is provided with a sliding groove, and the movable portion is provided with a sliding rod corresponding to the sliding groove, and the sliding rod is movably arranged in the sliding groove.

10. The device for adsorbing chips according to claim 5, characterized in that: An adsorption structure is provided at one end of the through hole corresponding to the test area.

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