Semiconductor device test tool

Abstract

The utility model relates to the technical field of semiconductor device testing, in particular to a semiconductor device testing tool. The semiconductor device testing tool comprises a base, an upper jig, a lower jig and a pressing assembly, the lower jig is arranged on the base, the upper end face of the lower jig is used for bearing a PCB provided with semiconductor devices, the upper end face of the lower jig is provided with at least one set of probes, each semiconductor device is arranged corresponding to one set of probes, and the pressing assembly is arranged on the base. The probe is connected with a test device through a connecting wire harness, the upper jig is located above the lower jig, the upper jig is installed at the position of the press-fit assembly, the press-fit assembly is rotationally connected with the base, and the press-fit assembly can drive the upper jig to rotate around a preset shaft relative to the lower jig so that the upper jig can abut against a PCB provided with a semiconductor device against the lower end face of the lower jig. Therefore, clamping and fixing of the semiconductor device and the PCB are achieved, the butt joint effect of the probe on the semiconductor device can be guaranteed, and the detection effect on the semiconductor device is further guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a semiconductor device testing tool. Background Art

[0002] During the testing process of semiconductor devices, a chip test socket is required for testing. Specifically, the semiconductor device is placed on the base of the chip test socket, and then the semiconductor device is held in place by a capping mechanism.

[0003] In the prior art, chip test sockets can only test a single semiconductor device, resulting in low test efficiency. Furthermore, due to production requirements, semiconductor devices are typically mounted on a printed circuit board (PCB). Chip test sockets cannot test semiconductor devices mounted on a PCB, failing to meet the testing requirements for semiconductor devices mounted on a PCB.

[0004] Therefore, it is urgent to invent a semiconductor device testing tool to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor device testing tool to realize the detection of semiconductor devices mounted on a PCB with high detection efficiency.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] Semiconductor device testing fixture, used to clamp and fix PCBs with semiconductor devices installed, including:

[0008] base;

[0009] A lower fixture is provided on the base, the upper end surface of the lower fixture is used to support the PCB on which the semiconductor device is mounted, the upper end surface of the lower fixture is provided with at least one set of probes, each semiconductor device is provided with a corresponding set of probes, and the probes are connected to the test equipment via a connecting harness;

[0010] An upper jig and a pressing assembly, wherein the upper jig is located above the lower jig, the upper jig is installed at the pressing assembly, the pressing assembly is rotatably connected to the base, and the pressing assembly can drive the upper jig to rotate relative to the lower jig around a preset axis so that the upper jig presses the PCB on which the semiconductor device is mounted against the lower end surface of the lower jig.

[0011] As an optional solution, the pressing assembly includes:

[0012] An installation frame, wherein a docking turntable is provided on the base, the installation frame is rotatably connected to the docking turntable, and the installation frame can rotate around the preset axis relative to the lower fixture; and

[0013] A clamping piece is clamped and fixed to the installation frame. The upper fixture is provided on the installation frame. The clamping piece is used to clamp and fix the upper fixture on the installation frame.

[0014] As an optional solution, the installation frame includes:

[0015] Two mounting beams arranged opposite to each other; and

[0016] Two installation longitudinal beams are arranged opposite to each other, and the two installation transverse beams and the two installation longitudinal beams together form the installation frame, and any one of the installation transverse beam and the installation longitudinal beam is rotatably connected to the docking turntable;

[0017] The upper jig is overlapped on the mounting crossbeam and the mounting longitudinal beam, the PCB on which the semiconductor device is mounted is opposite to the area enclosed by the mounting crossbeam and the mounting longitudinal beam, the clamping member is clamped and fixed to the mounting crossbeam or the mounting longitudinal beam, and the clamping member can press the upper jig against the mounting crossbeam and the mounting longitudinal beam along the rotation direction around the preset axis.

[0018] As an optional solution, the clamping member is provided with a first clamping protrusion and a second clamping protrusion, the upper end surface of the upper jig is provided with a first clamping groove extending downward, the outer side wall of the mounting cross beam or the mounting longitudinal beam is provided with a second clamping groove extending inward, the first clamping protrusion is clamped and fixed to the first clamping groove, and the second clamping protrusion is clamped and fixed to the second clamping groove.

[0019] As an optional solution, the pressing assembly further includes:

[0020] a first handpiece; and

[0021] A locking member is used to lock and fix the first handheld member to the installation frame.

[0022] As an optional solution, the pressing assembly further includes:

[0023] A telescopic sleeve, which can be extended and retracted in the axial direction, one axial end of the telescopic sleeve is rotatably connected to the mounting frame, and the other axial end of the telescopic sleeve is rotatably connected to the docking turntable, and the telescopic sleeve is used to provide resistance for the rotation of the mounting frame around the preset axis.

[0024] As an optional solution, the lower end surface of the upper fixture is provided with a downwardly extending abutting post, and the abutting post is configured to abut against the PCB on which the semiconductor device is mounted.

[0025] As an optional solution, the end surface of the abutment post close to the PCB is covered with an elastic buffer layer;

[0026] And / or, the upper end surface of the lower fixture is covered with an elastic buffer layer.

[0027] As an optional solution, a guide column is further provided on the upper jig, and the guide column is movably connected to the upper jig. The guide column can abut against the upper end surface of the lower jig. When the guide column abuts against the upper end surface of the lower jig, the upper jig can move along the guide column.

[0028] As an optional solution, the upper end surface of the lower fixture is provided with a positioning protrusion, and the positioning protrusion can be inserted and positioned with the positioning hole on the PCB.

[0029] Beneficial effects of the utility model:

[0030] The semiconductor device testing fixture provided by the utility model achieves stable support for the PCB mounted with the semiconductor device by arranging a lower fixture above a base so that the upper end surface of the lower fixture supports the PCB mounted with the semiconductor device, and at least one set of probes is arranged on the upper end surface of the lower fixture, and the probes are connected to the testing equipment via a connecting harness, thereby achieving detection of the semiconductor device. The upper fixture is arranged above the lower fixture and mounted on a pressing assembly, so that the pressing assembly is rotatably connected to the base, and the pressing assembly drives the upper fixture to rotate relative to the lower fixture about a preset axis, so that the upper fixture can press the PCB mounted with the semiconductor device against the upper end surface of the lower fixture, not only achieving clamping and fixing of the semiconductor device and the PCB, but also ensuring the effective docking of the probes with the semiconductor device, thereby ensuring the detection effect of the semiconductor device. In addition, by ensuring that each semiconductor device on the PCB is corresponding to a set of probes, it is possible to achieve synchronous detection of each semiconductor device on the PCB, not only improving detection efficiency, but also allowing the number of semiconductor devices on the PCB to be increased or decreased according to actual needs, thereby improving applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is one of the structural schematic diagrams of the semiconductor device testing tool provided by the embodiment of the present utility model;

[0032] Figure 2 This is the second structural diagram of the semiconductor device testing tool provided by the embodiment of the present utility model;

[0033] Figure 3This is a schematic structural diagram of an upper jig and a lower jig provided in an embodiment of the present utility model;

[0034] Figure 4 This is a structural diagram of a press-fit assembly and a docking turntable provided in an embodiment of the present utility model;

[0035] Figure 5 This is a cross-sectional schematic diagram of a semiconductor device testing tool provided by an embodiment of the present utility model;

[0036] Figure 6 yes Figure 5 A partial enlarged view of point A in the middle.

[0037] In the picture:

[0038] 100, upper fixture; 110, first handle; 120, first clamping groove; 130, guide column;

[0039] 200. Lower jig;

[0040] 300, press-fit assembly; 310, mounting frame; 311, mounting crossbeam; 3111, second clamping groove; 312, mounting longitudinal beam; 320, clamping member; 321, first clamping protrusion; 322, second clamping protrusion; 330, first handpiece; 340, locking member; 350, telescopic sleeve;

[0041] 400, base; 410, docking turntable;

[0042] 2000. Connect the wiring harness. DETAILED DESCRIPTION

[0043] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the present invention are further explained below with reference to the accompanying drawings and through specific implementation methods.

[0044] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0045] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0046] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on the positions or locations shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0047] Testing semiconductor devices requires the use of a chip test socket. Specifically, the semiconductor device is placed on the base of the chip test socket, and then a capping mechanism holds the semiconductor device in place. Prior art chip test sockets can only test a single semiconductor device, resulting in low testing efficiency. Furthermore, due to production requirements, semiconductor devices are typically mounted on a printed circuit board (PCB). Chip test sockets cannot test semiconductor devices mounted on a PCB, failing to meet the testing requirements for semiconductor devices mounted on a PCB.

[0048] In order to solve the above problems, Figures 1 to 6 As shown, this embodiment provides a semiconductor device testing tool. The semiconductor device testing tool includes a base 400, a lower jig 200, an upper jig 100, and a pressing assembly 300. The lower jig 200 is disposed on the base 400. The upper end surface of the lower jig 200 is used to support a PCB mounted with semiconductor devices. The upper end surface of the lower jig 200 is provided with at least one set of probes. Each semiconductor device is provided with a corresponding set of probes. The probes are connected to the testing equipment via a connecting harness 2000. The upper jig 100 is located above the lower jig 200. The upper jig 100 is mounted on the pressing assembly 300. The pressing assembly 300 is rotatably connected to the base 400. The pressing assembly 300 can drive the upper jig 100 to rotate relative to the lower jig 200 about a preset axis, so that the upper jig 100 presses the PCB mounted with semiconductor devices against the lower end surface of the lower jig 200.

[0049] The semiconductor device testing tool is configured to stably support the PCB on which the semiconductor device is mounted by arranging the lower jig 200 above the base 400 so that the upper end surface of the lower jig 200 supports the PCB on which the semiconductor device is mounted. At least one set of probes is disposed on the upper end surface of the lower jig 200 and connected to the detection equipment via a connecting harness 2000, thereby enabling detection of the semiconductor device. The upper jig 100 is disposed above the lower jig 200 and mounted on the pressing assembly 300 so that the pressing assembly 300 is rotatably connected to the base 400. The pressing assembly 300 drives the upper jig 100 to rotate relative to the lower jig 200 around a preset axis, enabling the upper jig 100 to press the PCB on which the semiconductor device is mounted against the upper end surface of the lower jig 200. This not only achieves clamping and fixing of the semiconductor device and the PCB, but also ensures the docking effect of the probes on the semiconductor device, thereby ensuring the detection effect of the semiconductor device. In addition, by ensuring that each semiconductor device on the PCB is set up corresponding to a set of probes, synchronous detection of each semiconductor device on the PCB can be achieved, which not only improves the detection efficiency, but also can increase or decrease the number of semiconductor devices on the PCB according to actual needs, thereby improving applicability.

[0050] It should be noted that the connection harness 2000 between the probe and the test equipment includes wires, docking pins and docking sockets. The docking pins and docking sockets are detachably docked. Any one of the docking pins and the docking sockets is connected to the probe through a wire, and the other one of the docking pins and the docking sockets is connected to the test equipment through a wire, so as to further facilitate the control of the connection and isolation between the probe and the test equipment.

[0051] In this embodiment, if Figure 1 and Figure 3 As shown, the front end of the base 400 is rotatably connected to the pressing assembly 300, the preset axis extends in the left-right direction, and the lower fixture 200 is disposed at the rear end of the preset axis. In other embodiments, the specific position and extension direction of the preset axis can also be adjusted according to actual needs, and this embodiment does not specifically limit this.

[0052] Specifically, if Figure 3 As shown, the lower end surface of the upper jig 100 is provided with a downwardly extending abutment post (not shown in the figure). The abutment post is configured to abut against the PCB on which the semiconductor device is mounted. By providing the abutment post at the lower end of the upper jig 100 and utilizing the abutment post to abut against the PCB on which the semiconductor device is mounted, the PCB on which the semiconductor device is mounted is firmly fixed to the upper end surface of the lower jig 200.

[0053] To enhance the contact between the upper end surface of the lower jig 200 and the PCB mounted with semiconductor devices, the lower end surface of the upper jig 100 is provided with at least two abutment posts, which are spaced apart. All of the abutment posts simultaneously press the PCB mounted with semiconductor devices against the upper end surface of the lower jig 200. It should be noted that in this embodiment, four abutment posts are spaced apart on the lower end surface of the upper jig 100. These four abutment posts simultaneously press the PCB mounted with semiconductor devices against the upper end surface of the lower jig 200. In other embodiments, the specific number of abutment posts can be adjusted based on actual needs, and this embodiment does not impose a specific limitation.

[0054] As an optional solution, the end surface of the abutment post near the PCB mounted with the semiconductor device is covered with an elastic buffer layer, and the upper end surface of the lower jig 200 is covered with an elastic buffer layer. By covering the end surface of the abutment post near the PCB mounted with the semiconductor device and the lower end surface of the lower jig 200 with elastic buffer layers, direct contact between the abutment post and the PCB mounted with the semiconductor device and direct contact between the PCB mounted with the semiconductor device and the upper end surface of the lower jig 200 can be cushioned, thereby improving protection for the PCB mounted with the semiconductor device. It should be noted that in this embodiment, the elastic buffer layer is made of rubber. Rubber materials have excellent elasticity, toughness, and wear resistance, and have a long service life. In other embodiments, the elastic buffer layer can also be made of sponge, cotton, or other elastic materials, which are not specifically limited in this embodiment. In other embodiments, the elastic buffer layer can be covered only on the end surface of the abutment post near the PCB mounted with the semiconductor device, or only on the upper end surface of the lower jig 200, which are not specifically limited in this embodiment.

[0055] In an optional embodiment, a guide post 130 is further provided on the upper jig 100. The guide post 130 is movably connected to the upper jig 100 and can abut against the upper end surface of the lower jig 200. When the guide post 130 abuts against the upper end surface of the lower jig 200, the upper jig 100 can move axially along the guide post 130. By additionally providing a movably connected guide post 130 on the upper jig 100, the guide post 130 abuts against the upper end surface of the lower jig 200, and the upper jig 100 can move along the guide post 130 while the guide post 130 abuts against the upper end surface of the lower jig 200, thereby providing guidance for the subsequent rotation of the upper jig 100 around a preset axis. It can be understood that since the upper jig 100 rotates around a preset axis, the moving path of the upper jig 100 is arc-shaped. If the curvature of the arc-shaped moving path of the upper jig 100 is small and the bending deviation can be ignored, the guide column 130 extends along a straight line. If the curvature of the arc-shaped moving path of the upper jig 100 is large, it is necessary to bend the guide column 130 along the shape of the arc-shaped moving path of the upper jig 100 so that the upper jig 100 can move along the guide column 130.

[0056] In order to further improve the test accuracy of semiconductor devices, the upper end surface of the lower fixture 200 is provided with a positioning protrusion, which can be inserted into the positioning hole on the PCB for positioning.

[0057] Combine Figures 4 to 6 The specific structure of the press-fit assembly 300 is described below. The press-fit assembly 300 includes a mounting frame 310 and a clamping member 320. A docking turntable 410 is provided on the base 400. The mounting frame 310 is rotatably connected to the docking turntable 410. The mounting frame 310 can rotate about a predetermined axis relative to the lower jig 200. The clamping member 320 is clamped and fixed to the mounting frame 310. The upper jig 100 is provided on the mounting frame 310. The clamping member 320 is used to clamp and fix the upper jig 100 to the mounting frame 310. By clamping and fixing the upper jig 100 to the mounting frame 310 using the clamping member 320, the mounting frame 310 is rotatably connected to the docking turntable 410 on the base 400, and the mounting frame 310 drives the upper jig 100 to rotate about a predetermined axis, thereby achieving clamping and fixing of the PCB on which the semiconductor device is mounted.

[0058] Specifically, the mounting frame 310 includes two mounting cross beams 311 and two mounting longitudinal beams 312 that are arranged opposite to each other, wherein the two mounting cross beams 311 and the two mounting longitudinal beams 312 together form the mounting frame 310, and either the mounting cross beams 311 or the mounting longitudinal beams 312 is rotatably connected to the docking turntable 410, and the upper jig 100 is overlapped on the mounting cross beams 311 and the mounting longitudinal beams 312, and the PCB on which the semiconductor device is mounted is directly opposite to the area surrounded by the mounting cross beams 311 and the mounting longitudinal beams 312, and the clamping member 320 is clamped and fixed to the mounting cross beams 311 or the mounting longitudinal beams 312, and the clamping member 320 can press the upper jig 100 against the mounting cross beams 311 and the mounting longitudinal beams 312 along the rotation direction around the preset axis. The two mounting crossbeams 311 and the two mounting longitudinal beams 312 together form a mounting frame 310, and the upper jig 100 is overlapped on the mounting crossbeams 311 and the mounting longitudinal beams 312, so that either the mounting crossbeams 311 or the mounting longitudinal beams 312 is rotatably connected to the docking turntable 410, thereby achieving the effect of the mounting frame 310 rotating around the preset axis, and also ensuring that the PCB with semiconductor devices mounted thereon is directly opposite to the area surrounded by the mounting crossbeams 311 and the mounting longitudinal beams 312, so that the abutting columns on the upper jig 100 extend into the area surrounded by the mounting crossbeams 311 and the mounting longitudinal beams 312 to press the PCB with semiconductor devices mounted thereon against the upper end surface of the lower jig 200, resulting in a compact structure and a good abutting effect.

[0059] It should be noted that, in this embodiment, the longitudinal beam 312 is rotatably connected to the docking turntable 410. In other embodiments, the transverse beam 311 can also be rotatably connected to the docking turntable 410.

[0060] In addition, a first handle 110 is provided on the upper end surface of the upper jig 100. The staff can grasp the first handle 110 to transfer the upper jig 100 to the top of the installation crossbeam 311 and the installation longitudinal beam 312, or remove the upper jig 100 above the installation crossbeam 311 and the installation longitudinal beam 312, thereby improving the convenience of operation.

[0061] like Figure 5 and Figure 6As shown, the clamping member 320 is provided with a first clamping protrusion 321 and a second clamping protrusion 322. The upper end surface of the upper jig 100 is provided with a first clamping groove 120 extending downward. The outer side wall of the mounting crossbeam 311 or the mounting longitudinal beam 312 is provided with a second clamping groove 3111 extending inward. The first clamping protrusion 321 is clamped and fixed with the first clamping groove 120, and the second clamping protrusion 322 is clamped and fixed with the second clamping groove 3111. By respectively providing the first clamping protrusion 321 and the second clamping protrusion 322 on the clamping member 320, the first clamping protrusion 321 is clamped and fixed with the first clamping groove 120 on the upper jig 100, and the second clamping protrusion 322 is clamped and fixed with the second clamping groove 3111 on the mounting crossbeam 311 or the mounting longitudinal beam 312. This achieves a relatively fixed upper jig 100 with the mounting crossbeam 311 and the mounting longitudinal beam 312, achieving a good fixing effect. It should be noted that, in this embodiment, the second engaging groove 3111 is provided on the mounting crossbeam 311. In other embodiments, the second engaging groove 3111 may also be provided on the mounting longitudinal beam 312, which is not specifically limited in this embodiment.

[0062] In order to facilitate the driving of the mounting frame 310 to rotate around a preset axis, as shown in FIG. Figure 4 As shown, the pressing assembly 300 also includes a first handpiece 330 and a locking member 340, wherein the locking member 340 is used to lock and secure the first handpiece 330 to the mounting frame 310. When it is necessary to drive the mounting frame 310 to rotate about a preset axis, the operator can use the locking member 340 to lock and secure the first handpiece 330 to the mounting frame 310, then grasp the first handpiece 330 and drive the first handpiece 330 to rotate about the preset axis, thereby improving operational convenience. It should be noted that in this embodiment, the locking member 340 is a bolt, and threaded holes are respectively provided on the first handpiece 330 and the mounting longitudinal beam 312. The bolt is screwed into the threaded holes on the first handpiece 330 and the mounting longitudinal beam 312 in turn.

[0063] In addition, in this embodiment, Figure 4 As shown, the press-fit assembly 300 further includes a telescopic sleeve 350, which is capable of axial extension and contraction. One axial end of the telescopic sleeve 350 is rotatably connected to the mounting longitudinal beam 312, and the other axial end of the telescopic sleeve 350 is rotatably connected to the docking turntable 410. The telescopic sleeve 350 is used to provide resistance to the rotation of the mounting frame 310 about a predetermined axis. By rotatably connecting the axial ends of the telescopic sleeve 350 to the mounting longitudinal beam 312 and the docking turntable 410, respectively, when the mounting frame 310 rotates about the predetermined axis, the telescopic sleeve 350 can rotate with the mounting frame 310 and extend and contract axially. The resistance provided during the extension and contraction process hinders the rotation of the mounting frame 310 about the predetermined axis, thereby providing feedback to the operator on the driving of the mounting frame 310.

[0064] Specifically, when the telescopic sleeve 350 is driven by the installation frame 310 to extend axially, the telescopic sleeve 350 itself generates resistance that hinders its axial extension. This resistance can resist the force applied by the operator to the installation frame 310, requiring the operator to overcome this resistance in order to rotate the installation frame 310 and extend the telescopic sleeve 350. When the telescopic sleeve 350 is driven by the installation frame 310 to retract axially, the telescopic sleeve 350 itself generates resistance that hinders its axial contraction. This resistance can resist the force applied by the operator to the installation frame 310, requiring the operator to overcome this resistance in order to rotate the installation frame 310 and retract the telescopic sleeve 350. The specific structure and operating principle of the telescopic sleeve 350 are both prior art and will not be described in detail here.

[0065] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. Semiconductor device testing tooling, used for clamping and fixing a PCB with semiconductor devices installed, characterized in that: include: Base (400); A lower fixture (200) is provided on the base (400), the upper end surface of the lower fixture (200) being used to support the PCB on which the semiconductor device is mounted, the upper end surface of the lower fixture (200) being provided with at least one set of probes, each semiconductor device being provided corresponding to a set of the probes, and the probes being connected to the test equipment via a connecting harness (2000); An upper jig (100) and a pressing assembly (300), wherein the upper jig (100) is located above the lower jig (200), the upper jig (100) is mounted on the pressing assembly (300), the pressing assembly (300) is rotatably connected to the base (400), and the pressing assembly (300) can drive the upper jig (100) to rotate relative to the lower jig (200) around a preset axis, so that the upper jig (100) presses the PCB on which the semiconductor device is mounted against the lower end surface of the lower jig (200).

2. The semiconductor device testing tool according to claim 1, wherein: The pressing assembly (300) comprises: A mounting frame (310) is provided on the base (400), the mounting frame (310) is rotatably connected to the docking turntable (410), and the mounting frame (310) is capable of rotating around the preset axis relative to the lower fixture (200); and A clamping member (320) is clamped and fixed to the installation frame (310); the upper jig (100) is arranged on the installation frame (310); and the clamping member (320) is used to clamp and fix the upper jig (100) to the installation frame (310).

3. The semiconductor device testing tool according to claim 2, wherein: The installation frame (310) comprises: Two mounting beams (311) arranged opposite to each other; and Two installation longitudinal beams (312) arranged opposite to each other, the two installation transverse beams (311) and the two installation longitudinal beams (312) together form the installation frame (310), and any one of the installation transverse beams (311) and the installation longitudinal beams (312) is rotatably connected to the docking turntable (410); The upper jig (100) is overlapped on the mounting crossbeam (311) and the mounting longitudinal beam (312); the PCB on which the semiconductor device is mounted is directly opposite to the area enclosed by the mounting crossbeam (311) and the mounting longitudinal beam (312); the clamping member (320) is clamped and fixed to the mounting crossbeam (311) or the mounting longitudinal beam (312); and the clamping member (320) can press the upper jig (100) against the mounting crossbeam (311) and the mounting longitudinal beam (312) along the rotation direction around the preset axis.

4. The semiconductor device testing tool according to claim 3, wherein: The clamping member (320) is provided with a first clamping protrusion (321) and a second clamping protrusion (322); the upper end surface of the upper fixture (100) is provided with a first clamping groove (120) extending downward; the outer side wall of the mounting crossbeam (311) or the mounting longitudinal beam (312) is provided with a second clamping groove (3111) extending inward; the first clamping protrusion (321) is clamped and fixed to the first clamping groove (120), and the second clamping protrusion (322) is clamped and fixed to the second clamping groove (3111).

5. The semiconductor device testing tool according to claim 2, wherein: The pressing assembly (300) further comprises: a first handpiece (330); and A locking member (340), wherein the locking member (340) is used to lock and fix the first handheld member (330) and the installation frame (310).

6. The semiconductor device testing tool according to claim 2, wherein: The pressing assembly (300) further comprises: A telescopic sleeve (350) is capable of axially extending and contracting, one axial end of the telescopic sleeve (350) is rotatably connected to the mounting frame (310), and the other axial end of the telescopic sleeve (350) is rotatably connected to the docking turntable (410), and the telescopic sleeve (350) is used to provide resistance to the rotation of the mounting frame (310) around the preset axis.

7. The semiconductor device testing tool according to any one of claims 1 to 6, characterized in that: The lower end surface of the upper fixture (100) is provided with a downwardly extending abutting column, and the abutting column is configured to abut against the PCB on which the semiconductor device is mounted.

8. The semiconductor device testing tool according to claim 7, wherein: The end surface of the abutment post close to the PCB is covered with an elastic buffer layer; And / or, the upper end surface of the lower fixture (200) is covered with an elastic buffer layer.

9. The semiconductor device testing tool according to any one of claims 1 to 6, characterized in that: The upper jig (100) is further provided with a guide post (130), the guide post (130) being movably connected to the upper jig (100), the guide post (130) being capable of abutting against the upper end surface of the lower jig (200), and when the guide post (130) is in abutment with the upper end surface of the lower jig (200), the upper jig (100) is capable of moving along the guide post (130).

10. The semiconductor device testing tool according to any one of claims 1 to 6, characterized in that: The upper end surface of the lower fixture (200) is provided with a positioning protrusion, and the positioning protrusion can be plugged into and positioned with a positioning hole on the PCB.

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