Chip testing device

Abstract

The utility model discloses a chip testing device, which comprises a chip fixing structure, a protection plate and a PCB, the protection plate is rotatably connected with the chip fixing structure, the chip fixing structure is internally provided with a hollow groove, a groove and a through groove, the hollow groove penetrates through two surfaces of the chip fixing structure along a first preset direction, and the groove penetrates through the through groove. The hollowed-out groove and the protection plate are used for fixing the chip, the groove is arranged close to the hollowed-out groove, the penetrating groove penetrates through the interior of the chip fixing structure in the second preset direction, and the penetrating groove is communicated with the groove; the PCB is arranged in the through groove in a penetrating mode in the second preset direction, and the PCB is used for leading out the electrode of the chip. According to the utility model, the front and back surfaces of the chip can be exposed through the hollowed-out grooves, so that wires can be led from the front and back surfaces of the chip conveniently. And during chip hot spot grabbing, double surfaces of the chip are completely exposed and are not shielded. Leads can be led from the front face and the back face of the chip through the PCB, and performance testing of the chip is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of testing devices, in particular to a chip testing device. Background Art

[0002] At present, the electrodes of most chips are located on the upper surface of the chip. The lower surface does not require special connection during hot spot analysis, so the existing technologies in the industry are all electrically connected from the upper surface. The general method is to adhere the lower surface of the chip sample to a transparent medium (such as a glass sheet) through glue, and the upper surface is electrically connected to the PCB board through bonding metal wires. Whether at the sample end or the PCB end, the bonding metal wires require vertical operating space. Since the back of the chip is tightly adhered to the medium, the existing solution cannot connect the upper and lower directions of the same sample at the same time. Only the front of the sample can be bonded. For three-dimensional vertical devices, the upper and lower surface electrodes need to be led out at the same time during hot spot analysis and there must be no obstruction. According to the current situation, there is no way to achieve this. The method that is closest to the goal is to use Cu glue connection method, such as Figure 4 The front of the chip is connected via bonding metal wires, while the back is electrically connected via conductive copper glue. During hotspot analysis, the chip must be fully exposed to the analysis equipment's lens. However, due to the thickness and lack of light transmission, copper glue can only achieve a double-sided conductive connection, preventing hotspot analysis from the back.

[0003] In summary, existing chip testing equipment cannot achieve unobstructed exposure of both sides of the vertical device to the lens during hotspot capture, while also meeting the requirements of metal wire bonding connection. Utility Model Content

[0004] In order to solve the technical problems in the background technology, the utility model provides a chip testing device, including a chip fixing structure, a protective plate and a PCB board, the protective plate is rotatably connected to the chip fixing structure, the chip fixing structure is provided with a hollow groove, a groove and a through groove, the hollow groove penetrates the two surfaces of the chip fixing structure along a first preset direction, the hollow groove and the protective plate are used to fix the chip, the groove is arranged close to the hollow groove, the through groove penetrates the inside of the chip fixing structure along a second preset direction, and the through groove is connected to the groove; the PCB board is inserted into the through groove along the second preset direction, and the PCB board is used to lead out the electrode of the chip; the second preset direction is perpendicular to the first preset direction.

[0005] Furthermore, the protective plate includes a first protective plate and a second protective plate, and the first protective plate and the second protective plate are respectively arranged on both sides of the chip fixing structure; a fixed shaft is provided on the chip fixing structure, and the first protective plate and the second protective plate are both rotatably connected to the chip fixing structure through the fixed shaft.

[0006] Furthermore, at least one of the first protective plate and the second protective plate is provided with a window. When the first protective plate and the second protective plate cover the surface of the chip fixing structure, the hollow groove and the projection of the window on the surface of the chip fixing structure at least partially overlap, and the groove and the projection of the window on the surface of the chip fixing structure at least partially overlap.

[0007] Furthermore, a first rotating portion is provided on one side of the first protective plate, and a second rotating portion is provided on one side of the second protective plate. Both the first rotating portion and the second rotating portion are rotatably connected to the fixed shaft.

[0008] Furthermore, there are two grooves, which are respectively arranged on two opposite surfaces of the chip fixing structure, and the depth of the groove is smaller than the thickness of the chip fixing structure.

[0009] Furthermore, the two grooves include a first groove and a second groove, the first groove is provided on a side surface of the chip fixing structure close to the first protective plate, and the second groove is provided on a side surface of the chip fixing structure close to the second protective plate.

[0010] A first window is provided on the first protective plate, and a second window is provided on the second protective plate. When the first protective plate and the second protective plate cover the surface of the chip fixing structure, the first window and the projection of the first groove on the surface of the chip fixing structure at least partially overlap, and the second window and the projection of the second groove on the surface of the chip fixing structure at least partially overlap.

[0011] Furthermore, the chip testing device also includes an elastic component, and an installation groove is also provided in the chip fixing structure along the second preset direction. The elastic component is passed through the installation groove, and the installation groove is provided between the fixed axis and the hollow groove, and the hollow groove is provided between the installation groove and the groove.

[0012] Furthermore, the preset area in the installation groove is connected to the hollow groove; the elastic component includes a protrusion, and when the elastic component is inserted into the installation groove, the protrusion is close to the hollow groove.

[0013] Furthermore, a first support member is provided on a side of the first protection plate close to the chip fixing structure, and a second support member is provided on a side of the second protection plate close to the chip fixing structure.

[0014] Furthermore, the surface areas of the first protection plate and the second protection plate are the same, and the surface area of the first protection plate is smaller than the surface area of the chip fixing structure.

[0015] The beneficial effects of the utility model are:

[0016] (1) The chip testing device of the present invention includes a chip fixing structure, a protective plate, and a PCB board. The protective plate is rotatably connected to the chip fixing structure. The chip fixing structure is provided with a hollow groove, a groove, and a through groove. The hollow groove penetrates the two surfaces of the chip fixing structure along a first preset direction. The hollow groove and the protective plate are used to fix the chip. The hollow groove can expose both sides of the chip, making it easy to wire from both sides of the chip. When grabbing the chip hot spot, ensure that both sides of the chip are completely exposed without obstruction.

[0017] (2) In the chip testing device of the present invention, the groove is arranged near the hollow groove, the through groove passes through the interior of the chip fixing structure along the second preset direction, and the through groove is connected to the groove; the PCB board is passed through the through groove along the second preset direction, and the PCB board is used to lead out the electrodes of the chip; the second preset direction is perpendicular to the first preset direction; the PCB board can be used to lead wires from the front and back sides of the chip, and then the test equipment is connected through the PCB board to realize the electrical connection between the chip and the test equipment; thereby realizing the performance test of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is a structural diagram of a vertical device insulated gate bipolar transistor of the utility model;

[0020] Figure 2 This is a structural diagram of a chip testing device provided by the present invention;

[0021] Figure 3 This is a top view of a chip testing device provided by the present invention;

[0022] Figure 4This is a schematic diagram of a chip fixing structure provided by the present invention;

[0023] Figure 5 This is a structural diagram of a first protective plate provided by the present invention;

[0024] Figure 6 This is a structural diagram of a second protective plate provided by the present invention;

[0025] Figure 7 This is a structural diagram of an elastic component provided by the utility model;

[0026] Among them, the reference numerals in the figure correspond to: 01-collector, 02-emitter, 03-gate, 1-chip fixing structure, 2-hollow groove, 3-groove, 4-through groove, 5-PCB board, 6-first protective plate, 7-second protective plate, 8-fixed shaft, 9-elastic component, 10-first window, 11-second window, 12-first rotating part, 13-second rotating part, 14-mounting groove, 15-first support member, 16-second support member, 17-protrusion. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Since the embodiments disclosed in the present invention can be set in different directions, these terms indicating directions are only for illustration and should not be regarded as limitations. For example, "up" and "down" are not necessarily limited to directions opposite to or consistent with the direction of gravity. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features.

[0029] In recent years, with the diversification of chip product types, the demand for analysis of three-dimensional vertical devices has gradually increased. These vertical devices have electrodes on both the upper and lower surfaces. Therefore, when capturing hot spots, the following conditions must be met: 1. Electrodes on both the upper and lower surfaces are connected to the test equipment through wires. 2. Both the upper and lower surfaces must remain optically transparent and unobstructed during hot spot capture. Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of a vertical device, an insulated-gate bipolar transistor (IGBT). A collector 01 is provided on the lower surface of the device, and an emitter 02 and a gate 03 are provided on the upper surface. When testing, the collector 01, emitter 02, and gate 03 must all be led out to the test equipment.

[0030] Currently, testing of 3D vertical devices typically uses a copper-based adhesive connection method. Bonding metal wires are used on the front of the chip, while conductive copper adhesive is applied to the back to achieve electrical connections. Hotspot analysis requires the chip to be fully exposed to the analysis equipment's lens. However, due to the thickness of the copper adhesive and its lack of light transmission, copper adhesive can only achieve a double-sided conductive connection, preventing hotspot analysis from the back.

[0031] In order to solve the problems existing in the prior art, such as Figure 2-7 As shown, this embodiment provides a chip testing device, including a chip fixing structure 1, a protection plate and a PCB board 5, wherein the protection plate is rotatably connected to the chip fixing structure 1, as shown in FIG. Figure 3-4 As shown, the chip fixing structure 1 is provided with a hollow groove 2, a groove 3 and a through groove 4. The hollow groove 2 penetrates the two surfaces of the chip fixing structure 1 along a first preset direction. The hollow groove 2 and the protective plate are used to fix the chip. The groove 3 is arranged close to the hollow groove 2. The through groove 4 penetrates the inside of the chip fixing structure 1 along a second preset direction. The through groove 4 is connected to the groove 3; the PCB board 5 is inserted into the through groove 4 along the second preset direction, and the PCB board 5 is used to lead out the electrodes of the chip; the second preset direction is perpendicular to the first preset direction.

[0032] Among them, the PCB board can be a double-sided PCB board, and a window is provided on the protective plate. The sum of the area of the hollow groove 2 and the area of the groove 3 is greater than the area of the window. The hollow groove 2 is used to expose the two side surfaces of the chip, and the groove 3 is used to expose part of the PCB board so that both side surfaces of the chip can be electrically connected to the PCB board through leads; the size of the hollow groove 2 and the size of the groove 3 can be the same or different. The size of the hollow groove 2 can be determined according to the size of the chip. The size of the hollow groove 2 is greater than or equal to the size of the chip so as to expose the front and back sides of the chip, which is convenient for wiring from the front and back sides of the chip.

[0033] Exemplarily, the first preset direction may be a direction running through the upper and lower surfaces of the chip fixing structure; and the second preset direction may be a direction perpendicular to the first preset direction.

[0034] For example, Figure 2 As shown, the protective plate includes a first protective plate 6 and a second protective plate 7, and the first protective plate 6 and the second protective plate 7 are respectively arranged on both sides of the chip fixing structure 1; a fixed shaft 8 is provided on the chip fixing structure 1, and the first protective plate 6 and the second protective plate 7 are both rotatably connected to the chip fixing structure 1 through the fixed shaft 8.

[0035] Exemplarily, a first rotating portion 12 is provided on one side of the first protective plate 6, and a second rotating portion 13 is provided on one side of the second protective plate 7. The first rotating portion 12 and the second rotating portion 13 are both rotatably connected to the fixed shaft 8, so that the first protective plate 6 and the second protective plate 7 can be opened or closed independently of each other.

[0036] Exemplarily, at least one of the first protective plate 6 and the second protective plate 7 is provided with a window. When the first protective plate 6 and the second protective plate 7 cover the surface of the chip fixing structure 1, the hollow groove 2 at least partially overlaps with the projection of the window on the surface of the chip fixing structure 1, and the groove 3 at least partially overlaps with the projection of the window on the surface of the chip fixing structure 1. The groove 3 is used to expose a portion of the PCB board, thereby facilitating the connection of wires between the chip and the PCB board 5 through the window to lead out the chip electrodes. The PCB board is a double-sided design, which can lead the chip signals to a relatively wide area and connect to a test source for testing, completing the electrical connection process from the microscopic to the macroscopic level of the double-sided device.

[0037] In some embodiments, when the electrodes of the chip are located on the same side surface, a groove 3 can be set on the side of the chip fixing structure 1 where the surface is located to lead out the electrodes of the chip; when the electrodes of the chip are located on both the front and back surfaces, grooves 3 can be set on both surfaces of the chip fixing structure 1 to respectively lead out the electrodes on the two surfaces of the chip, thereby realizing testing of vertical devices.

[0038] Exemplarily, there are two grooves 3, each disposed on two opposing surfaces of the chip mounting structure 1. The depth of each groove 3 is less than the thickness of the chip mounting structure 1. The sum of the depths of the two grooves 3 is less than the thickness of the chip mounting structure 1, allowing electrodes on two surfaces of the chip to be led out, thereby enabling testing of vertical devices.

[0039] Exemplarily, the two grooves 3 include a first groove and a second groove, the first groove is provided on the side surface of the chip fixing structure 1 close to the first protective plate 6, and the second groove is provided on the side surface of the chip fixing structure 1 close to the second protective plate 7, and the sum of the depths of the first groove and the second groove is less than the thickness of the chip fixing structure 1.

[0040] like Figure 5-6 As shown, the first protective plate 6 is provided with a first window 10, and the second protective plate 7 is provided with a second window 11. When the first protective plate 6 and the second protective plate 7 cover the surface of the chip fixing structure 1, the first window 10 and the projection of the first groove on the surface of the chip fixing structure 1 at least partially overlap, and the second window 11 and the projection of the second groove on the surface of the chip fixing structure 1 at least partially overlap. The projections of the first window 10 and the second window 11 on the surface of the chip fixing structure 1 partially overlap. The first protective plate 6 and the second protective plate 7 can achieve chip fixation in a direction perpendicular to the chip surface.

[0041] Exemplarily, a first support member 15 is provided on a side of the first protection plate 6 close to the chip fixing structure 1 , and a second support member 16 is provided on a side of the second protection plate 7 close to the chip fixing structure 1 .

[0042] Exemplarily, the first and second protective plates 6 and 7 have the same surface area, and the surface area of the first protective plate 6 is smaller than the surface area of the chip fixing structure 1. The first protective plate 6 is provided with a slot, and the second protective plate 7 is provided with a snap-on portion, and the slot and snap-on portion have matching dimensions; when both the first and second protective plates 6 and 7 cover the surface of the chip fixing structure 1, the slot of the first protective plate 6 snaps into engagement with the snap-on portion of the second protective plate 7.

[0043] In this embodiment, the first support member 15 and the second support member 16 can be arranged symmetrically relative to the chip fixing structure 1, or can be arranged so that their projections on the surface of the chip fixing structure 1 overlap. The first support member 15 can be a protrusion provided on the first protective plate 6, and the second support member 16 can be a protrusion provided on the second protective plate 7. The first support member 15 and the second support member 16 can have the same or different shapes. For example, the first support member 15 and the second support member 16 can both be rectangular, circular, or other shapes. The first protective plate 6 can support the chip located in the hollow groove 2 from the first side via the first support member 15; the second protective plate 7 can support the chip located in the hollow groove 2 from the second side via the second support member 16, thereby improving the stability of the chip position.

[0044] Exemplarily, the chip testing device also includes an elastic component 9, and an installation groove 14 is also provided in the chip fixing structure 1 along the second preset direction. The elastic component 9 is passed through the installation groove 14, and the installation groove 14 is provided between the fixed axis 8 and the hollow groove 2, and the hollow groove 2 is provided between the installation groove 14 and the groove 3.

[0045] The elastic component 9 may include but is not limited to a spring. By providing the elastic component 9, the chip can be fixed in the direction along the chip surface, thereby further strengthening the fixing effect of the chip and avoiding position displacement of the chip during the test process.

[0046] For example, the preset area in the installation groove 14 is connected to the hollow groove 2; the preset area can be a non-edge area of the installation groove 14. Figure 7 As shown, the elastic component 9 includes a first elastic portion, a connecting portion and a second elastic portion, wherein the first elastic portion and the second elastic portion are fixedly connected by the connecting portion; the connecting portion can be an arc-shaped result, the first elastic portion can be a linear structure, and the second elastic portion includes a protrusion 17, which can be an arc-shaped protrusion away from the first elastic component; when the elastic component 9 is passed through the mounting groove 14, the protrusion 17 is close to the hollow groove 2 and is engaged with the chip in the hollow groove 2. By providing the protrusion 17, the chip can be fixed in the direction along the surface of the chip, thereby further strengthening the fixing effect of the chip, avoiding position displacement of the chip during testing, and preventing the metal wire between the chip and the PCB board from being disconnected.

[0047] The chip testing device of this embodiment can be precisely modeled through computer-aided design and then accurately converted into a physical model through 3D printing technology.

[0048] This embodiment also discloses a method for using the chip testing device, including:

[0049] First, open the first protection plate 6 located on the upper layer of the chip fixing structure 1, and close the second protection plate 7 located on the lower layer of the chip fixing structure 1, so that the second protection plate 7 covers the lower surface of the chip fixing structure 1;

[0050] Then, the chip is placed in the hollow groove 2 of the chip fixing structure 1. At this time, the lower surface of the chip in the hollow groove 2 is supported by the second support member 16 on the second protective plate 7; then the first protective plate 6 located on the upper layer of the chip fixing structure 1 is closed, so that the first support member 15 on the first protective plate 6 supports the upper surface of the chip in the hollow groove 2; one end of the first metal wire is connected to the upper surface of the chip through the first window 11 on the first protective plate 6, and the other end of the first metal wire is connected to the one side surface of the double-sided PCB board through the first groove 3; one end of the second metal wire is connected to the lower surface of the chip through the second window 12 on the second protective plate 7, and the other end of the second metal wire is connected to the other side surface of the double-sided PCB board through the second groove 4; the chip signal is connected to the test source through the double-sided PCB board for electrical failure analysis test.

[0051] The main body of the chip testing device of this embodiment is divided into three parts: the first protective plate 6 (upper layer), the chip fixing structure 1 (middle layer), and the second protective plate 7 (lower layer). The three-layer design can protect the stability of the sample (chip) and the PCB board, so that it remains relatively still in any posture. When the upper and lower layers are closed, the sample can be tightly clamped. Through the window bonding operation, the sample can be supported to withstand the pressure during the bonding process and the double-sided bonding leads can be protected from damage. The PCB board is a double-sided design, which can lead the chip signal to a relatively wide area and connect the test source for testing, completing the electrical connection process from micro to macro of the double-sided device.

[0052] The upper layer or lower layer of the chip testing device can be opened independently to ensure that the front or back of the chip is completely exposed without obstruction, so that the lens can be used to achieve all-round scanning of the chip without blind spots when capturing hot spots. When the upper layer or lower layer of the fixture is opened, the middle layer plays a stabilizing role for the chip and PCB. When the upper layer or lower layer of the device is opened separately, the chip on the corresponding side will be completely exposed. Using this device to capture the hot spots of the vertical device IGBT, the hot spots on both sides can be successfully captured. In addition, the side spring device of the middle layer helps to further fix the chip and prevent the metal connection between the chip and the PCB board from being disconnected. The device of this embodiment can be used for hot spot capture operations of vertical devices in electrical failure analysis, and can simultaneously meet the requirements of double-sided wire lead-out and double-sided transparency without obstruction of the device, thereby effectively realizing the hot spot capture of vertical devices.

[0053] The beneficial effects of the utility model are:

[0054] (1) The chip testing device of the present invention includes a chip fixing structure, a protective plate, and a PCB board. The protective plate is rotatably connected to the chip fixing structure. The chip fixing structure is provided with a hollow groove, a groove, and a through groove. The hollow groove penetrates the two surfaces of the chip fixing structure along a first preset direction. The hollow groove and the protective plate are used to fix the chip. The hollow groove can expose both sides of the chip, making it easy to wire from both sides of the chip. When grabbing the chip hot spot, ensure that both sides of the chip are completely exposed without obstruction.

[0055] (2) In the chip testing device of the present invention, the groove is arranged near the hollow groove, the through groove passes through the interior of the chip fixing structure along the second preset direction, and the through groove is connected to the groove; the PCB board is passed through the through groove along the second preset direction, and the PCB board is used to lead out the electrodes of the chip; the second preset direction is perpendicular to the first preset direction; the PCB board can be used to lead wires from the front and back sides of the chip, and then the test equipment is connected through the PCB board to realize the electrical connection between the chip and the test equipment; thereby realizing the performance test of the chip.

[0056] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A chip testing device, characterized in that: The chip fixing structure (1) comprises a chip fixing structure (1), a protective plate and a PCB board (5), wherein the protective plate is rotatably connected to the chip fixing structure (1), and the chip fixing structure (1) is provided with a hollow groove (2), a groove (3) and a through groove (4), wherein the hollow groove (2) penetrates two surfaces of the chip fixing structure (1) along a first preset direction, and the hollow groove (2) and the protective plate are used to fix the chip, the groove (3) is arranged close to the hollow groove (2), and the through groove (4) penetrates the interior of the chip fixing structure (1) along a second preset direction, and the through groove (4) is connected to the groove (3); the PCB board (5) is inserted into the through groove (4) along the second preset direction, and the PCB board (5) is used to lead out the electrodes of the chip; The second preset direction is perpendicular to the first preset direction.

2. The chip testing device according to claim 1, characterized in that: The protective plate comprises a first protective plate (6) and a second protective plate (7), wherein the first protective plate (6) and the second protective plate (7) are respectively arranged on both sides of the chip fixing structure (1); a fixing shaft (8) is provided on the chip fixing structure (1), and the first protective plate (6) and the second protective plate (7) are both rotatably connected to the chip fixing structure (1) via the fixing shaft (8).

3. The chip testing device according to claim 2, wherein: At least one of the first protective plate (6) and the second protective plate (7) is provided with a window. When the first protective plate (6) and the second protective plate (7) cover the surface of the chip fixing structure (1), the hollow groove (2) and the projection of the window on the surface of the chip fixing structure (1) at least partially overlap, and the groove (3) and the projection of the window on the surface of the chip fixing structure (1) at least partially overlap.

4. The chip testing device according to claim 2, wherein: A first rotating portion (12) is provided on one side of the first protective plate (6), and a second rotating portion (13) is provided on one side of the second protective plate (7). Both the first rotating portion (12) and the second rotating portion (13) are rotatably connected to the fixed shaft (8).

5. The chip testing device according to any one of claims 1 to 4, characterized in that: There are two grooves (3), and the two grooves (3) are respectively arranged on two opposite surfaces of the chip fixing structure (1), and the depth of the grooves (3) is less than the thickness of the chip fixing structure (1).

6. The chip testing device according to claim 2, wherein: The two grooves (3) include a first groove and a second groove, the first groove is provided on a side surface of the chip fixing structure (1) close to the first protective plate (6), and the second groove is provided on a side surface of the chip fixing structure (1) close to the second protective plate (7). A first window (10) is provided on the first protective plate (6), and a second window (11) is provided on the second protective plate (7). When the first protective plate (6) and the second protective plate (7) cover the surface of the chip fixing structure (1), the first window (10) and the projection of the first groove on the surface of the chip fixing structure (1) at least partially overlap, and the second window (11) and the projection of the second groove on the surface of the chip fixing structure (1) at least partially overlap.

7. The chip testing device according to claim 2, wherein: The chip testing device further comprises an elastic component (9); a mounting groove (14) is further provided in the chip fixing structure (1) along the second preset direction; the elastic component (9) is passed through the mounting groove (14); the mounting groove (14) is provided between the fixing shaft (8) and the hollow groove (2); and the hollow groove (2) is provided between the mounting groove (14) and the groove (3).

8. The chip testing device according to claim 7, characterized in that: The preset area in the installation groove (14) is connected to the hollow groove (2); the elastic component (9) includes a protrusion (17), and when the elastic component (9) is inserted into the installation groove (14), the protrusion (17) is close to the hollow groove (2).

9. The chip testing device according to claim 2, wherein: A first support member (15) is provided on a side of the first protection plate (6) close to the chip fixing structure (1), and a second support member (16) is provided on a side of the second protection plate (7) close to the chip fixing structure (1).

10. The chip testing device according to claim 9, characterized in that: The surface areas of the first protection plate (6) and the second protection plate (7) are the same, and the surface area of the first protection plate (6) is smaller than the surface area of the chip fixing structure (1).

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