Wafer detection equipment

Abstract

The utility model relates to the field of wafer processing equipment, in particular to wafer detection equipment, which comprises a detection unit, an overturning unit, a second moving unit and a third moving unit, a second suction piece is arranged at the output end of the second moving unit, and a third suction piece is arranged at the output end of the third moving unit. The outer diameter of the third suction part is smaller than the inner diameter of the second suction part, and the inner diameter of the third suction part is larger than the outer diameter of the first containing disc. The shapes, sizes and positions of a second suction part and a third suction part are designed and reasonably arranged, so that the movement tracks of the second suction part, the third suction part and a placement disc I have overlapped parts due to limited space in a wafer transfer process in a macroscopic detection link and between macroscopic detection and microscopic detection, and the movement tracks of the second suction part, the third suction part and the placement disc II are not overlapped due to limited space. And the wafers are not easy to interfere with each other and are prevented from being damaged.

Description

Technical Field

[0001] The utility model relates to the field of wafer processing equipment, in particular to a wafer detection device. Background Art

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. The starting material is silicon. High-purity polysilicon is dissolved, mixed with silicon crystal seeds, and then slowly pulled out to form a cylindrical single crystal of silicon.

[0003] After wafer production, wafers need to be inspected by wafer inspection equipment to see if they meet standards. This inspection is typically divided into macroscopic and microscopic inspections, respectively checking whether the wafer's dimensions meet standards and whether the wafer's surface is damaged. Wafer transfer during macroscopic inspection and between macro and microscopic inspections is typically performed using multiple suction elements equipped with vacuum suction heads in conjunction with corresponding moving units. However, due to existing requirements for wafer inspection equipment, which generally require a small size, internal space is limited, and the motion paths of the various suction elements intersect, which can easily cause interference and damage to the wafer. Utility Model Content

[0004] The technical solution adopted by the present invention to solve the technical problem is to provide a wafer detection device, including:

[0005] A detection unit, comprising a macro detection module and a micro detection module;

[0006] A flip unit, wherein the flip unit is provided with a placement plate for adsorbing the wafer, and the flip unit is used to control the multi-angle rotation of the wafer;

[0007] A second moving unit, wherein the output end of the second moving unit is provided with a second suction member, and the second moving unit is used to control the lifting and flipping of the second suction member. In an initial state, the second suction member and the placement plate are coaxially arranged;

[0008] a third movable unit, wherein the output end of the third movable unit is provided with a third suction member, the second suction member and the third suction member are both annular structures with a notch, and the third movable unit is used to control the third suction member to move to a position coaxially arranged with the second suction member;

[0009] During macro inspection, the second suction member, the third suction member and the placement plate are coaxially arranged, the outer diameter of the third suction member is smaller than the inner diameter of the second suction member, and the inner diameter of the third suction member is larger than the outer diameter of the placement plate. When the second suction member transfers the wafer from the wafer calibrator to the flip unit, the position of the third suction member is higher than that of the second suction member.

[0010] Furthermore, the second suction member and the third suction member are both provided with a plurality of circumferentially distributed vacuum suction heads.

[0011] Furthermore, the wafer inspection device also includes a fourth moving unit, and the output end of the fourth moving unit is provided with a fourth suction member, and the fourth moving unit is used to control the fourth suction member to move from the wafer aligner to the microscopic inspection module.

[0012] Furthermore, the wafer inspection equipment also includes a first movable unit, and the output end of the first movable unit is provided with a first suction member, and the first suction member is used to transport the wafer to the wafer calibrator. The first suction member includes a support rod and a contact rod arranged at the output end of the first movable unit, and the contact rod is provided with three vacuum adsorption heads.

[0013] Furthermore, the flip unit includes a first flip motor arranged on the frame, a support frame 1 arranged at the output end of the first flip motor, a second flip motor arranged on the support frame 1 and a support frame 2 arranged on the output end of the second flip motor, the placement plate 1 is arranged on the support frame 2, and the rotation center axis of the rotation trajectory of the output end of the first flip motor and the rotation center axis of the rotation trajectory of the output end of the second flip motor are perpendicular to each other.

[0014] Furthermore, the wafer inspection device also includes a fifth moving unit, which is used to transfer the wafer on the fourth suction member to the microscopic inspection module, and the output end of the fifth moving unit is provided with a placement tray 2 for adsorbing the wafer.

[0015] Furthermore, the first moving unit is a screw moving module.

[0016] Furthermore, the third moving unit, the fourth moving unit and the fifth moving unit are all screw moving modules.

[0017] Furthermore, the second moving unit includes a lifting module and a third flip motor, the output end of the lifting module is connected to the cylinder of the third flip motor, and the output end of the third flip motor is connected to the second suction member.

[0018] Furthermore, the macro detection module includes an industrial camera and a data processing module, and the industrial camera is arranged above the placement plate 1 and the second suction member.

[0019] The beneficial effect of the present invention is that by designing and reasonably arranging the shape, size and position of the second suction member and the third suction member, during the macroscopic detection link and during the wafer transfer between macroscopic detection and microscopic detection, the movement trajectories of the second suction member, the third suction member and the placement plate 1, although there are overlapping parts due to limited space, are not likely to interfere with each other to avoid damaging the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] In the picture: Figure 1 This is an overall structural diagram of a wafer inspection device provided by the utility model;

[0022] Figure 2 for Figure 1 The status of the wafer inspection equipment shown Figure 1 (At this time, the wafer is located on the first suction member);

[0023] Figure 3 for Figure 1 The status of the wafer inspection equipment shown Figure 2 (At this point the wafer is in the first calibration process);

[0024] Figure 4 for Figure 1 The status of the wafer inspection equipment shown Figure 3 (At this time, the wafer is in the macro inspection process);

[0025] Figure 5 for Figure 1 The status of the wafer inspection equipment shown Figure 4 (At this point the wafer is in the second calibration process);

[0026] Figure 6 for Figure 2 The structural diagram of the flip unit is shown.

[0027] Explanation of reference numerals: 100, wafer inspection equipment; 10, rack; 11, entrance; 12, exit; 13, placement platform 1; 131, protrusion; 14, placement platform 2; 20, first moving unit; 21, first suction member; 211, support rod; 212, contact rod; 213, vacuum adsorption head 4; 30, second moving unit; 31, second suction member; 311, bayonet; 312, protrusion plate; 313, vacuum adsorption head 1; 32, lifting module; 33, third flip motor; 40, third moving unit Element; 41. Third suction member; 50. Fourth moving unit; 51. Fourth suction member; 60. Fifth moving unit; 61. Second placement plate; 611. Third vacuum adsorption head; 70. Detection unit; 71. Macro detection module; 72. Micro detection module; 80. Flip unit; 81. First flip motor; 82. Support frame 1; 83. Second flip motor; 84. Support frame 2; 841. First placement plate; 8411. Second vacuum adsorption head; 90. Wafer aligner; 91. Third placement plate; 200. Wafer. DETAILED DESCRIPTION

[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention is now described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, which only illustrates the basics of the present invention in an illustrative manner, and therefore only shows the structures related to the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0029] Please refer to Figure 1-6 The present invention provides a wafer inspection device 100, comprising a frame 10, a first movable unit 20, a second movable unit 30, a third movable unit 40, a fourth movable unit 50, a fifth movable unit 60, a detection unit 70, a flip unit 80, and a wafer aligner 90. The frame 10 is hollow, and the first movable unit 20, the second movable unit 30, the third movable unit 40, and the fourth movable unit 50 are all located within the frame 10.

[0030] As shown in the figure, the length direction of the rack 10 is the X-axis, the width direction of the rack 10 is the Y-axis, and the height direction of the rack 10 is the Z-axis. The direction of the arrow in the figure is the positive direction.

[0031] Rack 10 is provided with an entrance 11 and an exit 12. Entrance 11 is located at one end of rack 10 along the X-axis, and exit 12 is located at one end of rack 10 along the Y-axis. A first placement platform 13 and a through slot (not shown) corresponding to placement platform 13 are provided at entrance 11 of rack 10. The through slot communicates with the interior of rack 10. Placement platform 13 is provided along the X-axis and has three protrusions 131 for supporting wafers 200. A second placement platform 14 is provided at exit 12 of rack 10 and is provided along the Y-axis.

[0032] The first mobile unit 20, the second mobile unit 30, the third mobile unit 40 and the fourth mobile unit 50 are arranged corresponding to the four sides of the rack 10 in sequence, wherein one end of the first mobile unit 20 corresponds to the entrance 11 of the rack 10, and one end of the fourth mobile unit 50 corresponds to the exit 12 of the rack 10. The first mobile unit 20 and the third mobile unit 40 are both arranged corresponding to the long side of the rack 10, and the second mobile unit 30 and the fourth mobile unit 50 are both arranged corresponding to the short side of the rack 10.

[0033] The output end of the first movable unit 20 is provided with a first suction member 21, the output end of the second movable unit 30 is provided with a second suction member 31, the output end of the third movable unit 40 is provided with a third suction member 41, and the output end of the fourth movable unit 50 is provided with a fourth suction member 51. Each of the first suction members 21 is provided with a plurality of circumferentially distributed vacuum suction heads 213, and each of the second, third, 41, and fourth suction members 51 is provided with a plurality of circumferentially distributed vacuum suction heads 313.

[0034] The first moving unit 20 is used to control the first suction member 21 to transport the wafer 200 from the placement table 13 to the wafer calibrator 90 for the first calibration; the third moving unit 40 is used to control the third suction member 41 to transfer the wafer 200 from the wafer calibrator 90 to the flip unit 80 for macro inspection, and after the macro inspection is completed, control the third suction member 41 to transfer the wafer 200 from the second suction member 31 to the wafer calibrator 90 for the second calibration; the second moving unit 30 is used to control the second suction member 31 to lift the wafer 200 to remove the wafer 200 from the flip unit 80 and control the second suction member 31 to flip the wafer 200 to cooperate with the macro inspection module 71 for macro inspection; the fourth moving unit 50 is used to control the fourth suction member 51 to transport the wafer 200 from the wafer calibrator 90 to the micro inspection module 72.

[0035] The detection unit 70 includes a macro detection module 71 and a micro detection module 72. The macro detection module 71 is used to detect the external dimensions of the wafer 200. The macro detection module 71 includes an industrial camera and a data processing module (the data processing module is not shown in the figure) arranged on the inner wall of the frame 10. The industrial camera is arranged above the placement plate 1 841 and the second suction member 41. The micro detection module 72 includes a microscope detection module arranged on the placement table 2 14. The industrial camera is used to obtain the external image data of the wafer 200 and pass it to the data processing module for processing and analysis. The microscope detection module is used to obtain more subtle appearance image data on the wafer 200 and perform data processing and analysis. The specific structures of the industrial camera and the microscope detection module are both existing technologies and will not be repeated in this embodiment.

[0036] The wafer aligner 90 is fixedly mounted on the frame 10 and is located between the first movable unit 20, the second movable unit 30, the third movable unit 40, and the fourth movable unit 50. The wafer aligner 90 is provided with a placement tray 91 for placing the wafer 200. In this embodiment, the wafer aligner 90 is a JEL SAL38C3HV model purchased from Shanghai Hengpeng Enterprise Development Co., Ltd. The wafer aligner 90 is not limited to this model; any wafer aligner 90 capable of calibrating the wafer 200 can be used in the technical solution of this application.

[0037] The first suction member 21 comprises a support rod 211 positioned at the output end of the first movable unit 20 and two parallel contact rods 212 each equipped with three second vacuum suction heads 213. Both contact rods 212 are arranged along the X-axis. The spacing between the two contact rods 212 is greater than the diameter of the third placement plate 91 on the wafer aligner 90. This facilitates the placement of the wafer 200 on the third placement plate 91 by the first suction member 211. Once the two contact rods 212 descend to a height slightly lower than the third placement plate 91, the wafer 200 can be placed on the third placement plate 91, improving the efficiency of wafer 200 transfer.

[0038] The second suction member 31 is a ring-shaped structure with a notch. A plurality of slots 311 are formed on the inner side of the second suction member 31 . A convex plate 312 for mounting a vacuum suction head 313 is formed between adjacent slots 311 .

[0039] The third suction member 41 is an annular structure with a notch. The orthographic projection length of the notch of the third suction member 41 on the Y-axis is greater than the diameter of the placement plate three 91 on the wafer aligner 90, and the notch of the third suction member 41 is arranged toward the placement plate three 91. This facilitates the third suction member 41 to place the wafer 200 from the placement plate three 91 of the wafer aligner 90, and then directly move it in a direction away from the wafer aligner 90, without having to first descend to a point away from the placement plate three 91 and then move it in a direction, thereby improving the transfer efficiency of the wafer 200.

[0040] The fourth suction member 51 is an annular structure with a notch. The orthographic projection length of the notch of the fourth suction member 51 on the X-axis is greater than the diameter of the placement plate three 91 on the wafer aligner 90, and the notch of the fourth suction member 51 is set toward the placement plate three 91. This makes it convenient for the fourth suction member 51 to absorb the wafer 200 from the placement plate three 91 of the wafer aligner 90 and directly translate it toward the direction close to the wafer aligner 90, without having to first lift it to a position below the placement plate three 91 and then translate it, thereby improving the transfer efficiency of the wafer 200.

[0041] The flip unit 80 is used to cooperate with an industrial camera to detect the dimensional parameters of the wafer 200. The specific dimensional parameters to be detected are determined according to the actual detection process and are not specifically limited in this embodiment. The flip unit 80 includes a first flip motor 81 disposed on the frame 10, a first support frame 82 disposed at the output end of the first flip motor 81, a second flip motor 83 disposed on the first support frame 82, and a second support frame 84 disposed at the output end of the second flip motor 83. The second support frame 84 is equipped with a first placement plate 841, and the first placement plate 841 is equipped with three second vacuum adsorption heads 8411 distributed circumferentially.

[0042] Please refer to Figure 2-5 During macroscopic inspection, the second suction member 31, the third suction member 41, and the placement plate 841 are coaxially arranged. The outer diameter of the third suction member 41 is smaller than the inner diameter of the second suction member 31, while the inner diameter of the third suction member 41 is larger than the outer diameter of the placement plate 841. When the second suction member 31 transfers the wafer 200 from the wafer 200 aligner 90 to the flip unit 80, the position of the third suction member 41 is higher than that of the second suction member 31. Furthermore, when the flip unit 80 is not rotating the wafer 200 at multiple angles, the second suction member 31, the third suction member 41, and the placement plate 841 are coaxially arranged. The diameter of the circle formed by the trajectory of the vacuum suction head position on the three protruding plates 312 is larger than the outer diameter of the third suction member 41. The projected length of the notch of the second suction member 31 in the X-axis direction is larger than the outer diameter of the third suction member 41.

[0043] The above arrangement makes it convenient for the second suction member 31 to be directly lowered until the wafer 200 is sucked by the placement plate 1 841 when the wafer 200 is transferred to the placement plate 1 841 through the second suction member 31, and when the wafer 200 cooperates with the macro-detection module 71 to complete the macro-detection of the front side of the wafer 200 on the placement plate 1 841, the flipping unit 80 controls the placement plate 1 841 to reset the wafer 200 to a position coaxially arranged with the second suction member 31, and the second suction member 31 can be directly raised to suck the wafer 200 on the placement plate 1 841 and then rise, and after the back side of the wafer 200 completes the macro-detection on the second suction member 31, the third suction member 41 can directly rise to suck the wafer 200, and then pass through the inner wall of the second suction member 31 to transfer the wafer 200 to the next process. During these processes, by designing and reasonably arranging the shape, size and position of the second suction member 31 and the third suction member 41, although the movement trajectories of the second suction member 31, the third suction member 41 and the placement plate 841 have overlapping parts due to limited space, they are not likely to interfere with each other to avoid damaging the wafer 200.

[0044] The central axis of rotation of the output end of the first flip motor 81 and the central axis of rotation of the output end of the second flip motor 83 are perpendicular to each other. Furthermore, the central axis of rotation of the output end of the first flip motor 81, which controls the rotation of support frame 1 82, is arranged along the height direction of the frame 10, while the central axis of rotation of the output end of the second flip motor 83, which controls the rotation of support frame 2 84, is arranged along the width direction of the frame 10. The first flip motor 81 and the second flip motor 83 cooperate with each other to enable the wafer 200 on the placement plate 1 841 to achieve multi-angle rotation, facilitating the industrial camera to capture details of the wafer 200 from multiple angles.

[0045] The first movable unit 20 is a movable module that moves along the X-axis and Z-axis directions shown in the figure. In this embodiment, the specific structure of the first movable unit 20 can be a screw movable module in the prior art. The specific structure of the first movable unit 20 is not limited to this. Any movable module that can realize the translation function in the XZ-axis direction can be used for the technical solution of this application.

[0046] The output end of the second movable unit 30 is fixedly connected to the second suction member 31. More specifically, the second movable unit 30 includes a lifting module 32 and a third flip motor 33. The output end of the lifting module 32 is fixedly connected to the body of the third flip motor 33. The output end of the third flip motor 33 is fixedly connected to the second suction member 31. The rotation center axis of the rotation trajectory of the output end of the third flip motor 33 is set along the width direction of the frame 10.

[0047] The third movable unit 40 is a movable module that moves along the X-axis and Z-axis directions shown in the figure. In this embodiment, the specific structure of the third movable unit 40 can be a screw movable module in the existing technology. The specific structure of the third movable unit 40 is not limited to this. Any movable module that can realize the translation function in the XZ-axis direction can be used for the technical solution of this application.

[0048] The fourth movable unit 50 is a movable module that moves along the X-axis and Z-axis directions shown in the figure. In this embodiment, the specific structure of the fourth movable unit 50 can be a screw movable module in the existing technology. The specific structure of the fourth movable unit 50 is not limited to this. Any movable module that can realize the YZ-axis translation function can be used in the technical solution of this application.

[0049] The fifth movable unit 60 is arranged on the placement table 2 14, and the output end of the fifth movable unit 60 is provided with a placement disk 2 61, and the placement disk 2 61 is provided with three circumferentially distributed vacuum adsorption heads 3 611. The fifth movable unit 60 is a movable module that moves along the XYZ three-axis direction shown in the figure. In this embodiment, the specific structure of the fifth movable unit 60 can be a screw moving module in the existing technology. The specific structure of the fifth movable unit 60 is not limited to this. Any movable module that can realize the XYZ three-axis translation function can be used for the technical solution of this application.

[0050] Optionally, in some other embodiments, a wafer ID reader may be provided on the rack 10 to confirm the ID information of the wafer 200 to be inspected.

[0051] The working process of the wafer inspection device 100 provided by the present invention is as follows: Figure 2-5 The first moving unit 20 first controls the first suction member 21 to move to the placement table 13, where it holds the wafer 200. The first moving unit 20 then controls the first suction member 21 and the wafer 200 to move through the slot into the frame 10. The first moving unit 20 then controls the first suction member 21 to move along the X-axis and Z-axis until it reaches the left side of the wafer aligner 90. The first moving unit 20 then controls the first suction member 21 to move rightward, above the two contact rods 212 and the placement tray 3 91. The first moving unit 20 then controls the first suction member 21 to move downward, placing the wafer 200 on the placement tray 3 91. The wafer 200 undergoes its first alignment on the wafer aligner 90. The first moving unit 20 then controls the first suction member 21 to return to its initial position to transport the next wafer 200 to be inspected.

[0052] After the first calibration is complete, the third suction member 41 is positioned below the wafer 200. The third moving unit 40 controls the third suction member 41 to move rightward until all three vacuum heads on the third suction member 41 are directly below the wafer 200. The third moving unit 40 then controls the third suction member 41 to move upward, securing the wafer 200 and lifting it upward off the placement tray 3 91, with the third suction member 41 positioned slightly above the placement tray 1 841. The third moving unit 40 then controls the third suction member 41 to move leftward, transferring the wafer 200 to a position coaxial with the placement tray 1 841 and the second suction member 31. At this point, the second suction member 31 is positioned below the placement tray 1 841. The third moving unit 40 then controls the third suction member 41 to descend, placing the wafer 200 on the placement tray 1 841, where it is held by the vacuum heads on the placement tray 1 841, ultimately positioning the third suction member 41 below the placement tray 1 841.

[0053] Then, the first flip motor 81 and the second flip motor 83 cooperate to rotate the wafer 200 at multiple angles. The industrial camera located on the frame 10 takes multiple-angle photos of the front of the wafer 200 to obtain data and transmit the data to the data processing module for processing. After the industrial camera completes the front-side photography of the wafer 200, the first flip motor 81 and the second flip motor 83 cooperate to rotate the wafer 200 to a state where it is coaxially arranged with the second suction member 31. The second moving unit 30 controls the second suction member 31 to rise until it contacts and adsorbs the bottom of the wafer 200. The second suction member 31 is then controlled to move upward to a height that does not affect the flipping of the second suction member 31 and then stops rising. The second moving unit 30 then controls the second suction member 31 to flip 180 degrees, so that the back of the wafer 200 is within the shooting range of the industrial camera. The industrial camera then takes photos of the back of the wafer 200 and transmits the data to the data processing module for processing and analysis.

[0054] After the macro inspection of the wafer 200 is completed, the second suction member 31 is controlled by the second moving unit 30 to move downward until the third suction member 41 and the wafer 200 are in contact and adsorbed, and then the third suction member 41 is controlled by the third moving unit 40 to rise away from the placement tray 1 841, and then the third suction member 41 is controlled by the third moving unit 40 to move to the right to directly above the placement tray 3 91, and then the third suction member 41 is controlled by the third moving unit 40 to move downward to place the wafer 200 on the placement tray 3 91, and the wafer 200 is calibrated for the second time on the wafer calibrator 90, and the third moving unit 40 then controls the third suction member 41 to return to the initial position to transport the next wafer 200 to be inspected.

[0055] After the second calibration is completed, the fourth suction member 51 is controlled by the fourth moving unit 50 to move toward the direction close to the wafer calibrator 90. At this time, the fourth suction member 51 is located below the wafer 200 until the fourth suction member 51 is located directly below the wafer 200. Then, the fourth suction member 51 is controlled by the fourth moving unit 50 to rise until it contacts and adsorbs the wafer 200. Then, the fourth suction member 51 is controlled by the fourth moving unit 50 to move toward the exit 12 of the rack 10 until the wafer 200 is transported to the placement tray 2 61.

[0056] Then, the fifth moving unit 60 controls the second placement plate 61 to transport the wafer 200 to the microscope inspection module for further inspection.

Claims

1. A wafer inspection device, characterized in that: include: A detection unit, comprising a macro detection module and a micro detection module; A flip unit, wherein the flip unit is provided with a placement plate for adsorbing the wafer, and the flip unit is used to control the multi-angle rotation of the wafer; A second moving unit, wherein the output end of the second moving unit is provided with a second suction member, and the second moving unit is used to control the lifting and flipping of the second suction member. In an initial state, the second suction member and the placement plate are coaxially arranged; a third movable unit, wherein the output end of the third movable unit is provided with a third suction member, the second suction member and the third suction member are both annular structures with a notch, and the third movable unit is used to control the third suction member to move to a position coaxially arranged with the second suction member; During macro inspection, the second suction member, the third suction member and the placement plate are coaxially arranged, the outer diameter of the third suction member is smaller than the inner diameter of the second suction member, and the inner diameter of the third suction member is larger than the outer diameter of the placement plate. When the second suction member transfers the wafer from the wafer calibrator to the flip unit, the position of the third suction member is higher than that of the second suction member.

2. The wafer inspection device according to claim 1, wherein: The second suction member and the third suction member are both provided with a plurality of circumferentially distributed vacuum suction heads.

3. The wafer inspection device according to claim 1, wherein: The wafer inspection device further includes a fourth moving unit, an output end of the fourth moving unit is provided with a fourth suction member, and the fourth moving unit is used to control the fourth suction member to move from the wafer aligner to the microscopic inspection module.

4. The wafer inspection device according to claim 1, wherein: The wafer inspection equipment also includes a first movable unit, and a first suction member is provided at the output end of the first movable unit. The first suction member is used to transport the wafer to the wafer calibrator. The first suction member includes a support rod and a contact rod arranged at the output end of the first movable unit, and the contact rod is provided with three vacuum adsorption heads.

5. The wafer inspection device according to claim 1, wherein: The wafer inspection equipment also includes a frame, the flip unit includes a first flip motor arranged on the frame, a support frame 1 arranged at the output end of the first flip motor, a second flip motor arranged on the support frame 1 and a support frame 2 arranged on the output end of the second flip motor, the placement plate 1 is arranged on the support frame 2, and the rotation center axis of the rotation track of the output end of the first flip motor and the rotation center axis of the rotation track of the output end of the second flip motor are perpendicular to each other.

6. The wafer inspection device according to claim 3, wherein: The wafer inspection device further includes a fifth moving unit, which is used to transfer the wafer on the fourth suction member to the microscopic inspection module. The output end of the fifth moving unit is provided with a placement tray 2 for adsorbing the wafer.

7. The wafer inspection device according to claim 4, wherein: The first moving unit is a screw moving module.

8. The wafer inspection device according to claim 6, wherein: The third moving unit, the fourth moving unit and the fifth moving unit are all screw moving modules.

9. The wafer inspection device according to claim 1, wherein: The second moving unit includes a lifting module and a third flip motor. The output end of the lifting module is connected to the cylinder of the third flip motor, and the output end of the third flip motor is connected to the second suction member.

10. The wafer inspection device according to claim 1, wherein: The macro detection module includes an industrial camera and a data processing module, and the industrial camera is arranged above the placement plate 1 and the second suction member.

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