Automatic stripping equipment for stripping protection frame assembly and substrate

Abstract

The utility model discloses an automatic stripping device for stripping a protection frame assembly and a substrate, which comprises a control unit, a carrying table, a heating module, a first clamp module and a lifting mechanism, the carrying table is used for bearing and fixing the substrate, and the protection frame assembly is adhered on the substrate. The heating module is used for heating the glue material between the substrate and the protection frame assembly. The first clamp module comprises two first clamps and two first moving mechanisms, the two first moving mechanisms are connected with the two first clamps respectively, and the control unit can control the two first moving mechanisms through the first actuating unit, so that the two first clamps can clamp the protection frame assembly. The lifting mechanism is arranged below the carrying table, and the control unit can enable the lifting mechanism to move downwards through the second actuating unit, so that the protection frame assembly is stripped from the substrate.

Description

Technical Field

[0001] The utility model relates to a device for peeling a protection frame component and a substrate, in particular to an automatic peeling device which can automatically peel the protection frame component and the substrate. Background Art

[0002] In today's society, people's lives are increasingly filled with communications and consumer electronics (3C electronics), which has led to a growing demand for semiconductor chips. The semiconductor chip manufacturing process is very complicated, with steps such as deposition, illumination, development, etching, and cleaning.

[0003] Among these manufacturing steps, the illumination process mainly involves placing a mask on the semiconductor, on which a circuit pattern is engraved, and then applying ultraviolet light to the mask so that the circuit pattern can be printed on the semiconductor. Currently, the manufacturing process of general semiconductor chips is carried out in a clean room environment. This is because semiconductor chips are very small. If the mask is contaminated with any dust, it may affect the subsequent production yield of the semiconductor. Therefore, the manufacturing process of semiconductor chips must be carried out in a clean room environment to prevent the mask from being contaminated by particles in the air. However, current clean rooms cannot achieve a completely dust-free state, so when the mask is in use, a thin film is placed above the mask through a protective frame to ensure that the mask can remain clean.

[0004] Currently, removing the protective frame assembly (i.e., the combination of the protective frame and film) from the photomask requires manual operation. However, the protective frame assembly is very fragile, so this operation often damages the protective frame assembly, rendering the removed protective frame assembly unusable. Furthermore, manually peeling the protective frame assembly from the photomask can lead to improper operation and damage to the photomask. Therefore, there is a continued need for equipment that can automatically peel the protective frame assembly from the substrate. Utility Model Content

[0005] Purpose of the utility model:

[0006] This utility model aims to provide an automated peeling device for separating a protective frame assembly from a substrate. The device utilizes a control unit to control a heating module, a first clamping module, a second clamping module, and a lifting mechanism to automatically separate the protective frame assembly from the substrate. This ensures that the protective frame assembly remains intact when peeled from the substrate, and the automated peeling process improves peeling efficiency. Furthermore, the device is adaptable to photomasks and protective frame assemblies of varying sizes, demonstrating its high versatility.

[0007] In order to solve the above problems, the present invention adopts the following technical solutions:

[0008] The present invention provides an automatic peeling device for peeling off a protective frame assembly and a substrate, which includes a control unit, a carrier, a heating module, a first clamp module and a lifting mechanism, wherein the carrier is used to carry the substrate, and the protective frame assembly is glued to the surface of the substrate. The heating module is electrically connected to the control unit, and the heating module is arranged below the carrier and is controlled by the control unit to heat the glue between the substrate and the protective frame assembly. The first clamp module includes two first clamps and two first moving mechanisms arranged on opposite sides of the carrier, wherein the two first moving mechanisms are respectively connected to the two first clamps, and the two first moving mechanisms are connected to at least one first actuating unit, and the first actuating unit is electrically connected to the control unit and controlled by the control unit to make the two first moving mechanisms move toward each other, so that the two first clamps can be used to clamp or release the protective frame assembly. The lifting mechanism is arranged below the carrier and the heating module and is connected to the second actuating unit, wherein the second actuating unit is electrically connected to the control unit and is controlled by the control unit. After the two first clamps move to the two sides of the protective frame assembly and clamp the protective frame assembly, and the heating module heats the glue for a period of time, the second actuating unit will move the lifting mechanism downward, thereby driving the substrate downward and peeling the protective frame assembly from the substrate.

[0009] Preferably, the carrier has a plurality of abutting members, and the plurality of abutting members are used to fix the substrate placed on the carrier.

[0010] Preferably, the plurality of abutting members are four abutting members, which are respectively arranged at the four corners of the carrier. When the substrate and the protective frame assembly are placed on the carrier, the four abutting members will rotate onto the substrate and fix the substrate.

[0011] Preferably, each side of the protective frame assembly has at least one positioning hole, and the side of the first clamp facing the protective frame assembly has at least one positioning member, which is correspondingly disposed in the positioning hole and is used to receive the positioning member, so that the two first clamps clamp and fix the protective frame assembly.

[0012] Preferably, the automatic peeling device for peeling the protective frame assembly and the substrate further includes a second clamp module, the second clamp module includes two second clamps and two second moving mechanisms arranged on the other two opposite sides of the carrier, wherein the two second moving mechanisms are respectively connected to the two second clamps, and the two second moving mechanisms are connected to at least one third actuating unit, the third actuating unit is electrically connected to the control unit, and is controlled by the control unit to move the two second moving mechanisms toward each other, so that the two second clamps are used to carry the protective frame assembly peeled from the substrate.

[0013] Preferably, the automatic peeling device for peeling the protective frame assembly from the substrate further comprises a protective frame assembly placement portion, which is disposed at a location on one side of the carrier and is used to place the peeled protective frame assembly.

[0014] Preferably, the heating module includes at least one of an electric heating tube heating module, a coil heating module, a ceramic heating module, a microwave tube heating module, a quartz tube heating module, an infrared heating module and a halogen lamp heating module.

[0015] Preferably, the first moving mechanism and the second moving mechanism are slide rail moving mechanisms.

[0016] Preferably, the first actuating unit and the third actuating unit are one of a stepping motor, a servo motor and a linear motor.

[0017] Preferably, the second actuating unit is a pneumatic cylinder or a hydraulic cylinder.

[0018] Beneficial effects: Compared with the prior art, the utility model has the following advantages:

[0019] This automatic peeling device for peeling a protective frame assembly from a substrate utilizes a control unit to control all mechanisms, automating the separation of the substrate and protective frame assembly. The peeling process involves securing the substrate with a carrier and the protective frame assembly with a first clamp module. A lifting mechanism beneath the carrier then pulls the substrate downward, allowing the protective frame assembly to be peeled from the substrate without damage. This allows the protective frame assembly to be reused, saving labor, time, and capital costs while improving peeling efficiency. Furthermore, this new automatic peeling device is adaptable to photomasks and protective frame assemblies of varying sizes, demonstrating its high versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a three-dimensional schematic diagram of the automatic peeling device of the present invention;

[0021] Figure 2 Schematic diagram of the automatic peeling device in the initial state according to the embodiment of the present invention;

[0022] Figure 3 This is a three-dimensional schematic diagram of the automatic peeling device of the new embodiment after executing the first step;

[0023] Figure 4 A three-dimensional schematic diagram of the automatic peeling device of this new embodiment after performing the second step

[0024] Figure 5 This is a three-dimensional schematic diagram of the automatic peeling device of the present embodiment after executing the third step;

[0025] Figure 6This is a three-dimensional schematic diagram of the automatic peeling device of the present embodiment after executing the fourth step;

[0026] Figure 7 This is a three-dimensional schematic diagram of the automatic peeling device of the new embodiment after executing the fifth step;

[0027] Figure 8 This is a system block diagram of the automatic peeling equipment of the new embodiment.

[0028] Wherein: 1: carrier; 11: abutment; 12: first fixture module; 121: first fixture; 13:

[0029] Second fixture module; 131: Second fixture; 2: Lifting mechanism; 3: Protective frame assembly placement portion; 100:

[0030] Substrate; 200: protection frame assembly; CTR: control unit; H: heating module; MV1: first moving mechanism; MV2: second moving mechanism; M1: first actuating unit; M2: second actuating unit; M3:

[0031] The third actuating unit; P_B: positioning piece; P_H: positioning hole. DETAILED DESCRIPTION

[0032] Please refer to Figure 1 、 Figure 2 、 Figure 8 , Figure 1 This is a three-dimensional schematic diagram of the automatic peeling device of this new embodiment. Figure 2 This is a three-dimensional schematic diagram of the automatic peeling device of the new embodiment in the initial state. Figure 8 The system block diagram of the automatic peeling device of the present embodiment is shown in FIG. The automatic peeling device for peeling the protective frame assembly and the substrate comprises a control unit CTR, a carrier 1, a heating module H, a first clamping module 12, a second clamping module 13 and a lifting mechanism 2, wherein the heating module H is electrically connected to the control unit CTR and is disposed below the carrier 1. The control unit CTR can heat the adhesive between the substrate 100 placed on the carrier 1 and the protective frame assembly 200 through the heating module H, as shown in FIG. Figure 3 As shown. It should be noted that the heating module H includes at least one of an electric heating tube heating module, a coil heating module, a ceramic heating module, a microwave tube heating module, a quartz tube heating module, an infrared heating module, and a halogen lamp heating module, but the types of heating modules H used in the present invention are not limited to the above.

[0033] In addition, the substrate used in the embodiment of the present invention is a photomask, and the protection frame assembly includes a protection frame having a film inside for protecting the photomask. However, the present invention is not limited to the types of substrate and protection frame assembly.

[0034] The first fixture module 12 includes two first fixtures 121 and two first moving mechanisms MV1, wherein the two first fixtures 121 are respectively arranged on opposite sides of the carrier 1, and the two first moving mechanisms MV1 are respectively connected to the two first fixtures 121, and the two first moving mechanisms MV1 are further connected to at least one first actuating unit M1, and the first actuating unit M1 is electrically connected to the control unit CTR, and the control unit CTR uses the first actuating unit M1 to move the two first moving mechanisms MV1 toward each other, so that the two first fixtures 121 can clamp or release the protective frame assembly 200, as shown in FIG. Figure 3 shown.

[0035] The second fixture module 13 includes two second fixtures 131 and two second moving mechanisms MV2, wherein the two second fixtures 131 are respectively arranged on the other two opposite sides of the carrier 1, and the two second moving mechanisms MV2 are respectively connected to the two second fixtures 131, and the two second moving mechanisms MV2 are additionally connected to at least one third actuating unit M3, and the third actuating unit M3 is electrically connected to the control unit CTR, and the control unit CTR uses the third actuating unit M3 to move the two second moving mechanisms MV2 toward each other, so that the two second fixtures 131 can carry the protective frame assembly 200 peeled from the substrate 100, as shown in FIG. Figure 3 It is additionally explained that the first moving mechanism MV1 and the second moving mechanism MV2 are slide rail moving mechanisms, and the first actuating unit M1 and the third actuating unit M3 are one of a stepping motor, a servo motor and a linear motor, but the present invention is not limited thereto.

[0036] Incidentally, considering versatility, this new automatic peeling machine can be designed to accommodate photomasks and protective frame assemblies of varying sizes. Specifically, a marking can be placed on stage 1 to indicate the center point. By increasing the travel distance of the first and second moving mechanisms MV1 and MV2, the new automatic peeling machine can be designed to accommodate photomasks and protective frame assemblies of varying sizes.

[0037] The lifting mechanism 2 is disposed below the stage 1 and the heating module H. The lifting mechanism 2 is connected to a second actuator unit M2, which is electrically connected to a control unit CTR. The control unit CTR controls the lifting mechanism 2 via the second actuator unit M2. The second actuator unit M2 can be a pneumatic or hydraulic cylinder, but the present invention is not limited thereto.

[0038] Please refer to Figures 2 to 7 and Figure 8 , Figure 2This is a three-dimensional schematic diagram of the automatic peeling device of the new embodiment in the initial state. Figure 3 This is a three-dimensional schematic diagram of the automatic peeling device of the new embodiment after executing the first step. Figure 4 This is a three-dimensional schematic diagram of the automatic peeling device of the new embodiment after executing the second step. Figure 5 This is a three-dimensional schematic diagram of the automatic peeling device of the new embodiment after executing the third step. Figure 6 This is a three-dimensional schematic diagram of the automatic peeling device of this new embodiment after executing the fourth step. Figure 7 This is a three-dimensional diagram of the automatic peeling device of the present embodiment after executing the fifth step. Before peeling the substrate 100 and the protective frame assembly 200, first Figure 2 As shown, when the substrate 100 and the protection frame assembly 200 are not placed on the carrier 1, as shown in FIG. Figure 3 As shown, the two first clamps 121 of the first clamp module 12 and the two second clamps 131 of the second clamp module 13 are at a distance from the carrier 1 to facilitate the placement of the substrate 100 and the protection frame assembly 200 on the carrier 1. Figure 3 shown.

[0039] Perform the first step, then Figure 3 As shown, the substrate 100 and the protection frame assembly 200 are placed on the carrier 1, wherein each of the four corners of the carrier 1 is provided with a supporting member 11, and the four supporting members 11 can be rotated onto the substrate 100 to fix the substrate 100.

[0040] After the supporting member 11 fixes the substrate 100, the second step is performed, such as Figure 4 As shown, the control unit CTR (as Figure 8 As shown in FIG, the first actuating unit M1 controls the two first moving mechanisms MV1 to move toward each other, so that the two first clamps 121 clamp the protection frame assembly 200. The protection frame assembly 200 has at least one positioning hole P_H on both sides facing the two first clamps 121, and the two first clamps 121 have at least one positioning member P_B on one side facing the protection frame assembly 200. The positioning member P_B is correspondingly arranged in the positioning hole P_H, so that when the two first clamps 121 clamp the protection frame assembly 200, the positioning hole P_H is used to receive the positioning member P_B to strengthen the stability of the two first clamps 121 clamping the protection frame assembly 200. Then, the control unit CTR (as shown in FIG. Figure 8 As shown in FIG. 1 , the heating module H is controlled to heat the adhesive between the substrate 100 and the protection frame assembly 200 to melt the adhesive through heating.

[0041] Then proceed to the third step, such as Figure 5As shown, after the heating module H heats for a period of time and the two first clamps 121 clamp the protection frame assembly 200, the control unit CTR activates the second actuating unit M2, as shown in FIG. Figure 8 As shown, the lifting mechanism 2 moves downward. At this time, the substrate 100 is fixed on the carrier 1 by four supporting members 11. Figure 4 As shown, the lifting mechanism 2 can pull the substrate 100 downward together with the carrier 1 to separate the substrate 100 from the protection frame assembly 200 .

[0042] After the protection frame assembly 200 is peeled off from the substrate 100, the fourth step is performed. Figure 6 As shown, the control unit CTR will activate the third actuating unit M3, as shown in FIG. Figure 8 As shown, the two second moving mechanisms MV2 are controlled to move toward each other, so that the two second clamps 131 are close to the protection frame assembly 200 , and the protection frame assembly 200 is supported by the grooves on the two second clamps 131 .

[0043] After confirming that the protection frame assembly 200 is firmly supported by the two second clamps 131, proceed to the fifth step, such as Figure 7 As shown, the control unit CTR controls the two first clamps 121 to release the protection frame assembly 200 through the first actuating unit M1. Finally, the user can manually or the robot arm can automatically place the protection frame assembly 200 on the protection frame assembly placement portion 3. Figure 1 As shown, the control unit CTR controls the first clamp module 12, the second clamp module 13 and the lifting mechanism 2 to return them to their initial positions. Figure 2 As shown, the next substrate 100 and the protection frame assembly 200 can be peeled off.

[0044] In summary, the new automatic peeling device for peeling the protective frame assembly and the substrate uses a control unit to control the carrier, the heating module, the first clamp module, the second clamp module and the lifting mechanism to automatically peel the substrate and the protective frame assembly, saving manpower and time costs and improving peeling efficiency. The peeling method is to fix the substrate by the carrier and the protective frame assembly by the first clamp module, and then heat the glue between the substrate and the protective frame assembly to melt the glue, and then pull the substrate down by the lifting mechanism to peel the protective frame assembly from the substrate in a non-destructive manner, so that the protective frame assembly can be reused, saving usage costs. On the other hand, the new automatic peeling device can be applied to different sizes of masks and protective frame assemblies, and has a high degree of versatility, without requiring the industry to purchase an automatic peeling device for each size of mask and protective frame assembly.

Claims

1. An automatic peeling device for peeling a protective frame assembly from a substrate, characterized by: Contains the following components: Control unit (CTR); A carrier (1) for carrying a substrate (100): a protective frame assembly (200) is glued to the surface of the substrate (100); A heating module (H) controlled by a control unit (CTR): electrically connected to the control unit (CTR) and disposed below the carrier (1); The first fixture module (12) comprises two first fixtures (121) and two first moving mechanisms (MV1) arranged on opposite sides of the carrier (1), the two first moving mechanisms (MV1) are respectively connected to the two first fixtures (121), the two first moving mechanisms (MV1) are both connected to a first actuating unit (M1), and at least one first actuating unit (M1) is electrically connected to a control unit (CTR); as well as The lifting mechanism (2) is arranged below the carrier (1) and the heating module (H) and is connected to the second actuating unit (M2), wherein the second actuating unit (M2) is electrically connected to the control unit (CTR) and is controlled by the control unit (CTR).

2. The automatic peeling device for peeling the protective frame assembly and the substrate according to claim 1, characterized in that: The carrier (1) is provided with a plurality of abutting members (11) for fixing a substrate (100) placed on the carrier (1).

3. The automatic peeling device for peeling the protective frame assembly and the substrate according to claim 2, characterized in that: The plurality of supporting members (11) are four supporting members (11), and the four supporting members (11) are respectively arranged at the four corners of the carrier (1). When the substrate (100) and the protective frame assembly (200) are placed on the carrier (1), the four supporting members (11) are rotated onto the substrate (100) to fix the substrate (100).

4. The automatic peeling device for peeling the protective frame assembly and the substrate according to claim 1, characterized in that: Both sides of the protection frame assembly (200) are respectively provided with at least one positioning hole (P_H), and a side surface of the first clamp (121) facing the protection frame assembly (200) is provided with at least one positioning piece (P_B), and the positioning piece (P_B) is adapted to the positioning hole (P_H) so that the two first clamps (121) can clamp and fix the protection frame assembly (200).

5. The automatic peeling device for peeling the protective frame assembly and the substrate according to claim 1, characterized in that: The invention also includes a second clamp module (13), which includes two second clamps (131) and two second moving mechanisms (MV2) arranged on the other two opposite sides of the carrier (1). The two second moving mechanisms (MV2) are respectively connected to the two second clamps (131). The two second moving mechanisms (MV2) are both connected to the third actuating unit (M3) and electrically connected to the control unit (CTR). The two second moving mechanisms (MV2) are controlled by the control unit (CTR) to enable the two second moving mechanisms (MV2) to move toward each other, so that the two second clamps (131) are used to support the protective frame assembly (200) peeled from the substrate (100).

6. The automatic peeling device for peeling the protective frame assembly and the substrate according to claim 1, characterized in that: It also comprises a protection frame component placement portion (3) which is arranged at one side of the carrier (1) and is used for placing the peeled protection frame component (200).

7. The automatic peeling device for peeling the protective frame assembly and the substrate according to claim 1, characterized in that: The heating module (H) is a combination of one or more of an electric heating tube heating module, a coil heating module, a ceramic heating module, a microwave tube heating module, a quartz tube heating module, an infrared heating module or a halogen lamp heating module.

8. The automatic peeling device for peeling the protective frame assembly and the substrate according to claim 1 or 5, characterized in that: The first moving mechanism (MV1) and the second moving mechanism (MV2) are slide rail moving mechanisms.

9. The automatic peeling device for peeling the protective frame assembly and the substrate according to claim 1 or 5, characterized in that: The first actuating unit (M1) and the third actuating unit (M3) are one of a stepping motor, a servo motor and a linear motor.

10. The automatic peeling device for peeling the protective frame assembly and the substrate according to claim 1, characterized in that: The second actuating unit (M2) is a pneumatic cylinder or a hydraulic cylinder.

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