Semiconductor detection equipment and adjusting device thereof

Abstract

The utility model discloses semiconductor detection equipment and an adjusting device thereof. The adjusting device comprises a carrying table, a first lifting mechanism and a second lifting mechanism. The carrying platform is used for carrying a semiconductor device to be detected. The first adjusting mechanism is used for driving the carrying table to ascend and descend in the vertical direction and comprises a first wedge-shaped piece and a second wedge-shaped piece, the second wedge-shaped piece is slidably connected with the first wedge-shaped piece through a wedge-shaped face, and the second wedge-shaped piece is configured to be driven by the first wedge-shaped piece to drive the carrying table to ascend and descend in the vertical direction. The second adjusting mechanism is arranged on the second wedge-shaped piece, the second adjusting mechanism comprises a plurality of adjusting units, each adjusting unit comprises a flexible connecting piece and a micro driving mechanism arranged below the flexible connecting piece, the flexible connecting pieces are connected to the carrying table and the second wedge-shaped piece, and the micro driving mechanisms can stretch and deform in the vertical direction; and the flexible connecting piece is selectively jacked upwards or released. According to the invention, the vertical stroke range of the carrying platform can be expanded, and the vertical adjustment precision of the carrying platform can be improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and in particular relates to a semiconductor detection device and an adjustment device thereof. Background Art

[0002] In recent years, charged particle beam inspection and imaging equipment has become widely used in the semiconductor industry. Scanning electron microscopes, for example, are often used to detect defects in production objects such as chips. Semiconductor inspection equipment is a key component in the semiconductor manufacturing process, inspecting wafer performance and defects and ensuring chip yield.

[0003] Semiconductor testing equipment includes an adjustment mechanism capable of vertical motion. This adjustment structure supports semiconductor devices, such as wafers, and moves vertically to complete a series of actions required for yield testing, including wafer loading and unloading, focusing, and wafer profile measurement. Different types of yield testing require different adjustment positions and precisions, and existing adjustment mechanisms cannot meet the position and precision requirements of various yield tests. Utility Model Content

[0004] The embodiments of the present application provide a semiconductor testing device and an adjustment device thereof, which can meet the position requirements and accuracy requirements of various types of testing.

[0005] According to the first aspect of the present application, the present application provides an adjustment device for a semiconductor testing device, which includes a carrier, a first adjustment mechanism and a second adjustment mechanism. The carrier is used to carry the semiconductor device to be tested. The first adjustment mechanism is used to drive the carrier to rise and fall vertically, and includes a first wedge and a second wedge. The first wedge and the second wedge are slidably connected by a wedge surface, and the second wedge is configured to drive the carrier to rise and fall vertically under the drive of the first wedge. The second adjustment mechanism is provided on the second wedge, and is used to drive the carrier to move slightly vertically. The second adjustment mechanism includes a plurality of adjustment units, each adjustment unit includes a flexible connector and a micro-drive mechanism provided below the flexible connector. The flexible connector is connected to the carrier and the second wedge. The micro-drive mechanism can be telescopically deformed vertically to selectively lift the flexible connector upward or release the flexible connector.

[0006] In some embodiments, the flexible connector includes a first connector, a second connector and a main body, the first connector is fixedly connected to the second wedge, the second connector is fixedly connected to the platform, and the main body is connected between the first connector and the second connector; the micro-drive mechanism is disposed below the main body and can be offset against the main body, and at least a portion of the main body can be bent and deformed relative to the first connector under the lifting action of the micro-drive mechanism.

[0007] In some embodiments, the adjustment unit further includes an elastic member extending vertically, one end of the elastic member is connected to the second connecting portion, and the other end is connected to the second wedge-shaped member; the elastic member is configured to pull the second connecting portion downward.

[0008] In some embodiments, the main body includes a main body and a first thinning portion. Vertically, the thickness of the first thinning portion is smaller than the thickness of the main body and the first connecting portion; the first thinning portion is connected between the main body and the first connecting portion, the main body can offset the micro-driving mechanism, and the first thinning portion can bend and deform relative to the first connecting portion under the lifting action of the micro-driving mechanism on the main body.

[0009] In some embodiments, the main body has a first recess and a second recess, which are respectively located on the upper and lower sides of the first thinning portion, and the first recess and the second recess are both surrounded by the first connecting portion, the first thinning portion and the main body; along the arrangement direction of the first connecting portion and the main body, the size of the first recess is smaller than the size of the second recess.

[0010] In some embodiments, the main body further includes a second thinning portion, and along the vertical direction, the thickness of the second thinning portion is smaller than the thickness of the main body and the second connecting portion; the second thinning portion is connected between the main body and the second connecting portion.

[0011] In some embodiments, the main body has a third recess and a fourth recess, which are respectively located on the upper and lower sides of the second thinning portion, and the third recess and the fourth recess are both surrounded by the main body, the second thinning portion and the second connecting portion; along the arrangement direction of the main body and the second connecting portion, the size of the third recess is smaller than the size of the fourth recess.

[0012] In some embodiments, the second wedge-shaped member includes a wedge-shaped body and multiple mounting parts. The wedge-shaped body is arranged below the carrier. The multiple mounting parts are arranged at intervals along the outer periphery of the wedge-shaped body. The first connecting parts of the multiple adjustment units are respectively connected to the multiple mounting parts. The mounting parts are provided with mounting holes extending vertically, and the micro-drive mechanism is arranged in the mounting holes.

[0013] In some embodiments, the adjustment device also includes a base, and the first wedge is disposed on the base; the first adjustment mechanism also includes a driving mechanism disposed on the base, the driving mechanism is connected to the first wedge and is configured to drive the first wedge to move relative to the base along a first direction, and the first direction is parallel to the horizontal direction.

[0014] In some embodiments, the first adjustment mechanism further includes a first guide rail and a first sliding member, the first guide rail is provided on the base and extends along the first direction, the first sliding member is slidably connected to the first guide rail, and the first wedge member is fixedly connected to the first sliding member.

[0015] In some embodiments, the first adjustment mechanism also includes a second guide rail and a second sliding member, the second sliding member is slidably connected to the second guide rail, one of the second guide rail and the second sliding member is fixed on the first wedge surface of the first wedge member, and the other is fixed on the second wedge surface of the second wedge member.

[0016] In some embodiments, the first adjustment mechanism further includes a third guide rail and a third sliding member, the third guide rail extends vertically, the third sliding member is slidably connected to the third guide rail, and the second wedge member is fixedly connected to the third sliding member.

[0017] In some embodiments, the micro-actuator mechanism comprises a piezoelectric ceramic actuator; and / or the flexible connector comprises a flexible hinge.

[0018] According to the second aspect of the present application, an embodiment of the present application provides a semiconductor detection device, which includes an adjustment device and a detection device provided by any embodiment of the present application, and the detection device is configured to detect the semiconductor device on the carrier.

[0019] The adjustment device provided in the embodiment of the present application includes a first adjustment mechanism and a second adjustment mechanism. The second adjustment mechanism is arranged on the second wedge-shaped piece of the first adjustment mechanism. When the first adjustment structure is lifted or lowered vertically, it drives the second adjustment mechanism to lift or lower synchronously. Each adjustment unit of the second adjustment mechanism generates telescopic deformation through the micro-driving mechanism itself, and transmits the deformation generated by the micro-driving mechanism to the carrier through the flexible connecting member. The telescopic deformation generated by the micro-driving mechanism is relatively small, and can drive the carrier to move slightly vertically relative to the second wedge-shaped piece, thereby realizing the combination of macro-movement and micro-movement of the carrier in the vertical direction, which can expand the vertical movable range of the carrier through the macro-movement of the carrier, and improve the adjustment accuracy through the micro-movement of the carrier, which is conducive to meeting the position requirements and accuracy requirements of various types of detection.

[0020] Moreover, the flexible connector can not only realize a stable connection between the carrier and the second adjustment mechanism, but also transmit the vertical deformation of the micro-drive mechanism to the carrier, which is conducive to the carrier moving up and down more stably in the vertical direction, reducing the shaking of the carrier and reducing the adverse effects on the detection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 A schematic top view of the structure of an adjustment device for semiconductor detection equipment provided in some embodiments of the present application.

[0023] Figure 2 for Figure 1 A partial cross-sectional structural diagram of the regulating device shown.

[0024] Figure 3 for Figure 1 Schematic diagram of the exploded structure of the adjustment device shown.

[0025] Figure 4 for Figure 1 The diagram shows a partial cross-sectional view of the regulating device as viewed from the side.

[0026] Figure 5 for Figure 3 Schematic diagram of the enlarged structure of area A in the middle.

[0027] Figure 6 for Figure 5 Schematic diagram of the enlarged structure of area B in the middle.

[0028] Figure 7 for Figure 5 Schematic diagram of the enlarged structure of area C in the middle.

[0029] Figure 8 A schematic structural diagram of semiconductor testing equipment provided in some embodiments of the present application.

[0030] In the attached figure:

[0031] Adjustment device 1, semiconductor testing equipment 2, testing device 3, semiconductor device 4;

[0032] Base 10, stage 20, first adjustment mechanism 30, first wedge 31, first wedge surface 311, second wedge 32, second wedge surface 321, wedge body 322, mounting portion 323, mounting hole 324, drive mechanism 33, motor 331, screw 332, nut 333, coupling 334, motor mounting seat 335, support seat 336, first guide rail 341, first sliding member 342, second guide rail 351, second sliding member 352, third guide rail 361, third sliding member 362, adjustment unit 40, micro-driving mechanism 41, flexible connecting member 42, first connecting portion 421, second connecting portion 422, main body 423, body 4231, first thinning portion 4232, first recess 4233, second recess 4234, second thinning portion 4235, third recess 4236, fourth recess 4237, elastic member 43, elastic body 431, fixing portion 432, first direction X, second direction Y, vertical Z. DETAILED DESCRIPTION

[0033] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0034] Unless otherwise defined, all technical and scientific terms used in this application have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first" and "second" in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order or a primary-secondary relationship.

[0035] References to "embodiments" in this application mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments.

[0036] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connected," and "attached" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0037] The term "and / or" in this application simply describes an association between related objects, indicating that three possible relationships exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this application generally indicates that the related objects are in an "or" relationship.

[0038] In the embodiments of this application, the same reference numerals represent the same components, and for the sake of brevity, detailed descriptions of the same components in different embodiments are omitted. It should be understood that the thickness, length, width, and other dimensions of the various components in the embodiments of this application, as well as the overall thickness, length, width, and other dimensions of the integrated device shown in the drawings are merely illustrative and should not constitute any limitation on this application.

[0039] The term "plurality" used in this application refers to two or more (including two).

[0040] In the embodiments of the present application, "parallel" includes not only the absolutely parallel situation, but also the roughly parallel situation conventionally recognized in engineering; at the same time, "vertical" includes not only the absolutely vertical situation, but also the roughly vertical situation conventionally recognized in engineering.

[0041] Figure 1 A schematic top view of the structure of an adjustment device for a semiconductor testing device provided in some embodiments of the present application is provided. Figure 2 for Figure 1 A partial cross-sectional structural diagram of the regulating device shown in FIG. Figure 3 for Figure 1 The exploded structural diagram of the regulating device is shown in FIG. Figure 4 for Figure 1 The schematic diagram of the partial cross-section structure of the adjustment device shown in the side view is as follows: Figure 5 for Figure 3 Schematic diagram of the enlarged structure of area A in the middle. Figure 6 for Figure 5 Schematic diagram of the enlarged structure of area B in the middle. Figure 7 for Figure 5 Schematic diagram of the enlarged structure of area C in the middle.

[0042] Reference Figures 1 to 7 An embodiment of the present application provides an adjustment device 1 for a semiconductor testing device. The adjustment device 1 includes a carrier 20, a first adjustment mechanism 30, and a second adjustment mechanism.

[0043] The carrier 20 is used to carry the semiconductor device to be tested. Optionally, the carrier 20 can be a plate-shaped structure. The semiconductor device can be, for example, a wafer.

[0044] Reference Figure 3 and Figure 4 The first adjustment mechanism 30 is used to drive the platform 20 to rise and fall in the vertical direction Z. The first adjustment mechanism 30 includes a first wedge 31 and a second wedge 32, which are slidably connected by a wedge surface. The second wedge 32 is configured to drive the platform 20 to rise and fall in the vertical direction Z under the drive of the first wedge 31.

[0045] The second adjustment mechanism is provided on the second wedge-shaped member 32 and is used to drive the stage 20 to finely move in the vertical direction Z. The second adjustment mechanism includes multiple adjustment units 40, each of which includes a flexible connector 42 and a micro-drive mechanism 41 provided below the flexible connector 42. The flexible connector 42 is connected to the stage 20 and the second wedge-shaped member 32. The micro-drive mechanism 41 can be deformed and extended in the vertical direction Z to selectively lift the flexible connector 42 upward or release the flexible connector 42.

[0046] The first wedge member 31 can move horizontally under the driving action of a driving mechanism or other mechanism. When the first wedge member 31 moves horizontally, it can cause the second wedge member 32 to rise or fall in the vertical direction Z, that is, the second wedge member 32 has a displacement in the vertical direction Z.

[0047] The first wedge member 31 and the second wedge member 32 can be directly slidably connected through the wedge surface, or can be indirectly slidably connected through other structures. For example, the first wedge member 31 and the second wedge member 32 can be slidably connected through guide rails, rollers, etc. provided on the wedge surface.

[0048] Optionally, the first wedge member 31 has a first wedge surface 311, and the second wedge member 32 has a second wedge surface 321. The first wedge surface 311 and the second wedge surface 321 can be directly slidably connected, or can be indirectly connected through structures such as guide rails and rollers. The first wedge surface 311 and the second wedge surface 321 are both inclined surfaces with respect to both the horizontal direction and the vertical direction Z.

[0049] The second adjustment mechanism is integrally provided on the second wedge-shaped member 32 . When the second wedge-shaped member 32 is lifted or lowered along the vertical direction Z, it can drive the second adjustment mechanism to be lifted or lowered synchronously along the vertical direction Z.

[0050] The flexible connector 42 of each adjustment unit 40 is connected to the second wedge member 32, so that each adjustment unit 40 can be raised and lowered synchronously with the second wedge member 32. The flexible connector 42 and the second wedge member 32 can be connected by abutment, screw connection, clamping, or other suitable means. A portion of the flexible connector 42 can be fixed relative to the second wedge member 32.

[0051] A plurality of adjustment units 40 may be spaced apart along the periphery of the carrier 20. The plurality of adjustment units 40 may operate synchronously in a controlled manner. The combination of the plurality of adjustment units 40 facilitates more stable support of the carrier 20.

[0052] The flexible connector 42 can be fixedly connected to the carrier 20. When the second wedge-shaped member 32 is raised or lowered in the vertical direction Z, the carrier 20 can be driven to move up and down by the flexible connector 42, thereby adjusting the position of the carrier 20 in the vertical direction Z. The micro-drive mechanism 41 can stretch and deform upward in the vertical direction Z, and can also shrink and deform downward in the vertical direction Z. When the micro-drive mechanism 41 stretches upward, it can lift the flexible connector 42 upward, thereby lifting the carrier 20 fixedly connected to the flexible connector 42, so that the carrier 20 moves slightly in the vertical direction Z relative to the second wedge-shaped member 32; when the micro-drive mechanism 41 shrinks downward, it can release the lifting effect on the flexible connector 42, thereby releasing the flexible connector 42, which is conducive to the flexible connector 42 and the carrier 20 restoring their positions downward.

[0053] Optionally, the micro-drive mechanism 41 can change its extension state according to whether it is powered on or not. For example, when powered on, the micro-drive mechanism 41 can extend upward along the vertical direction Z; when powered off, the micro-drive mechanism 41 can retract downward along the vertical direction Z.

[0054] When the micro-driving mechanism 41 extends upward, it may directly contact the flexible connecting member 42 , or it may indirectly act on the flexible connecting member 42 through other structures.

[0055] The first adjustment mechanism 30 drives the platform 20 to move up and down along the vertical direction Z through the cooperation of the first wedge 31 and the second wedge 32. Under the driving action of the first adjustment mechanism 30, the displacement of the platform 20 along the vertical direction Z is relatively large, which can realize the macro movement of the platform 20 along the vertical direction Z.

[0056] The second adjustment mechanism generates telescopic deformation through the micro-drive mechanism 41 itself, and transmits the deformation generated by the micro-drive mechanism 41 to the carrier 20 through the flexible connector 42, driving the carrier 20 to move up and down along the vertical Z. The telescopic deformation generated by the micro-drive mechanism 41 is relatively small, and the micro-movement of the carrier 20 along the vertical Z can be realized.

[0057] Optionally, the movement stroke of the first adjustment mechanism 30 along the vertical direction Z may be in the millimeter level, and the movement stroke of the second adjustment mechanism along the vertical direction Z may be in the nanometer level.

[0058] The adjustment device 1 provided in the embodiment of the present application has a first adjustment mechanism 30 and a second adjustment mechanism. The second adjustment mechanism is arranged on the second wedge 32 of the first adjustment mechanism 30. When the first adjustment mechanism 30 is lifted or lowered in the vertical direction Z, it drives the second adjustment mechanism to lift or lower synchronously. Each adjustment unit 40 of the second adjustment mechanism can drive the carrier 20 to move slightly in the vertical direction Z relative to the second wedge 32, thereby realizing the combination of macro-movement and micro-movement of the carrier 20 in the vertical direction Z, which can not only expand the movable stroke range of the carrier 20 in the vertical direction Z, but also improve the adjustment accuracy of the carrier 20 in the vertical direction Z, which is conducive to meeting the position requirements and accuracy requirements of various different types of detection.

[0059] Moreover, the flexible connector 42 can not only realize a stable connection between the carrier 20 and the second adjustment mechanism, but also transmit the deformation of the micro-drive mechanism 41 along the vertical direction Z to the carrier 20, which is beneficial for the carrier 20 to move up and down more stably along the vertical direction Z, reduce the shaking of the carrier 20, and reduce the adverse effects on the detection results.

[0060] In some embodiments, reference Figure 5The flexible connector 42 includes a first connector 421, a second connector 422, and a main body 423. The first connector 421 is fixedly connected to the second wedge-shaped member 32, the second connector 422 is fixedly connected to the carrier 20, and the main body 423 is connected between the first connector 421 and the second connector 422. The micro-actuator 41 is disposed below the main body 423 and is capable of abutting against the main body 423. At least a portion of the main body 423 is capable of bending and deforming relative to the first connector 421 under the lifting action of the micro-actuator 41.

[0061] The first connection portion 421 can be connected to the second wedge-shaped member 32 by screw connection, riveting, clamping or other appropriate methods, and is relatively fixed to the second wedge-shaped member 32.

[0062] The second connection portion 422 can be connected to the carrier 20 by screw connection, riveting, clamping or other appropriate methods, and is relatively fixed to the carrier 20.

[0063] For example, the first connection portion 421, the second connection portion 422 and the main body 423 are an integrally formed structure. Alternatively, the first connection portion 421, the second connection portion 422 and the main body 423 can also be connected by screw connection, riveting or other suitable means.

[0064] Optionally, the material of the flexible connector 42 may include copper. Copper is relatively soft and easily bends and deforms under external influences, thereby driving the carrier 20 to move slightly up and down through the bending deformation.

[0065] The micro-driving mechanism 41 is adjacently located below the main body 423 . When the micro-driving mechanism 41 extends upward, it can abut against the bottom of the main body 423 , thereby lifting the main body 423 .

[0066] Under the lifting action of the micro-drive mechanism 41, the main body 423 can bend and deform as a whole, or only a portion of the main body 423 can bend and deform. At least a portion of the main body 423 can move upward relative to the first connecting portion 421, thereby driving the second connecting portion 422 and the carrier 20 to move upward.

[0067] The first connecting portion 421 of the flexible connector 42 is fixed to the second wedge-shaped member 32, and the second connecting portion 422 of the flexible connector 42 is fixed to the platform 20. This helps improve the connection stability between the flexible connector 42 and the second wedge-shaped member 32, and between the flexible connector 42 and the platform 20, thereby improving the support stability of the platform 20 and further reducing the adverse effects on the test results. The flexible connector 42 transmits the extension of the micro-drive mechanism 41 in the vertical direction Z to the second connecting portion 422 and the platform 20 through the deformation of the main portion 423, which facilitates fine adjustment of the platform 20 in the vertical direction Z.

[0068] In some embodiments, reference Figure 5 The adjustment unit 40 further includes an elastic member 43 extending along the vertical direction Z. One end of the elastic member 43 is connected to the second connecting portion 422, and the other end is connected to the second wedge-shaped member 32. The elastic member 43 is configured to pull the second connecting portion 422 downward.

[0069] The elastic member 43 can generate elastic deformation along the vertical direction Z. For example, the elastic member 43 can be stretched and compressed along the vertical direction Z.

[0070] The elastic member 43 may include an elastic body 431 and two fixing portions 432. The elastic body 431 extends along the vertical direction Z. The two fixing portions 432 are respectively provided at both ends of the elastic body 431 along the vertical direction Z and are respectively connected to the second connecting portion 422 and the second wedge-shaped member 32. For example, the elastic body 431 may be a spring, and the fixing portions 432 may be fixing rings.

[0071] In some examples, when the micro-driving mechanism 41 does not lift the flexible connector 42 , the elastic member 43 may be in a natural state; when the micro-driving mechanism 41 lifts the flexible connector 42 , the elastic member 43 may be in a stretched state.

[0072] In other examples, the elastic member 43 may also be in a stretched state all the time.

[0073] The elastic member 43 can pull the second connecting portion 422 downward. After the micro-drive mechanism 41 releases the flexible connecting portion 42, the second connecting portion 422 can move downward under the pulling action of the elastic member 43 and the gravity of the platform 20 and the second connecting portion 422, thereby driving the platform 20 downward. The elastic member 43 and the micro-drive mechanism 41 cooperate to achieve micro-motion of the platform 20 up and down in the vertical direction Z. In addition, the elastic member 43 pulling the second connecting portion 422 downward can also restore the bent and deformed portion of the main body 423 to its pre-deformation state.

[0074] In some embodiments, reference Figure 6 The main body 423 includes a main body 4231 and a first thinned portion 4232. Along the vertical direction Z, the thickness of the first thinned portion 4232 is less than the thickness of the main body 4231 and the first connecting portion 421. The first thinned portion 4232 is connected between the main body 4231 and the first connecting portion 421. The main body 4231 can be offset against the micro-actuator 41. The first thinned portion 4232 can bend and deform relative to the first connecting portion 421 when the micro-actuator 41 lifts the main body 4231.

[0075] The first connecting portion 421 may be a horizontally placed plate-shaped structure, and the first connecting portion 421 and the second wedge-shaped member 32 may be in surface contact and connected.

[0076] The first thinned portion 4232 may be directly connected to the main body 4231 , or other connection structures may be provided between the first thinned portion 4232 and the main body 4231 .

[0077] The first thinned portion 4232 may be directly connected to the first connecting portion 421 , or other connecting structures may be provided between the first thinned portion 4232 and the first connecting portion 421 .

[0078] The main body 4231 may be located directly above the micro-driving mechanism 41 , and the micro-driving mechanism 41 may directly abut against the main body 4231 when extending and deforming upward.

[0079] The thickness of the first thinning portion 4232 is relatively small and is easy to deform. The thickness of the body 4231 and the first connecting portion 421 is relatively large, and the deformation resistance is strong, and it is not easy to deform. The body 4231 can withstand the lifting effect of the micro-drive mechanism 41 and move upward, and the first thinning portion 4232 is bent and deformed, and a relative motion along the vertical Z is generated between the body 4231 and the first connecting portion 421. Thus, the first connecting portion 421 can be fixed relative to the second wedge 32, and the body 4231 can move along the vertical Z relative to the second wedge 32, which is conducive to improving the connection stability between the flexible connector 42 and the second wedge 32 (for example, the first connecting portion 421 will not tilt due to the lifting effect of the micro-drive mechanism 41 on the body 4231), and is also conducive to realizing the micro-motion of the carrier 20 along the vertical Z.

[0080] In some embodiments, the main body 423 has a first recess 4233 and a second recess 4234, which are respectively located above and below the first thinned portion 4232. The first recess 4233 and the second recess 4234 are both enclosed by the first connecting portion 421, the first thinned portion 4232, and the main body 4231. Along the arrangement direction of the first connecting portion 421 and the main body 423, the size of the first recess 4233 is smaller than the size of the second recess 4234.

[0081] The first recess 4233 is formed by the first connecting portion 421, the first thinned portion 4232, and the main body 4231. The first recess 4233 is open at least upward, and a clearance space is formed within the first recess 4233. When the main body 4231 moves upward relative to the first connecting portion 421, the first recess 4233 can make way for the main body 4231, thereby reducing the possibility of interference between the main body 4231 and the first connecting portion 421.

[0082] The second recess 4234 is formed by the first connecting portion 421, the first thinned portion 4232, and the main body 4231. The second recess 4234 is open at least downwardly and also forms a clearance space within the second recess 4234. When the main body 4231 moves downward relative to the first connecting portion 421, the second recess 4234 can make way for the main body 4231, thereby reducing the possibility of interference between the main body 4231 and the first connecting portion 421.

[0083] The flexible connector 42 is integrally supported on the second wedge-shaped member 32. When the body 4231 moves downward relative to the first connecting portion 421, it is likely to interfere not only with the first connecting portion 421 but also with the second wedge-shaped member 32. To this end, the second recess 4234 is relatively larger, providing more clearance and reducing the possibility of interference between the body 4231 and the second wedge-shaped member 32.

[0084] In some embodiments, reference Figure 7 The main body 423 further includes a second thinning portion 4235 . Along the vertical direction Z, the thickness of the second thinning portion 4235 is smaller than the thickness of the main body 4231 and the second connecting portion 422 . The second thinning portion 4235 is connected between the main body 4231 and the second connecting portion 422 .

[0085] The second connection portion 422 may be a horizontally placed plate-shaped structure. The second connection portion 422 and the carrier 20 may be in surface contact and connected to improve the stability of the carrier 20 .

[0086] The second thinned portion 4235 may be directly connected to the main body 4231 , or other connection structures may be provided between the second thinned portion 4235 and the main body 4231 .

[0087] The second thinned portion 4235 may be directly connected to the second connecting portion 422 , or other connecting structures may be provided between the second thinned portion 4235 and the second connecting portion 422 .

[0088] The thickness of the second thinned portion 4235 and the first thinned portion 4232 may be the same or different.

[0089] The thicknesses of the body 4231 , the first connection portion 421 , and the second connection portion 422 may be the same or different.

[0090] The second thinning portion 4235 is relatively thin and easily deformed, while the second connecting portion 422 is relatively thick and has a strong deformation resistance and is not easily deformed.

[0091] It is understood that, under the lifting action of the micro-drive mechanism 41, the body 4231 as a whole rotates about the axis between the body 4231 and the first connecting portion 421, causing the body 4231 to tilt as a whole. If the second connecting portion 422 is rigidly connected to the body 4231, the second connecting portion 422 will tilt with the body 4231, affecting the connection between the second connecting portion 422 and the carrier 20.

[0092] In the embodiment of the present application, a second thinning portion 4235 is provided between the main body 4231 and the second connecting portion 422, so that the second thinning portion 4235 can produce a certain bending deformation. As a result, the second connecting portion 422 can move along the vertical Z direction under the drive of the main body 4231, thereby driving the carrier 20 to move along the vertical Z direction. The second connecting portion 422 can also maintain a stable connection with the carrier 20 through the bending deformation of the second thinning portion 4235, reducing the possibility of the second connecting portion 422 rotating and tilting, which is beneficial to improving the connection stability between the second connecting portion 422 and the carrier 20, thereby improving the support stability of the carrier 20.

[0093] In some embodiments, the main body 423 has a third recess 4236 and a fourth recess 4237, which are located above and below the second thinned portion 4235, respectively. The third recess 4236 and the fourth recess 4237 are both enclosed by the body 4231, the second thinned portion 4235, and the second connecting portion 422. Along the arrangement direction of the main body 423 and the second connecting portion 422, the size of the third recess 4236 is smaller than the size of the fourth recess 4237.

[0094] The third recess 4236 is formed by the body 4231, the second thinned portion 4235, and the second connecting portion 422. The third recess 4236 is open at least upward, and a clearance space is formed within the third recess 4236. When the body 4231 moves upward relative to the second connecting portion 422, the third recess 4236 can make way for the body 4231, thereby reducing the possibility of interference between the body 4231 and the second connecting portion 422.

[0095] The fourth recess 4237 is formed by the body 4231, the second thinned portion 4235, and the second connecting portion 422. The fourth recess 4237 is open at least downwardly and also defines a clearance space within the fourth recess 4237. When the body 4231 moves downward relative to the second connecting portion 422, the fourth recess 4237 can make way for the body 4231, thereby reducing the possibility of interference between the body 4231 and the second connecting portion 422.

[0096] The flexible connector 42 is integrally supported on the second wedge-shaped member 32. When the body 4231 moves downward relative to the second connecting portion 422, it is likely to interfere not only with the second connecting portion 422 but also with the second wedge-shaped member 32. To this end, the fourth recess 4237 is relatively larger in size to provide more clearance, thereby reducing the possibility of interference between the body 4231 and the second wedge-shaped member 32, and between the second connecting portion 422 and the second wedge-shaped member 32.

[0097] In some embodiments, reference Figure 3 and Figure 5 The second wedge-shaped member 32 includes a wedge-shaped body 322 and multiple mounting portions 323. The wedge-shaped body 322 is arranged below the carrier 20. The multiple mounting portions 323 are arranged at intervals along the outer periphery of the wedge-shaped body 322. The first connecting portions 421 of the multiple adjustment units 40 are respectively connected to the multiple mounting portions 323. The mounting portions 323 are provided with mounting holes 324 extending along the vertical direction Z, and the micro-driving mechanism 41 is arranged in the mounting hole 324.

[0098] The wedge-shaped body 322 and the plurality of mounting portions 323 may be an integrally formed structure, or may be connected together in a suitable manner.

[0099] Optionally, both the first connecting portion 421 and the mounting portion 323 are provided with connecting holes, and the first connecting portion 421 and the mounting portion 323 are connected by screws passing through the connecting holes.

[0100] The mounting hole 324 may be a blind hole extending along the vertical direction Z. The opening of the mounting hole 324 faces upward, and a portion of the micro-driving mechanism 41 may be exposed through the opening of the mounting hole 324 .

[0101] The wedge-shaped body 322 has a second wedge-shaped surface 321 , which may be a bottom surface of the wedge-shaped body 322 . The first wedge-shaped surface 311 may be a top surface of the first wedge 31 .

[0102] The number of the mounting portions 323 can match the number of the adjustment units 40 . Each adjustment unit 40 is mounted on a corresponding mounting portion 323 .

[0103] Optionally, the wedge-shaped body 322 may have four corner portions, and there may be four mounting portions 323 and four adjustment units 40. The four mounting portions 323 are respectively arranged at the four corner portions of the wedge-shaped body 322, and the four adjustment units 40 are respectively installed on the four mounting portions 323. The four adjustment units 40 are connected to different positions on the edge of the carrier 20.

[0104] In some embodiments, reference Figure 2The adjustment device 1 further includes a base 10, with a first wedge 31 disposed thereon. The first adjustment mechanism 30 further includes a drive mechanism 33 disposed thereon. The drive mechanism 33 is connected to the first wedge 31 and is configured to drive the first wedge 31 to move along a first direction X, which is parallel to the horizontal direction. The base 10 provides bottom support for the entire adjustment device 1. The base 10 may include a horizontally positioned bottom plate to enhance support stability.

[0105] The driving mechanism 33 may be a screw-nut mechanism, a gear-rack mechanism, or other suitable driving mechanism capable of transmitting horizontal power to the first wedge-shaped member 31 .

[0106] In some embodiments, the drive mechanism 33 includes a motor 331, a lead screw 332, and a nut 333. The motor 331 is used to provide power. The lead screw 332 is rotatably supported on the base 10 about a rotation axis and is connected to the motor 331. The rotation axis of the lead screw 332 is parallel to the first direction X. The nut 333 is threadedly connected to the lead screw 332 to form a "lead screw nut mechanism" with the lead screw 332. The nut 333 is fixedly connected to the first wedge member 31.

[0107] The lead screw 332 can rotate around the horizontal axis driven by the motor 331. When the lead screw 332 rotates under the driving action of the motor 331, the nut 333 moves horizontally along the lead screw 332, thereby driving the first wedge 31 to move along the first direction X.

[0108] Exemplarily, the motor 331 may be a stepper motor, a servo motor, or the like.

[0109] Optionally, the driving mechanism 33 further includes a coupling 334 , and the motor 331 can be connected to the lead screw 332 via the coupling 334 .

[0110] The driving mechanism 33 further includes a motor mounting seat 335 and a support seat 336 provided on the base 10. The motor 331 is provided on the motor mounting seat 335, and both ends of the lead screw 332 are respectively mounted on the motor mounting seat 335 and the support seat 336 through bearings.

[0111] In some embodiments, reference Figure 3 The first adjustment mechanism 30 also includes a first guide rail 341 and a first sliding member 342. The first guide rail 341 is provided on the base 10 and extends along the first direction X. The first sliding member 342 is slidably connected to the first guide rail 341. The first wedge member 31 is fixedly connected to the first sliding member 342.

[0112] The first guide rail 341 can be connected to the base 10 by screw connection, riveting, clamping or other appropriate methods.

[0113] The first sliding member 342 can be connected to the first wedge member 31 by screw connection, riveting, clamping or other suitable means.

[0114] There may be two first guide rails 341 and two first sliding members 342 . The two first guide rails 341 are spaced apart along the second direction Y. The second direction Y is parallel to the horizontal direction and perpendicular to the first direction X.

[0115] The cooperation between the first guide rail 341 and the first sliding member 342 can guide the movement of the first wedge member 31 along the first direction X, which is conducive to improving the smoothness of the movement of the first wedge member 31 along the first direction X.

[0116] In some embodiments, reference Figure 3 The first adjustment mechanism 30 also includes a second guide rail 351 and a second sliding member 352. The second sliding member 352 is slidably connected to the second guide rail 351. One of the second guide rail 351 and the second sliding member 352 is fixed on the first wedge surface 311 of the first wedge member 31, and the other is fixed on the second wedge surface 321 of the second wedge member 32.

[0117] The second guide rail 351 and the second sliding member 352 form a sliding guide structure, and the first wedge member 31 and the second wedge member 32 are slidably connected through the sliding guide structure.

[0118] One of the second guide rail 351 and the second sliding member 352 is disposed on the first wedge surface 311 and fixed relative to the first wedge member 31 ; the other of the second guide rail 351 and the second sliding member 352 is disposed on the second wedge surface 321 and fixed relative to the second wedge member 32 .

[0119] Optionally, the second guide rail 351 is provided on the first wedge surface 311 and is connected to the first wedge member 31 by screw connection, riveting, clamping or other suitable means. The second sliding member 352 is provided on the second wedge surface 321 and is connected to the second wedge member 32 by screw connection, riveting, clamping or other suitable means.

[0120] Alternatively, the second guide rail 351 and the second sliding member 352 may also be interchangeable.

[0121] The first wedge surface 311 and the second wedge surface 321 are arranged in parallel, and the second guide rail 351 extends along the inclined direction of the first wedge surface 311 and the second wedge surface 321 .

[0122] There may be two first wedge surfaces 311 and two second wedge surfaces 321 , the two first wedge surfaces 311 being opposite and spaced apart along the second direction Y, and the two second wedge surfaces 321 being opposite and spaced apart along the second direction Y. Accordingly, there may also be two second guide rails 351 and two second sliding members 352 .

[0123] Optionally, the second guide rail 351 may be a cross-ball guide rail to reduce the possibility of the second sliding member 352 falling off the second guide rail 351 , reduce the risk of jamming or blocking, and improve sliding smoothness.

[0124] The first wedge member 31 and the second wedge member 32 are adaptively connected through the second guide rail 351 and the second sliding member 352. The relative movement between the first wedge member 31 and the second wedge member 32 can be guided by the cooperation of the second guide rail 351 and the second sliding member 352, which is conducive to reducing friction and improving movement smoothness.

[0125] In some embodiments, reference Figure 2 and Figure 4 The first adjustment mechanism 30 also includes a third guide rail 361 and a third sliding member 362. The third guide rail 361 is fixed to the base 10 and extends along the vertical direction Z. The third sliding member 362 is slidably connected to the third guide rail 361. The second wedge member 32 is fixedly connected to the third sliding member 362.

[0126] The third guide rail 361 can be connected to the base 10 by screw connection, riveting, clamping or other suitable methods.

[0127] The second wedge member 32 may be connected to the second wedge member 32 by screw connection, riveting, clamping or other suitable means.

[0128] Optionally, the third guide rail 361 may be a cross-ball guide rail to reduce the possibility of the third sliding member 362 falling off the third guide rail 361 , reduce the risk of jamming or blocking, and improve sliding smoothness.

[0129] The third sliding member 362 is slidably connected to the third guide rail 361 , and the third guide rail 361 can limit the sliding direction of the third sliding member 362 to the vertical direction Z, thereby limiting the movement of the second wedge member 32 to translation along the vertical direction Z.

[0130] In some embodiments, the micro-drive mechanism 41 includes a piezoelectric ceramic driver.

[0131] In some embodiments, the flexible connection 42 comprises a flexible hinge.

[0132] The present application also provides a semiconductor testing device 2. Figure 8 This is a schematic diagram of the structure of the semiconductor testing equipment provided in the embodiment of the present application. For ease of understanding, Figure 8 The semiconductor device 4 to be tested is also shown in FIG. Figure 8 The semiconductor testing device 2 includes the adjustment device 1 and the testing device 3 provided according to any embodiment of the present application. The testing device 3 is configured to test the semiconductor device 4 on the carrier 20.

[0133] In some examples, the semiconductor inspection device 2 may be a defect inspection device for inspecting surface defects of the semiconductor device 4 . In other examples, the semiconductor inspection device 2 may be a measurement device for measuring critical dimensions of the semiconductor device 4 .

[0134] The detection device 3 can be connected to the adjustment device 1 or can be provided separately from the adjustment device 1 .

[0135] The adjustment device 1 can realize macro-movement and micro-movement of the carrier 20 along the vertical direction Z. The carrier 20 has a large motion range and high motion accuracy along the vertical direction Z, which is beneficial to improving the structural layout flexibility and detection accuracy of the semiconductor detection equipment 2.

[0136] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. An adjustment device for semiconductor testing equipment, characterized in that: include: A carrier, used for carrying a semiconductor device to be tested; a first adjustment mechanism for driving the platform to move vertically upward and downward, the first adjustment mechanism comprising a first wedge-shaped member and a second wedge-shaped member, the first wedge-shaped member and the second wedge-shaped member being slidably connected via a wedge-shaped surface, the second wedge-shaped member being configured to drive the platform to move vertically upward and downward under the drive of the first wedge-shaped member; as well as The second adjustment mechanism is provided on the second wedge-shaped piece and is used to drive the carrier to move slightly in the vertical direction. The second adjustment mechanism includes multiple adjustment units. Each adjustment unit includes a flexible connector and a micro-drive mechanism provided below the flexible connector. The flexible connector is connected to the carrier and the second wedge-shaped piece. The micro-drive mechanism can be telescopically deformed in the vertical direction to selectively lift the flexible connector upward or release the flexible connector.

2. The adjustment device according to claim 1, characterized in that The flexible connector includes a first connector, a second connector, and a main body, wherein the first connector is fixedly connected to the second wedge-shaped member, the second connector is fixedly connected to the platform, and the main body is connected between the first connector and the second connector. The micro-driving mechanism is disposed below the main body and can abut against the main body. At least a portion of the main body can be bent and deformed relative to the first connecting portion under the lifting action of the micro-driving mechanism.

3. The adjustment device according to claim 2, characterized in that The adjusting unit further includes an elastic member extending in the vertical direction, one end of the elastic member being connected to the second connecting portion, and the other end of the elastic member being connected to the second wedge-shaped member; The elastic member is configured to pull the second connecting portion downward.

4. The adjusting device according to claim 2 or 3, characterized in that: The main body portion includes a main body and a first thinned portion, and along the vertical direction, the thickness of the first thinned portion is smaller than the thickness of the main body and the first connecting portion; The first thinning portion is connected between the body and the first connecting portion. The body can be offset against the micro-driving mechanism. The first thinning portion can be bent and deformed relative to the first connecting portion under the lifting action of the micro-driving mechanism on the body.

5. The adjustment device according to claim 4, characterized in that The main body has a first recess and a second recess, the first recess and the second recess are respectively located on the upper side and the lower side of the first thinned portion, and the first recess and the second recess are both enclosed by the first connecting portion, the first thinned portion and the main body; Along an arrangement direction of the first connecting portion and the main body portion, a size of the first recess is smaller than a size of the second recess.

6. The adjustment device according to claim 4, characterized in that The main body portion further includes a second thinned portion, and along the vertical direction, the thickness of the second thinned portion is smaller than the thickness of the body and the second connecting portion; The second thinned portion is connected between the body and the second connecting portion.

7. The adjustment device according to claim 6, characterized in that The main body has a third recess and a fourth recess, the third recess and the fourth recess are respectively located on the upper side and the lower side of the second thinned portion, and the third recess and the fourth recess are both enclosed by the main body, the second thinned portion and the second connecting portion; Along an arrangement direction of the main body portion and the second connecting portion, a size of the third recess is smaller than a size of the fourth recess.

8. The adjustment device according to claim 2, characterized in that The second wedge-shaped member includes a wedge-shaped body and multiple mounting parts. The wedge-shaped body is arranged below the carrier. The multiple mounting parts are arranged at intervals along the outer circumference of the wedge-shaped body. The first connecting parts of the multiple adjustment units are respectively connected to the multiple mounting parts. The mounting parts are provided with mounting holes extending along the vertical direction. The micro-drive mechanism is arranged in the mounting hole.

9. The adjustment device according to claim 1, characterized in that The adjusting device also includes a base, and the first wedge-shaped member is arranged on the base; the first adjusting mechanism also includes a driving mechanism arranged on the base, the driving mechanism is connected to the first wedge-shaped member, and is configured to drive the first wedge-shaped member to move relative to the base along a first direction, and the first direction is parallel to the horizontal direction.

10. The adjustment device according to claim 9, characterized in that The first adjustment mechanism further includes a first guide rail and a first sliding member. The first guide rail is provided on the base and extends along the first direction. The first sliding member is slidably connected to the first guide rail. The first wedge-shaped member is fixedly connected to the first sliding member.

11. The adjustment device according to claim 1, characterized in that The first adjustment mechanism also includes a second guide rail and a second sliding member, the second sliding member is slidably connected to the second guide rail, one of the second guide rail and the second sliding member is fixed on the first wedge surface of the first wedge member, and the other is fixed on the second wedge surface of the second wedge member.

12. The adjustment device according to claim 1, characterized in that The first adjustment mechanism further includes a third guide rail and a third sliding member, the third guide rail extends vertically, the third sliding member is slidably connected to the third guide rail, and the second wedge-shaped member is fixedly connected to the third sliding member.

13. The adjustment device according to claim 1, characterized in that The micro-driving mechanism includes a piezoelectric ceramic driver; and / or The flexible connection comprises a flexible hinge.

14. A semiconductor testing device, characterized in that: include: The regulating device according to any one of claims 1 to 13; as well as The detection device is configured to detect the semiconductor device on the carrier.

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