Suction nozzle assembly, binding head assembly and eutectic device

Abstract

The utility model relates to the technical field of eutectic equipment, in particular to a suction nozzle assembly, a binding head assembly and an eutectic device. The suction nozzle assembly comprises a suction nozzle body, a pressing block, a pressure sensor and an elastic piece, a receding channel is formed in one side of the suction nozzle body, a containing groove is formed in the suction nozzle body, a groove opening of the containing groove is communicated with the receding channel, and a partial area of the groove bottom of the containing groove penetrates through the suction nozzle body in the axial direction to form an air suction channel. The pressing block is close to the receding channel and arranged in the containing groove, and part of the pressing block penetrates through the receding channel and is exposed out of the suction nozzle body. The pressing block is provided with a through hole in the axial direction of the receding channel, wherein the through hole communicates with the interior of the containing groove and the outside. One end of the elastic piece is close to the through hole and connected with the pressing block, the other end of the elastic piece is connected with the groove bottom of the containing groove, and when the suction nozzle assembly exerts pressure on the chip for eutectic, the pressing block can drive the elastic piece to do telescopic motion in the containing groove. The problem that a suction nozzle assembly is prone to causing chip damage due to overlarge downward pressure is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of eutectic, in particular to a nozzle assembly, a head binding assembly and a eutectic device. Background Art

[0002] In the eutectic soldering process, the suction nozzle is a key component in automated equipment that enables high-precision, high-efficiency, and high-reliability soldering. The nozzle utilizes vacuum pressure to safely, stably, and non-destructively pick up delicate chips, enabling movement or eutectic operations on compact components. Especially during the eutectic process, after the nozzle picks up the chip, it typically applies downward pressure to more stably secure it to the substrate. However, existing nozzles often damage the chip due to excessive downward pressure. Utility Model Content

[0003] In order to solve the problem that a conventional nozzle assembly is prone to chip damage due to excessive downward pressure, the utility model provides a nozzle assembly, a head binding assembly and a eutectic device.

[0004] In order to solve the above technical problems, the utility model provides the following technical solutions: a suction nozzle assembly for performing eutectic operation on chips, the suction nozzle assembly includes a suction nozzle body, a pressure block and an elastic member, a yield channel is opened on one side of the suction nozzle body, a receiving groove is provided in the suction nozzle body, the notch of the receiving groove is connected with the yield channel, and a partial area of the bottom of the receiving groove penetrates the suction nozzle body along the axial direction to form an air suction channel, the pressure block is arranged in the receiving groove near the yield channel, and part of the pressure block passes through the yield channel and is exposed to the suction nozzle body; a through hole connecting the inside of the receiving groove and the outside is provided on the pressure block along the axial direction of the yield channel; one end of the elastic member is connected to the pressure block near the through hole, and the other end is connected to the bottom of the receiving groove. When the suction nozzle assembly applies pressure to the chip for eutectic, the pressure block can drive the elastic member to perform telescopic movement in the receiving groove.

[0005] Preferably, the pressure block includes a mounting portion and an operating portion that are connected to each other, the mounting portion is accommodated in the accommodating groove, one end of the elastic member is connected to the bottom of the accommodating groove away from the end of the mounting portion, and the other end is connected to the mounting portion, the operating portion is arranged at the end of the mounting portion away from the elastic member, and the end of the operating portion away from the mounting portion passes through the makeshift channel and is exposed to the nozzle body, the operating portion is transitionally matched with the makeshift channel, and the mounting portion and the operating portion are provided with a through hole connecting the inside of the accommodating groove and the outside.

[0006] Preferably, the elastic member is coaxially arranged with the operating portion, and when the elastic member is deformed, the end of the operating portion away from the mounting portion is always exposed to the nozzle body.

[0007] Preferably, the inner diameter of the accommodating groove is larger than the inner diameter of the air suction channel, and the inner diameter of the accommodating groove is larger than the inner diameter of the clearance channel.

[0008] Preferably, there is one clearance channel, and the axis of the clearance channel, the axis of the accommodating groove and the axis of the air intake channel are the same.

[0009] Preferably, there are at least two give way channels, and the air suction channel includes a first air suction channel and a second air suction channel. The first air suction channel that runs through the suction nozzle body is provided on the side of the accommodating groove away from the pressure block, and a partial area of the bottom of the accommodating groove is provided with a second air suction channel that connects the first air suction channel and the inside of the accommodating groove.

[0010] Preferably, the end of the operating portion away from the mounting portion is a contact end, and the distance between two adjacent contact ends is less than 1 mm.

[0011] Preferably, the suction nozzle assembly also includes a pressure sensor, which is arranged on the pressure block; when the suction nozzle assembly sucks the chip, the outside air enters the first suction channel through the through hole, the inside of the receiving groove, and the second suction channel in sequence; when the suction nozzle assembly applies pressure to the chip for eutectic, the pressure block can drive the elastic part to perform telescopic movement in the receiving groove, and the pressure sensor is used to perform pressure detection on the chip.

[0012] In order to solve the above technical problems, the present invention provides another technical solution as follows: a head binding assembly, comprising a driving assembly and the above-mentioned suction nozzle assembly, wherein the suction nozzle assembly is detachably connected to the driving assembly.

[0013] In order to solve the above technical problems, the present invention provides another technical solution as follows: a eutectic device, including an operating table, a eutectic table, a control component and a head binding component as described above, wherein the eutectic table and the head binding component are arranged on the operating table, the control component and the head binding component are electrically connected, and the head binding component is used to perform eutectic operation on the chip.

[0014] Compared with the prior art, the nozzle assembly, head binding assembly and eutectic device provided by the present invention have the following beneficial effects:

[0015] 1. The embodiment of the present invention provides a nozzle assembly for performing eutectic operation on a chip. The nozzle assembly includes a nozzle body, a pressure block, and an elastic member. A yield channel is provided on one side of the nozzle body, and a receiving groove is provided in the nozzle body. The notch of the receiving groove is connected to the yield channel. Part of the bottom of the receiving groove penetrates the nozzle body in the axial direction to form an air suction channel. The pressure block is provided in the receiving groove near the yield channel, and part of the pressure block passes through the yield channel and is exposed to the nozzle body. A through hole connecting the inside of the receiving groove and the outside is provided on the pressure block in the axial direction of the yield channel. One end of the elastic member is connected to the pressure block near the through hole, and the other end is connected to the bottom of the receiving groove. When the nozzle assembly applies pressure to the chip for eutectic operation, the pressure block can drive the elastic member to perform telescopic movement in the receiving groove. This embodiment constructs a passive pressure buffer structure inside the nozzle assembly through the linkage effect of the pressure block and the elastic member. During the eutectic operation, when the applied downward pressure exceeds the preset safety threshold, the elastic part can immediately respond and produce telescopic deformation, effectively absorbing excessive impact energy and limiting the actual pressure transmitted to the chip to a safe range, thereby significantly reducing the risk of chip damage due to excessive downward pressure.

[0016] 2. The present embodiment of the pressure block includes a mounting portion and an operating portion that are interconnected. The mounting portion is housed within a receiving groove. One end of an elastic member is connected to the bottom of the receiving groove at the end of the receiving groove distal to the mounting portion, and the other end is connected to the mounting portion. The operating portion is disposed at the end of the mounting portion distal to the elastic member, and the end of the operating portion distal to the mounting portion is exposed to the nozzle body through a clearance channel. The operating portion and the clearance channel are transitionally connected, and a through hole is formed between the mounting portion and the operating portion to connect the interior of the receiving groove with the outside world. The mounting portion of this embodiment serves as an anchor point for the elastic member and is completely housed within the receiving groove. Its direct connection to the elastic member allows the pressure transmitted by the operating portion to be efficiently converted into axial deformation of the elastic member, maximizing its cushioning effectiveness. The operating portion, as the component that directly contacts the chip, has its exposed end extended through the clearance channel through a transitional fit. This ensures that the operating portion can slide freely axially along the clearance channel while limiting radial movement, thereby maintaining the direction of force application during the pressure block's retraction. This prevents localized stress concentration on the chip caused by pressure block deflection or unnecessary radial deformation of the elastic member due to radial force.

[0017] 3. In this embodiment of the present invention, when the elastic member deforms, the end of the operating portion away from the mounting portion remains exposed to the outside of the nozzle body. Regardless of the degree of compression of the elastic member, the operating portion remains partially exposed to the outside of the nozzle body. Ambient air can continuously flow through the operating portion through-hole, the mounting portion through-hole, and the receiving groove to the suction channel, ensuring that the vacuum adsorption system maintains a zero-interruption air path throughout the entire die bonding process.

[0018] 4. In this embodiment of the utility model, the inner diameter of the receiving groove is larger than the inner diameter of the air inlet channel, and the inner diameter of the receiving groove is larger than the inner diameter of the air outlet channel. This embodiment establishes a stepped flow resistance by limiting the inner diameters of the three channels, thereby optimizing the airflow organization efficiency.

[0019] 5. In this embodiment of the utility model, there is only one clearance channel, and the axis of the clearance channel, the axis of the receiving slot, and the axis of the suction channel are aligned. The nozzle assembly is a single-contact nozzle. In this embodiment, the axis of the clearance channel, the axis of the receiving slot, and the axis of the suction channel are aligned. After passing through the operating portion through-hole and the receiving slot, ambient air flows directly along the axis to the suction channel, shortening the shortest airflow path.

[0020] 6. This embodiment of the present invention features at least two air passages, including a first and a second air passage. The first air passage, which extends through the nozzle body, is located on the side of the receiving groove away from the pressure block. A second air passage, connecting the first air passage and the interior of the receiving groove, is located in a portion of the bottom of the receiving groove. The nozzle assembly of this embodiment incorporates multiple pressure blocks, ensuring that chips of varying thicknesses can contact the pressure blocks during operation. Each pressure block can achieve independent force control.

[0021] 7. In this embodiment, the end of the operating portion away from the mounting portion is the contact end, and the distance between two adjacent contact ends is less than 1 mm. The nozzle assembly design in this embodiment can support simultaneous die bonding of multiple chips with a pitch less than 1 mm, and can be equipped with a vacuum vent line to vacuum-adsorb the chips, meeting the requirements of multi-chip die bonding with a small pitch.

[0022] 8. The nozzle assembly of the present invention also includes a pressure sensor, which is provided on the pressure block. When the nozzle assembly sucks a chip, outside air enters the first suction channel through the through hole, the interior of the receiving groove, and the second suction channel in sequence. When the nozzle assembly applies pressure to the chip to form a eutectic, the pressure block can drive the elastic member to perform telescopic movement within the receiving groove, and the pressure sensor is used to detect pressure on the chip. During eutectic, the pressure block drives the sensor to move synchronously, outputting real-time pressure feedback. If the pressure feedback is too large, the nozzle assembly can be controlled to reduce the pressure applied to the chip while the elastic member provides buffering, thereby evolving the nozzle assembly from a mechanical actuator to an operating terminal with perception capabilities.

[0023] 9. The embodiment of the present invention also provides a head binding assembly, which has the same beneficial effects as the above-mentioned nozzle assembly and will not be described in detail here.

[0024] 10. The embodiment of the present invention also provides a eutectic device, which has the same beneficial effects as the above-mentioned head binding assembly and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0026] Figure 1 This is a schematic diagram of the structure of the nozzle assembly provided by the first embodiment of the present invention. Figure 1 .

[0027] Figure 2 yes Figure 1 A cross-sectional view of the nozzle assembly in the figure is produced along the direction of the common diameter of the multiple through holes.

[0028] Figure 3 yes Figure 2 Enlarged view of the middle area.

[0029] Figure 4 This is a schematic diagram of the structure of the nozzle assembly provided by the first embodiment of the present invention. Figure 2 .

[0030] Figure 5 yes Figure 4 A cross-sectional view of the nozzle assembly in the radial direction of the through hole.

[0031] Figure 6 yes Figure 5 Enlarged view of the middle area.

[0032] Figure 7 This is a schematic diagram of the working of the head binding assembly provided by the second embodiment of the present invention. Figure 1 .

[0033] Figure 8 This is a schematic diagram of the working of the head binding assembly provided by the second embodiment of the present invention. Figure 2 .

[0034] Figure 9 This is a schematic diagram of the working of the head binding assembly provided by the second embodiment of the present invention. Figure 3 .

[0035] Description of the accompanying drawings:

[0036] 10. Nozzle assembly;

[0037] 1. Nozzle body; 2. Pressing block; 3. Elastic part;

[0038] 11. Clearance channel; 12. Accommodation groove; 13. Air suction channel; 21. Through hole; 22. Mounting portion; 23. Operating portion; 24. Contact end;

[0039] 131. First air intake channel; 132. Second air intake channel;

[0040] d1, inner diameter of the receiving groove; d2, inner diameter of the suction channel; d3, inner diameter of the clearance channel;

[0041] x, axis. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0043] It should be noted that the terms "first" and "second" in the description and claims of the present utility model are used to distinguish different objects rather than to describe a specific order.

[0044] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0045] In this utility model, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe the utility model and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0046] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0047] Furthermore, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0048] In the eutectic soldering process, the suction nozzle is a key component in automated equipment, enabling high-precision, high-efficiency, and high-reliability soldering. The nozzle utilizes vacuum pressure to safely, stably, and non-destructively pick up delicate chips, enabling movement or eutectic operations on compact components. Especially during the eutectic process, after the nozzle picks up the chip, it typically applies downward pressure to more stably secure it to the substrate. However, existing nozzles often damage the chip due to excessive downward pressure.

[0049] Please combine Figure 1 、 Figure 2 and Figure 4 The first embodiment of the present invention provides a suction nozzle assembly 10 for performing eutectic operation on chips. The suction nozzle assembly 10 includes a suction nozzle body 1, a pressure block 2 and an elastic member 3. A clearance channel 11 is opened on one side of the suction nozzle body 1, and a receiving groove 12 is provided in the suction nozzle body 1. The notch of the receiving groove 12 is connected to the clearance channel 11, and a part of the bottom of the receiving groove 12 passes through the suction nozzle body 1 in the axial direction to form an air suction channel 13. The pressure block 2 is arranged in the receiving groove 12 near the clearance channel 11, and part of the pressure block 2 passes through the clearance channel 11 and is exposed to the suction nozzle body 1; a through hole 21 is provided on the pressure block 2 along the axial direction of the clearance channel to connect the inside of the receiving groove 12 and the outside; one end of the elastic member 3 is connected to the pressure block 2 near the through hole 21, and the other end is connected to the bottom of the receiving groove 12. When the suction nozzle assembly 10 applies pressure to the chip for eutectic, the pressure block 2 can drive the elastic member 3 to perform telescopic movement in the receiving groove.

[0050] Understandably, during the eutectic soldering process, the nozzle assembly 10 must apply a certain amount of downward pressure to securely press the chip onto the substrate. However, a core drawback of existing technologies lies in the difficulty of precisely controlling the force applied by the nozzle assembly during this process. Excessive downward pressure can easily cause irreversible damage to the delicate chip, such as chip breakage, cracks, or internal structural damage. This damage directly impacts the yield rate and product reliability of eutectic soldering, and is a key issue hindering the development of high-precision eutectic processes.

[0051] Please understand, please refer to Figure 3The core purpose of the technical solution of the nozzle assembly 10 provided in this embodiment is to solve the problem of chip damage caused by the loss of control of the downward pressure of the nozzle assembly 10. A mechanism with dynamic buffering and pressure self-adaptation capabilities is set up inside the nozzle assembly 10. Specifically, this embodiment adopts a combined structure of a pressure block 2 and an elastic member 3: the pressure block 2 is partially exposed to the nozzle body 1, so that it can directly contact the chip. The pressure block 2 is not rigidly fixed to the nozzle body 1, but is connected to the bottom of the receiving groove 12 through the elastic member 3. It should be noted that the elastic member 3 can be a spring or a spring. When the nozzle assembly 10 moves downward to apply pressure to the chip during the solidification process, the pressure block 2 contacts the surface of the chip. If the pressure is too large, the pressure block 2 will retract into the receiving groove 12, driving the elastic member 3 connected to it to produce a telescopic movement. Specifically, the elastic member 3 can play a buffering role, and the telescopic movement of the elastic member 3 is its core function. It absorbs and buffers the downward pressure that exceeds the set range. When the pressure attempts to exceed the preset elastic force of the elastic member 3, the elastic member 3 is compressed, allowing the pressure block 2 to retreat, thereby physically limiting the maximum pressure transmitted to the chip. That is, in the process of solid crystal in this embodiment, when the pressure reaches the critical point, the elastic member 3 deforms to absorb energy, avoiding the rigid impact directly acting on the fragile chip. It should be noted that when the number of pressure blocks in this embodiment is at least two, the elastic member 3 in the nozzle body 1 can adapt to different types of chips, such as chips of different heights, under the same downward pressure environment. In addition, when the nozzle assembly 10 is pressed down, different pre-tightening forces can be set in advance for the elastic member 3 to provide different downward pressures for different types of chips.

[0052] In addition, the elastic member 3 of this embodiment is arranged in the receiving groove 12, maximizing the use of the space inside the suction nozzle body 1. The clearance channel 11 provides the necessary space for the pressing block 2 to move, allowing it to move within a certain range in the receiving groove 12 along the axial direction, that is, the direction of applying pressure, thereby supporting the realization of the telescopic movement of the elastic member 3. Furthermore, a through hole 21 connecting the inside of the receiving groove 12 and the outside is provided on the pressing block 2 of this embodiment along the axial direction of the clearance channel. It ensures that the air pressure balance between the inside of the receiving groove 12 and the outside is maintained during the process in which the pressing block 2 retreats due to pressure and the elastic member 3 is deformed. It ensures that the vacuum negative pressure environment generated by the suction channel 13 will not be destroyed by the movement of the pressing block 2, so that the suction nozzle assembly 10 can still stably and reliably hold the chip firmly through the vacuum adsorption force while applying downward pressure and performing buffering, preventing the chip from shifting or falling off during the eutectic process.

[0053] Specifically, this embodiment incorporates a passive pressure buffering and limiting mechanism within the nozzle assembly 10. During eutectic operation, when the applied downward pressure exceeds a preset safety threshold, the elastic member 3 immediately responds and undergoes expansion and contraction deformation, effectively absorbing the excess impact energy and limiting the actual pressure transmitted to the chip to a safe range. This significantly reduces the risk of chip damage caused by excessive downward pressure. Furthermore, the design of the through-hole 21 in the pressure block 2 cleverly resolves the conflict between buffering action and maintaining vacuum absorption, ensuring the stability and reliability of eutectic operation.

[0054] It should be noted that, please combine Figure 1 and Figure 4 In this embodiment, the number of the pressing blocks 2 in the nozzle assembly 10 is one or at least two.

[0055] Furthermore, the nozzle assembly 10 also includes a pressure sensor, which is installed on the pressure block 2. It can be understood that in this embodiment, each pressure block 2 can achieve independent force control. The pressure sensor can be used to detect the pressure of each elastic pressure block 2, and by adjusting the spring compression or elastic coefficient, the downward force required for each chip process can be achieved. The nozzle is equipped with the head binding device's own closed-loop force control feedback system to realize a multi-chip placement process with independent force control.

[0056] Further, see Figure 3 The pressing block 2 includes a mounting portion 22 and an operating portion 23 that are interconnected. Both the mounting portion 22 and the operating portion 23 are cylindrical, and the diameter of the mounting portion 22 is larger than the diameter of the operating portion 23. The mounting portion 22 is accommodated in the receiving groove 12, and the diameter of the mounting portion 22 is larger than the inner diameter of the clearance channel 11, so that the clearance channel 11 limits the pressing block 2. One end of the elastic member 3 is connected to the bottom of the receiving groove away from the mounting portion 22, and the other end is connected to the mounting portion 22. The operating portion 23 is arranged at the end of the mounting portion 22 away from the elastic member 3, and the end of the operating portion 23 away from the mounting portion 22 passes through the clearance channel 11 and is exposed to the nozzle body 1. The operating portion 23 is transitionally matched with the clearance channel 11. The mounting portion 22 and the operating portion 23 are provided with a through hole 21 that connects the interior of the receiving groove 12 with the outside.

[0057] It can be understood that the mounting portion 22 of this embodiment serves as an anchor point for the elastic member 3 and is completely housed in the accommodating groove 12. Its direct connection with the elastic member 3 enables the pressure transmitted by the operating portion 23 to be efficiently converted into the axial deformation of the elastic member 3, maximizing the buffering efficiency. The operating portion 23 is a component that directly contacts the chip, and its exposed end passes through the clearance channel 11 through a transition fit. It ensures that the operating portion 23 can slide freely along the axial direction of the clearance channel 11, while limiting its radial shaking, thereby maintaining the force direction when the pressure block 2 retracts, avoiding local stress concentration on the chip caused by the deflection of the pressure block 2 or causing unnecessary radial deformation of the elastic member 3 due to radial force. In addition, the transition fit method, while not restricting the movement of the pressure block 2, can also prevent gas from entering the accommodating groove 12 through the gap between the operating portion 23 and the clearance channel 11 as much as possible, thereby improving the stability of the air intake of the through hole 21. In this embodiment, when the pressing block 2 slides, the influence on the relative position accuracy of the multiple chips is extremely small, and in conjunction with the high-precision bonding head motion mechanism, high-precision multi-chip mounting at the micron level can be achieved.

[0058] Furthermore, the elastic member 3 is coaxially arranged with the operating portion 23. When the elastic member 3 is deformed, the end of the operating portion 23 away from the mounting portion 22 is always exposed to the nozzle body 1. It can be understood that when the pressure block 2 retracts due to the buffering pressure, if the operating portion 23 is completely retracted into the receiving groove 12, the chip will shift or fall off from the operating portion 23. In this embodiment, no matter to what extent the elastic member 3 is compressed, the operating portion 23 always remains partially exposed to the outside of the nozzle body 1. Therefore, the external gas can pass through the through hole 21 of a section of the operating portion 23, the through hole 21 of a section of the mounting portion 22, enter the receiving groove 12, and then enter the suction channel 13, ensuring that the vacuum adsorption system always maintains zero interruption of the air path during the entire solid crystal process. Specifically, the end of the operating portion 23 becomes the surface that is in constant contact with the chip. In the initial contact stage with the chip, the end of the operating portion 23 first contacts the chip to establish a pressure sensing point. Secondly, if the pressure is too high, the pressing block 2 and the elastic member 3 enter the buffering retraction stage. As the elastic member 3 is compressed, the operating portion 23 moves into the receiving groove 12, but its end always maintains physical contact with the chip surface.

[0059] Further, see Figures 4 to 6The inner diameter d1 of the receiving groove is larger than the inner diameter d2 of the suction channel, which in turn is larger than the inner diameter d3 of the relinquishing channel. As can be understood, when airflow enters the smaller inner diameter suction channel 13 from the larger inner diameter receiving groove 12, it accelerates due to the sudden decrease in cross-sectional area, significantly enhancing the negative pressure adsorption force at the end of the suction channel 13 and ensuring stable chip pickup. Specifically, the relinquishing channel 11 in this embodiment serves as the airflow inlet, its small inner diameter creating a throttling effect that reduces the impact of external airflow disturbances on adsorption stability. The receiving groove 12, on the other hand, serves as an airflow transfer station, with its large space reducing flow velocity and equalizing air pressure. Furthermore, the inner diameter of the suction channel 13 is smaller than that of the receiving groove 12, further enhancing the negative pressure adsorption force at the end of the suction channel 13. By limiting the inner diameters of the three channels, this embodiment creates a stepped flow resistance, optimizing airflow organization efficiency. Furthermore, the larger receiving groove 12 allows for space to prevent the elastic member 3 from moving, providing ample travel for the pressure block 2 / elastic member 3 combination, ensuring that overload pressure can be fully absorbed. It can also prevent the elastic member 3 from interfering with the groove wall after being squeezed, thereby extending the service life of the elastic member 3.

[0060] In one possible implementation, Figure 4 As shown, the clearance channel 11 is one, and the nozzle assembly 10 is a single-touch nozzle. Figure 5 and Figure 6 , the axis of the giving way channel 11, the axis of the receiving groove 12 and the axis of the air intake channel 13 are the same. If the axial directions of the three channels deviate from each other, a low-pressure vortex zone will be formed during the air intake process, resulting in uneven distribution of air pressure on the surface of the pressing block 2. In this embodiment, the axis of the giving way channel 11, the axis of the receiving groove 12 and the axis of the air intake channel 13 are the same, and the external gas passes through the through hole 21 of the operating part 23 and the receiving groove 12 and goes directly to the air intake channel 13 along the axis, shortening the shortest path of the airflow. In addition, at this time, the airflow in the receiving groove 12 diffuses in concentric circles, which can ensure that the air pressure at each point on the surface of the pressing block 2 is consistent. As Figure 6 As shown, x is the axis of the clearance channel 11 , the axis of the accommodating groove and the axis of the suction channel 13 .

[0061] In one possible implementation, Figure 1 As shown, there are at least two channels 11. Please combine Figure 2 and Figure 3 The nozzle assembly 10 is a multi-contact nozzle, and the air suction channel 13 includes a first air suction channel 131 and a second air suction channel 132. The side of the accommodating groove 12 away from the pressing block 2 is provided with a first air suction channel 131 that penetrates the nozzle body 1, and a part of the bottom area of the accommodating groove 12 is provided with a second air suction channel 132 that connects the first air suction channel 131 and the inside of the accommodating groove 12.

[0062] It is understandable that the previous embodiment can only absorb one chip at a time, and its working efficiency is low. In this embodiment, at least two give way channels 11 are correspondingly provided with multiple independent pressure blocks 2, so that the single suction nozzle assembly 10 has multi-touch operation capabilities. Each give way channel 11 is embedded with a pressure block 2-elastic member 3 unit, and each unit is isolated from each other in the receiving groove 12 to avoid interference with each other's movements. The operating part 23 of each pressure block 2 can apply differentiated downward pressure to the independent chip to adapt to chips of different thicknesses. In addition, the suction channel 13 in this embodiment is composed of a first suction channel 131 and at least two second suction channels 132 connected to form a tree-like air network. The external gas passes through the through hole 21 of the operating part 23, the chamber of the receiving groove 12, the second suction channel 132 and the first suction channel 131 in sequence. The air paths of each pressure block 2 are physically isolated but the terminals converge, so that the leakage of a chip that is not adsorbed at a certain operating end does not affect the adsorption of other operating ends. The suction nozzle assembly 10 in this embodiment has multiple pressure blocks 2 to ensure that chips of different thicknesses can contact the pressure blocks 2 during operation, and each pressure block 2 can achieve independent force control; a pressure sensor can be used to detect the pressure of each elastic pressure block 2, and the downward pressure required for each chip process can be achieved by adjusting the spring compression amount or elastic coefficient; the suction nozzle is equipped with the closed-loop force control feedback system of the head binding device itself to realize the multi-chip individual force control placement process.

[0063] Furthermore, please combine Figure 2 and Figure 3 The end of the operating portion 23 away from the mounting portion 22 is a contact end 24, and the distance between two adjacent contact ends 24 is less than 1 mm. The nozzle assembly 10 in this embodiment is designed to support simultaneous die bonding of multiple chips with a pitch less than 1 mm. It can also be equipped with a vacuum vent line to vacuum-adsorb the chips, meeting the requirements of multi-chip die bonding with a small pitch.

[0064] Furthermore, when the nozzle assembly 10 sucks the chip, the outside air enters the first suction channel 131 through the through hole 21, the inside of the receiving groove 12, and the second suction channel 132 in sequence. The chip can be stably sucked through the air path design. When the nozzle assembly 10 applies pressure to the chip for eutectic, the pressure block 2 can drive the elastic member 3 to perform telescopic movement in the receiving groove, and the pressure sensor is used to detect the pressure of the chip. That is, during eutectic, the pressure block 2 drives the sensor to move synchronously and outputs pressure feedback in real time. If the pressure feedback is too large, the nozzle assembly 10 can be controlled to reduce the pressure applied to the chip while the elastic member 3 performs buffering, so that the nozzle assembly 10 evolves from a mechanical actuator to an operating terminal with perception capabilities.

[0065] The second embodiment of the present invention further provides a head binding assembly, comprising a driving assembly and the suction nozzle assembly 10 as described above, wherein the suction nozzle assembly 10 is detachably connected to the driving assembly.

[0066] It is understood that the nozzle assembly 10 of this embodiment is detachably connected to the drive assembly, allowing the drive assembly to be replaced with a different nozzle assembly 10 according to different suction requirements. The same drive assembly can quickly load any of the above-mentioned nozzles, such as a single-contact nozzle or a multi-contact matrix nozzle. The head binding assembly provided in this embodiment has the same beneficial effects as the above-mentioned nozzle assembly 10, and will not be further described here.

[0067] Two workflows are provided as examples:

[0068] Workflow 1: Figure 7 As shown, in step one, a single-chip nozzle assembly 10 is loaded on the head binding device, and the single-chip nozzle assembly 10 is used to pick up multiple chips one by one from the waffle box or blue film by vacuum adsorption to the transfer table, and the multiple chips are placed according to the relative position relationship of the final mounting on the substrate; the transfer table is provided with an independently controllable vacuum adsorption hole at the corresponding position where each chip is placed; when placing, subsequent chips are placed according to the relative relationship between the chips through the visual system, and the relative position between the chips is verified by the visual system after the placement is completed. If the relative position accuracy requirements are not met, the pick-up and placement adjustments can be continued until they are met. In this way, the relative position accuracy of multiple chips is guaranteed. Step two, the head binding device replaces the single-chip nozzle assembly 10 with the multi-chip nozzle assembly 10; step three, as shown Figure 8 As shown, the head binding device is loaded with a multi-chip nozzle assembly 10, and after moving to the transfer table to simultaneously absorb multiple chips, the vacuum holes on the transfer table are closed at the same time, and the head binding device picks up multiple chips and moves to the transfer table as shown. Figure 7 Above the substrate shown, the machine moves to the target position through visual positioning, performs closed-loop force-controlled downward placement, and fixes multiple chips to the corresponding positions of the substrate with the set pressure, achieving high-precision multi-chip individual force-controlled die bonding.

[0069] Workflow 2: Figure 7 As shown, in step 1, the single-chip nozzle assembly 10 is loaded on the head binding device, and the single-chip nozzle assembly 10 is used to pick up multiple chips one by one from the waffle box or blue film through the visual system and closed-loop force control system and then mount them on the substrate. The substrate is placed on the eutectic table. During mounting, the eutectic table is preheated to pre-fix the chip, and the multiple chips are pre-cured and mounted according to the relative position relationship of the final mounting on the substrate; in step 2, the head binding device replaces the single-chip nozzle assembly 10 with a multi-chip nozzle assembly 10. Step 3, as shown Figure 9As shown, the head-binding device, equipped with a multi-chip nozzle assembly 10, moves the corresponding chip position on the eutectic table. The head-binding device then applies closed-loop force-controlled downward pressure. Multiple pressing blocks press the chips to the set process pressure, and then eutectic solidification of the multi-chip proceeds. In this case, the multi-chip nozzle assembly 10 does not require a vacuum suction channel. Since vacuum tightness is not required, the contact area between the guide block's guide groove and the pressing block can be appropriately reduced, reducing friction between the two. This further improves the precision of the fit between the guide block's guide groove and the pressing block, as well as the force control accuracy.

[0070] The third embodiment of the present invention further provides a eutectic device, comprising an operating table, a eutectic table, a control assembly, and the aforementioned head-binding assembly. The eutectic table and the head-binding assembly are disposed on the operating table, the control assembly and the head-binding assembly are electrically connected, and the head-binding assembly is used to perform eutectic operations on chips. It is understood that in the eutectic device of this embodiment, when the head-binding assembly sucks and moves the chip to the eutectic table for eutecticization, when the applied pressure exceeds a preset safety threshold, the elastic member 3 can immediately respond and produce a stretching deformation, effectively absorbing the excessive impact energy and limiting the actual pressure transmitted to the chip to a safe range, thereby significantly reducing the risk of chip damage due to excessive downward pressure.

[0071] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A nozzle assembly for performing eutectic operation on a chip, characterized by: The suction nozzle assembly includes a suction nozzle body, a pressure block and an elastic member. A yield channel is opened on one side of the suction nozzle body, and a receiving groove is provided in the suction nozzle body. The notch of the receiving groove is connected with the yield channel, and a part of the area of the bottom of the receiving groove penetrates the suction nozzle body along the axial direction to form an air suction channel. The pressure block is arranged in the receiving groove near the yield channel, and part of the pressure block passes through the yield channel and is exposed to the suction nozzle body; a through hole connecting the inside of the receiving groove and the outside is provided on the pressure block along the axial direction of the yield channel; one end of the elastic member is connected to the pressure block near the through hole, and the other end is connected to the bottom of the receiving groove. When the suction nozzle assembly applies pressure to the chip for eutectic, the pressure block can drive the elastic member to perform telescopic movement in the receiving groove.

2. The nozzle assembly according to claim 1, wherein: The pressure block includes a mounting portion and an operating portion that are connected to each other. The mounting portion is accommodated in the accommodating groove. One end of the elastic member is connected to the bottom of the accommodating groove away from the end of the mounting portion, and the other end is connected to the mounting portion. The operating portion is arranged at the end of the mounting portion away from the elastic member, and the end of the operating portion away from the mounting portion passes through the makeshift channel and is exposed to the nozzle body. The operating portion is transitionally matched with the makeshift channel, and the mounting portion and the operating portion are provided with a through hole connecting the inside of the accommodating groove and the outside.

3. The nozzle assembly according to claim 2, wherein: The elastic member is coaxially arranged with the operating portion. When the elastic member is deformed, one end of the operating portion away from the mounting portion is always exposed outside the nozzle body.

4. The nozzle assembly according to claim 1, wherein: The inner diameter of the accommodating groove is larger than the inner diameter of the air suction channel, and the inner diameter of the accommodating groove is larger than the inner diameter of the clearance channel.

5. The nozzle assembly according to claim 2, wherein: There is one clearance channel, and the axis of the clearance channel, the axis of the accommodating groove and the axis of the air intake channel are the same.

6. The nozzle assembly according to claim 2, wherein: There are at least two give way channels, and the air suction channel includes a first air suction channel and a second air suction channel. The first air suction channel that runs through the nozzle body is provided on the side of the accommodating groove away from the pressure block, and a partial area of the bottom of the accommodating groove is provided with a second air suction channel that connects the first air suction channel and the inside of the accommodating groove.

7. The nozzle assembly according to claim 2, wherein: One end of the operating portion away from the mounting portion is a contact end, and a distance between two adjacent contact ends is less than 1 mm.

8. The nozzle assembly according to claim 1, wherein: The suction nozzle assembly also includes a pressure sensor, which is arranged on the pressure block; when the suction nozzle assembly sucks the chip, the outside air enters the first suction channel through the through hole, the inside of the receiving groove, and the second suction channel in sequence; when the suction nozzle assembly applies pressure to the chip for eutectic, the pressure block can drive the elastic part to perform telescopic movement in the receiving groove, and the pressure sensor is used to detect the pressure of the chip.

9. A head binding assembly, characterized in that: It comprises a driving assembly and a suction nozzle assembly according to any one of claims 1 to 8, wherein the suction nozzle assembly is detachably connected to the driving assembly.

10. A eutectic device, characterized in that: It includes an operating table, a eutectic table, a control component and a head binding component as claimed in claim 9, wherein the eutectic table and the head binding component are arranged on the operating table, the control component and the head binding component are electrically connected, and the head binding component is used to perform eutectic operation on the chip.

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