Antenna structure and electronic equipment

Abstract

The utility model relates to an antenna structure and electronic equipment. The antenna structure comprises a substrate, a first coil and a second coil. The substrate includes a main body portion and a connection portion. The first coil and the second coil are attached to the same side of the substrate and respectively comprise a first bonding pad, a second bonding pad, a first pin and a second pin, wherein the first bonding pad and the second bonding pad are located on the main body portion, and the first pin and the second pin are located on the connecting portion. The first coil extends to the first pin from at least part of the main body portion around the first welding disc, the second coil extends to the second pin from the second welding disc around the main body portion, and the first welding disc and the second welding disc are arranged at intervals. The two ends of the metal connecting bridge are connected with the first bonding pad and the second bonding pad respectively, so that the first coil and the second coil are electrically connected. According to the antenna structure, the coil layout is optimized, that is, the multiple coils are attached to the same side of the substrate, and the coils are connected through the metal connecting bridges, so that the number of layers of the coils can be effectively reduced, the production cost of the antenna structure is reduced, and the design of the arrangement of the coils on the same side can reduce signal loss and improve the performance and efficiency of the antenna.

Description

Technical Field

[0001] The present application relates to the technical field of circuit metal plates, and in particular to an antenna structure and an electronic device. Background Art

[0002] In a traditional antenna coil stack, a copper coil is attached to each side of a common polyimide (PI)-based dielectric insulating film. The two coils are connected by vias made of electroplated copper. This coil stack structure is complex to manufacture and expensive. Furthermore, the stacked antenna structure increases signal loss, reducing antenna performance and efficiency. Utility Model Content

[0003] To solve the above problems, the present application provides an antenna structure and an electronic device, including:

[0004] The substrate comprises a main body and a connecting portion; the main body is an annular structure connected end to end; the connecting portion extends from a side frame of the main body toward the interior of the main body and is a strip-shaped structure; along the thickness direction of the antenna structure, the substrate comprises a connecting surface and a mounting surface disposed opposite each other, the mounting surface being configured to be fixed to the housing; the surfaces of the main body and the connecting portion away from the housing form the connecting surface;

[0005] a first coil, attached to the connection surface of the substrate, comprising a first pad and a first pin at both ends, the first pad being located on the main body, the first pin being located on the connection portion, and the first coil extending from the first pad around the main body to the first pin;

[0006] a second coil, attached to the connection surface of the substrate, comprising a second pad and a second pin, the second pad being located on the main body, the second pin being located on the connection portion, the second coil extending from the second pad around the main body to the second pin; wherein the first pad and the second pad are spaced apart;

[0007] The metal connecting bridge has two ends connected to the first pad and the second pad respectively, so as to realize electrical connection between the first coil and the second coil.

[0008] In one embodiment, the antenna structure further includes a welding structure, and any one or more of the first pad, the second pad, the first pin and the second pin are provided with the welding structure, and the material of the welding structure is different from the material of the first coil and the second coil.

[0009] In one embodiment, the welding structure includes a first welding metal layer and a second welding metal layer sequentially arranged in a direction away from the substrate; wherein,

[0010] The first welding metal layer is made of one of nickel and zinc materials, and the second welding metal layer is made of the other of nickel and zinc materials.

[0011] In one embodiment, the welding structure further includes a third welding metal layer, and the third welding metal layer is located on the second welding metal layer; wherein,

[0012] The third welding metal layer is made of gold.

[0013] In one embodiment, the first solder pad and the second solder pad are located in the middle of any frame of the main body, and the spacing direction between the first solder pad and the second solder pad is the same as the extension direction of the frame where they are located.

[0014] In one embodiment, the first solder pad and the second solder pad are located in the same frame, and are located on a different frame from the connecting portion of the main body.

[0015] In one embodiment, a double-layer coil routing is provided on any frame of the main body, the inner coil routing is used as the inner loop routing, and the outer coil routing is used as the outer loop routing, the first coils are all inner loop routing; the second coils include inner loop routing and outer loop routing;

[0016] The second coil includes a first wiring unit, a second wiring unit and a connecting wiring unit, and two ends of the connecting wiring unit are respectively connected to the first wiring unit and the second wiring unit; wherein,

[0017] One end of the first routing unit away from the connecting routing unit extends to the main body and forms the second pad, and the first routing unit is the outer ring routing;

[0018] One end of the second wiring unit away from the connecting wiring unit extends to the connecting portion and forms the second pin, and the second wiring unit is the inner ring wiring;

[0019] The connection wiring unit passes through the gap between the first pad and the second pad.

[0020] In one embodiment, the metal connection bridge covers at least a portion of the connection wiring unit, and the metal connection bridge and the connection wiring unit are insulated.

[0021] In one embodiment, a third pin is further provided at one end of the connecting portion away from the main body portion, the third pin is electrically connected to the second coil, and the third pin is located between the first pin and the second pin, and is spaced apart from the first pin and the second pin.

[0022] In one embodiment, the second coil further includes a third wiring unit, wherein one end of the third wiring unit away from the main body extends to the connecting portion to form the third pin, and the other end of the third wiring unit extends to the main body and is electrically connected to the second wiring unit.

[0023] In one embodiment, the antenna structure further includes a reinforcement structure, and the reinforcement structure is provided on the mounting surface of the connecting portion;

[0024] The orthographic projections of the first pin and the second pin on the substrate fall within the orthographic projection of the reinforcement structure on the substrate.

[0025] In one embodiment, at least a portion of the reinforcement structure extends out of the mounting surface.

[0026] In one embodiment, the antenna structure further includes an ink layer, which covers the first coil and the second coil and exposes the first pad, the first pin, the second pad, and the second pin.

[0027] In one embodiment, the metal connecting bridge is made of nickel or copper; and / or

[0028] The first coil and the second coil are made of the same material, and both are made of aluminum.

[0029] In one embodiment, the width of the first coil is in the range of 0.8 mm to 1.2 mm; and / or

[0030] The width of the second coil is in the range of 0.8 mm to 1.2 mm; and / or

[0031] The spacing distance between the first pad and the second pad is 0.2 mm to 3 mm.

[0032] The present application also provides an electronic device, comprising a housing and the antenna structure mentioned in any of the above embodiments.

[0033] The technical solutions provided by the embodiments of the present application may have the following beneficial effects:

[0034] It can be seen from the above embodiments that the antenna structure of the present application includes a substrate, a first coil and a second coil. The substrate includes a main body and a connecting part. The first coil and the second coil are both attached to the substrate, and respectively include a first pad and a second pad located on the main body and a first pin and a second pin located on the connecting part. The first coil extends from the first pad around the main body to the first pin, and the second coil extends from the second pad around the main body to the second pin, and the first pad and the second pad are arranged at intervals. The two ends of the metal connecting bridge are respectively connected to the first pad and the second pad to achieve electrical connection between the first coil and the second coil. The present application optimizes the coil layout, that is, attaches multiple coils on the same side of the substrate, and then connects the coils through a metal connecting bridge. This can effectively reduce the number of coil layers and reduce the production cost of the antenna structure. The arrangement of coils on the same side can reduce signal loss, improve antenna performance and efficiency, and effectively solve the problems of high cost, large thickness and large signal loss of the traditional antenna coil laminated structure.

[0035] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. It is obvious that the drawings described are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0037] Figure 1 This is a structural schematic diagram of the antenna structure provided in an embodiment of the present application at one viewing angle.

[0038] Figure 2 This is a structural schematic diagram of the antenna structure provided in one embodiment of the present application from another perspective.

[0039] Figure 3 This is a structural schematic diagram of the antenna structure provided in one embodiment of the present application from another perspective.

[0040] Figure 4 This is a structural schematic diagram of a reinforcement structure provided in an embodiment of the present application at one viewing angle.

[0041] Reference numerals:

[0042] 10. Substrate; 101. Main body; 102. Connecting part; 10a. Connecting surface; 10b. Mounting surface; 111. First frame; 112. Second frame; 113. Third frame; 114. Fourth frame; 20. First coil; 201. First solder pad; 202. First pin; 30. Second coil; 31. First routing unit; 32. Second routing unit; 33. Connecting routing unit; 34. Third routing unit; 301. Second solder pad; 302. Second pin; 303. Third pin; 40. Metal connecting bridge; 50. Reinforcement structure; 501. First reinforcement part; 502. Second reinforcement part; 60. Ink layer. DETAILED DESCRIPTION

[0043] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. Various changes, modifications and equivalents of the methods, devices and / or systems described herein will become apparent after understanding the present disclosure. For example, the order of operations described herein is merely an example and is not limited to those orders set forth herein, but may be changed as becomes apparent after understanding the present disclosure, except for operations that must be performed in a specific order. In addition, descriptions of features known in the art may be omitted for clarity and brevity. The methods described in the following exemplary embodiments do not represent all methods consistent with the present application. Instead, they are merely examples of devices consistent with some aspects of the present application as detailed in the appended claims.

[0044] As mentioned in the background, traditional antenna coil stacks not only have thick circuit boards, making them difficult to meet the demands of small electronic devices, but also tend to generate reverse eddy currents between the coils, leading to energy loss and reduced antenna radiation efficiency, thus reducing the antenna's ability to transmit or receive signals. Furthermore, these reverse eddy currents can cause signal interference, leading to signal distortion, attenuation, and even noise, compromising communication quality.

[0045] Based on this, the present application provides an antenna structure that can effectively solve the problems of large thickness and low performance efficiency in traditional antenna coil stacking structures.

[0046] Reference Figure 1 and Figure 2 The antenna structure of the present application includes a substrate 10, a first coil 20, a second coil 30, and a metal connecting bridge 40. Along the thickness direction of the antenna structure, substrate 10 includes a connecting surface 10a and a mounting surface 10b, which are oppositely disposed. Mounting surface 10b is used to secure the substrate 10 to the housing. Substrate 10 includes a main body 101 and a connecting portion 102. The surfaces of main body 101 and connecting portion 102 facing away from the housing form connecting surface 10a.

[0047] The main body 101 is an annular structure connected end to end. The connecting portion 102 extends from a side frame of the main body 101 toward the inside of the main body 101 and is a strip-shaped structure.

[0048] It should be noted that the annular structure designed for the main body 101 can have a variety of forms and is not limited to the traditional circular ring. In addition to the standard circular ring, the annular structure can also take the form of a rectangular ring (with right or rounded corners), an elliptical ring (with differentiated major and minor axes), and a polygonal ring (such as a triangle or hexagon). There are no restrictions on the design of the edge profile of the annular structure. It can be designed with wavy edges, gear shapes, and other shapes.

[0049] Likewise, the strip-shaped structure of the connecting portion 102 can be in various shapes and is not limited to the traditional rectangular shape. In addition to the standard rectangular shape, the strip-shaped structure can be in a semicircular or elliptical shape.

[0050] The first coil 20 is attached to the connection surface 10a of the substrate 10 and includes a first pad 201 and a first lead 202 at each end. The first pad 201 is located on the main body 101, and the first lead 202 is located on the connection portion 102. The first coil 20 extends from the first pad 201 around the main body 101 to the first lead 202. The second coil 30 is attached to the connection surface 10a of the substrate 10 and includes a second pad 301 and a second lead 302. The second pad 301 is located on the main body 101. The second lead 302 is located on the connection portion 102. The second coil 30 extends from the second pad 301 around the main body 101 to the second lead 302.

[0051] The first pad 201 and the second pad 301 are spaced apart. Two ends of the metal connection bridge 40 are connected to the first pad 201 and the second pad 301 respectively, so as to realize the electrical connection between the first coil 20 and the second coil 30.

[0052] Specifically, the first pad 201 can be understood as one of the starting end or the ending end of the first coil 20, and the first pin 202 can be understood as the other of the starting end or the ending end. Similarly, the second pad 301 can be understood as one of the starting end or the ending end of the second coil 30, and the second pin 302 can be understood as the other of the starting end or the ending end.

[0053] It is worth noting that, to improve the reading experience, the first pad 201 and the second pad 301 can be collectively referred to as pads. The first pin 202 and the second pin 302 can be collectively referred to as pins.

[0054] The pads are connected to other circuit components or external devices via metal bridges 40, enabling signal input and output for the antenna structure. The pins are electrically connected to the motherboard within the housing to enable communication with the motherboard. This application does not limit the connection method between the pins and the motherboard; plug-in or other connection methods may be used.

[0055] By placing the first coil 20 and the second coil 30 on the same surface of the substrate 10 and electrically connecting them using a metal bridge 40, this arrangement effectively avoids the problem of reverse eddy currents that are common in conventional laminated coils. This arrangement not only reduces coil energy loss but also significantly reduces signal interference, thereby improving the antenna's radiation efficiency and signal transmission quality, enhancing the antenna's transmit and receive capabilities and effectively improving communication quality.

[0056] At the same time, the first coil 20 and the second coil 30 are arranged on the same layer, which can realize the function of a double-layer circuit board in a single-layer circuit, effectively reducing the complexity of coil preparation, thereby reducing production costs and improving production efficiency.

[0057] In some embodiments, the substrate 10 is made of polyimide (PI) material, and the first coil 20 and the second coil 30 are made of aluminum.

[0058] The first coil 20 and the second coil 30 are made of aluminum, which can not only effectively reduce the resistance of the coil and improve the current transmission efficiency, but also effectively reduce the cost and reduce the overall weight of the antenna junction, so as to further meet the demand for lightweight electronic equipment.

[0059] In this embodiment, the aluminum foil and PI are laminated using a conventional printed circuit board (PCB) manufacturing process, that is, an aluminum coil pattern is printed or etched on a PI substrate 10 to form the first coil 20 and the second coil 30. The specific process will not be repeated here.

[0060] Further, refer to Figure 3 The antenna structure further includes an ink layer 60. The ink layer 60 covers the first coil 20 and the second coil 30, and exposes the pads and pins.

[0061] Specifically, after the first coil 20 and the second coil 30 are prepared, an ink layer 60 is prepared on the connecting surface 10a of the substrate 10 by screen printing, gravure printing, lithography, etc., to protect the coils, provide electrical insulation, reduce signal interference, and optimize the overall performance of the antenna.

[0062] Furthermore, the ink layer 60 can be made of a variety of materials, such as UV curable ink, epoxy resin ink, etc., which is not limited in this application.

[0063] In one embodiment, the gap between the first solder pad 201 and the second solder pad 301 is also coated with an ink layer 60. This arrangement insulates the metal bridge 40 from the coil located in the gap, ensuring a secure and stable electrical connection and preventing short circuits and other electrical faults. Furthermore, the ink layer 60 is heat-resistant, facilitating the soldering of the metal bridge 40 to the first and second solder pads 201 and 301. It also protects the substrate 10 or coil from the heat and mechanical stress generated during soldering, thereby extending the antenna's service life.

[0064] In some embodiments, the first pad 201 and the second pad 301 are spaced apart by a distance ranging from 0.2 mm to 3 mm.

[0065] The spacing between the first and second pads 201 and 301 effectively improves the antenna structure's anti-interference capabilities. Specifically, it reduces mutual interference between the first and second coils 20 and 30, minimizing the impact of interference signals on normal signals. This makes the antenna's signal transmission more stable and clear, thereby improving communication quality.

[0066] In some embodiments, the present application does not limit the width of the first coil 20 and the second coil 30. The width of the first coil 20 and / or the second coil 30 ranges from 0.8 mm to 1.2 mm.

[0067] It is worth noting that when the second coil 30 is wound around the main body 101 for more than one turn, the spacing between the first pad 201 and the second pad 301 must be greater than the width of the second coil 30. This ensures that the second coil 30 can smoothly pass through the gap between the two pads and continue to be arranged around the main body 101.

[0068] In some embodiments, the metal bridge 40 can be made of nickel or copper. Furthermore, the metal bridge 40 can be configured as a copper or nickel sheet. The shapes of the copper and nickel sheets are not limited. It is sufficient to ensure that both ends of the metal bridge 40 are connected to the first and second pads 201 and 301.

[0069] Specifically, nickel, with its excellent electrical conductivity and corrosion resistance, effectively ensures the electrical performance and stability of the connecting bridge. Copper, with its excellent electrical conductivity, reduces the resistance of the connecting bridge, minimizing energy loss and improving antenna efficiency. Whether made of nickel or copper, the metal connecting bridge 40 ensures a reliable electrical connection between the first coil 20 and the second coil 30, ensuring the performance and functionality of the antenna.

[0070] Furthermore, the orthographic projection of the metal bridge 40 on the substrate 10 completely covers the orthographic projections of the first pad 201 and the second pad 301 on the substrate 10. This can also be understood as the entire surface of the first pad 201 and the second pad 301 being welded to the metal bridge 40. This arrangement ensures that the electrical connection between the first coil 20 and the second coil 30 is not only stable and reliable, but also tightly integrated, thereby further improving the efficiency and quality of signal transmission.

[0071] In some embodiments, the width of the welds between the metal bridge 40 and the first and second pads 201 and 301 is greater than 0.7 mm to ensure the reliability and stability of the electrical connection. Specifically, during high-frequency signal transmission, signal loss and interference may occur between the pads and the metal bridge 40. Increasing the width of the welds can effectively reduce the resistance of the connection and reduce losses during signal transmission. This also provides greater operating space for the welding process between the metal bridge 40 and the pads, making the welds more secure and able to withstand certain mechanical and thermal stresses.

[0072] In some embodiments, the antenna structure further includes a welding structure, and any one or more of the pads (first pad 201, second pad 301) and the pins (first pin 202 and second pin 302) are provided with a welding structure, and the material of the welding structure is different from the material of the first coil 20 and the second coil 30.

[0073] Specifically, the welding structure is located between the welding pad and the metal connecting bridge 40. When the first coil 20 and the second coil 30 are made of aluminum, and the metal connecting bridge 40 is made of a copper sheet or a nickel sheet, aluminum is easily oxidized to form a dense oxide film. This can lead to problems such as loose welding and increased contact resistance when directly welding aluminum to copper or nickel.

[0074] Therefore, the present application configures the welding structure to be made of a material different from the welding pad. Specifically, materials with better conductivity such as gold, silver, and tin can be used to enhance the electrical connection strength between the welding pad and the metal connecting bridge 40, ensure the reliability and stability of the connection, and thus improve the overall performance of the antenna.

[0075] In some embodiments, the welding structure on the welding pad includes a first welding metal layer and a second welding metal layer sequentially arranged in a direction away from the substrate 10, the first welding metal layer is made of zinc, and the second welding metal layer is made of nickel, or vice versa.

[0076] Nickel offers excellent corrosion and oxidation resistance, forming a stable oxide layer that prevents further oxidation and improves the durability of welded structures. Zinc, with its low melting point, is easily molten and has good fluidity, filling weld gaps and enhancing the mechanical strength of the weld. The nickel-zinc combination creates a good electrical connection, reducing contact resistance and improving signal transmission efficiency. Furthermore, zinc's low melting point helps lower welding temperatures, minimizing thermal damage to the pad and coil, and improving weld quality.

[0077] In some embodiments, the soldering structure on the soldering pad further includes a third soldering metal layer, the third soldering metal layer is located on the second soldering metal layer, and the third soldering metal layer is made of gold.

[0078] In one embodiment, a zinc metal layer, a nickel metal layer, and a gold metal layer are sequentially formed on the surface of the pad away from the substrate 10. This arrangement of layered metal layers not only improves the electrical connection between the pad and the metal bridge 40, but also facilitates adjustment of welding parameters to meet different welding process requirements, thereby improving production efficiency and welding reliability.

[0079] Specifically, the soldering structure is located on the side of the pin away from the substrate 10. The soldering structure is configured with a material different from that of the pad, such as gold, silver, tin, or other materials with better conductivity, which can enhance the electrical connection strength between the pin and external devices (such as circuit boards, connectors, or other electronic components).

[0080] This setting ensures the reliability and stability of the connection, effectively reduces contact resistance and loss during signal transmission, thereby improving the overall performance of the antenna and signal transmission quality.

[0081] In some embodiments, the solder structure on the pin includes a first solder metal layer and a second solder metal layer sequentially disposed in a direction away from the substrate 10. The first solder metal layer is made of zinc and the second solder metal layer is made of nickel, or vice versa. The specific effects can be referred to in the above embodiment and will not be further described here.

[0082] In some embodiments, the soldering structure on the soldering pad further includes a third soldering metal layer, the third soldering metal layer is located on the second soldering metal layer, and the third soldering metal layer is made of gold.

[0083] In one embodiment, a zinc metal layer, a nickel metal layer, and a gold metal layer are sequentially formed on the surface of the pin away from the substrate 10 .

[0084] In some embodiments, the first solder pad 201 and the second solder pad 301 are located in the middle of any frame of the main body 101 , and the spacing direction between the first solder pad 201 and the second solder pad 301 is the same as the extension direction of the frame where they are located.

[0085] Specifically, refer to Figure 1 The main body 101 includes a first frame 111 and a second frame 112, which are arranged opposite to each other, as well as a third frame 113 and a fourth frame 114, which are arranged opposite to each other. The first frame 111, the second frame 112, the third frame 113, and the fourth frame 114 are all referred to as the "frames" above. The first solder pad 201 and the second solder pad 301 can be located in the middle of any frame. It should be noted that the middle is not limited to the middle, but is a roughly middle area, and a certain offset is allowed.

[0086] Placing the first and second solder pads 201 and 301 in the middle of the frame facilitates manufacturing and positioning, improving manufacturing accuracy and efficiency while reducing processing difficulty and cost. Furthermore, this central location effectively avoids signal interference, helping to maintain the antenna's signal transmission quality and stability, ensuring proper operation.

[0087] In some embodiments, the first pad 201 and the second pad 301 are located in the same frame, and are located on a different frame from the connecting portion 102 of the main body 101 .

[0088] For example, continue to refer to Figure 1 The first solder pad 201 and the second solder pad 301 are located on the first frame 111 , and the connecting portion 102 is located on the fourth frame 114 and extends toward the third frame 113 .

[0089] Distributing the solder pads and connector 102 on different sides of the frame optimizes the antenna layout, making coil routing more flexible and facilitating adjustment of coil length and shape, thereby changing the antenna's resonant frequency and bandwidth to better match the operating frequency band. Furthermore, this distribution reduces mutual interference between solder pads and pins on the same side, improving signal transmission stability and efficiency.

[0090] In some embodiments, the second coil 30 is wound around the main body 101 at least once. The first coil 20 extends from at least one frame to the other frame.

[0091] Furthermore, after the second coil 30 has circled the main body 101 from the second pad 301 , it extends through the gap between the first pad 201 and the second pad 301 to the second pin 302 .

[0092] Specifically, a double layer of coil wiring is provided on any frame of the main body 101, with the inner coil wiring being the inner coil wiring and the outer coil wiring being the outer coil wiring. The first coil 20 is all inner coil wiring. The second coil 30 includes inner coil wiring and outer coil wiring.

[0093] The second coil 30 includes a first wiring unit 31 , a second wiring unit 32 and a connecting wiring unit 33 . Two ends of the connecting wiring unit 33 are respectively connected to the first wiring unit 31 and the second wiring unit 32 .

[0094] The end of the first routing unit 31, away from the connecting routing unit 33, extends along one side of the middle of a frame of the main body 101 to the other side of the same middle of the main body 101 frame, forming a second solder pad 301. The first routing unit 31 is an outer routing. The end of the second routing unit 32, away from the connecting routing unit 33, extends to the connecting portion 102, forming a second pin 302. The second routing unit 32 is an inner routing. The connecting routing unit 33 passes through the gap between the first solder pad 201 and the second solder pad 301.

[0095] For example, refer to Figure 1 The routing path of the first coil 20 is: starting from the first solder pad 201 in the middle of the first frame 111, first extending to the fourth frame 114, and then extending to the end of the connecting portion 102 away from the fourth frame 114 to form a first pin 202.

[0096] Continue to refer to Figure 1 The routing path of the second coil 30 is as follows: the first routing unit 31 takes the second solder pad 301 in the middle of the first frame 111 as the starting point, extends to the third frame 113, the second frame 112, the fourth frame 114 in sequence, and returns to another part of the first frame 111 and is connected to one end of the connecting routing unit 33. Then, the connecting routing unit 33 passes through the gap between the first solder pad 201 and the second solder pad 301, and is connected to the second routing unit 32. Then, the second routing unit 32 extends to the third frame 113, the second frame 112 and the fourth frame 114 in sequence, and then extends to the end of the connecting portion 102 away from the fourth frame 114 to form a second pin 302.

[0097] It's important to note that the "starting point" and "routing path" mentioned above do not imply a specific routing direction or a specific order for coil formation. They are simply for the convenience of describing the coil's end positions, formation location, and structure.

[0098] In some embodiments, this application does not impose any restrictions on the spacing between the inner and outer coils. A smaller spacing can increase inductance, making it suitable for NFC applications and improving communication efficiency and recognition accuracy. A larger spacing can reduce coupling between coils, reduce interference, and facilitate multi-band or wideband antenna designs. This spacing can be set based on specific needs. Preferably, the spacing between the inner and outer coils ranges from 0.3 mm to 3 mm.

[0099] In some embodiments, the metal connection bridge 40 covers at least a portion of the connection wiring unit 33 , and the metal connection bridge 40 and the connection wiring unit 33 are insulated.

[0100] Specifically, ink layer 60 covers the gap between first pad 201 and second pad 301, that is, covers connection trace unit 33 extending between first pad 201 and second pad 301. This provides insulation between metal bridge 40 and connection trace unit 33. This insulation ensures that signal transmission in connection trace unit 33 is not interfered with by metal bridge 40, maintaining normal circuit functionality.

[0101] In some embodiments, reference Figure 1 and Figure 3 A third pin 303 is also provided on the end of the connecting portion 102 away from the main body 101. The third pin 303 is electrically connected to the second coil 30. The third pin 303 is located between the first pin 202 and the second pin 302, and is spaced apart from both. The third pin 303 provides an additional electrical connection for the second coil 30, enhancing signal transmission flexibility.

[0102] Specifically, the third pin 303 is typically grounded to provide a stable reference potential and shield signal interference. The ground pin helps reduce electromagnetic interference (EMI) and improve the signal integrity and communication quality of the antenna.

[0103] In some embodiments, continue with reference to Figure 1 The second coil 30 also includes a third wiring unit 34, one end of the third wiring unit 34 away from the main body 101 extends to the connecting portion 102 to form a third pin 303, and the other end of the third wiring unit 34 extends to the main body 101 and is electrically connected to the first wiring unit 31.

[0104] In some embodiments, reference Figure 3 The antenna structure also includes a reinforcement structure 50, which is disposed on the mounting surface 10b of the connection portion 102. The orthographic projections of the first pin 202 and the second pin 302 on the substrate 10 fall within the orthographic projections of the reinforcement structure 50 on the substrate 10. The provision of the reinforcement structure 50 enhances the mechanical strength and electrical stability of the connection portion 102, ensures the reliability of the ground connection, and provides additional electromagnetic shielding.

[0105] In some embodiments, at least a portion of the reinforcement structure 50 extends beyond the mounting surface 10b. This can further enhance the mechanical strength and stability of the connector 102, better protect it from external physical shock and vibration, and reduce the risk of deformation of the connector 102 during use, thereby ensuring the reliability of the pin's electrical connection. Furthermore, the extended portion can serve as an additional support point, helping to disperse stress and prevent damage caused by concentrated force.

[0106] Specifically, refer to Figure 1 、 Figure 2 and Figure 4 The reinforcement structure 50 includes a first reinforcement portion 501 and a second reinforcement portion 502. The first reinforcement structure 50 is entirely located on the connecting portion 102, and a portion of the second reinforcement portion 502 is located on the connecting portion 102, while the other portion extends out of the mounting surface 10b of the connecting portion 102.

[0107] Furthermore, the orthographic projections of the pins on the substrate 10 all fall within the orthographic projection of the first reinforcing portion 501 on the substrate 10 , and the orthographic projections of the pins on the substrate 10 partially overlap or do not overlap with the orthographic projections of the second reinforcing portion 502 on the substrate 10 .

[0108] In one embodiment, the end of the connection part 102 where the pin is provided is rectangular, the first reinforcement structure 50 and the second reinforcement structure 50 are integrated and in a convex shape, wherein the first reinforcement part 501 is completely fitted with the end of the connection part 102, the middle part of the second reinforcement is fitted with the end of the connection part 102, and the two ends extend out of the fitting surface of the connection part 102 respectively.

[0109] It should be noted that Figure 2 The location indicated by the dashed line is the approximate area where the metal bridge is located on the connection surface 10a of the substrate 10. Depending on design requirements, the area indicated by the dashed line on the mounting surface may include reinforcement structures, electrical connection structures, and other structures, or may not require any additional design. This application does not impose any restrictions on this.

[0110] This application also provides an electronic device, comprising a housing, a mainboard, and the antenna structure described in any of the above embodiments. This antenna structure, through optimized design, namely, by configuring the coil layout and connection method, effectively improves signal transmission efficiency, reduces interference, and lowers production costs.

[0111] In the foregoing detailed description, reference is made to the accompanying drawings, which illustrate, by way of illustration, specific aspects of the present disclosure in which it may be practiced. In this regard, terms indicating directions or expressing positional relationships, such as "thickness," "up," "down," "top," "bottom," "inside," "outside," etc., may be used with reference to the orientation of the figures being described. Since the components of the described devices may be positioned in a plurality of different orientations, the directional terms may be used for illustrative purposes and are not restrictive. It should be understood that other aspects may be utilized and structural or logical changes may be made without departing from the concepts of the present disclosure. Therefore, the following detailed description should not be taken in a limiting sense.

[0112] It should be understood that, unless otherwise specifically noted, the features of the various embodiments of the present disclosure described herein may be combined with each other. As used herein, the term "and / or" includes any one of the relevant listed items and any combination of any two or more thereof; similarly, "at least one of" includes any one of the relevant listed items and any combination of any two or more thereof.

[0113] It should be understood that, unless otherwise expressly specified or limited, the terms "join," "attach," "install," "connect," "connect," "fix," etc. used in the embodiments of the present disclosure should be understood in a broad sense. For example, they can be fixedly connected, detachably connected, or integrated; they can be mechanically connected, electrically connected, or communicable with each other; they can be directly connected, or indirectly connected through an intermediate medium, and they can be internally connected between two elements or an interactive relationship between two elements, unless otherwise expressly limited. For those skilled in the art, the specific meanings of the above terms in this article can be understood according to specific circumstances.

[0114] Although terms such as "first", "second" and "third" may be used herein to describe various components, parts, regions, layers or sections, these components, parts, regions, layers or sections are not limited to these terms. On the contrary, these terms are only used to distinguish one component, part, region, layer or section from another component, part, region, layer or section. Therefore, without departing from the teachings of each example, the first component, part, region, layer or section mentioned in the examples described herein may also be referred to as the second component, part, region, layer or section. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" can explicitly or implicitly include at least one such feature. In the description herein, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.

[0115] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

Claims

1. An antenna structure, characterized in that: The antenna structure is used to be mounted on the housing, and the antenna structure includes: The substrate comprises a main body and a connecting portion; the main body is an annular structure connected end to end; the connecting portion extends from a side frame of the main body toward the interior of the main body and is a strip-shaped structure; along the thickness direction of the antenna structure, the substrate comprises a connecting surface and a mounting surface disposed opposite each other, the mounting surface being configured to be fixed to the housing; the surfaces of the main body and the connecting portion away from the housing form the connecting surface; a first coil, attached to the connection surface of the substrate, comprising a first pad and a first pin at both ends, the first pad being located on the main body, the first pin being located on the connection portion, and the first coil extending from the first pad around the main body to the first pin; a second coil, attached to the connection surface of the substrate, comprising a second pad and a second pin, the second pad being located on the main body, the second pin being located on the connection portion, the second coil extending from the second pad around the main body to the second pin; wherein the first pad and the second pad are spaced apart; The metal connecting bridge has two ends connected to the first pad and the second pad respectively, so as to realize electrical connection between the first coil and the second coil.

2. The antenna structure according to claim 1, characterized in that The antenna structure further includes a welding structure, and any one or more of the first pad, the second pad, the first pin, and the second pin are provided with the welding structure, and the material of the welding structure is different from the material of the first coil and the second coil.

3. The antenna structure according to claim 2, characterized in that: The welding structure comprises a first welding metal layer and a second welding metal layer sequentially arranged in a direction away from the substrate; wherein, The first welding metal layer is made of one of nickel and zinc materials, and the second welding metal layer is made of the other of nickel and zinc materials.

4. The antenna structure according to claim 3, characterized in that: The welding structure further includes a third welding metal layer, and the third welding metal layer is located on the second welding metal layer; wherein, The third welding metal layer is made of gold.

5. The antenna structure according to claim 1, wherein: The first solder pad and the second solder pad are located in the middle of any frame of the main body, and a spacing direction between the first solder pad and the second solder pad is the same as an extension direction of the frame where the first solder pad and the second solder pad are located.

6. The antenna structure according to claim 5, characterized in that: The first solder pad and the second solder pad are located in the same frame, and are located on a different frame from the connecting portion of the main body.

7. The antenna structure according to claim 5, characterized in that: A double-layer coil wiring is provided on any frame of the main body, with the inner coil wiring being the inner coil wiring and the outer coil wiring being the outer coil wiring. The first coils are all inner coil wirings; the second coils include inner coil wirings and outer coil wirings. The second coil includes a first wiring unit, a second wiring unit and a connecting wiring unit, and two ends of the connecting wiring unit are respectively connected to the first wiring unit and the second wiring unit; wherein, One end of the first routing unit away from the connecting routing unit extends to the main body and forms the second pad, and the first routing unit is the outer ring routing; One end of the second wiring unit away from the connecting wiring unit extends to the connecting portion and forms the second pin, and the second wiring unit is the inner ring wiring; The connection wiring unit passes through the gap between the first pad and the second pad.

8. The antenna structure according to claim 7, characterized in that: The metal connection bridge covers at least a portion of the connection wiring unit, and the metal connection bridge and the connection wiring unit are insulated.

9. The antenna structure according to claim 7, characterized in that: A third pin is further provided at one end of the connecting portion away from the main body portion. The third pin is electrically connected to the second coil. The third pin is located between the first pin and the second pin and is spaced apart from the first pin and the second pin.

10. The antenna structure according to claim 9, characterized in that: The second coil further includes a third wiring unit, one end of the third wiring unit away from the main body extends to the connecting portion to form the third pin, and the other end of the third wiring unit extends to the main body and is electrically connected to the second wiring unit.

11. The antenna structure according to any one of claims 1 to 10, characterized in that: The antenna structure further includes a reinforcement structure, wherein the reinforcement structure is provided on the mounting surface of the connecting portion; The orthographic projections of the first pin and the second pin on the substrate fall within the orthographic projection of the reinforcement structure on the substrate.

12. The antenna structure according to claim 11, characterized in that: At least a portion of the reinforcement structure extends out of the mounting surface.

13. The antenna structure according to any one of claims 1 to 10, characterized in that: The antenna structure further includes an ink layer, which covers the first coil and the second coil and exposes the first pad, the first pin, the second pad, and the second pin.

14. The antenna structure according to any one of claims 1 to 10, characterized in that: The metal connecting bridge is made of nickel or copper; and / or The first coil and the second coil are made of the same material, and both are made of aluminum.

15. The antenna structure according to any one of claims 1 to 10, characterized in that: The width of the first coil is in the range of 0.8 mm to 1.2 mm; and / or The width of the second coil is in the range of 0.8 mm to 1.2 mm; and / or The spacing distance between the first pad and the second pad is 0.2 mm to 3 mm.

16. An electronic device, characterized in that: The electronic device comprises a housing and the antenna structure according to any one of claims 1 to 15.

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